CN206024377U - Power device radiating subassembly and cooling system - Google Patents

Abstract

The utility model relates to the technical field of design of electric control power devices for elevators, and discloses a cooling assembly for power devices, which includes a radiator and a suction device. The radiator includes a substrate and a plurality of heat pipes arranged on the substrate. The substrate and the power The size of the bottom plate of the device is corresponding, the plurality of heat pipes are embedded in the normal direction of the substrate, each heat pipe is equipped with a phase change medium, the air suction device includes a suction hood, an air duct and a fan unit, the The air suction hood is arranged on the radiator, the air duct connects the air suction hood and the fan unit, an air inlet is opened on the air suction hood, and an air outlet is opened on the fan unit. The utility model also discloses a heat dissipation system composed of power device heat dissipation components. The flexible air duct design of the utility model can separate the layout of the fan and the radiator, the air duct is not restricted, the size of the radiator is reduced to the size of each module, and the thermal resistance is reduced through the heat pipe.

Description

Power device cooling components and cooling system

technical field

The utility model relates to the technical field of design of electric control power devices of elevators, in particular to a power device cooling assembly and a cooling system.

Background technique

In recent years, the field of power electronics has developed rapidly. High-power electric drives, such as finishers, inverters, power supply devices, such as UPS, etc., mostly use power devices such as IGBTs and IPMs to achieve power conversion. Such components tend to generate large amounts of heat, and the temperature rise of power devices seriously affects their service life and reliability. In these occasions, special radiators for power devices must be used. Common radiators are aluminum substrates with fins, gravity heat pipe radiators, and water-cooled radiators. They are large in size, high in cost, and have strict requirements on air duct design.

Utility model content

The purpose of the utility model is to solve the above-mentioned technical problems, and provide a heat dissipation assembly and heat dissipation system for power devices, which can greatly reduce the size of the heat sink, and is suitable for heat dissipation of high-power modules.

The technical scheme that the utility model takes is:

A heat dissipation assembly for a power device, characterized in that it includes a radiator and an air suction device, the radiator includes a substrate and a plurality of heat pipes arranged on the substrate, the substrate corresponds to the size of the bottom plate of the power device, and the plurality of heat pipes The heat pipes are embedded in the normal direction of the substrate, each heat pipe is equipped with a phase change medium, and the total maximum heat transfer of the plurality of heat pipes is greater than the heating power of the power device; the air suction device includes a suction hood , an air duct and a fan unit, the air suction hood is arranged on the radiator, the air duct connects the air suction hood and the fan unit, an air inlet is opened on the air suction hood, the There is an air outlet on the fan unit.

Further, the heat pipe is expanded or welded to the substrate through holes in the substrate, the bottom of the heat pipe is flush with the substrate, the part of the heat pipe submerged in the substrate is cylindrical, and the part exposed to the substrate is conical.

Further, the heat pipe is filled with pure water or a mixture of water and alcohol.

Further, the air suction hood completely covers the radiator, and a first air chamber is formed in the air suction hood above the radiator, and the air inlet of the air suction hood is an air intake grid, which is arranged on around the hood.

Further, the air intake grid is a rhombus grid.

Further, a second air chamber is formed at the connection position between the fan unit and the air duct, the air duct is a flexible hollow duct, and the air duct is screw-fastened with the suction hood and the fan unit.

A power device heat dissipation system, which is composed of the above-mentioned power device heat dissipation assembly, is characterized in that the air ducts of each heat dissipation assembly are connected to the same fan unit, and the fan unit includes a plurality of fan combinations, and a plurality of air ducts The second air cavity connected with the fan unit is in communication.

The beneficial effects of the utility model are:

(1) The heat pipe is set according to the layout of the semiconductor chip inside the power device, and the heat pipe can exert the maximum heat transfer efficiency;

(2) The inside of the heat pipe is filled with a phase-change medium to improve the thermal conductivity. The conical and cylindrical structures, combined with the air cavity 1 of the suction hood and the air inlet grid, can quickly perform heat exchange. The size of a single radiator is the smallest and does not require Traditional fin cooling;

(3) The centralized fan unit, combined with the air duct, the radiator and the fan unit can be flexibly arranged, which is convenient for the space layout of the cabinet and saves the size of the cabinet. The overall radiator and air duct design, compared with traditional air-cooled radiators and heat pipe radiators, has lower thermal resistance, the most space-saving, smallest size, and more flexible layout.

Description of drawings

Accompanying drawing 1 is the side view of radiator of the present utility model;

Accompanying drawing 2 is the front view of radiator of the present utility model;

Accompanying drawing 3 is the structural representation that air suction hood is arranged on radiator;

Accompanying drawing 4 is the structural schematic diagram of the heat dissipation assembly in the heat dissipation system.

The labels in the accompanying drawings are respectively:

1. Radiator; 2. Suction device;

3. Substrate; 4. Heat pipe;

5. Suction hood; 6. Air duct;

7. Fan unit; 8. Air intake grille;

9. The first air chamber; 10. Air outlet;

11. Second air chamber; 12. Fan unit.

detailed description

The specific implementation of the power device heat dissipation assembly and heat dissipation system of the present invention will be described in detail below in conjunction with the accompanying drawings.

Referring to accompanying drawings 1 and 2, the power device heat dissipation assembly includes a radiator 1 and an air suction device 2. The radiator 1 includes a substrate 3 and a plurality of heat pipes 4 arranged on the substrate 3. The substrate 3 corresponds to the size of the bottom plate of the power device. A heat pipe 4 is embedded in the normal direction of the substrate 3 . The substrate 3 can be made of aluminum alloy or pure copper, and the surface treatment is done; the size of the substrate 3 is the same as or slightly larger than that of the bottom plate of the power device; there are through holes on the substrate 3 that can fasten the heat pipe 4, and the number and position of the holes are at least the same as Power device semiconductor chip correspondence. The heat pipe 4 is installed perpendicular to the substrate 3, and is expanded or welded with the substrate 3 through the hole on the substrate 3 to ensure good contact; the bottom of the heat pipe 4 is flush with the substrate 3 to ensure a certain flatness and roughness; the heat pipe 4 is submerged The part of the substrate 3 is cylindrical, and the part exposed to the substrate 3 is conical; the inside of the heat pipe 4 is filled with a certain amount of medium with phase change capability, such as pure water, a mixture of water and alcohol, or a mixture of other chemical liquids. The product of the calorific value and the number of heat pipes 4 should be greater than the calculated heating power of the module.

Referring to accompanying drawings 3 and 4, the air suction device 2 includes a suction hood 5, an air duct 6 and a fan unit 7, the air suction hood 5 is covered on the radiator 1, and the air duct 6 is connected to the air suction hood 5 and the fan unit 7, An air inlet is provided on the air suction cover 5, and an air outlet 10 is provided on the fan unit 7. The air suction hood 5 is completely covered on the radiator 1, and the first air cavity 9 is formed in the air suction hood 5 above the radiator 1, and there is a gas flow space at the bottom of the heat pipe 4, and the air inlet of the air suction hood 5 is for the air inlet. The air grid 8 is arranged around the suction hood 5 . The connection position between the fan unit 7 and the air duct 6 forms a second air cavity 11, and the air duct 6 is a flexible hollow pipe, which can be freely bent and screw-fastened to the air duct 6 and the suction hood 5 and the fan unit 7 to achieve a sealing effect.

A plurality of fan units 7 form a fan unit 12 , and a plurality of air ducts 6 communicate with the second air cavity 11 connected to the fan units 7 . The fan unit 12 is composed of several air duct connection ports, which are used to connect with the suction hoods 5 corresponding to the radiator 1 modules to form a heat dissipation system. A plurality of fan units 7 form a large-capacity central fan unit, which sucks air from the sides of the 6 air ducts, and vents air from the air outlet 10 to provide ventilation for the suction hood 5 .

The above is only a preferred embodiment of the utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made. It should be regarded as the protection scope of the present utility model.

Claims (7)

1. a kind of power device radiating subassembly, it is characterised in that：Including radiator and air intake device, the radiator includes substrate And the multiple heat pipes arranged on substrate, the substrate is corresponding with the base plate size of power device, and the plurality of heat pipe is inlayed and set The normal direction in the substrate is put, built with phase change medium, total maximum heat transport of the plurality of heat pipe is big for each heat pipe Heating power in the power device；The air intake device includes that suspended hood, airduct and fan unit, the suspended hood cover set On the radiator, the airduct connects the suspended hood and fan unit, on the suspended hood is provided with air inlet, described Air outlet is provided with fan unit.

2. power device radiating subassembly according to claim 1, it is characterised in that：The heat pipe is by the substrate Hole is risen with substrate and connects or weld, and the heat pipe bottom is concordant with substrate, the heat pipe submerge substrate part be column type, dew Go out substrate portion for pyramid type.

3. power device radiating subassembly according to claim 1, it is characterised in that：In the heat pipe filling pure water or water with The mixed liquor of alcohol.

4. power device radiating subassembly according to any one of claim 1 to 3, it is characterised in that：The suspended hood is complete All standing forms the first air cavity, the air inlet of the suspended hood in the suspended hood above the radiator on the radiator Mouth is air inlet grid, is arranged on the surrounding of the suspended hood.

5. power device radiating subassembly according to claim 4, it is characterised in that：The air inlet grid is network.

6. power device radiating subassembly according to any one of claim 1 to 3, it is characterised in that：The fan unit The second air cavity is formed with airduct link position, the airduct is flexible hollow pipeline, the airduct and suspended hood and fan unit Screw-tightened connects.

7. a kind of power device cooling system, is made up of multiple power device radiating subassemblies as described in claim 1 to 6, It is characterized in that：The airduct company of each radiating subassembly is connected to same fan unit, and the fan unit includes multiple wind Fan combination, the second air cavity that multiple airducts are connected with fan unit are connected.