CN219891803U

CN219891803U - Singlechip development experiment board

Info

Publication number: CN219891803U
Application number: CN202320973927.8U
Authority: CN
Inventors: 李国谦; 陈武发; 林寿铿
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-04-26
Filing date: 2023-04-26
Publication date: 2023-10-24
Anticipated expiration: 2033-04-26

Abstract

The utility model discloses a single-chip microcomputer development experiment board in the technical field of single-chip microcomputer experiments, which comprises a circuit board body and a single-chip microcomputer main body, wherein supporting columns are arranged at four corners of the lower surface of the circuit board body, a radiating box is connected to the middle of the lower surface of the circuit board body, a radiating component is arranged in the radiating box and comprises a heat conducting plate, a plurality of groups of radiating copper pipes and a radiating fan, a radiating opening is formed in the bottom end of the radiating box, one side of the upper surface of the circuit board body is connected with a mounting base, L-shaped supports are arranged at two ends of the upper surface of the mounting base, sliding plates are connected in the L-shaped supports in a sliding manner, adjusting screws are vertically arranged in the sliding plates, insulating plates are arranged at the bottoms of the adjusting screws, efficient heat dissipation of the single-chip microcomputer development experiment board is realized, various elements on the experiment board are prevented from being damaged due to high temperature, single-chip microcomputers of different models can be pressed, a user is prevented from deviating or sliding out the single-chip microcomputer position during experiments, and the stability of the single-chip microcomputer development experiment board during use is improved.

Description

Singlechip development experiment board

Technical Field

The utility model relates to the technical field of single-chip microcomputer experiments, in particular to a single-chip microcomputer development experiment board.

Background

The single chip microcomputer is an integrated circuit chip and is widely applied to various electronic devices. In order to facilitate the study and grasp of the singlechip technique, the singlechip development experiment board is usually required.

Because each component on the singlechip development experiment board can produce heat when the operation, consequently, need dispel the heat to the singlechip development experiment board, current heat dissipation mode is mostly single installation fan heat dissipation in its bottom, and the radiating effect of single fan is general, and the singlechip development experiment board is easy to damage because of high temperature, and the singlechip development experiment board is inconvenient for fixed singlechip, leads to the user when the operation experiment singlechip position easily skew or roll-off, uses unstably inadequately, for this reason, we propose a singlechip development experiment board.

Disclosure of Invention

The utility model aims to provide a singlechip development experiment board so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a singlechip development experiment board, including circuit board body and singlechip main part, the support column is all installed to the lower surface four corners department of circuit board body, and the lower surface middle part of circuit board body is connected with the radiating box, be equipped with radiating component in the radiating box, radiating component includes the heat-conducting plate, multiunit radiating copper pipe and radiator fan, and the thermovent has been seted up to the bottom of radiating box, upper surface one side of circuit board body is connected with the installation base, the singlechip main part is located the upper surface of installation base, and the upper surface both ends of installation base all are equipped with L type support, sliding connection has the sliding plate in the L type support, and vertical installation adjusting screw in the sliding plate, adjusting screw's bottom is equipped with the insulation board, and the lower surface laminating of insulation board is at the upper surface of singlechip main part.

Further: the inner side surface of the heat conducting plate is attached to the lower surface of the circuit board body, the plurality of groups of heat radiating copper pipes are positioned on the outer side surface of the heat conducting plate, and the heat radiating fan is positioned at the bottoms of the plurality of groups of heat radiating copper pipes.

Further: the L-shaped support comprises a transverse plate and a vertical plate, the bottom of the vertical plate is connected with the upper surface of the mounting base, and the transverse plate is in sliding connection with the sliding plate.

Further: the cross plate is vertically connected with a bolt, and a plurality of groups of locking holes matched with the bolts are formed in the sliding plate.

Further: the upper surface of the circuit board body is also provided with a switch component, a buzzer, an LED display screen, a matrix control key, a welding part, an IPS integrated circuit, an LED running light, a USB interface and an external power interface.

Further: the dustproof net is arranged in the heat dissipation opening and is connected with the inner wall of the heat dissipation opening in a clamping manner.

Further: the bottoms of the four groups of support columns are respectively provided with a base plate, and the lower surfaces of the base plates are connected with damping pads.

Compared with the prior art, the utility model has the beneficial effects that:

1. the heat conducting plate in the inner cavity of the heat radiating box has good heat conducting effect, can quickly conduct heat on the circuit board to a plurality of groups of heat radiating copper pipes, accelerates the flow speed of air after the heat radiating fan works, can quickly discharge the heat on the heat radiating copper pipes through the heat radiating ports, has high heat conducting efficiency, realizes high-efficiency heat radiation, avoids damage of each element on the experiment board due to high temperature, and prolongs the service life of each element;

2. through sliding connection of sliding plate and L type support, the front and back position of adjustable insulation board can drive the insulation board through adjusting screw's rotation and reciprocate, can make the insulation board compress tightly the singlechip main part of different models, prevent that the user from singlechip main part position skew or roll-off when the operation experiment, improved the stability of singlechip development experiment board when using.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the bottom view of the present utility model;

FIG. 3 is a schematic diagram of the connection structure between the SCM main body and the mounting base;

fig. 4 is a side structural cross-sectional view of the heat dissipating case of the present utility model.

In the figure: 1. a circuit board body; 2. a singlechip main body; 3. a mounting base; 4. a support column; 5. a backing plate; 6. a heat dissipation box; 7. a dust screen; 8. an L-shaped support; 9. a sliding plate; 10. a plug pin; 11. a locking hole; 12. adjusting a screw; 13. an insulating plate; 14. a heat conductive plate; 15. a heat dissipation copper pipe; 16. a heat radiation fan; 17. and a heat radiation port.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1:

referring to fig. 1-4, the present utility model provides a technical solution: the single chip microcomputer development experiment board comprises a circuit board body 1, wherein the circuit board body 1 is a main body of the single chip microcomputer development experiment board, each element on the circuit board body 1 and a single chip microcomputer main body 2 form the experiment board, and the working principle of each element on the circuit board body 1 is not described herein, and the operation principle is the prior art; including circuit board body 1 and singlechip main part 2, support column 4 is all installed to circuit board body 1's lower surface four corners department, and circuit board body 1's lower surface middle part is connected with radiating box 6, be equipped with radiating component in the radiating box 6, radiating component includes heat-conducting plate 14, multiunit radiating copper pipe 15 and radiator fan 16, and radiating hole 17 has been seted up to radiating box 6's bottom, circuit board body 1's upper surface one side is connected with installation base 3, singlechip main part 2 is located the upper surface of installation base 3, and the upper surface both ends of installation base 3 all are equipped with L type support 8, sliding connection has slide plate 9 in L type support 8, and vertically install adjusting screw 12 in the slide plate 9, adjusting screw 12's bottom is equipped with insulation board 13, and the laminating of insulation board 13's lower surface is at the upper surface of singlechip main part 2.

Before the use, place support column 4 on table surface to with the electrical property end electric connection external power source and the electrical property end of controller of consumer, place the singlechip main part 2 that needs the development experiment on the upper surface of installation base 3, adjust the front and back position of sliding plate 9 through L type support 8 and sliding connection of sliding plate 9, make insulation board 13 just right the top of singlechip main part 2, rotate the adjusting screw 12 of sliding plate 9 internal thread connection again, make the insulation board 13 of its bottom rotatory and move down, until the laminating of the bottom of insulation board 13 is at the upper surface of singlechip main part 2, prevent that the user from when the operation experiment singlechip main part 2 position skew or roll-off, stability when the singlechip development experiment board is used has been improved, through the work of radiator unit, the high-efficient heat dissipation of experiment board can be realized, avoid each component on the experiment board to damage because of the temperature is high, prolonged its life.

Preferably, the inner side surface of the heat conducting plate 14 is attached to the lower surface of the circuit board body 1, the plurality of groups of heat dissipation copper pipes 15 are located on the outer side surface of the heat conducting plate 14, the heat dissipation fan 16 is located at the bottom of the plurality of groups of heat dissipation copper pipes 15, the heat conducting plate 14 has good heat conduction effect, heat on the circuit board body 1 can be quickly conducted to the plurality of groups of heat dissipation copper pipes 15, the flow speed of air is increased after the heat dissipation fan 16 works, and the heat on the heat dissipation copper pipes 15 can be quickly discharged through the heat dissipation openings 17 by the heat dissipation fan 16, so that the heat dissipation effect is better than that of a traditional single fan.

Preferably, the L-shaped support 8 comprises a transverse plate and a vertical plate, the bottom of the vertical plate is connected with the upper surface of the mounting base 3, the transverse plate is connected with the sliding plate 9 in a sliding manner, a plurality of groups of locking holes 11 matched with the locking pins 10 are formed in the sliding plate 9, the sliding connection principle of the transverse plate and the sliding plate 9 is similar to that of a telescopic rod, after the position of the sliding plate 9 is determined, a group of locking holes 11 on the sliding plate 9 are aligned with the bottom ends of the locking pins 10, the bottom ends of the locking pins 10 can be connected with the corresponding locking holes 11 through the sliding locking pins 10, and the position of the sliding plate 9 is reinforced.

Preferably, the upper surface of the circuit board body 1 is further provided with a switch assembly, a buzzer, an LED display screen, a matrix control key, a welding part, an IPS integrated circuit, an LED running light, a USB interface and an external power supply interface, which are all in the prior art, and specific principles and using methods are not described herein.

Example 2:

referring to fig. 4, this embodiment differs from the first embodiment in that: be equipped with dust screen 7 in the thermovent 17, and dust screen 7 passes through the mode of joint and is connected with thermovent 17's inner wall, and dust screen 7 has played dustproof effect, avoids operational environment's dust to enter into the inside of thermobox 6, and the joint is convenient for the dismouting of dust screen 7, is convenient for follow-up clearance and change.

The bottom of four group support column 4 all is equipped with backing plate 5, and the lower surface of backing plate 5 is connected with the damping pad, and the setting of backing plate 5 and damping pad has increased the frictional force with table surface, has improved the stability of singlechip development experiment board when using.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a singlechip development experiment board, includes circuit board body (1) and singlechip main part (2), its characterized in that: support column (4) are all installed in lower surface four corners department of circuit board body (1), and the lower surface middle part of circuit board body (1) is connected with radiating box (6), be equipped with radiating component in radiating box (6), radiating component includes heat-conducting plate (14), multiunit radiating copper pipe (15) and radiator fan (16), and radiating opening (17) have been seted up to the bottom of radiating box (6), upper surface one side of circuit board body (1) is connected with mounting base (3), singlechip main part (2) are located the upper surface of mounting base (3), and the upper surface both ends of mounting base (3) all are equipped with L type support (8), sliding connection has sliding plate (9), and vertically install adjusting screw (12) in sliding plate (9), the bottom of adjusting screw (12) is equipped with insulation board (13), and the lower surface laminating of insulation board (13) is at the upper surface of singlechip main part (2).

2. The single-chip microcomputer development experiment board according to claim 1, wherein: the inner side surface of the heat conducting plate (14) is attached to the lower surface of the circuit board body (1), a plurality of groups of heat radiating copper pipes (15) are located on the outer side surface of the heat conducting plate (14), and the heat radiating fan (16) is located at the bottom of the plurality of groups of heat radiating copper pipes (15).

3. The single-chip microcomputer development experiment board according to claim 1, wherein: the L-shaped support (8) comprises a transverse plate and a vertical plate, the bottom of the vertical plate is connected with the upper surface of the mounting base (3), and the transverse plate is in sliding connection with the sliding plate (9).

4. A single-chip microcomputer development experiment board according to claim 3, wherein: the cross plate is vertically connected with bolts (10), and a plurality of groups of locking holes (11) matched with the bolts (10) are formed in the sliding plate (9).

5. The single-chip microcomputer development experiment board according to claim 1, wherein: the upper surface of circuit board body (1) still is equipped with switch module, bee calling organ, LED display screen, matrix control button, welding portion, IPS integrated circuit, LED running water lamp, USB interface and external power source interface.

6. The single-chip microcomputer development experiment board according to claim 1, wherein: the dustproof net (7) is arranged in the radiating opening (17), and the dustproof net (7) is connected with the inner wall of the radiating opening (17) in a clamping manner.

7. The single-chip microcomputer development experiment board according to claim 1, wherein: the bottoms of the four groups of support columns (4) are respectively provided with a base plate (5), and the lower surfaces of the base plates (5) are connected with damping pads.