CN111399609A - High-efficient cooling system for computer - Google Patents
High-efficient cooling system for computer Download PDFInfo
- Publication number
- CN111399609A CN111399609A CN202010188867.XA CN202010188867A CN111399609A CN 111399609 A CN111399609 A CN 111399609A CN 202010188867 A CN202010188867 A CN 202010188867A CN 111399609 A CN111399609 A CN 111399609A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- computer
- box
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 120
- 239000007788 liquid Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000004519 grease Substances 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 230000007774 longterm Effects 0.000 abstract description 5
- 239000012141 concentrate Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 241000405070 Percophidae Species 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention provides a high-efficiency heat dissipation system for a computer. High-efficient cooling system for computer includes: the computer comprises a computer case, a power supply, a mounting plate and a display card, wherein the power supply and the mounting plate are both arranged in the computer case, and the display card is arranged on one side of the mounting plate; the first fan is fixedly arranged on the display card; the heat dissipation box is fixedly installed on one side, far away from the display card, of the mounting plate. The efficient heat dissipation system for the computer can concentrate heat inside the computer and discharge the heat through the air outlet pipe by arranging the heat dissipation box, and meanwhile, the liquid heat dissipation assembly is arranged to assist the heat dissipation box in heat dissipation and blow the heat out of the computer case under the cooperation of the first fan, so that the heat inside the computer can be timely and quickly blown out of the computer case, the purpose of efficient heat dissipation is achieved, and the long-term use of the computer is facilitated.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a high-efficiency heat dissipation system for a computer.
Background
The heat generating element of computer mainly is CPU and display card, the inside heat production of computer is more, be unfavorable for the better operation of computer, also be unfavorable for the long-term use of inner member, consequently, need dispel the heat to the computer inside, however, traditional computer cooling system is comparatively simple, just installs several fans, this kind of radiating efficiency is lower, a plurality of fans operate simultaneously, make the inside wind vortex that forms of computer easily to make the heat can not in time spill, be unfavorable for computer heat dissipation and long-term use.
Therefore, it is necessary to provide an efficient heat dissipation system for a computer to solve the above technical problems.
Disclosure of Invention
The invention aims to provide an efficient cooling system for a computer.
In order to solve the above technical problems, the present invention provides a high efficiency heat dissipation system for a computer, comprising: the computer comprises a computer case, a power supply, a mounting plate and a display card, wherein the power supply and the mounting plate are both arranged in the computer case, and the display card is arranged on one side of the mounting plate; the first fan is fixedly arranged on the display card; the heat dissipation box is fixedly installed on one side, far away from the display card, of the mounting plate and is used for absorbing heat on the mounting plate; liquid heat dissipation assembly, liquid heat dissipation assembly locates computer machine incasement, liquid heat dissipation assembly is used for absorbing the heat of heat dissipation incasement, liquid heat dissipation assembly includes thermal-arrest copper pipe, thermal-arrest copper pipe fixed mounting be in the heat dissipation incasement, the both ends of thermal-arrest copper pipe all extend to outside the heat dissipation incasement, fixed mounting has miniature pump on one side inner wall of computer machine case, fixed mounting has the connecting pipe on the miniature pump, the connecting pipe is kept away from miniature pump's one end fixed mounting has the water tank, the both ends of thermal-arrest copper pipe respectively with miniature pump with water tank fixed connection, the material of water tank is the copper product.
Preferably, a plurality of radiating fins are arranged in the radiating box, and two sides of the plurality of radiating fins are fixedly connected with the inside of the radiating box.
Preferably, the mounting plate, the heat dissipation box and the plurality of heat dissipation fins are made of copper materials.
Preferably, the radiating fins are distributed in a staggered manner.
Preferably, a duckbilled type pipe is fixedly mounted on the lower portion of one side of the heat dissipation box, the duckbilled type pipe is communicated with the heat dissipation box, an air inlet hole is formed in one side of the computer case, and the air inlet hole is communicated with the duckbilled type pipe.
Preferably, one side upper portion fixed mounting of heat dissipation case has a tuber pipe, go out the tuber pipe with the heat dissipation case is linked together, it keeps away from to go out the tuber pipe the one end of heat dissipation case extends to outside the computer machine case, one side fixed mounting of computer machine case has two filter screens, two the filter screen respectively with the fresh air inlet with go out tuber pipe looks adaptation.
Preferably, the air outlet pipe is internally provided with a second fan, the second fan is fixedly connected with the air outlet pipe, and the second fan is used for extracting heat in the heat dissipation box.
Preferably, the mounting panel is close to the even one deck heat conduction silicone grease of paining in one side of heat dissipation case, heat dissipation case and heat conduction silicone grease in close contact with, fixed mounting has four threaded sleeve on the mounting panel, four the threaded sleeve is the rectangle array and distributes, the equal fixed mounting in top and the bottom of heat dissipation case has the fixed plate, two equal threaded mounting has two screws, four on the fixed plate the screw respectively with corresponding threaded sleeve threaded connection.
Preferably, a heat absorption pipe is fixedly installed on the power supply, and the heat absorption pipe is communicated with the heat dissipation box.
Preferably, the first fan is sleeved with a protective sleeve, the computer case is provided with a plurality of heat dissipation holes, and the heat dissipation holes are used for blowing heat in the computer case out of the computer case by the first fan.
Compared with the related art, the high-efficiency cooling system for the computer provided by the invention has the following beneficial effects:
the invention provides a high-efficiency heat dissipation system for a computer, which can concentrate heat inside the computer and discharge the heat through an air outlet pipe by arranging a heat dissipation box, and meanwhile, a liquid heat dissipation assembly is arranged to assist the heat dissipation box in heat dissipation and blow the heat out of a computer case under the coordination of a first fan, so that the heat inside the computer can be quickly blown out of the computer case in time, the purpose of high-efficiency heat dissipation is achieved, and the long-term use of the computer is facilitated.
Drawings
FIG. 1 is a schematic diagram of an internal structure of a high-efficiency heat dissipation system for a computer according to the present invention;
FIG. 2 is a schematic diagram of a front view of a high-efficiency heat dissipation system for a computer according to the present invention;
FIG. 3 is a schematic front sectional view of the efficient heat dissipation system for a computer according to the present invention;
FIG. 4 is a diagram illustrating a distribution of heat dissipation fins in a high-efficiency heat dissipation system for a computer according to the present invention;
FIG. 5 is a schematic structural diagram of a liquid heat dissipation assembly in the high-efficiency heat dissipation system for a computer according to the present invention;
FIG. 6 is a schematic view of an installation structure of an installation board and a heat dissipation box in the efficient heat dissipation system for a computer according to the present invention;
fig. 7 is an exploded view of a mounting plate and a heat dissipation box in the efficient heat dissipation system for a computer according to the present invention.
Reference numbers in the figures: 1. the box, 2, the power, 3, the mounting panel, 4, first fan, 5, the protective sheath, 6, the louvre, 7, the heat dissipation case, 8, the fin, 9, duckbilled type pipe, 10, the fresh air inlet, 11, go out the tuber pipe, 12, the second fan, 13, the filter screen, 14, the thermal-arrest copper pipe, 15, micro-water pump, 16, the connecting pipe, 17, the water tank, 18, heat conduction silicone grease, 19, the screw sleeve, 20, the fixed plate, 21, the screw, 22, the heat absorption pipe.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 1-7, in an embodiment of the present invention, a high-efficiency heat dissipation system for a computer includes: the computer comprises a computer case 1, a power supply 2, a mounting plate 3 and a display card, wherein the power supply 2 and the mounting plate 3 are both arranged in the computer case 1, and the display card is arranged on one side of the mounting plate 3; the first fan 4 is fixedly arranged on the display card; the heat dissipation box 7 is fixedly installed on one side, away from the display card, of the mounting plate 3, and the heat dissipation box 7 is used for absorbing heat on the mounting plate 3; liquid heat dissipation assembly, liquid heat dissipation assembly locates in the computer machine case 1, liquid heat dissipation assembly is used for absorbing heat in the heat dissipation case 7, liquid heat dissipation assembly includes thermal-arrest copper pipe 14, thermal-arrest copper pipe 14 fixed mounting be in the heat dissipation case 7, thermal-arrest copper pipe 14's both ends all extend to outside the heat dissipation case 7, fixed mounting has miniature pump 15 on one side inner wall of computer machine case 1, fixed mounting has connecting pipe 16 on the miniature pump 15, connecting pipe 16 keeps away from the one end fixed mounting of miniature pump 15 has water tank 17, the both ends of thermal-arrest copper pipe 14 respectively with miniature pump 15 with water tank 17 fixed connection, the material of water tank 17 is the copper product, and miniature pump 15's model is DC35H, and miniature pump 15's power comes from power 2.
A plurality of radiating fins 8 are arranged in the radiating box 7, and the two sides of the radiating fins 8 are fixedly connected with the inside of the radiating box 7.
The mounting panel 3 the heat dissipation case 7 is with a plurality of the material of fin 8 is the copper product, adopts the copper product to make the heat absorption better.
The radiating fins 8 are distributed in a staggered mode, distributed in a staggered mode and can be matched with the heat collecting copper pipes 14.
One side lower part fixed mounting of heat dissipation case 7 has duckbilled type pipe 9, duckbilled type pipe 9 with heat dissipation case 7 is linked together, fresh air inlet 10 has been seted up to one side of computer machine case 1, fresh air inlet 10 with duckbilled type pipe 9 is linked together, adopts duckbilled type pipe 9 to make the wind energy that enters into in heat dissipation case 7 increase enough.
One side upper portion fixed mounting of heat dissipation case 7 has a tuber pipe 11, go out tuber pipe 11 with heat dissipation case 7 is linked together, it keeps away from to go out tuber pipe 11 the one end of heat dissipation case 7 extends to outside computer machine case 1, one side fixed mounting of computer machine case 1 has two filter screens 13, two filter screen 13 respectively with fresh air inlet 10 with play tuber pipe 11 looks adaptation, filter screen 13 can stop the dust outside computer machine case 1, avoid the dust to go on in the heat dissipation case 7 to influence the ventilation effect in the heat dissipation case 7, thereby influence the radiating effect of heat dissipation case 7.
The air outlet pipe 11 is internally provided with a second fan 12, the second fan 12 is fixedly connected with the air outlet pipe 11, and the second fan 12 is used for extracting heat in the heat dissipation box 7.
The heat dissipation device is characterized in that a heat absorption pipe 22 is fixedly installed on the power supply 2, the heat absorption pipe 22 is communicated with the heat dissipation box 7, a heat dissipation fan is arranged on the power supply 2, the heat absorption pipe 22 is connected with the heat dissipation fan, and heat blown out by the heat dissipation fan on the power supply 2 directly enters the heat dissipation box 7 and is discharged through the air outlet pipe 11.
The first fan 4 is sleeved with a protective sleeve 5, the computer case 1 is provided with a plurality of heat dissipation holes 6, and the heat dissipation holes 6 are used for blowing heat in the computer case 1 out of the computer case 1 by the first fan 4.
The working principle of the high-efficiency cooling system for the computer provided by the invention is as follows:
when the host is started, after the power supply 2 is electrified, the first fan 4, the second fan 12 and the micro water pump 15 are started simultaneously, and after the first fan 4 is started, the heat emitted by the display card is directly blown out of the display card 1;
after the second fan 12 is started, the heat in the heat dissipation box 7 is blown out of the box computer case 1 through the air outlet pipe 11, so that the air pressure in the heat dissipation box 7 is reduced, at the moment, cooler air outside the computer case 1 enters the heat dissipation box 7 through the duckbill pipe 9, when the host normally operates, a part of heat emitted by some electrical elements such as a CPU (central processing unit) and a display card is dissipated into the computer case 1, the temperature dissipated into the computer case 1 is blown out of the computer case 1 under the action of the first fan 4, a part of heat is absorbed by the mounting plate 3, the mounting plate 3 transfers the heat to the heat dissipation box 7 through the heat-conducting silicone grease 18, the heat dissipation box 7 transfers the heat to the plurality of heat dissipation fins 8, so that the heat on the heat dissipation box 7 is mostly concentrated inside the heat dissipation box 7, at the moment, the heat collection copper pipe 14 can absorb the heat in the heat dissipation box 7 and transfer the heat to the water flowing inside, under the action of the micro water pump 15, water in the heat collection copper pipe 14 flows in a circulating mode, so that the water in the heat collection copper pipe 14 can absorb more heat, the heat is dissipated in the flowing water tank 17, and the dissipated heat is finally blown out of the computer case 1 through the heat dissipation holes 6 by the first fan 4.
Compared with the related art, the high-efficiency cooling system for the computer provided by the invention has the following beneficial effects:
this device can concentrate the heat of computer inside and discharge through going out the tuber pipe through setting up the heat dissipation case, sets up the supplementary heat dissipation case of liquid cooling assembly simultaneously and dispels the heat to blow off computer machine case with the heat under the cooperation of first fan, thereby can in time quick blow off computer machine case with the heat of computer inside, thereby reach high-efficient radiating purpose, more do benefit to the long-term use of computer.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An efficient heat dissipation system for a computer, comprising:
the computer comprises a computer case, a power supply, a mounting plate and a display card, wherein the power supply and the mounting plate are both arranged in the computer case, and the display card is arranged on one side of the mounting plate;
the first fan is fixedly arranged on the display card;
the heat dissipation box is fixedly installed on one side, far away from the display card, of the mounting plate and is used for absorbing heat on the mounting plate;
liquid heat dissipation assembly, liquid heat dissipation assembly locates computer machine incasement, liquid heat dissipation assembly is used for absorbing the heat of heat dissipation incasement, liquid heat dissipation assembly includes thermal-arrest copper pipe, thermal-arrest copper pipe fixed mounting be in the heat dissipation incasement, the both ends of thermal-arrest copper pipe all extend to outside the heat dissipation incasement, fixed mounting has miniature pump on one side inner wall of computer machine case, fixed mounting has the connecting pipe on the miniature pump, the connecting pipe is kept away from miniature pump's one end fixed mounting has the water tank, the both ends of thermal-arrest copper pipe respectively with miniature pump with water tank fixed connection, the material of water tank is the copper product.
2. The system of claim 1, wherein a plurality of heat dissipation fins are disposed inside the heat dissipation box, and both sides of the plurality of heat dissipation fins are fixedly connected to the inside of the heat dissipation box.
3. The system for dissipating heat efficiently from a computer according to claim 2, wherein the material of the mounting plate, the heat dissipating box, and the plurality of heat dissipating fins is copper.
4. The system of claim 2, wherein the fins are distributed in a staggered pattern.
5. The efficient cooling system for computers according to claim 1, wherein a duckbill-shaped pipe is fixedly mounted at a lower portion of one side of the cooling box, the duckbill-shaped pipe is communicated with the cooling box, an air inlet hole is formed at one side of the computer case, and the air inlet hole is communicated with the duckbill-shaped pipe.
6. The efficient heat dissipation system for computers of claim 5, wherein an air outlet pipe is fixedly mounted on an upper portion of one side of the heat dissipation box, the air outlet pipe is communicated with the heat dissipation box, one end of the air outlet pipe, which is far away from the heat dissipation box, extends to the outside of the computer case, two filter screens are fixedly mounted on one side of the computer case, and the two filter screens are respectively matched with the air inlet hole and the air outlet pipe.
7. The efficient cooling system for computers of claim 6, wherein a second fan is disposed in the air outlet pipe, the second fan is fixedly connected to the air outlet pipe, and the second fan is used for extracting heat from the cooling box.
8. The efficient heat dissipation system for computers of claim 1, wherein one side of the mounting plate close to the heat dissipation box is evenly coated with a layer of heat-conducting silicone grease, the heat dissipation box is in close contact with the heat-conducting silicone grease, four threaded sleeves are fixedly mounted on the mounting plate, the four threaded sleeves are distributed in a rectangular array, fixed plates are fixedly mounted at the top and the bottom of the heat dissipation box, two screws are mounted on the two fixed plates in a threaded manner, and the four screws are respectively in threaded connection with the corresponding threaded sleeves.
9. The system of claim 1, wherein a heat absorption tube is fixedly mounted on the power supply, and the heat absorption tube is in communication with the heat dissipation box.
10. The system of claim 1, wherein the first fan is sleeved with a protective cover, the computer case has a plurality of heat dissipation holes, and the heat dissipation holes are used for blowing heat in the computer case out of the computer case by the first fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010188867.XA CN111399609A (en) | 2020-03-17 | 2020-03-17 | High-efficient cooling system for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010188867.XA CN111399609A (en) | 2020-03-17 | 2020-03-17 | High-efficient cooling system for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111399609A true CN111399609A (en) | 2020-07-10 |
Family
ID=71428888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010188867.XA Pending CN111399609A (en) | 2020-03-17 | 2020-03-17 | High-efficient cooling system for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111399609A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112445306A (en) * | 2020-11-30 | 2021-03-05 | 西安电子科技大学 | Computer cooling system based on multi-way cooling |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104656855A (en) * | 2013-11-19 | 2015-05-27 | 江苏阿尼信息技术有限公司 | Water cooling type mainboard |
| CN104850200A (en) * | 2015-05-29 | 2015-08-19 | 黑龙江大学 | Water-cooled computer and application method thereof |
| CN106708219A (en) * | 2015-11-17 | 2017-05-24 | 济南宇星测绘仪器有限公司 | Radiating device for computer chip and working method of radiating device |
| CN206788696U (en) * | 2017-03-22 | 2017-12-22 | 连江大农环保科技有限公司 | A kind of Evapotranspiration heat type computer motherboard |
| CN207198742U (en) * | 2017-07-25 | 2018-04-06 | 天津众赢科技发展有限公司 | A kind of computer water-cooling cooling cabinet |
| CN108427493A (en) * | 2018-05-14 | 2018-08-21 | 安徽机电职业技术学院 | A kind of computer host box temperature control system |
| CN207817636U (en) * | 2018-02-22 | 2018-09-04 | 广东白石实业有限公司 | A kind of high cooling type computer supply unit of insulated type |
| CN109375752A (en) * | 2018-12-07 | 2019-02-22 | 大连鑫鑫创世科技发展有限公司 | A kind of radiator for hard disc and method |
-
2020
- 2020-03-17 CN CN202010188867.XA patent/CN111399609A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104656855A (en) * | 2013-11-19 | 2015-05-27 | 江苏阿尼信息技术有限公司 | Water cooling type mainboard |
| CN104850200A (en) * | 2015-05-29 | 2015-08-19 | 黑龙江大学 | Water-cooled computer and application method thereof |
| CN106708219A (en) * | 2015-11-17 | 2017-05-24 | 济南宇星测绘仪器有限公司 | Radiating device for computer chip and working method of radiating device |
| CN206788696U (en) * | 2017-03-22 | 2017-12-22 | 连江大农环保科技有限公司 | A kind of Evapotranspiration heat type computer motherboard |
| CN207198742U (en) * | 2017-07-25 | 2018-04-06 | 天津众赢科技发展有限公司 | A kind of computer water-cooling cooling cabinet |
| CN207817636U (en) * | 2018-02-22 | 2018-09-04 | 广东白石实业有限公司 | A kind of high cooling type computer supply unit of insulated type |
| CN108427493A (en) * | 2018-05-14 | 2018-08-21 | 安徽机电职业技术学院 | A kind of computer host box temperature control system |
| CN109375752A (en) * | 2018-12-07 | 2019-02-22 | 大连鑫鑫创世科技发展有限公司 | A kind of radiator for hard disc and method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112445306A (en) * | 2020-11-30 | 2021-03-05 | 西安电子科技大学 | Computer cooling system based on multi-way cooling |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201654658U (en) | Dustproof and waterproof closed cabinet radiating device | |
| CN205051560U (en) | Frequency converter | |
| CN206892786U (en) | A kind of computer water-cooling radiating device | |
| CN201590029U (en) | Radiating system | |
| CN101466240B (en) | Radiating device | |
| US20140008039A1 (en) | Liquid-cooling heat dissipation apparatus for electronic elements | |
| CN110034500A (en) | A kind of distribution box of high-performance heat dissipation | |
| CN207529318U (en) | A kind of computer efficient radiating apparatus | |
| CN111399609A (en) | High-efficient cooling system for computer | |
| CN207766778U (en) | A kind of server rack with heat sinking function | |
| CN106774751B (en) | External surface heat abstractor | |
| CN209343288U (en) | A kind of giant scale integration server central water-cooling pedestal | |
| CN208386082U (en) | A kind of busbar side board of high heat dispersion | |
| TWI397369B (en) | Heat dissipation device | |
| CN109152281A (en) | Locomotive information service terminal heat-conducting radiator | |
| CN214042256U (en) | Water-cooling heat dissipation machine case for computer | |
| CN115047960A (en) | Auxiliary heat dissipation device for computer | |
| CN209248442U (en) | A kind of computer water-cooling turbine radiator | |
| CN206672004U (en) | A kind of outer surface heat abstractor | |
| CN207424777U (en) | A kind of cooling cabinet | |
| CN111491491A (en) | Efficient heat dissipation rack-mounted server | |
| CN220526290U (en) | Heat abstractor of computer all-in-one | |
| CN220603945U (en) | Efficient heat dissipation module | |
| CN219872315U (en) | Environment-friendly energy-saving radiator | |
| CN206024377U (en) | Power device radiating subassembly and cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200710 |