CN111491491A - Efficient heat dissipation rack-mounted server - Google Patents
Efficient heat dissipation rack-mounted server Download PDFInfo
- Publication number
- CN111491491A CN111491491A CN202010305060.XA CN202010305060A CN111491491A CN 111491491 A CN111491491 A CN 111491491A CN 202010305060 A CN202010305060 A CN 202010305060A CN 111491491 A CN111491491 A CN 111491491A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- server
- heat
- outer frame
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 118
- 238000001816 cooling Methods 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229920000742 Cotton Polymers 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 9
- 229910002804 graphite Inorganic materials 0.000 abstract description 4
- 239000010439 graphite Substances 0.000 abstract description 4
- -1 graphite alkene Chemical class 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000007792 addition Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-efficiency heat dissipation rack-mounted server which comprises a server main body, an outer frame body and a connecting port, wherein the server main body is arranged inside the outer frame body, a heat dissipation calandria is arranged inside the server main body, a heat dissipation device and an air cooling pipe are arranged inside the outer frame body, the heat dissipation device is connected with the air cooling pipe, the heat dissipation calandria is connected with the heat dissipation device, and a heat dissipation mesh plate is arranged at one end of the outer frame body. The heat dissipation device is arranged at the four corners of the outer frame body, one end of the air cooling pipe enters air and the other end of the air cooling pipe exits air, the whole heat dissipation wind direction flows in an H shape, the contact area of the heat dissipation wind direction and the internal heat is increased, and therefore the heat is effectively discharged out of the device through the air cooling pipe; through the heat dissipation strip of last installation at the forced air cooling pipe to holistic heat-conducting component all passes through graphite alkene material preparation, very big improvement holistic heat conduction effect, improved the radiating efficiency, guaranteed the normal operating of server.
Description
Technical Field
The invention belongs to the technical field of servers, and particularly relates to a high-efficiency heat-dissipation rack-mounted server.
Background
With the increasing development of modern big data technology, the requirement for data calculation is higher and higher nowadays, meanwhile, the requirement for a CPU (central processing unit) for data processing is higher, and more importantly, heat generated by the CPU in the operation process needs to be dissipated timely, so that the operation speed and the service life of the CPU are prevented from being influenced by long-time high temperature; blade server, rack-mounted server and tower server are adopted mostly in big data calculation's equipment among the prior art, and current most rack-mounted server all has the drawback that the radiating effect is poor, leads to the heat dissipation that can not be timely in the use of reality, influences normal work.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a high-efficiency heat-radiating rack-mounted server.A heat-radiating device is arranged at four corners of an outer frame body, air is fed into one end of an air-cooled pipe and exhausted out of the other end of the air-cooled pipe, the whole heat-radiating wind direction flows in an H shape, the contact area with internal heat is increased, and therefore the heat is more effectively exhausted out of the device through the air-cooled pipe; through the heat dissipation strip of last installation at the forced air cooling pipe to holistic heat-conducting component all passes through graphite alkene material preparation, very big improvement holistic heat conduction effect, improved the radiating efficiency, guaranteed the normal operating of server.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a high-efficient heat dissipation rack-mounted server, includes server main part, outer frame body and connection port, the inside at outer frame body is installed to the server main part, has the heat dissipation calandria at the internally mounted of server main part, is equipped with heat abstractor and forced air cooling pipe in the inside of outer frame body, heat abstractor is connected with forced air cooling pipe, the heat dissipation calandria is connected with heat abstractor, the heat dissipation mesh board is installed to the one end of outer frame body, one side of heat dissipation mesh board is equipped with built-in filter screen, built-in filter screen cooperatees with heat abstractor, be equipped with the protective cover in the outer frame body, install the fin on the protective cover, the fin with CPU in the server main part cooperatees, installs the heating panel in the outside of outer frame body.
Preferably, the heating panel is equipped with a plurality ofly, and a plurality of heating panels divide into two sets ofly, and two sets of heating panels symmetry are installed on the outer wall of outer frame body, can dispel the heat to the server main part, have guaranteed the normal operating of server.
Preferably, the number of the heat dissipation devices is four, and the four heat dissipation devices are distributed at four corners of the outer frame body and used for dissipating heat of the server main body, so that the heat dissipation efficiency of the server main body is improved, and the normal operation of the server is guaranteed.
Preferably, every heat abstractor includes two radiator fan, baffle, two seal hose, the baffle is installed between two radiator fan, still is equipped with the soundproof cotton in heat abstractor, seal hose installs the one end at radiator fan, two radiator fan are connected with air-cooled pipe through seal hose, another is connected with the heat dissipation calandria through seal hose, and seal hose can improve inside leakproofness, connects through seal hose and can avoid causing the junction to appear droing because of the shake that radiator fan operation produced, has guaranteed the radiating effect, and the soundproof cotton can avoid producing the noise of too big decibel, has guaranteed operational environment's silence.
Preferably, the two ends of the air cooling pipe are connected with the two cooling fans, and the rotors inside the two cooling fans are opposite in rotation direction, so that the air flow in the server is accelerated, and the cooling efficiency is improved.
Preferably, the air cooling pipe is of an integrated structure and is made of graphene materials, so that the stability of the air cooling pipe is guaranteed, and the heat dissipation efficiency is improved.
Preferably, all install the heat dissipation strip on the inner wall of forced air cooling pipe and the outer wall, the heat dissipation strip is equipped with a plurality ofly, and a plurality of heat dissipation strips are the equidistant distribution of annular array on forced air cooling pipe, can increase with the inside thermal area of contact of server, have improved the radiating efficiency, have guaranteed the normal operating of server.
Preferably, the heat dissipation calandria is Z-shaped, two ends of the heat dissipation calandria are connected with the two heat dissipation fans at opposite angles, and the rotors inside the two heat dissipation fans rotate in opposite directions, so that the air flow in the server is accelerated, and the heat dissipation efficiency is improved.
The invention has the beneficial effects that:
1) the heat dissipation device is arranged at the four corners of the outer frame body, one end of the air cooling pipe enters air and the other end of the air cooling pipe exits air, the whole heat dissipation wind direction flows in an H shape, the contact area of the heat dissipation wind direction and the internal heat is increased, and therefore the heat is effectively discharged out of the device through the air cooling pipe; through the heat dissipation strip of last installation at the forced air cooling pipe to holistic heat-conducting component all passes through graphite alkene material preparation, very big improvement holistic heat conduction effect, improved the radiating efficiency, guaranteed the normal operating of server.
2) The plurality of heat dissipation plates are divided into two groups, and the two groups of heat dissipation plates are symmetrically arranged on the outer wall of the outer frame body, so that heat can be dissipated to the server main body, and the normal operation of the server is ensured.
3) The four heat dissipation devices are distributed at four corners of the outer frame body and used for dissipating heat of the server main body, so that the heat dissipation efficiency of the server main body is improved, and the normal operation of the server is ensured; every heat abstractor includes two radiator fan, baffle, two seal hose, the baffle is installed between two radiator fan, still is equipped with soundproof cotton in heat abstractor, seal hose installs the one end at radiator fan, two radiator fan are connected with the forced air cooling pipe through seal hose, another is connected with the heat dissipation calandria through seal hose, and seal hose can improve inside leakproofness, connects through seal hose and can avoid causing the junction to appear droing because of the shake that radiator fan operation produced, has guaranteed the radiating effect, and soundproof cotton can avoid producing the noise of too big decibel, has guaranteed operational environment's silence.
4) The inner wall and the outer wall of the air cooling pipe are respectively provided with a plurality of heat dissipation strips, and the plurality of heat dissipation strips are distributed on the air cooling pipe in an annular array at equal intervals, so that the contact area of the heat dissipation strips and the heat inside the server can be increased, the heat dissipation efficiency is improved, and the normal operation of the server is ensured; the air cooling pipe is of an integrated structure and is made of graphene materials, so that the stability of the air cooling pipe is ensured, and the heat dissipation efficiency is improved; the heat dissipation strips are installed on the air-cooled pipe and are arranged in a plurality of annular arrays, and the heat dissipation strips are distributed on the air-cooled pipe at equal intervals, so that the contact area with the heat inside the server can be increased, the heat dissipation efficiency is improved, and the normal operation of the server is ensured.
5) The heat dissipation calandria is Z-shaped, two ends of the heat dissipation calandria are connected with the two heat dissipation fans at opposite angles, and the rotors inside the two heat dissipation fans are opposite in rotation direction, so that the air flow in the server is accelerated, and the heat dissipation efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a rack server with high efficiency heat dissipation according to the present invention.
Fig. 2 is a schematic structural diagram of a heat dissipation device in an efficient heat dissipation rack server according to the present invention.
Fig. 3 is a schematic structural diagram of an air-cooling duct in an efficient heat dissipation rack server according to the present invention.
Fig. 4 is a side view of an air-cooled duct in an efficient heat-dissipating rack-mounted server according to the present invention.
Fig. 5 is a schematic structural diagram of an installation diagram of an air-cooling pipe in an efficient heat dissipation rack server according to the present invention.
In the figure: 1. a server main body; 2. an outer frame body; 3. a connection port; 4. a heat sink; 5. a heat dissipation mesh plate; 6. a heat sink; 7. a heat dissipation plate; 8. a heat dissipation calandria; 9. a protective cover; 10. an air-cooled pipe; 11. A heat radiation fan; 12. sealing the hose; 13. a filter screen is arranged inside; 14. a heat dissipating strip; 15. a separator.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1 to 5, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
A high-efficiency heat dissipation rack-mounted server comprises a server main body 1, an outer frame body 2 and a connecting port 3, wherein the server main body 1 is arranged inside the outer frame body 2, a heat dissipation calandria 8 is arranged inside the server main body 1, a heat dissipation device 4 and an air cooling pipe 10 are arranged inside the outer frame body 2, the heat dissipation device 4 is connected with the air cooling pipe 10, the heat dissipation calandria 8 is connected with the heat dissipation device 4, a heat dissipation mesh plate 5 is arranged at one end of the outer frame body 2, a built-in filter screen 13 is arranged on one side of the heat dissipation mesh plate 5, the built-in filter screen 13 is matched with the heat dissipation device 4 and used for preventing external dust from entering the server main body 1 to influence the heat dissipation effect, a protective cover 9 is arranged on the outer frame body 2, a heat dissipation fin 6 is arranged on the protective cover, a heat dissipation plate 7 is arranged on the outer side of the outer frame body 2, and the connection port 3 is arranged on the server main body 1 and close to one end of the heat dissipation mesh plate 5 to ensure data transmission with the outside; the heat dissipation devices 4 are arranged at the four corners of the outer frame body 2, air is fed into one end of the air cooling pipe 10, air is discharged out of the other end of the air cooling pipe, the whole heat dissipation wind direction flows in an H shape, the contact area of the heat with the inside is increased, and therefore the heat is more effectively discharged out of the device through the air cooling pipe 10; through installing heat dissipation strip 14 on air-cooled pipe 10 to holistic heat-conducting component all makes through graphite alkene material, very big improvement holistic heat conduction effect, improved the radiating efficiency, guaranteed the normal operating of server.
The heating panel 7 is equipped with a plurality ofly, and a plurality of heating panels 7 divide into two sets ofly, and two sets of heating panels 7 symmetry are installed on the outer wall of outer frame body 2, can dispel the heat to server main part 1, have guaranteed the normal operating of server.
The four heat dissipation devices 4 are distributed at four corners of the outer frame body 2, and are used for dissipating heat of the server main body 1, so that the heat dissipation efficiency of the server main body 1 is improved, and the normal operation of the server is guaranteed.
Every heat abstractor 4 includes two radiator fan 11, baffle 15, two sealing hose 12, baffle 15 is installed between two radiator fan 11, still is equipped with soundproof cotton in heat abstractor 4, sealing hose 12 installs the one end at radiator fan 11, two radiator fan 11 are connected with forced air cooling pipe 10 through sealing hose 12, and another is connected with heat dissipation calandria 8 through sealing hose 12, and sealing hose 12 can improve inside leakproofness, connects through sealing hose 12 and can avoid causing the junction to drop because of the shake that radiator fan operation produced, has guaranteed the radiating effect, and soundproof cotton can avoid producing the noise of too big decibel, has guaranteed operational environment's silence.
The two ends of the air-cooled pipe 10 are connected with the two cooling fans 11, and the rotors inside the two cooling fans 11 are opposite in rotation direction, so that the air flow in the server is accelerated, and the cooling efficiency is improved.
The air cooling pipe 10 is of an integrated structure and is made of graphene materials, so that stability of the air cooling pipe 10 is guaranteed, and heat dissipation efficiency is improved.
All install heat dissipation strip 14 on the inner wall of forced air cooling pipe 10 and the outer wall, heat dissipation strip 14 is equipped with a plurality ofly, and a plurality of heat dissipation strips 14 are the equidistant distribution of annular array on forced air cooling pipe 10, can increase with the inside thermal area of contact of server, have improved the radiating efficiency, have guaranteed the normal operating of server.
The heat dissipation calandria 8 is Z-shaped, two ends of the heat dissipation calandria 8 are connected with the two heat dissipation fans 11 at opposite angles, and the rotors inside the two heat dissipation fans 11 are opposite in rotation direction, so that the air flow in the server is accelerated, and the heat dissipation efficiency is improved.
The cooling fins 6 are made of graphene materials, so that heat generated by the CPU on the server main body 1 can be more quickly led out and dissipated, and normal operation of the server is guaranteed.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the present invention as defined in the accompanying claims.
Claims (8)
1. The utility model provides a high-efficient heat dissipation rack-mounted server, includes server main part, outer frame body and connection port, its characterized in that, the inside at outer frame body is installed to the server main part, has the heat dissipation calandria at the internally mounted of server main part, is equipped with heat abstractor and forced air cooling pipe in the inside of outer frame body, heat abstractor is connected with forced air cooling pipe, the heat dissipation calandria is connected with heat abstractor, the heat dissipation mesh board is installed to the one end of outer frame body, one side of heat dissipation mesh board is equipped with built-in filter screen, built-in filter screen cooperatees with heat abstractor, be equipped with the protective cover in the outer frame body, install the fin on the protective cover, the fin with CPU in the server main part cooperatees, installs the heating panel in the outside of outer frame body.
2. The rack server according to claim 1, wherein the number of the heat dissipation plates is two, and the two sets of heat dissipation plates are symmetrically mounted on the outer wall of the outer frame.
3. The rack-mounted server with high efficiency heat dissipation of claim 1, wherein four heat dissipation devices are disposed at four corners of the outer frame.
4. The rack server according to claim 3, wherein each heat sink comprises two heat dissipation fans, a partition board, and two sealing hoses, the partition board is installed between the two heat dissipation fans, the sound-proof cotton is further installed in the heat sink, the sealing hose is installed at one end of the heat dissipation fan, one of the two heat dissipation fans is connected to the air-cooled pipe through the sealing hose, and the other of the two heat dissipation fans is connected to the heat dissipation pipes through the sealing hose.
5. The rack-mounted server with efficient heat dissipation of claim 4, wherein the two ends of the air-cooled tube are connected to two heat dissipation fans, and the rotors inside the two heat dissipation fans are in opposite directions.
6. The rack-mounted server with high efficiency heat dissipation according to claim 5, wherein the air-cooled tube is of an integrated structure and is made of graphene material.
7. The rack-mounted server with high efficiency heat dissipation of claim 6, wherein the air-cooled tube has a plurality of heat dissipation strips mounted on the inner wall and the outer wall thereof, and the plurality of heat dissipation strips are distributed on the air-cooled tube in an annular array at equal intervals.
8. The rack server according to claim 4, wherein the heat dissipation pipes are Z-shaped, and two ends of the heat dissipation pipes are connected to two heat dissipation fans at opposite angles, and the rotation directions of the rotors inside the two heat dissipation fans are opposite.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010305060.XA CN111491491A (en) | 2020-04-17 | 2020-04-17 | Efficient heat dissipation rack-mounted server |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010305060.XA CN111491491A (en) | 2020-04-17 | 2020-04-17 | Efficient heat dissipation rack-mounted server |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111491491A true CN111491491A (en) | 2020-08-04 |
Family
ID=71813696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010305060.XA Withdrawn CN111491491A (en) | 2020-04-17 | 2020-04-17 | Efficient heat dissipation rack-mounted server |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111491491A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112013572A (en) * | 2020-09-09 | 2020-12-01 | 周毛婉 | Air conditioner evaporator for engineering machinery |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6731502B1 (en) * | 2002-11-14 | 2004-05-04 | Inventec Corporation | Heat dissipation device for server |
CN104936399A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Dustproof network cabinet |
CN206975601U (en) * | 2017-07-25 | 2018-02-06 | 李斯博 | A kind of radiator structure of computer |
CN110764574A (en) * | 2019-09-26 | 2020-02-07 | 广州视觉风科技有限公司 | Big screen of wisdom based on wireless control |
-
2020
- 2020-04-17 CN CN202010305060.XA patent/CN111491491A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6731502B1 (en) * | 2002-11-14 | 2004-05-04 | Inventec Corporation | Heat dissipation device for server |
CN104936399A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Dustproof network cabinet |
CN206975601U (en) * | 2017-07-25 | 2018-02-06 | 李斯博 | A kind of radiator structure of computer |
CN110764574A (en) * | 2019-09-26 | 2020-02-07 | 广州视觉风科技有限公司 | Big screen of wisdom based on wireless control |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112013572A (en) * | 2020-09-09 | 2020-12-01 | 周毛婉 | Air conditioner evaporator for engineering machinery |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN209821768U (en) | Computer radiator device | |
CN111491491A (en) | Efficient heat dissipation rack-mounted server | |
CN211019105U (en) | Switch with dustproof function of heat dissipation | |
CN106774751B (en) | External surface heat abstractor | |
CN209358427U (en) | Frequency converter and air conditioner | |
CN213814525U (en) | Heat dissipation device for large data server host | |
CN214170075U (en) | Fan room capable of quickly dissipating heat | |
CN211956368U (en) | Computer water-cooling heat abstractor | |
CN210569136U (en) | Heat dissipation device for ventilation air conditioner | |
CN210980248U (en) | Machine room ventilation chamber | |
CN111930188A (en) | Air self-flowing type large-scale computer dustproof heat dissipation case | |
CN219938826U (en) | A dustproof, high-efficient heat radiation structure for power supply unit | |
CN216960633U (en) | Air-cooled heat dissipation plate for network communication equipment | |
CN111399609A (en) | High-efficient cooling system for computer | |
CN220629875U (en) | Display backboard structure | |
CN217360676U (en) | Notebook computer display screen with novel radiator | |
CN215421464U (en) | Photoelectric communication box with multiple heat radiation structures | |
CN209928357U (en) | Device for computer heat dissipation and heat dissipation mechanism | |
CN111103955A (en) | Combined heat dissipation device for server | |
CN212460490U (en) | Server heat dissipation device for local information service platform | |
CN220505174U (en) | Generator set heat abstractor | |
CN219695694U (en) | Server with heat radiation structure | |
CN220651216U (en) | Duct type heat abstractor | |
CN211061987U (en) | Computer air guide cover | |
CN211531647U (en) | Signal acquisition's supervisor with heat dissipation function |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200804 |
|
WW01 | Invention patent application withdrawn after publication |