CN220068129U - Power IC heat radiation structure - Google Patents
Power IC heat radiation structure Download PDFInfo
- Publication number
- CN220068129U CN220068129U CN202321529325.XU CN202321529325U CN220068129U CN 220068129 U CN220068129 U CN 220068129U CN 202321529325 U CN202321529325 U CN 202321529325U CN 220068129 U CN220068129 U CN 220068129U
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- Prior art keywords
- power
- heat dissipation
- heat
- fixedly connected
- heat transfer
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- 230000005855 radiation Effects 0.000 title claims description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 230000002146 bilateral effect Effects 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 3
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000003079 width control Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of power ICs, and provides a power IC heat dissipation structure, which comprises a PCB, wherein a power IC body is welded at the top of the PCB, a heat dissipation box with an opening at the bottom is detachably and fixedly connected to the top of the PCB, the power IC body is positioned in the heat dissipation box, and a row of heat transfer plates I in the vertical direction are fixedly connected to the top of the inner wall of the heat dissipation box; the heat generated by the power IC body during operation can be transferred to the second heat transfer plate and the first heat transfer plates, so that the heat dissipation area is increased, and the two fans suck outside air from the heat dissipation holes on one side and discharge the outside air from the heat dissipation holes on the other side, so that the outside cold air can rapidly take away the heat in the heat dissipation box, the power IC body can be effectively dissipated, and the power IC body can work under a reasonable temperature condition.
Description
Technical Field
The utility model relates to the technical field of power ICs, in particular to a power IC heat dissipation structure.
Background
The power supply IC refers to pulse width control integration of a switching power supply, and the power supply adjusts the stability of output voltage and current by using the pulse width control integration. With the development of electronic technology, especially the current promotion of popularity, energy conservation and environmental protection of portable products, the power supply IC plays an increasing role.
However, during the operation of the power IC, a large amount of heat is generated, and particularly when the voltage and current passing through the power IC increase due to the increase of the power supply voltage outside the power IC, the large amount of heat generated by the power IC is further increased, which puts a higher requirement on heat dissipation of the entire circuit structure.
In the prior art, publication number CN213280435U provides a heat dissipation structure of a power IC, which includes a structural body including a housing, a middle cover, and a bottom cover; the shell is provided with a mounting groove, the middle cover and the bottom cover are respectively provided with a first connecting lug and a second connecting lug, and the first connecting lug and the second connecting lug correspond to the mounting groove; the heat dissipation efficiency and the heat exchange efficiency of the power IC are improved, and the service stability and the service life of the power IC are improved.
In the above design, the whole PCB board needs to be placed in the casing of the heat dissipation structure, but the PCB board generally needs to be installed at a reserved position in the equipment, and the PCB board cannot be installed in the corresponding equipment in a compatible manner when being located in the casing.
Disclosure of Invention
The present utility model is directed to a heat dissipation structure of a power IC, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a power IC heat radiation structure, including the PCB board, the top welding of PCB board has the power IC body, the top of PCB board can be dismantled fixedly connected with bottom and be open-ended heat dissipation box, and the power IC body is located the inside of heat dissipation box, the inner wall top fixedly connected with of heat dissipation box is one row and is the heat transfer board one of vertical direction, and the common fixedly connected with in bottom of a plurality of heat transfer boards one is the horizontal direction and contradicts the heat transfer board two on the power IC body surface, be provided with two bilateral symmetry's fans in the heat dissipation box, and a plurality of louvres have all been densely seted up to the both sides of heat dissipation box.
Preferably, the top of the inner wall of the heat dissipation box is fixedly connected with two bilaterally symmetrical brackets, and the two fans are respectively installed on the surfaces of the corresponding brackets, so that the two fans can be installed on two sides of the inside of the heat dissipation box.
Preferably, the air outlet directions of the two fans are the same, so that the outside air can circulate in the heat dissipation box and take away the heat on the first heat transfer plate and the second heat transfer plate.
Preferably, heat conduction silicone grease is smeared between the power supply IC body and the second heat transfer plate, so that heat generated by the power supply IC body can be more efficiently transferred to the second heat transfer plate.
Preferably, the top fixedly connected with two bilateral symmetry's of PCB board post type piece, the thread groove has all been seted up at two post type piece tops, the equal fixedly connected with extension board in both sides of heat dissipation box, and all alternate on two extension boards and be connected with the threaded rod of pegging graft in corresponding thread groove through screw-thread fit, the equal fixedly connected with in top of two threaded rods is contradicted the knob on corresponding extension board top surface for the heat dissipation box can form the fixed at PCB board top.
Preferably, the first heat transfer plate and the second heat transfer plate are both aluminum plates.
Compared with the prior art, the utility model has the beneficial effects that:
the heat generated by the power IC body during operation can be transferred to the second heat transfer plate and the first heat transfer plates, so that the heat dissipation area is increased, and the two fans suck outside air from the heat dissipation holes on one side and discharge the outside air from the heat dissipation holes on the other side, so that the outside cold air can rapidly take away the heat in the heat dissipation box, the power IC body can be effectively dissipated, and the power IC body can work under a reasonable temperature condition.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic plan view of the present utility model;
FIG. 3 is a schematic view of the cross-sectional structure of FIG. 2 taken along the line A-A in accordance with the present utility model;
FIG. 4 is a schematic diagram showing a top structure of a heat dissipation case according to the present utility model;
fig. 5 is a schematic diagram showing a split state of a PCB board and a heat dissipation case according to the present utility model;
in the figure: 1. a PCB board; 2. a power IC body; 3. a heat dissipation box; 4. a first heat transfer plate; 5. a second heat transfer plate; 6. a fan; 61. a bracket; 7. a heat radiation hole; 8. a column block; 9. a support plate; 10. a threaded rod; 11. and (5) a knob.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
It will be apparent that numerous specific details are set forth in the following description in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced in other ways than as described herein, and therefore the present utility model is not limited to the specific embodiments of the present disclosure.
Referring to fig. 1-5, the present utility model provides a heat dissipation structure for a power IC: including PCB board 1, PCB board 1's top welding has power IC body 2, PCB board 1's top detachable fixedly connected with bottom is open-ended heat dissipation box 3, and power IC body 2 is located the inside of heat dissipation box 3, heat transfer plate one 4 that is vertical direction is fixedly connected with at the inner wall top of heat dissipation box 3, and the bottom of a plurality of heat transfer plates one 4 is fixedly connected with jointly and is a horizontal direction and contradict two heat transfer plates 5 on power IC body 2 surface, be provided with two bilateral symmetry's fan 6 in the heat dissipation box 3, and a plurality of louvres 7 have all been densely seted up to the both sides of heat dissipation box 3, through such design, power IC body 2 can transmit heat transfer plate two 5 and a plurality of heat transfer plates one 4 at the during operation, thereby increase the radiating area, and two fans 6 inhale outside air in the louvres 7 of one side and discharge, make outside cold air can take away the heat in the heat dissipation box 3 rapidly, so as to play the effectual heat dissipation to power IC body 2, make power IC body 2 can work under a reasonable temperature condition.
Regarding the specific connection manner between the two fans 6 and the heat dissipation box 3, two bilaterally symmetrical brackets 61 are fixedly connected to the top of the inner wall of the heat dissipation box 3, and the two fans 6 are respectively mounted on the surfaces of the corresponding brackets 61, so that the two fans 6 can be mounted on two sides inside the heat dissipation box 3.
It should be noted that, the air outlet directions of the two fans 6 are the same, so that an air channel can be formed in the heat dissipation box 3, and external air can circulate in the heat dissipation box 3 and take away heat on the surfaces of the first heat transfer plate 4 and the second heat transfer plate 5.
Furthermore, heat conduction silicone grease is smeared between the power supply IC body 2 and the second heat transfer plate 5, so that heat generated by the power supply IC body 2 can be more efficiently transferred to the second heat transfer plate 5.
Regarding the concrete connection mode between the heat dissipation box 3 and the PCB 1, as follows, the top fixedly connected with two bilateral symmetry's columnar block 8 of PCB 1, the thread groove has all been seted up at two columnar block 8 tops, the equal fixedly connected with extension board 9 in both sides of heat dissipation box 3, and all alternate on two extension boards 9 and be connected with the threaded rod 10 of pegging graft in corresponding thread groove through screw-thread fit, the equal fixedly connected with of top of two threaded rods 10 is contradicted in the knob 11 of corresponding extension board 9 top surface, so that the heat dissipation box 3 can form the fixed at PCB 1 top, simultaneously, hold knob 11 and rotatory can twist out threaded rod 10 from the thread groove with the hand, thereby can release the spacing to the heat dissipation box 3, in order to make things convenient for the dismantlement of heat dissipation box 3.
Meanwhile, the first heat transfer plate 4 and the second heat transfer plate 5 are both aluminum plates, and the aluminum plates have better heat conduction performance and are suitable choices.
Claims (6)
1. The utility model provides a power IC heat radiation structure, includes PCB board (1), and the top welding of PCB board (1) has power IC body (2), its characterized in that: the top of PCB board (1) can be dismantled fixedly connected with bottom and be open-ended radiating box (3), and power IC body (2) are located the inside of radiating box (3), the inner wall top fixedly connected with of radiating box (3) is one row of heat transfer board one (4) of vertical direction, and the bottom of a plurality of heat transfer boards one (4) is fixedly connected with jointly and is a horizontal direction and contradicts two (5) of heat transfer board on power IC body (2) surface, be provided with two bilateral symmetry's fans (6) in radiating box (3), and a plurality of louvres (7) have all been offered densely in both sides of radiating box (3).
2. The power IC heat dissipation structure as defined in claim 1, wherein: two bilaterally symmetrical brackets (61) are fixedly connected to the top of the inner wall of the radiating box (3), and two fans (6) are respectively installed on the surfaces of the corresponding brackets (61).
3. The power IC heat dissipation structure as defined in claim 1, wherein: the air outlet directions of the two fans (6) are the same.
4. The power IC heat dissipation structure as defined in claim 1, wherein: and heat conduction silicone grease is smeared between the power IC body (2) and the second heat transfer plate (5).
5. The power IC heat dissipation structure as defined in claim 1, wherein: two bilateral symmetry's column type piece (8) are fixedly connected with at top of PCB board (1), the screw thread groove has all been seted up at two column type piece (8) tops, the equal fixedly connected with extension board (9) in both sides of radiating box (3), and all alternate on two extension boards (9) and be connected with threaded rod (10) of pegging graft in corresponding screw thread groove through screw-thread fit, the equal fixedly connected with in top of two threaded rods (10) is contradicted knob (11) on corresponding extension board (9) top surface.
6. The power IC heat dissipation structure as defined in claim 1, wherein: the first heat transfer plate (4) and the second heat transfer plate (5) are both aluminum plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321529325.XU CN220068129U (en) | 2023-06-14 | 2023-06-14 | Power IC heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321529325.XU CN220068129U (en) | 2023-06-14 | 2023-06-14 | Power IC heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220068129U true CN220068129U (en) | 2023-11-21 |
Family
ID=88764928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321529325.XU Active CN220068129U (en) | 2023-06-14 | 2023-06-14 | Power IC heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220068129U (en) |
-
2023
- 2023-06-14 CN CN202321529325.XU patent/CN220068129U/en active Active
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