CN202503863U - Heat conduction base and electronic device using the same - Google Patents
Heat conduction base and electronic device using the same Download PDFInfo
- Publication number
- CN202503863U CN202503863U CN2012200757624U CN201220075762U CN202503863U CN 202503863 U CN202503863 U CN 202503863U CN 2012200757624 U CN2012200757624 U CN 2012200757624U CN 201220075762 U CN201220075762 U CN 201220075762U CN 202503863 U CN202503863 U CN 202503863U
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- Prior art keywords
- heat
- heat conduction
- circuit board
- support chip
- electronic installation
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Abstract
The utility model provides a heat conduction base, comprising a heat conduction plate, two heat conduction walls, and two opposite sides respectively extending from the heat conduction plate. Inner surfaces of the two heat conduction walls are faced with each other. Each heat conduction wall has at least one support piece, the support piece is provided inside the inner surface of the heat conduction wall and the support piece is a little bit higher than the heat conduction plate. The electronic device comprises the above mentioned heat conduction base and further comprises a case and a circuit module. The heat conduction base is arranged on the case. The bottom surface of the heat conduction plate of the heat conduction base is faced with the case. The circuit module is arranged on the heat conduction base. The circuit module has a circuit board and a plurality of heat sources on the circuit board. The circuit board is fixed on the support pieces of the two heat conduction walls, and is faced with the top surface of the heat conduction plate. The heat sources are abutted against the two heat conduction walls. With the heat conduction base and the electronic device using the same, a heat dissipation area is increased through the heat conduction base such that the heat sources can effectively penetrate through the heat conduction seat to increase the heat dissipation area.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to a kind of electronic installation that increases the radiating seat of area of dissipation and thermally conductive pathways and use this radiating seat.
Background technology
The radiator structure of power supply unit roughly can be divided into casing formula (enclosed type) and open (open frame type) at present.
Casing formula power supply unit such as TaiWan, China the 456763rd, I266581, M322141 patent etc.; Wherein, The I266581 patent discloses a kind of shell mechanism and electronic building brick fixer structure of DC/AC inverter, and the printed circuit board (PCB) of this patent directly utilizes screw to pass printed circuit board (PCB) and is screwed onto regularly on the hole of shell wall under this, like this if this hole is when running through this time shell wall; Four screws on this printed circuit board (PCB) are difficult for being fixed on equal height; And cause this printed circuit board (PCB) crooked, even damage, and expose outside the hole of this time shell wall easily the bottom of screw.
Open power supply unit such as patents such as No. the 7239519th, U.S. the electronic installation of a kind of Homogeneouslly-radiating of exposure, this electronic installation comprises a housing, a circuit board, a metal screen-wall and an insulating case.This circuit board is positioned in the insulating case; This metallic shield is socketed in outside this insulating case, and this housing is socketed in outside this metallic shield, so; The thermal source that heat generating component produced on this circuit board can directly not touch this metallic shield and this housing, and makes radiating effect not good.Moreover; This housing inboard fluted, the outside of this metal screen-wall have the protuberance that cooperates this groove, so that this housing and this metal screen-wall closely cooperate; But in fact; The protuberance of the groove of this housing and this metal screen-wall is easy to generate error and can't closely cooperates during fabrication, and then makes the radiant heat energy that this heat generating component produced can't be passed to this housing efficiently.
The utility model content
The main purpose of the utility model is to provide a kind of heat-conducting seat, and this heat-conducting seat supplies a circuit board to assemble easily, and the thermal source of this circuit board can effectively be led to this heat-conducting seat, to increase area of dissipation and to improve radiating efficiency.
Another purpose of the utility model is to provide a kind of electronic installation that uses above-mentioned heat-conducting seat; This heat-conducting seat can be mounted on the casing easily; And utilize the material behavior of this casing to increase thermally conductive pathways, or come this radiating seat is dispelled the heat efficiently through radiating airflow.
In order to solve problem in the prior art, the utility model provides a kind of heat-conducting seat, and it comprises; One heat-conducting plate, and two heat conduction walls extend the limit, two opposite sides from this heat-conducting plate respectively; The inner face of this two heat conduction wall faces, and each heat conduction wall has at least one support chip, and this support chip is located at the inner face of this heat conduction wall; Wherein, this support chip is a little more than this heat-conducting plate.
As the further improvement of the utility model, this heat-conducting plate is provided with at least two ports, and this two port is respectively adjacent to this two heat conduction wall, and over against the support chip of this two heat conduction wall.
As the further improvement of the utility model, each heat conduction wall is provided with at least one breach, and this breach is located at the below of the support portion of this heat conduction wall, and is communicated with this port.
In order to solve problem in the prior art, the utility model provides a kind of electronic installation, and it comprises above-mentioned described heat-conducting seat; Also comprise, a casing and a circuit module, heat-conducting seat is located on this casing; This casing of the bottom surface faces of the heat-conducting plate of heat-conducting seat; Circuit module is located on this heat-conducting seat, and circuit module has a circuit board and is positioned at a plurality of thermals source on this circuit board, and this circuit board is fixed on the support chip of this two heat conduction wall; And in the face of the end face of this heat-conducting plate, these thermals source are resisted against on this two heat conduction wall.
Further improvement as the utility model; This casing comprises a coverboard and at least two posts, and two posts connect this coverboard, and this two post is located at respectively in two ports; And below the support chip of this two heat conduction wall, the height of each post is less than or equal to the distance between each support chip and this coverboard.
Further improvement as the utility model; This casing comprises a coverboard and at least two posts, and two posts connect this coverboard, and this two post is located at respectively in two ports; And below the support chip of this two heat conduction wall, the height of each post is greater than the distance between each support chip and this coverboard.
Further improvement as the utility model; This electronic installation also comprises many bolts; Each bolt has a head, the whole body portion and an afterbody; The head of each bolt is pressed on this circuit board, and wherein one of this circuit board and this two support chip passes in its body portion, and the be spirally connected post of this casing of its afterbody.
As the further improvement of the utility model, this electronic installation more comprises a plurality of fixtures, and those thermals source are fixed on this two heat conduction wall.
As the further improvement of the utility model, this electronic installation more comprises an insulating trip, and this insulating trip is between the heat-conducting plate of this circuit board and this heat-conducting seat.
As the further improvement of the utility model, the bottom surface of this heat-conducting plate or the coverboard of this casing are provided with thermal grease.
The beneficial effect of the utility model is: the heat-conducting seat of the utility model and use the electronic installation of this heat-conducting seat to increase area of dissipation through this heat-conducting seat increase area of dissipation so that the thermal source of this circuit board can effectively see through this heat-conducting seat.
Description of drawings
Fig. 1 is the electronic device construction sketch map of first preferable case study on implementation of the utility model;
Fig. 2 is the explosive view of this electronic installation among Fig. 1;
Fig. 3 is the cutaway view of the utility model electronic installation;
Fig. 4 is the partial enlarged view of Fig. 3;
Fig. 5 is the zoomed-in view of heat-conducting seat among Fig. 2;
Fig. 6 is the structural representation of another preferable case study on implementation of the utility model.
Embodiment
Below in conjunction with description of drawings and embodiment the utility model is further specified.
Explain, in the middle of the following example, do not extract heat-conducting seat separately, but in the middle of the application of heat-conducting seat, be illustrated, in the reality, can produce heat-conducting seat separately.
First figure is the electronic installation sketch map of first preferable case study on implementation of the utility model.Shown in first and two figure, this electronic installation 1 comprises a casing 10, a heat-conducting seat 12 and a circuit module 14.
This heat-conducting seat 12 is normally selected metal for use or the material of good heat conductive effect is arranged, and this heat-conducting seat 12 is located on this casing 10, and has a heat-conducting plate 120 and extend two heat conduction walls 122 from the limit, two opposite sides of this heat-conducting plate 120 respectively.This casing 10 of the bottom surface faces of this heat-conducting plate 120; The inner face of this two heat conduction wall 122 faces; Each heat conduction wall 122 has at least one support chip 1220; This support chip 1220 is positioned at the inner face of this heat conduction wall 122, and a little more than this heat-conducting plate 120, representing has difference in height between this support chip 1220 and this casing 10.
This circuit module 14 is located on this heat-conducting seat 12, and has a circuit board 140 and be positioned at a plurality of thermals source 142 on this circuit board 140.This circuit board 140 is fixed on the support chip 1220 of two heat conduction walls 122, and faces the end face of this heat-conducting plate 120.
These thermals source 142 are resisted against on the two heat conduction walls 122, so that the heat energy that these thermals source 142 are produced is directly conducted to this heat-conducting seat 12, increase area of dissipation and radiating effect.In fact; The multiple electronic building brick of these circuit board 140 grafting; For example transformer, resistance, electric capacity, inductance, integrated circuit, thyristor (Silicon-Controlled Rectifier; SCR), metal-oxide half field effect transistor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET)
Insulated gate bipolar transistor (Insulated Gate Bipolar Transistor; IGBT) and bi-directional thyristor switch (The triode AC switch; TRIAC) etc., and these electronic building bricks are fixed on this circuit board 140, because this support chip 1220 has difference in height with this casing 10 with welding manner; So exposed assembly pin forms short circuit with regard to the heat-conducting plate 120 that can not touch this metal on this circuit board 140.Wherein, those thermals source 142 typically refer to thyristor (SCR), metal-oxide half field effect transistor (MOSFET), insulated gate bipolar transistor (IGBT) and the bi-directional thyristor switch (TRIAC) etc. in the above-mentioned running.
Shown in second and three figure, this casing 10 comprises a coverboard 100 and many posts 102.These posts 102 connect these coverboards 100, connected mode can be spirally connected or extend on this coverboard 100, wherein, represent that with the mode that is spirally connected these posts 102 are a kind of structures that can be separated on this coverboard 100.The heat-conducting plate 120 of this heat-conducting seat 12 has a plurality of ports 1200, and these ports 1200 are disposed at four corners of the heat-conducting plate 120 of rectangle, and is respectively adjacent to this two heat conduction wall 122, and each port 1200 is over against a wherein support chip 1220 of this two heat conduction wall 122.These posts 102 are located in these ports 1200 one to one, and below these support chips 1220.That is to say that all there is a post 102 below of each support chip 1220.
In this case study on implementation, the height of each post 102 is less than or equal to the distance between each support chip 1220 and this coverboard 100, shown in the 3rd figure.In this embodiment; The height of this post 102 equals the distance between this support chip 1220 and this coverboard 100; So the bottom of this heat-conducting plate 120 just can directly contact the coverboard 100 of this casing 10; So that the heat energy that these thermals source 142 are produced is passed on the coverboard 100 of this casing 10 naturally, to form bigger area of dissipation.In addition,, but need only the coverboard 100 that this heat-conducting plate 120 can directly contact this casing 10, also can reach above-mentioned effect if the height of this post 102 is less than the distance between this support chip 1220 and this coverboard 100.Preferably, can be coated with thermal grease on the coverboard 100 of the bottom surface of this heat-conducting plate 120 or this casing 10, to improve radiating effect.Wherein, the coverboard 100 of this casing 10 is preferably selected the material of metal or the preferable heat conduction of tool for use.
Please with reference to the 4th figure, this electronic installation 1 more comprises many bolts 16 (shown in second figure), and each bolt 16 has a head 160, the whole body portion 162 and an afterbody 164.The head 160 of each bolt 16 is pressed on this circuit board 140, and one of them hole 1221 of hole 141 and these support portions 1220 of this circuit board 140 is passed by its body portion 162, and the be spirally connected screw 103 of post 102 of this casing 10 of its afterbody 164.Like this, each bolt 16 all is that the front from this circuit board 140 down is locked on this casing 10, and the support of this support portion 1220 and this post 102 is arranged, make this circuit board 140 is installed can be more efficient than prior art.
Shown in the 5th figure, each heat conduction wall 122 also has at least one breach 1222, and this breach 1222 is positioned at the below of the support chip 1220 of this heat conduction wall 122, and communicates with a wherein port 1200 of this heat-conducting plate 120, and so, this heat-conducting seat 12 helps volume production.
Please refer again to first and two figure, this electronic installation 1 more comprises a plurality of fixtures 18, in order to respectively these thermals source 142 are fixed on this two heat conduction wall 122.In this case study on implementation; Each fixture 18 comprises a lamellar body 180a, 180b and a screw 182, wherein, and an end butt one thermal source 142 of this lamellar body 180a; And its other end is screwed onto on this heat conduction wall 122 by this screw 182 regularly; The two ends of another lamellar body 180b thermal source 142 of conflicting respectively, and this screw 182 with the center fixed of this lamellar body 180b be screwed onto on the heat conduction wall 122, so; The heat energy that these thermals source 142 produce will conduct on this heat-conducting seat 12, and the temperature of this thermal source 142 is reduced.
This electronic installation 1 more comprises an insulating trip 19, and this insulating trip 19 so, when operating with the electronic building brick that prevents this circuit board 140, leaks off on this heat-conducting seat 12 between the heat-conducting plate 120 of this circuit board 140 and this heat-conducting seat 12.
The 6th is the sketch map of another preferable case study on implementation of the electronic installation of the utility model.Shown in the 6th figure, be that compared to the main difference of above-mentioned preferred embodiment the height of each post 102 is greater than this heat-conducting plate 120 and the distance between the support portion 1220 wherein, other structure and effect are all same as described above, repeat no more here.Because; These posts 102 are higher; Make between this heat-conducting plate 120 and this casing 10 to form a heat-dissipating space, so, blow under the situation that this heat-conducting seat 12 dispels the heat in free convection (outside convection current air gets in the casing) or forced convertion (extra increase radiator fan); Radiating airflow can be blown over each part of heat-conducting seat 12, promotes radiating effect.
Above content is the further explain that combines concrete preferred implementation that the utility model is done, and can not assert that the practical implementation of the utility model is confined to these explanations.For the those of ordinary skill of technical field under the utility model, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be regarded as belonging to the protection range of the utility model.
Claims (10)
1. heat-conducting seat, it is characterized in that: it comprises, a heat-conducting plate; And two heat conduction walls, extending limit, two opposite sides respectively from this heat-conducting plate, the inner face of this two heat conduction wall faces; Each heat conduction wall has at least one support chip; This support chip is located at the inner face of this heat conduction wall, and wherein, this support chip is a little more than this heat-conducting plate.
2. a kind of heat-conducting seat according to claim 1 is characterized in that: this heat-conducting plate is provided with at least two ports, and this two port is respectively adjacent to this two heat conduction wall, and over against the support chip of this two heat conduction wall.
3. a kind of heat-conducting seat according to claim 2 is characterized in that: each heat conduction wall is provided with at least one breach, and this breach is located at the below of the support portion of this heat conduction wall, and is communicated with this port.
4. electronic installation, it is characterized in that: it comprises the described heat-conducting seat of claim 3, also comprises; One casing and a circuit module, heat-conducting seat are located on this casing, this casing of the bottom surface faces of the heat-conducting plate of heat-conducting seat; Circuit module is located on this heat-conducting seat, and circuit module has a circuit board and is positioned at a plurality of thermals source on this circuit board, and this circuit board is fixed on the support chip of this two heat conduction wall; And in the face of the end face of this heat-conducting plate, these thermals source are resisted against on this two heat conduction wall.
5. a kind of electronic installation according to claim 4; It is characterized in that: this casing comprises a coverboard and at least two posts; Two posts connect this coverboard; This two post is located at respectively in two ports, and below the support chip of this two heat conduction wall, the height of each post is less than or equal to the distance between each support chip and this coverboard.
6. a kind of electronic installation according to claim 4; It is characterized in that: this casing comprises a coverboard and at least two posts; Two posts connect this coverboard; This two post is located at respectively in two ports, and below the support chip of this two heat conduction wall, the height of each post is greater than the distance between each support chip and this coverboard.
7. according to claim 5 or 6 described a kind of electronic installations; It is characterized in that: this electronic installation also comprises many bolts; Each bolt has a head, the whole body portion and an afterbody; The head of each bolt is pressed on this circuit board, and wherein one of this circuit board and this two support chip passes in its body portion, and the be spirally connected post of this casing of its afterbody.
8. a kind of electronic installation according to claim 4 is characterized in that: this electronic installation more comprises a plurality of fixtures, and those thermals source are fixed on this two heat conduction wall.
9. a kind of electronic installation according to claim 4 is characterized in that: this electronic installation more comprises an insulating trip, and this insulating trip is between the heat-conducting plate of this circuit board and this heat-conducting seat.
10. a kind of electronic installation according to claim 4 is characterized in that: the bottom surface of this heat-conducting plate or the coverboard of this casing are provided with thermal grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200757624U CN202503863U (en) | 2012-03-02 | 2012-03-02 | Heat conduction base and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200757624U CN202503863U (en) | 2012-03-02 | 2012-03-02 | Heat conduction base and electronic device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202503863U true CN202503863U (en) | 2012-10-24 |
Family
ID=47040461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200757624U Expired - Lifetime CN202503863U (en) | 2012-03-02 | 2012-03-02 | Heat conduction base and electronic device using the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202503863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
-
2012
- 2012-03-02 CN CN2012200757624U patent/CN202503863U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121024 |