CN220858797U - Heat radiation structure and power supply - Google Patents
Heat radiation structure and power supply Download PDFInfo
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- CN220858797U CN220858797U CN202322561883.0U CN202322561883U CN220858797U CN 220858797 U CN220858797 U CN 220858797U CN 202322561883 U CN202322561883 U CN 202322561883U CN 220858797 U CN220858797 U CN 220858797U
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- heat
- heat dissipation
- plate
- cover
- power supply
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- 230000005855 radiation Effects 0.000 title claims description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 238000007789 sealing Methods 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a power supply, comprising a bottom plate, a heat dissipation cover, a fan, two guide plates, a plurality of heat dissipation fins, two sealing plates and a heat conduction plate for conducting heat to the power supply; the bottom plate is detachably arranged on the heat dissipation cover; two groups of heat dissipation strip-shaped holes are formed in the heat dissipation cover; the fan is arranged in the heat dissipation cover; both guide plates are arranged in the heat dissipation cover; the two sealing plates are arranged on the bottom surface of the heat conducting plate; the plurality of radiating fins are all installed on the bottom surface of the heat conducting plate. According to the utility model, the plurality of radiating fins extend out of the through holes, so that the heat dissipation of the power supply is realized; the heat dissipation cover and the bottom plate are matched so as to protect power supplies with different sizes, and the complexity of power supply production is reduced; then the power supply is quickly cooled by the arranged fan; simultaneously shelter from two sets of heat dissipation bar holes through two deflector that set up, avoided external rainwater to get into in the heat dissipation lid through two sets of heat dissipation bar holes and damage the power.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a power supply.
Background
Along with the continuous improvement of the convenience requirement of people, the volume requirement of the power supply product is smaller and smaller so as to be convenient to carry, and components in the power supply product develop to miniaturization and high efficiency. However, high-performance components can generate a large amount of heat under high-speed operation, and in order to ensure that the components can operate at high efficiency under normal operating temperature, the heat generated in the operation process of the components needs to be transferred, so that the heat dissipation technology of the components is continuously challenged along with the development of a power supply.
The Chinese patent with the authorized bulletin number of CN218735700U discloses a heat dissipation structure and a power supply, wherein a first heat conduction piece enables the first heat dissipation piece to be tightly attached to a second heat dissipation piece, and a second heat conduction piece enables the second heat dissipation piece to be tightly attached to a third heat dissipation piece; the first heat dissipation piece covers at least one heating element, and the third heat dissipation piece is arranged on the shell and is in contact with the outside. According to the utility model, heat generated by the heating element during operation is quickly transferred to the outside through the first heat radiating piece, the first heat conducting piece, the second heat radiating piece, the second heat conducting piece and the third heat radiating piece contacted with the outside air, so that heat exchange is more effectively performed with the air, the temperature in the shell is reduced, the temperature of the heating element and the outside temperature tend to be in a heat balance state, and the service life of the element is prolonged.
The technical defects existing in the prior art are as follows: the first radiating piece, the second radiating piece and the third radiating piece which are arranged in the device are all installed on the heating element, the circuit boards with different sizes and the heating elements with different numbers are required to be installed in a radiating mode one by one, and the practicality of the device is poor.
Disclosure of utility model
The utility model aims at solving the problems in the background technology and provides a heat dissipation structure and a power supply which are convenient for heat dissipation of circuit boards with different sizes and heating elements with different numbers.
The technical scheme of the utility model is as follows: a heat radiation structure comprises a bottom plate, a heat radiation cover, a fan, two guide plates, a plurality of heat radiation fins, two sealing plates and a heat conduction plate for conducting heat to a power supply;
The bottom surface of the bottom plate is provided with a through hole, and the bottom plate is detachably arranged on the heat dissipation cover;
Two groups of heat dissipation strip-shaped holes are formed in the heat dissipation cover, and a conduit is arranged on the heat dissipation cover; the fan is arranged in the heat dissipation cover;
The two guide plates are arranged in the heat dissipation cover and are respectively positioned at the two groups of heat dissipation strip-shaped holes;
The two sealing plates are arranged on the bottom surface of the heat conducting plate and are arranged at the through holes; the plurality of radiating fins are all installed on the bottom surface of the heat conducting plate, and the plurality of radiating fins all pass through the through holes.
Preferably, the device further comprises a mold-shaped frame and a plurality of bolts; the mold-returning frame is arranged on the bottom plate, and the outer peripheral surface of the mold-returning frame is tightly pressed on the inner wall of the heat radiation cover; the bolts are arranged on the heat dissipation cover and the mold-returning frame.
Preferably, each guide plate is inclined downward toward the end surface far from the central axis of the heat radiating cover.
Preferably, each guide plate is provided with a plurality of heat dissipation holes.
Preferably, the bottom surface of the bottom plate is provided with a plurality of supporting feet.
Preferably, sealing rubber pads are arranged on the end faces, away from each other, of the two sealing plates.
Preferably, the bottom surface of the heat conducting plate is provided with a plurality of heat dissipation grooves.
A power supply comprising a heat dissipating structure as defined in any one of the preceding claims, comprising a circuit board, a plurality of heat dissipating elements, and a mounting board; the mounting plate is arranged on the heat-conducting plate; the circuit board is arranged on the mounting plate; the plurality of heat dissipation elements are all mounted on the circuit board.
Compared with the prior art, the technical scheme provided by the utility model has the following beneficial technical effects:
The power supply is arranged on the heat conducting plate, the heat conducting plate and the plurality of radiating fins conduct heat transfer on the power supply, and meanwhile the sealing plate is arranged at the through hole, so that the plurality of radiating fins extend out of the through hole, and the heat dissipation of the power supply is realized; the radiating cover is detachably arranged on the bottom plate, so that the power supplies with different sizes can be protected by the cooperation of the radiating cover and the bottom plate, the protective shell can be conveniently and quickly arranged outside the power supply, and the complexity of power supply production is reduced; then, the power supply is quickly radiated through the arranged fans, so that heat is ventilated and radiated through the two groups of radiating strip-shaped holes; simultaneously shelter from two sets of heat dissipation bar holes through two deflector that set up, avoided external rainwater to get into in the heat dissipation lid through two sets of heat dissipation bar holes and damage the power.
The heat dissipation cover is limited and installed through the set mold-returning frame, and then the heat dissipation cover is installed on the mold-returning frame through the set bolts, so that the heat dissipation cover can be conveniently and detachably installed, the power supplies with different sizes can be conveniently installed, and the power supplies can be conveniently and detachably checked.
Drawings
Fig. 1 is a perspective view of the present utility model.
Fig. 2 is a schematic structural view of a base plate in the present utility model.
Fig. 3 is a schematic structural diagram of a power supply according to the present utility model.
Fig. 4 is a schematic structural view of a heat dissipating cover according to the present utility model.
Reference numerals: 1. a bottom plate; 101. a through hole; 2. a bolt; 3. a heat-dissipating cover; 301. a heat dissipation strip-shaped hole; 31. a conduit; 4. a fan; 5. a guide plate; 501. a heat radiation hole; 6. a mold frame; 7. a circuit board; 8. a heat dissipation element; 9. a heat conductive plate; 10. a heat radiation fin; 11. a sealing plate; 12. and supporting the feet.
Detailed Description
Example 1
As shown in fig. 1 to 4, the heat dissipation structure provided by the utility model comprises a bottom plate 1, a heat dissipation cover 3, a fan 4, two guide plates 5, a plurality of heat dissipation fins 10, two sealing plates 11 and a heat conduction plate 9 for conducting heat to a power supply.
The bottom surface of bottom plate 1 is equipped with through-hole 101, and bottom plate 1 demountable installation is on heat dissipation lid 3, and the bottom surface of bottom plate 1 is equipped with a plurality of supporting legs 12.
Two groups of heat dissipation strip-shaped holes 301 are formed in the heat dissipation cover 3, and a conduit 31 is arranged on the heat dissipation cover 3; each group of heat dissipation strip-shaped holes 301 are downwards inclined towards the direction away from the heat dissipation cover 3; a fan 4 is installed in the heat radiation cover 3, and the fan 4 is located directly above the power supply.
Two deflector plates 5 are all installed in the heat dissipation lid 3, and two deflector plates 5 are located two sets of heat dissipation bar hole 301 departments respectively, and every deflector plate 5 all inclines downwards on the terminal surface that keeps away from the axis of heat dissipation lid 3, all is equipped with a plurality of louvres 501 on every deflector plate 5.
The two sealing plates 11 are arranged on the bottom surface of the heat conducting plate 9, the two sealing plates 11 are arranged at the through holes 101, and sealing rubber pads are arranged on the end surfaces of the two sealing plates 11, which are far away from each other; a plurality of radiating fins 10 are all installed on the bottom surface of the heat conducting plate 9, and the radiating fins 10 all penetrate through the through holes 101; the bottom surface of the heat-conducting plate 9 is provided with a plurality of heat-dissipating grooves.
In the utility model, when in use, a power supply is arranged on the heat conducting plate 9, the heat conducting plate 9 and the plurality of radiating fins 10 are used for carrying out heat transfer on the power supply, and meanwhile, the sealing plate 11 is arranged at the through hole 101, so that the plurality of radiating fins 10 extend out of the through hole 101, thereby realizing the heat dissipation on the power supply; the radiating cover 3 is detachably arranged on the bottom plate 1, and the power supplies with different sizes are protected by the cooperation of the radiating cover 3 and the bottom plate 1, so that the protective shell is conveniently and quickly arranged outside the power supply, and the complexity of power supply production is reduced; then, the power supply is quickly radiated by the arranged fan 4, so that heat is ventilated and radiated through the two groups of radiating strip-shaped holes 301; simultaneously shelter from two sets of heat dissipation bar holes 301 through two deflector 5 that set up, avoided external rainwater to get into in the heat dissipation lid 3 through two sets of heat dissipation bar holes 301 and damage the power.
Example two
As shown in fig. 1 to 4, the heat dissipation structure provided by the utility model comprises a bottom plate 1, a heat dissipation cover 3, a fan 4, two guide plates 5, a square frame 6, a plurality of bolts 2, a plurality of heat dissipation fins 10, two sealing plates 11 and a heat conduction plate 9 for conducting heat to a power supply.
The bottom surface of the bottom plate 1 is provided with a through hole 101, and the bottom surface of the bottom plate 1 is provided with a plurality of supporting feet 12.
Two groups of heat dissipation strip-shaped holes 301 are formed in the heat dissipation cover 3, and a conduit 31 is arranged on the heat dissipation cover 3; each group of heat dissipation strip-shaped holes 301 are downwards inclined towards the direction away from the heat dissipation cover 3; a fan 4 is installed in the heat radiation cover 3, and the fan 4 is located directly above the power supply.
The mold-returning frame 6 is arranged on the bottom plate 1, and the outer peripheral surface of the mold-returning frame 6 is tightly pressed on the inner wall of the heat radiation cover 3; a plurality of bolts 2 are mounted on the heat radiation cover 3 and the mold frame 6.
Two deflector plates 5 are all installed in the heat dissipation lid 3, and two deflector plates 5 are located two sets of heat dissipation bar hole 301 departments respectively, and every deflector plate 5 all inclines downwards on the terminal surface that keeps away from the axis of heat dissipation lid 3, all is equipped with a plurality of louvres 501 on every deflector plate 5.
The two sealing plates 11 are arranged on the bottom surface of the heat conducting plate 9, the two sealing plates 11 are arranged at the through holes 101, and sealing rubber pads are arranged on the end surfaces of the two sealing plates 11, which are far away from each other; a plurality of radiating fins 10 are all installed on the bottom surface of the heat conducting plate 9, and the radiating fins 10 all penetrate through the through holes 101; the bottom surface of the heat-conducting plate 9 is provided with a plurality of heat-dissipating grooves.
In the utility model, when in use, the heat radiation cover 3 is mounted in a limiting way through the arranged mold-returning frame 6, and then the heat radiation cover 3 is mounted on the mold-returning frame 6 through the arranged bolts 2, so that the heat radiation cover 3 is convenient to detachably mount, the power supplies with different sizes are convenient to mount, and the power supplies are also convenient to dismount and inspect.
Example two
As shown in fig. 3, the power supply provided by the utility model comprises a circuit board 7, a plurality of heat dissipation elements 8 and a mounting plate; the mounting plate is arranged on the heat-conducting plate 9; the circuit board 7 is mounted on the mounting plate; a plurality of heat dissipation elements 8 are mounted on the circuit board 7.
In the utility model, when in use, the circuit board 7 is arranged on the heat conducting plate 9, and the heat conducting plate 9 conducts heat transfer to the heat generated by the circuit board 7 and the plurality of heat radiating elements 8, thereby improving the heat radiating effect of the device.
The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present utility model.
Claims (8)
1. The heat radiation structure is characterized by comprising a bottom plate (1), a heat radiation cover (3), a fan (4), two guide plates (5), a plurality of heat radiation fins (10), two sealing plates (11) and a heat conduction plate (9) for conducting heat to a power supply;
The bottom surface of the bottom plate (1) is provided with a through hole (101), and the bottom plate (1) is detachably arranged on the heat dissipation cover (3);
Two groups of heat dissipation strip-shaped holes (301) are formed in the heat dissipation cover (3), and a conduit (31) is arranged on the heat dissipation cover (3); the fan (4) is arranged in the heat dissipation cover (3);
The two guide plates (5) are arranged in the heat dissipation cover (3), and the two guide plates (5) are respectively positioned at the two groups of heat dissipation strip-shaped holes (301);
The two sealing plates (11) are arranged on the bottom surface of the heat conducting plate (9), and the two sealing plates (11) are arranged at the through holes (101); the plurality of radiating fins (10) are all installed on the bottom surface of the heat conducting plate (9), and the plurality of radiating fins (10) all penetrate through the through holes (101).
2. A heat dissipating structure according to claim 1, further comprising a mold frame (6) and a plurality of bolts (2); the mold-returning frame (6) is arranged on the bottom plate (1), and the outer peripheral surface of the mold-returning frame (6) is tightly pressed on the inner wall of the heat radiation cover (3); the bolts (2) are arranged on the heat dissipation cover (3) and the square frame (6).
3. A heat dissipating structure according to claim 1, wherein each guide plate (5) is inclined downward toward the end surface away from the center axis of the heat dissipating cover (3).
4. A heat dissipating structure according to claim 3, wherein each guide plate (5) is provided with a plurality of heat dissipating holes (501).
5. A heat dissipating structure according to claim 1, wherein the bottom surface of the bottom plate (1) is provided with a plurality of supporting feet (12).
6. A heat dissipating structure according to claim 1, wherein sealing rubber pads are provided on the end surfaces of the two sealing plates (11) facing away from each other.
7. A heat dissipating structure according to claim 1, wherein the bottom surface of the heat conducting plate (9) is provided with a plurality of heat dissipating grooves.
8. A power supply comprising a heat dissipating structure as claimed in any one of claims 1-6, characterized by comprising a circuit board (7), a plurality of heat dissipating elements (8) and a mounting board; the mounting plate is arranged on the heat-conducting plate (9); the circuit board (7) is arranged on the mounting plate; a plurality of heat dissipation elements (8) are mounted on the circuit board (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322561883.0U CN220858797U (en) | 2023-09-20 | 2023-09-20 | Heat radiation structure and power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322561883.0U CN220858797U (en) | 2023-09-20 | 2023-09-20 | Heat radiation structure and power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220858797U true CN220858797U (en) | 2024-04-26 |
Family
ID=90787150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322561883.0U Active CN220858797U (en) | 2023-09-20 | 2023-09-20 | Heat radiation structure and power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220858797U (en) |
-
2023
- 2023-09-20 CN CN202322561883.0U patent/CN220858797U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |