CN214852484U

CN214852484U - Fin protection device

Info

Publication number: CN214852484U
Application number: CN202121216441.7U
Authority: CN
Inventors: 黄芜宣; 熊文静
Original assignee: Kunshan Songzhen Precision Hardware Co ltd
Current assignee: Kunshan Songzhen Precision Hardware Co ltd
Priority date: 2021-06-02
Filing date: 2021-06-02
Publication date: 2021-11-23
Anticipated expiration: 2031-06-02

Abstract

The utility model discloses a fin protection device, include heat dissipation base, lower heat conduction membrane, go up heat conduction membrane and heat dissipation apron, heat dissipation apron top fixedly connected with fin and guard plate, a plurality of air inlet duct has been seted up to the guard plate upper surface, the mounting groove has all been seted up to the heat dissipation apron left and right sides, first connecting hole has all been seted up to the heat dissipation apron left and right sides outer wall, the equal fixedly connected with linking baffle in heat dissipation base left and right sides, two a plurality of second connecting hole has all been seted up to the linking baffle outer wall, the louvre under a plurality of has been seted up to heat dissipation base bottom. The utility model discloses in, at DRAM during operation, the heat that DRAM bottom produced passes through down in the heat conduction membrane transmits the heat dissipation base, through fin discharge DRAM top steam, through at heat dissipation apron top fixed connection guard plate, protects the fin through the guard plate, through the air inlet duct of seting up on through the guard plate, makes the circulation of air, improves the radiating effect.

Description

Fin protection device

Technical Field

The utility model belongs to the technical field of the fin, specifically be a fin protection device.

Background

The radiating fin is a device for radiating heat of electronic elements which are easy to generate heat in electrical appliances, and is made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a plurality of sheet shapes and the like, for example, a CPU (central processing unit) in a computer needs to use a relatively large radiating fin, and power tubes, row tubes and power amplifier tubes in a power amplifier in a television set need to use the radiating fin. Generally, a layer of heat-conducting silicone grease is coated on the contact surface of an electronic element and a heat sink when the heat sink is used, so that heat emitted by the element is more effectively conducted to the heat sink and then dissipated to ambient air through the heat sink, the heat sink plays an important role in the formation of the heat sink, and besides the active heat dissipation of a fan, the quality of the heat sink is evaluated and greatly depends on the heat absorption capacity and the heat conduction capacity of the heat sink;

the heat sink in the prior art is generally directly exposed in the air, so that the heat sink is easily contaminated by dust to influence the heat dissipation capability of the heat sink, and is easily influenced by external force to cause damage to the heat sink, thereby seriously influencing the heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the problems that the radiating fins in the prior art are generally directly exposed in the air, are easily polluted by dust to influence the radiating capacity of the radiating fins, are easily influenced by external force to cause damage of the radiating fins and seriously influence the radiating effect, the radiating fin protection device is provided.

The utility model adopts the technical scheme as follows: the utility model provides a fin protection device, includes heat dissipation base, lower heat conduction membrane, goes up heat conduction membrane and heat dissipation apron, heat dissipation apron top fixedly connected with fin and guard plate, a plurality of air inlet duct has been seted up to the guard plate upper surface, the mounting groove has all been seted up to the heat dissipation apron left and right sides, first connecting hole has all been seted up to the heat dissipation apron left and right sides outer wall, the equal fixedly connected with linking baffle in heat dissipation base left and right sides, two a plurality of second connecting hole has all been seted up to the linking baffle outer wall, the louvre under a plurality of has been seted up to heat dissipation base bottom.

In a preferred embodiment, the radiating fins form a group of four radiating fins, and two groups of radiating fins are respectively positioned at the left side and the right side of the protection plate.

In a preferred embodiment, the lower and upper thermally conductive films are both graphite thermally conductive films.

In a preferred embodiment, the heat dissipation base and the heat dissipation cover plate are both made of aluminum alloy.

In a preferred embodiment, the lower heat conducting film is located on the top of the heat dissipation base, the upper heat conducting film is located on the top of the lower heat conducting film, and the heat dissipation cover plate is located on the top of the upper heat conducting film.

In a preferred embodiment, the first connection holes and the second connection holes are the same in number and position. To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

1. the utility model discloses in, at DRAM during operation, in the heat that DRAM bottom produced transmitted the heat dissipation base through lower heat conduction membrane, through louvre discharge steam down, the heat that DRAM top produced transmitted to the fin through last heat conduction membrane, through fin discharge DRAM top steam, through at heat dissipation apron top fixed connection guard plate, protected the fin through the guard plate, through the air inlet duct of seting up on through the guard plate, made the circulation of air, improved the radiating effect.

2. The utility model discloses in, when needs dispel the heat to computer memory strip, put into the memory strip and go up between the heat conduction membrane and the heat conduction membrane down, will paste the memory strip of going up the heat conduction membrane and heat conduction membrane down and put into between heat dissipation base and the heat dissipation apron, put into the mounting groove with linking stop, pass first connecting hole and second connecting hole with the bolt simultaneously, will dispel the heat the base and fix with the heat dissipation apron together, be convenient for install convenient to detach.

Drawings

Fig. 1 is a schematic diagram of a structure of a heat sink protection device according to the present invention;

fig. 2 is a schematic structural view of a heat dissipating cover plate in the heat dissipating fin protection device of the present invention;

fig. 3 is a schematic structural view of a heat dissipation base in the heat dissipation fin protection device of the present invention.

The labels in the figure are: 1-heat dissipation base, 2-lower heat conduction film, 3-upper heat conduction film, 4-heat dissipation cover plate, 5-heat dissipation sheet, 6-protection plate, 7-first connection hole, 8-air inlet groove, 9-connection baffle, 10-lower heat dissipation hole, 11-second connection hole and 12-installation groove.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-3, a heat sink protection device comprises a heat sink base 1, a lower heat conductive film 2, an upper heat conductive film 3 and a heat sink cover plate 4, wherein the lower heat conductive film 2 and the upper heat conductive film 3 are both graphite heat conductive films having low thermal resistance, light weight and high heat conductivity coefficient, and improving heat dissipation effect, the heat sink base 1 and the heat sink cover plate 4 are both aluminum alloy, the lower heat conductive film 2 is positioned on top of the heat sink base 1, the upper heat conductive film 3 is positioned on top of the lower heat conductive film 2, and the heat sink cover plate 4 is positioned on top of the upper heat conductive film 3, when needing to dissipate heat of a memory bank of a computer, a memory bank is placed between the upper heat conductive film 3 and the lower heat conductive film 2, the memory bank adhered with the upper heat conductive film 3 and the lower heat conductive film 2 is placed between the heat sink base 1 and the heat sink cover plate 4, a connection baffle 9 is placed in a mounting groove 12, and a bolt is passed through a first connection hole 7 and a second connection hole 11 to fix the heat sink base 1 and the heat sink cover plate 4 together, the heat dissipation cover plate 4 is convenient to mount and dismount, the heat dissipation fins 5 and the protection plate 6 are fixedly connected to the top of the heat dissipation cover plate 4, the heat dissipation fins 5 are arranged in one group, two groups of heat dissipation fins 5 are respectively positioned at the left side and the right side of the protection plate 6, the upper surface of the protection plate 6 is provided with a plurality of air inlet grooves 8, the left side and the right side of the heat dissipation cover plate 4 are respectively provided with a mounting groove 12, the outer walls of the left side and the right side of the heat dissipation cover plate 4 are respectively provided with a first connecting hole 7, the left side and the right side of the heat dissipation base 1 are respectively and fixedly connected with a connecting baffle 9, the outer walls of the two connecting baffles 9 are respectively provided with a plurality of second connecting holes 11, the first connecting holes 7 and the second connecting holes 11 are identical in number and position, the bottom of the heat dissipation base 1 is provided with a plurality of lower heat dissipation holes 10, when the memory bank works, heat generated at the bottom of the memory bank is transferred into the heat dissipation base 1 through the lower heat conduction film 2, hot air is discharged through the lower heat dissipation holes 10, heat dissipation holes, heat generated at the top of the memory bank is transferred into the heat dissipation fins 5 through the upper heat conduction film 3, through 5 exhaust memory bank top steam of fin, through 4 top fixed connection guard plates 6 at the heat dissipation apron, protect fin 5 through guard plate 6, through the air inlet duct 8 of seting up on through guard plate 6, make the circulation of air, improve the radiating effect.

The working principle is as follows: when the computer memory bank needs to be cooled, the memory bank is placed between the upper heat conduction film 3 and the lower heat conduction film 2, the memory bank adhered with the upper heat conduction film 3 and the lower heat conduction film 2 is placed between the heat dissipation base 1 and the heat dissipation cover plate 4, the connecting baffle plate 9 is placed in the mounting groove 12, and meanwhile, bolts penetrate through the first connecting hole 7 and the second connecting hole 11 to fix the heat dissipation base 1 and the heat dissipation cover plate 4 together, so that the mounting and the dismounting are convenient;

at DRAM during operation, the heat that DRAM bottom produced transmits heat dissipation base 1 in through heat conduction membrane 2 down, through heat dissipation hole 10 steam of discharging down, the heat that DRAM top produced transmits to fin 5 in through last heat conduction membrane 3, through fin 5 exhaust DRAM top steam, through 4 top fixed connection guard plates 6 at the heat dissipation apron, protect fin 5 through guard plate 6, through the air inlet duct 8 of seting up on through guard plate 6, make the circulation of air, and the radiating effect is improved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a fin protection device, includes heat dissipation base (1), lower heat conduction membrane (2), goes up heat conduction membrane (3) and heat dissipation apron (4), its characterized in that: heat dissipation apron (4) top fixedly connected with fin (5) and guard plate (6), a plurality of air inlet duct (8) have been seted up to guard plate (6) upper surface, mounting groove (12) have all been seted up to heat dissipation apron (4) the left and right sides, first connecting hole (7) have all been seted up to heat dissipation apron (4) the left and right sides outer wall, the equal fixedly connected with linking stop (9) of heat dissipation base (1) the left and right sides, two a plurality of second connecting hole (11) have all been seted up to linking stop (9) outer wall, louvre (10) under a plurality of have been seted up to heat dissipation base (1) bottom.

2. A heat sink protection device as recited in claim 1, wherein: the four radiating fins (5) form a group, and the two groups of radiating fins (5) are respectively positioned at the left side and the right side of the protection plate (6).

3. A heat sink protection device as recited in claim 1, wherein: the lower heat-conducting film (2) and the upper heat-conducting film (3) are both graphite heat-conducting films.

4. A heat sink protection device as recited in claim 1, wherein: the heat dissipation base (1) and the heat dissipation cover plate (4) are both made of aluminum alloy.

5. A heat sink protection device as recited in claim 1, wherein: the lower heat conducting film (2) is located at the top of the heat dissipation base (1), the upper heat conducting film (3) is located at the top of the lower heat conducting film (2), and the heat dissipation cover plate (4) is located at the top of the upper heat conducting film (3).

6. A heat sink protection device as recited in claim 1, wherein: the number and the positions of the first connecting holes (7) and the second connecting holes (11) are the same.