CN216928563U - Heat dissipation cooling device, power semiconductor module assembly and air conditioner - Google Patents
Heat dissipation cooling device, power semiconductor module assembly and air conditioner Download PDFInfo
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- CN216928563U CN216928563U CN202123194049.XU CN202123194049U CN216928563U CN 216928563 U CN216928563 U CN 216928563U CN 202123194049 U CN202123194049 U CN 202123194049U CN 216928563 U CN216928563 U CN 216928563U
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- soaking plate
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Abstract
The utility model provides a heat dissipation cooling device, a power semiconductor module assembly and an air conditioner, and relates to the technical field of heat dissipation and cooling of electric control parts. The heat dissipation cooling device comprises a soaking plate and a heat dissipation cooling assembly, wherein the soaking plate is fixedly arranged on a heat collection plate of the heat dissipation cooling assembly, and the soaking plate can be attached and connected with the resin wall surface of the power semiconductor module. When a certain power semiconductor component is out of control due to heat in the use process, the soaking plate can timely and quickly diffuse heat generated by the power semiconductor component to the whole module, so that the temperature of the whole module is balanced, damage caused by local high heat can be effectively reduced, time can be won for detecting abnormal high temperature and performing abnormal stop for the thermistor, and damage can be effectively avoided; correction tolerance does not need to be calculated, and time and labor are saved; in addition, the heat on the soaking plate is also dissipated or absorbed by the heat dissipation and cooling component and then taken away, so that the temperature of the power semiconductor module is reduced.
Description
Technical Field
The utility model relates to the technical field of heat dissipation and cooling of electric control parts, in particular to a heat dissipation and cooling device, a power semiconductor module assembly and an air conditioner.
Background
In order to safely operate electric control components used in an air conditioner, such as an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), and the like, tolerance design is required for each component so as to control the temperature not to exceed the junction temperature. In a power semiconductor module in which a plurality of power semiconductor components are densely mounted, temperature detection and design tolerance are generally performed with the entire module as one component.
In the prior art, a thermistor is usually mounted inside the power semiconductor module for detecting the temperature, and in the design stage, the measured temperature is used for the design tolerance; in the use stage, when the temperature measured by the thermistor exceeds the design tolerance, the abnormal stop can be performed by software, so that the power semiconductor module is protected.
However, since the thermistor is often mounted at a position away from a location where the power semiconductor components are densely packed, and the actual temperature of each power semiconductor component inside the module is different from the temperature measured by the thermistor, the power semiconductor components inside the power semiconductor module may be damaged by thermal runaway of the entire module. The existing solution is that, when designing the tolerance, the actual temperature of each power semiconductor component is measured independently, and the correction value is calculated, which is time-consuming and labor-consuming. That is, the power semiconductor components inside the power semiconductor module may damage the whole module due to thermal runaway because of the deviation between the temperature measurement value and the actual temperature value, but correcting the tolerance by calculating the correction value wastes time and labor.
SUMMERY OF THE UTILITY MODEL
The first objective of the present invention is to provide a heat dissipation cooling device, so as to solve the technical problems existing in the prior art that the power semiconductor components inside the power semiconductor module may damage the whole module due to thermal runaway because of the deviation between the temperature measurement value and the actual temperature value, but the correction of the tolerance by calculating the correction value is time-consuming and labor-consuming.
The heat dissipation cooling device provided by the utility model comprises a soaking plate and a heat dissipation cooling assembly, wherein the soaking plate is fixedly arranged on a heat collection plate of the heat dissipation cooling assembly, and the soaking plate can be attached and connected with the resin wall surface of the power semiconductor module.
The heat dissipation cooling device provided by the utility model can produce the following beneficial effects:
the heat dissipation cooling device comprises the soaking plate, wherein the soaking plate is attached and connected with the resin wall surface of the power semiconductor module when the heat dissipation cooling device is used, and the heat of each power semiconductor component can be diffused, so that when a certain power semiconductor component is out of control due to heat, the soaking plate can timely and quickly diffuse the heat generated by the certain power semiconductor component to the whole module, the temperature balance of the whole module is realized, the damage caused by local high heat can be effectively reduced, the abnormal high temperature can be detected by the thermistor, the time can be strived for abnormal stop, and the damage of the power semiconductor components and even the whole module can be effectively avoided; and correction value correction tolerance does not need to be calculated, and time and labor are saved. And when the soaking plate balances the heat, the heat on the soaking plate is also dissipated by the heat dissipation cooling component or taken away after being absorbed by the heat dissipation cooling component, so that the temperature of the power semiconductor module is reduced.
Furthermore, the soaking plate is in an omega shape, two ends of the soaking plate are fixedly connected with the heat collecting plate, and the power semiconductor module can be accommodated in a space defined by the soaking plate and the heat collecting plate.
Under this technical scheme, during the use, power semiconductor module not only passes through soaking plate equilibrium heat and heat dissipation cooling, holds in the space that soaking plate and thermal-arrest board enclose moreover, and the distance of the thermal-arrest board of whole discrete heat cooling assembly is very close, more does benefit to the heat dissipation cooling.
Furthermore, the soaking plate is filled with a heat exchange working medium.
Under this technical scheme, realize thermal diffusion and equilibrium through the flow of heat transfer working medium, the heat dissipation is faster, more timely, and efficiency is higher.
Optionally, the heat dissipation cooling assembly includes a coolant pipe and a coolant pipe sleeve wrapped on an outer wall of the coolant pipe, the soaking plate is fixedly mounted on the coolant pipe sleeve, and the coolant pipe sleeve can also be used for mounting the power semiconductor module.
Under this technical scheme, carry out the heat exchange between soaking plate and the refrigerant pipe box, the refrigerant in the refrigerant pipe fitting takes away the heat, realizes the heat dissipation cooling of power semiconductor module.
Furthermore, a first heat-conducting fin is clamped between the soaking plate and the refrigerant pipe sleeve or heat-conducting silicone grease is filled between the soaking plate and the refrigerant pipe sleeve.
Under this technical scheme, no matter be first conducting strip, still heat conduction silicone grease, the contact thermal resistance between the resin wall that all can effectively reduce unsmooth undulation and the soaking plate.
Optionally, the heat dissipation cooling assembly is a heat pipe radiator, and the soaking plate is fixedly mounted on a heat collecting plate of the heat pipe radiator.
Under the technical scheme, heat exchange is carried out between the soaking plate and the heat collecting plate of the heat pipe radiator, working media in the heat pipe radiator take away heat, and heat dissipation and cooling of the power semiconductor module are achieved.
Optionally, the heat dissipation cooling assembly is a finned radiator, and the soaking plate is fixedly mounted on a heat collection plate of the finned radiator.
Under this technical scheme, carry out the heat exchange between soaking plate and the fin radiator, the fin radiator gives off the heat, realizes the heat dissipation cooling of power semiconductor module.
A second objective of the present invention is to provide a power semiconductor module assembly, so as to solve the technical problem that the power semiconductor components inside the power semiconductor module in the prior art may damage the whole module due to thermal runaway because of deviation between a temperature measurement value and an actual temperature value, but correcting the tolerance by calculating a correction value is time-consuming and labor-consuming.
The power semiconductor module assembly provided by the utility model comprises a power semiconductor module and the heat dissipation cooling device, wherein the soaking plate is attached to the resin wall surface of the power semiconductor module.
In the use process of the power semiconductor module assembly, when a certain power semiconductor component is out of control due to heat, the soaking plate can timely and quickly diffuse heat generated by the certain power semiconductor component to the whole module, so that the temperature balance of the whole module is realized, the damage caused by local high heat can be effectively reduced, the time can be won for the thermistor to detect abnormal high temperature and perform abnormal stop, and the damage of the power semiconductor component and even the whole module can be effectively avoided; and correction value correction tolerance does not need to be calculated, and time and labor are saved. And when the soaking plate balances the heat, the heat on the soaking plate is also dissipated by the heat dissipation cooling component or taken away after being absorbed by the heat dissipation cooling component, so that the temperature of the power semiconductor module is reduced.
Further, a second heat conduction sheet is arranged between the soaking plate and the resin wall surface in a clamping mode.
Under this technical scheme, the setting of second conducting strip can effectively reduce the thermal contact resistance between the resin wall surface and the soaking board of unsmooth undulation.
A third objective of the present invention is to provide an air conditioner, so as to solve the technical problems that the power semiconductor components inside the power semiconductor module in the prior art may damage the whole module due to thermal runaway because of deviation between the temperature measurement value and the actual temperature value, but correcting the tolerance by calculating the correction value is time-consuming and labor-consuming.
The air conditioner provided by the utility model comprises the power semiconductor module assembly. The air conditioner has all the advantages of the power semiconductor module assembly, and therefore, the description is omitted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a top view of an assembly structure of a heat dissipation cooling device and a power semiconductor module according to a first form of the present invention;
fig. 2 is a side view of an assembly structure of a heat dissipation cooling device and a power semiconductor module according to a first form of the present invention;
fig. 3 is a side view of an assembly structure of a heat sink cooling device and a power semiconductor module according to a second form of the present invention;
fig. 4 is a side view of an assembly structure of a heat sink cooling device and a power semiconductor module according to a third form of the present invention;
fig. 5 is a schematic structural diagram of a power semiconductor module.
Description of reference numerals:
100-soaking plates; 150-screw; 200-refrigerant pipe sleeve; 300-refrigerant tubing; 400-heat pipe radiator; 500-finned heat sinks;
700-a second thermally conductive sheet;
800-power semiconductor module; 810-a thermistor; 820-a diode; 830-IGBT;
900-substrate.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
The present embodiment provides a heat dissipation and cooling device, as shown in fig. 1 to 4, which includes a soaking plate 100 and a heat dissipation and cooling element, wherein the soaking plate 100 is fixedly mounted on a heat collecting plate of the heat dissipation and cooling element, and the soaking plate 100 can be attached to a resin wall of a power semiconductor module 800.
The heat dissipation cooling device provided by the embodiment comprises a soaking plate 100, wherein when the heat dissipation cooling device is used, the soaking plate 100 is attached to and connected with the resin wall surface of a power semiconductor module 800, and heat of each power semiconductor component can be diffused, so that when a certain power semiconductor component is out of control due to heat, the soaking plate 100 can timely and quickly diffuse the heat generated by the certain power semiconductor component to the whole module, the temperature balance of the whole module is realized, the damage caused by local high heat can be effectively reduced, the abnormal high temperature can be detected by a thermistor 810, the time is strived for abnormal stop, and the damage of the power semiconductor components and even the whole module can be effectively avoided; and correction value correction tolerance does not need to be calculated, and time and labor are saved. While the soaking plate 100 balances the heat, the heat on the soaking plate 100 is also dissipated by the heat dissipation cooling component or is absorbed by the heat dissipation cooling component and then taken away, thereby realizing the cooling of the power semiconductor module 800.
However, although the heat sink cooling device according to the present embodiment can equalize the heat of the power semiconductor module 800, local thermal destruction due to transient overcurrent such as surge is not within the scope of the present invention.
Specifically, in the present embodiment, as shown in fig. 2 to 4, the soaking plate 100 is in an "Ω" shape, two ends of the soaking plate 100 are fixedly connected with the heat collecting plate, and a space surrounded by the soaking plate 100 and the heat collecting plate can accommodate the power semiconductor module 800. In this arrangement, when the power semiconductor module 800 is used, the heat is balanced and the heat is dissipated and cooled by the soaking plate 100, and the power semiconductor module is accommodated in the space surrounded by the soaking plate 100 and the heat collecting plates, so that the distance between the heat collecting plates of the integral heat dissipating and cooling assembly is very short, and the heat dissipating and cooling are facilitated.
Specifically, in the present embodiment, the soaking plate 100 is fixed to the heat collecting plate by the screw 150. Further, a washer (a common washer or a threaded washer is fitted over the screw) or a spring or the like may be provided between the screw 150 and the soaking plate 100 to further fasten the metal parts which do not affect the thermal conductivity.
More specifically, in the present embodiment, the power semiconductor module 800 is fixed to the heat collecting plate of the heat radiating cooling member.
Specifically, in this embodiment, the vapor chamber 100 may be filled with a heat exchange medium. So set up, the during operation realizes thermal diffusion and equilibrium through the flow of heat transfer working medium, and the heat dissipation is faster, more timely, and efficiency is higher.
Specifically, in the present embodiment, the heat dissipation cooling device has three forms:
fig. 1 and 2 show an assembly structure of a first heat dissipation and cooling device and a power semiconductor module 800, wherein the heat dissipation and cooling assembly includes a coolant pipe 300 and a coolant pipe sleeve 200 wrapped on an outer wall of the coolant pipe 300, and a vapor chamber 100 and the power semiconductor module 800 are fixedly mounted on the coolant pipe sleeve 200. In this arrangement, heat exchange is performed between the vapor chamber 100 and the refrigerant pipe sleeve 200, and the refrigerant in the refrigerant pipe 300 takes away heat, thereby achieving heat dissipation and cooling of the power semiconductor module 800.
Specifically, in the present embodiment, a first heat conducting sheet is sandwiched between the soaking plate 100 and the refrigerant pipe sleeve 200 or filled with heat conducting silicone grease. Since the resin wall surface is usually uneven, the thermal contact resistance between the uneven resin wall surface and the soaking plate 100 can be effectively reduced regardless of the first heat conductive sheet or the heat conductive silicone grease.
Fig. 3 shows an assembly structure of a second form of the heat-sink cooling device with a power semiconductor module 800, wherein the heat-sink cooling component is a heatpipe heatsink 400, and a soaking plate 100 is fixedly mounted to a heat collecting plate of the heatpipe heatsink 400. In this arrangement, the soaking plate 100 exchanges heat with the heat collecting plate of the heat pipe radiator 400, and the working medium in the heat pipe radiator 400 takes away the heat, thereby achieving heat dissipation and cooling of the power semiconductor module 800.
Specifically, in the present embodiment, a heat conducting sheet may be sandwiched between the soaking plate 100 and the heat collecting plate of the heatpipe radiator 400 or filled with a heat conducting silicone grease to reduce the contact thermal resistance.
Fig. 4 shows an assembly structure of a third form of the heat radiation cooling device with a power semiconductor module 800, in which the heat radiation cooling member is a finned radiator 500, and a soaking plate 100 is fixedly mounted to a heat collecting plate of the finned radiator 500. In this arrangement, heat exchange is performed between the soaking plate 100 and the fin radiator 500, and the fin radiator 500 radiates heat, thereby achieving heat radiation and cooling of the power semiconductor module 800.
Specifically, in the present embodiment, a heat conducting sheet may be sandwiched or filled between the soaking plate 100 and the heat collecting plate of the finned radiator 500 to reduce the contact thermal resistance.
It should be noted that in other embodiments of the present application, the heat dissipation and cooling assembly is not limited to the three structural forms described above, but may also adopt other structural forms as long as it can dissipate or carry away the heat in the soaking plate 100.
The present embodiment also provides a power semiconductor module assembly, as shown in fig. 1 to 4, which includes a power semiconductor module 800 and the heat dissipation and cooling device, wherein the soaking plate 100 is attached to the resin wall surface of the power semiconductor module 800.
In the power semiconductor module assembly provided by the embodiment, in the use process, when a certain power semiconductor component is out of control thermally, the soaking plate 100 can timely and quickly diffuse the generated heat to the whole module, so that the temperature balance of the whole module is realized, the damage caused by local high heat can be effectively reduced, the thermistor 810 can detect abnormal high temperature and the time for abnormal stop can be obtained, and the damage of the power semiconductor component and even the whole module can be effectively avoided; and correction value correction tolerance does not need to be calculated, and time and labor are saved. While the soaking plate 100 balances the heat, the heat on the soaking plate 100 is also dissipated by the heat dissipation cooling component or is absorbed by the heat dissipation cooling component and then taken away, thereby realizing the cooling of the power semiconductor module 800.
Specifically, in the present embodiment, the second heat conductive sheet 700 is interposed between the soaking plate 100 and the resin wall surface. Since the resin wall surface is usually uneven, as shown in fig. 5, the circuit board is provided with many components such as the thermistor 810, the diode 820, and the IGBT830, the provision of the second heat conduction sheet 700 can effectively reduce the contact thermal resistance between the resin wall surface and the soaking plate 100.
In other embodiments of the present application, the thermal grease may be filled between the soaking plate 100 and the resin wall surface, which can also reduce the contact thermal resistance.
The embodiment also provides an air conditioner, which comprises the power semiconductor module assembly. The air conditioner has all the advantages of the power semiconductor module assembly, and therefore, the description is omitted. In fig. 2 to 4, a substrate 900 for mounting the module assembly is also shown, but the structural form of the substrate 900 is not limited thereto and is only schematic in the figures.
Finally, it should also be noted that, in this document, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The heat dissipation cooling device is characterized by comprising a soaking plate (100) and a heat dissipation cooling assembly, wherein the soaking plate (100) is fixedly installed on a heat collection plate of the heat dissipation cooling assembly, and the soaking plate (100) can be attached to and connected with a resin wall surface of a power semiconductor module (800).
2. The heat dissipating and cooling device as claimed in claim 1, wherein the soaking plate (100) is in an "Ω" shape, both ends of the soaking plate (100) are fixedly connected with the heat collecting plate, and a space surrounded by the soaking plate (100) and the heat collecting plate can accommodate the power semiconductor module (800).
3. The heat dissipating cooling device according to claim 2, wherein the soaking plate (100) is filled with a heat exchanging medium.
4. The heat sink cooling device according to any one of claims 1 to 3, wherein the heat sink cooling assembly comprises a coolant pipe (300) and a coolant pipe sleeve (200) wrapped around an outer wall of the coolant pipe (300), the soaking plate (100) is fixedly mounted on the coolant pipe sleeve (200), and the coolant pipe sleeve (200) is further configured to mount the power semiconductor module (800).
5. The heat dissipation cooling device according to claim 4, wherein a first heat conducting sheet is interposed between the soaking plate (100) and the refrigerant pipe sleeve (200) or heat conducting silicone grease is filled between the soaking plate and the refrigerant pipe sleeve.
6. The thermal dissipation cooling device according to any one of claims 1-3, wherein the thermal dissipation cooling element is a heatpipe heatsink (400), and the heat spreader plate (100) is fixedly mounted to a heat collecting plate of the heatpipe heatsink (400).
7. The thermal sink cooling device according to any one of claims 1 to 3, wherein the thermal sink cooling component is a finned radiator (500), and the heat equalizing plate (100) is fixedly mounted to a heat collecting plate of the finned radiator (500).
8. A power semiconductor module assembly comprising a power semiconductor module (800) and the heat dissipating and cooling device as claimed in any one of claims 1 to 7, wherein the soaking plate (100) is attached to a resin wall surface of the power semiconductor module (800).
9. The power semiconductor module assembly according to claim 8, wherein a second heat conductive sheet (700) is interposed between the soaking plate (100) and the resin wall surface.
10. An air conditioner comprising the power semiconductor module assembly of claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123194049.XU CN216928563U (en) | 2021-12-16 | 2021-12-16 | Heat dissipation cooling device, power semiconductor module assembly and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123194049.XU CN216928563U (en) | 2021-12-16 | 2021-12-16 | Heat dissipation cooling device, power semiconductor module assembly and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216928563U true CN216928563U (en) | 2022-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123194049.XU Active CN216928563U (en) | 2021-12-16 | 2021-12-16 | Heat dissipation cooling device, power semiconductor module assembly and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216928563U (en) |
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2021
- 2021-12-16 CN CN202123194049.XU patent/CN216928563U/en active Active
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