CN217608195U

CN217608195U - Heat radiation structure

Info

Publication number: CN217608195U
Application number: CN202221427350.2U
Authority: CN
Inventors: 王凤昕; 黄炫煜; 甘泉; 谌振宇
Original assignee: Beijing Haqi Robot Technology Co ltd
Current assignee: Beijing Haqi Robot Technology Co ltd
Priority date: 2022-06-08
Filing date: 2022-06-08
Publication date: 2022-10-18
Anticipated expiration: 2032-06-08

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure, which is used for dissipating heat of an electronic product, wherein the electronic product comprises a shell and an electronic element arranged in the shell, the heat dissipation structure comprises a heat dissipation pipe, an air pipe sealing element, a heat conduction element and a fan, and the heat dissipation pipe passes through the shell; the two air pipe sealing pieces are respectively arranged between the air inlet of the radiating pipe and the shell and between the air outlet of the radiating pipe and the shell; one end of the heat conducting piece is contacted with the electronic element, and the other end of the heat conducting piece is positioned in the heat radiating pipe; the fan is arranged in the heat dissipation pipe and used for blowing the air from the air inlet to the air outlet. With the help of the arrangement of the air pipe sealing element, the air inlet and the air outlet can be respectively sealed with the shell, and in the heat dissipation process, the electronic element in the shell can be effectively prevented from being damped, thereby being beneficial to prolonging the service life of the product. In addition, the fan blows air to the air outlet of the radiating pipe from the air inlet of the radiating pipe, hot air can be prevented from circulating in the shell, and radiating efficiency is improved.

Description

Heat radiation structure

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a heat radiation structure.

Background

Along with the development of science and technology, the functions of products such as electronic products, robots and the like are more and more complete, and the requirements on the computational power of circuit boards are higher and the power is high. Therefore, the problem of heat dissipation of the circuit board needs to be solved urgently, and poor heat dissipation can reduce the frequency of the core module, so that many functions cannot be performed normally.

The heat dissipation mode is divided into active heat dissipation and passive heat dissipation, and for some products with higher calculation force requirements, the active heat dissipation cannot meet the use requirements, and a passive heat dissipation scheme is required. The existing passive heat dissipation scheme needs an air inlet and an air outlet, so that the sealing performance of a product cannot be guaranteed, the product is easily affected with damp, and the service life is shortened.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat radiation structure to solve among the prior art problem that the leakproofness of product can't be guaranteed to the heat dissipation process.

In order to achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a heat radiation structure for electronic product heat dissipation, electronic product includes the casing and locates electronic component in the casing, heat radiation structure includes:

a heat dissipation tube passing through the housing;

the two air pipe sealing pieces are respectively arranged between the air inlet of the radiating pipe and the shell and between the air outlet of the radiating pipe and the shell;

one end of the heat conducting piece is contacted with the electronic element, and the other end of the heat conducting piece is positioned in the heat radiating pipe;

and the fan is arranged in the heat dissipation pipe and used for blowing gas from the air inlet to the air outlet.

As an optimal technical scheme of the heat dissipation structure, the heat dissipation structure further comprises a heat conduction sealing element, the heat dissipation tube is provided with a heat conduction hole, the heat conduction element is embedded in the heat conduction hole, and the heat conduction sealing element is arranged between the heat conduction element and the heat dissipation tube.

As a preferred technical scheme of a heat radiation structure, the heat conducting piece and the heat radiation pipe are integrally formed.

As a preferred technical scheme of a heat radiation structure, the heat radiation pipe is provided with a wire hole penetrating to the inside of the shell, a power wire of the fan penetrates through the wire hole, and the heat radiation pipe and the power wire are sealed through a wire sealing piece.

As a preferred technical scheme of the heat dissipation structure, the heat dissipation structure further comprises a support, the support is arranged in the heat dissipation pipe, and the fan is installed on the support.

As a preferred technical scheme of the heat dissipation structure, the support and the heat dissipation pipe are integrally formed.

As a preferred technical solution of the heat dissipation structure, the heat conducting member includes a heat conducting plate and heat dissipation fins disposed on the heat conducting plate, the heat conducting plate contacts with the electronic component, and the heat dissipation fins are disposed in the heat dissipation tube.

As a preferred technical solution of the heat dissipation structure, the heat conducting plate is screwed with the electronic component.

As a preferred technical scheme of the heat dissipation structure, the number of the heat conduction plates is two, and the heat dissipation fins are arranged between the two heat conduction plates; the two heat conduction plates are respectively contacted with the two electronic elements.

As a preferred technical solution of a heat dissipation structure, the heat conducting members are provided in a plurality, and the plurality of heat conducting members are arranged in one-to-one correspondence with the plurality of electronic components and used for conducting heat to the plurality of electronic components; or

The plurality of heat-conducting members are each adapted to conduct heat for one of the electronic components.

The utility model has the advantages that:

the utility model provides a heat radiation structure, which is used for radiating heat for an electronic product, wherein the electronic product comprises a shell and an electronic element arranged in the shell, the heat radiation structure comprises a heat radiation pipe, an air pipe sealing element, a heat conduction element and a fan, and the heat radiation pipe passes through the shell; the two air pipe sealing pieces are respectively arranged between the air inlet of the radiating pipe and the shell and between the air outlet of the radiating pipe and the shell; one end of the heat conducting piece is contacted with the electronic element, and the other end of the heat conducting piece is positioned in the heat radiating pipe; the fan is arranged in the heat dissipation pipe and used for blowing the air from the air inlet to the air outlet. By means of the arrangement of the air pipe sealing element, the air inlet and the air outlet can be respectively sealed with the shell, electronic elements in the shell can be effectively prevented from being damped in the heat dissipation process, and the service life of a product is prolonged. In addition, the fan blows air to the air outlet of the radiating pipe from the air inlet of the radiating pipe, hot air can be prevented from circulating in the shell, and radiating efficiency is improved.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation structure in an embodiment of the present invention;

fig. 2 is an explosion structure diagram of the heat dissipation structure in the embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a heat dissipation structure according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a heat conducting member according to an embodiment of the present invention;

FIG. 5 is a schematic structural view of a heat pipe with a heat conducting hole according to an embodiment of the present invention;

fig. 6 is an explosion structure diagram of a heat dissipation structure provided with two heat conduction plates in the embodiment of the present invention;

fig. 7 is a schematic cross-sectional view of a heat dissipation structure with two heat conductive plates according to an embodiment of the present invention;

FIG. 8 is a schematic view of a heat-conducting member having two heat-conducting plates according to an embodiment of the present invention;

fig. 9 is a schematic structural view of the heat pipe with two heat conduction holes according to the embodiment of the present invention.

In the figure:

100. a housing; 101. an upper cover; 102. a lower cover; 200. an electronic component;

1. a radiating pipe; 11. an air inlet; 12. an air outlet; 13. a heat conduction hole;

2. an air duct sealing element;

3. a heat conductive member; 31. a heat conducting plate; 32. heat dissipation fins;

4. a fan; 41. a power line; 42. a wire seal;

5. a thermally conductive seal;

6. and (4) a bracket.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

As shown in fig. 1 to 5, the present embodiment provides a heat dissipation structure for dissipating heat of an electronic product, where the electronic product includes a housing 100 and an electronic component 200 disposed in the housing 100, and the electronic product may be a robot or a processor of the robot. The heat dissipation structure comprises a heat dissipation pipe 1, an air pipe sealing member 2, a heat conducting member 3 and a fan 4, wherein the heat dissipation pipe 1 penetrates through a shell 100; the two air pipe sealing pieces 2 are respectively arranged between the air inlet 11 of the radiating pipe 1 and the shell 100 and between the air outlet 12 of the radiating pipe 1 and the shell 100; one end of the heat conducting member 3 is in contact with the electronic component 200, and the other end is positioned in the radiating pipe 1; the fan 4 is disposed in the heat pipe 1 for blowing air from the air inlet 11 to the air outlet 12. By means of the arrangement of the air pipe sealing element 2, the air inlet 11 and the air outlet 12 can be respectively sealed with the shell 100, and in the heat dissipation process, the electronic element 200 in the shell 100 can be effectively prevented from being affected with damp, so that the service life of a product is prolonged. In addition, the fan 4 blows air from the air inlet 11 of the heat dissipation pipe 1 to the air outlet 12 of the heat dissipation pipe 1, so that hot air can be prevented from circulating in the casing 100, and the heat dissipation efficiency is improved. In this embodiment, the electronic component 200 may be a circuit board, a CPU, or other devices requiring heat dissipation. The air pipe sealing element 2 can be selected as a rubber sealing ring.

The housing 100 includes an upper cover 101 and a lower cover 102, the upper cover 101 is disposed on the lower cover 102, a mounting cavity is defined between the upper cover 101 and the lower cover 102, and the electronic component 200 is disposed in the mounting cavity. The upper cover 101 is provided with a first inlet notch and a first outlet notch, the lower cover 102 is provided with a second inlet notch and a second outlet notch, when the upper cover 101 is covered on the lower cover 102, the first inlet notch and the second inlet notch form a shell inlet, and the second inlet notch and the second outlet notch form a shell outlet; the radiating pipe 1 penetrates through the inlet of the case and penetrates through the outlet of the case.

Regarding the connection relationship between the heat dissipating structure and the casing 100, in the present embodiment, optionally, the heat dissipating structure further includes a heat conductive sealing member 5, the heat dissipating pipe 1 is provided with a heat conductive hole 13, the heat conductive member 3 is embedded in the heat conductive hole 13, and the heat conductive sealing member 5 is disposed between the heat conductive member 3 and the heat dissipating pipe 1. The heat conductive sealing member 5 is provided to seal the junction between the heat conductive member 3 and the radiating pipe 1, thereby effectively preventing moisture or impurities from entering the interior of the case 100 through the gap between the heat conductive member 3 and the heat conductive hole 13. Wherein, the heat conduction sealing member 5 is a rubber sealing ring.

In another embodiment, the heat conducting member 3 is optionally integrally formed with the radiating pipe 1. The structure can save the arrangement of the heat conduction sealing element 5, save the cost and is favorable for improving the installation efficiency. Wherein the heat conducting member 3 and the heat dissipating pipe 1 are made of copper or aluminum.

Regarding the power supply manner of the fan 4, in the present embodiment, optionally, the heat dissipation pipe 1 is provided with a wire hole penetrating to the inside of the housing 100, the power wire 41 of the fan 4 passes through the wire hole, and the heat dissipation pipe 1 and the power wire 41 are sealed by the wire sealing member 42. This setting makes need not to supply power alone to fan 4, only need follow inside electronic component 200 department with external power source meet can, reduce power cord 41 as far as possible and occupy the inner space of cooling tube 1, improve the radiating efficiency. In addition, the wire seal 42 is provided to prevent moisture or impurities from entering the inside of the housing 100 through a gap between the wire hole and the power wire 41. Wherein, optionally, the wire seal 42 may be a rubber grommet.

In this embodiment, optionally, the heat dissipation structure further includes a bracket 6, the bracket 6 is disposed in the heat dissipation pipe 1, and the fan 4 is mounted on the bracket 6. The provision of the bracket 6 facilitates the mounting of the fan 4. Optionally, the fan 4 and the bracket 6 are screwed. In order to improve the assembling efficiency, in the present embodiment, it is preferable that the bracket 6 and the radiating pipe 1 are integrally formed.

In order to effectively transfer the heat of the electronic component 200, in the present embodiment, the heat conducting member 3 optionally comprises a heat conducting plate 31 and heat dissipating fins 32 disposed on the heat conducting plate 31, the heat conducting plate 31 is in contact with the electronic component 200, and the heat dissipating fins 32 are disposed in the heat dissipating pipe 1. The heat conducting plate 31 and the heat dissipating fins 32 are made of copper or aluminum.

The heat conductive plate 31 is screwed with the electronic component 200. Specifically, the heat conducting plate 31 is provided with mounting holes, and fixing screws are screwed into screw holes of the electronic component 200 through the mounting holes.

A plurality of electronic components 200 are required for a product with various functions, and a plurality of radiators are generally required for heat dissipation when the plurality of electronic components 200 are subjected to heat dissipation, so that the cost is high, and the occupied space is large.

As shown in fig. 6-9, in order to reduce the space occupied by the heat dissipation structure, in the present embodiment, optionally, two heat conduction plates 31 are provided, and the heat dissipation fins 32 are provided between the two heat conduction plates 31; the two heat conduction plates 31 are in contact with the two electronic components 200, respectively. In this embodiment, the heat pipe 1 has two heat conduction holes 13, and the two heat conduction plates 31 penetrate into the housing through the two heat conduction holes 13 respectively. With the help of the above structure, the two heat conducting plates 31 can respectively conduct the heat of the two electronic components 200, the heat is blown out by the fan 4 after being transferred into the radiating pipe 1, and the heat dissipation of the two electronic components 200 can be completed by one heat dissipation structure, so that the occupied space is reduced, and the cost is reduced.

In other embodiments of the present embodiment, the heat conducting members 3 may further include a plurality of heat conducting members 3, and the plurality of heat conducting members 3 are disposed in one-to-one correspondence with the plurality of electronic components 200 for conducting heat to the plurality of electronic components 200. Or several heat conducting members 3 are used to conduct heat for one electronic component 200. The above arrangement enables the heat dissipation of one or more electronic components 200 to be effectively processed, after the heat is transferred to the heat dissipation pipe 1, the heat of all the electronic components 200 can be blown out of the heat dissipation pipe 1 by one fan 4, and cool air is introduced from the air inlet 11 to cool the heat conducting member 3, so that the space occupied by the heat dissipation structure is reduced to the greatest extent, and the cost is reduced.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A heat dissipation structure for dissipating heat from an electronic product, the electronic product including a housing (100) and an electronic component (200) disposed in the housing (100), the heat dissipation structure comprising:

a heat radiating pipe (1), wherein the heat radiating pipe (1) penetrates through the shell (100);

the two air pipe sealing pieces (2) are respectively arranged between an air inlet (11) of the radiating pipe (1) and the shell (100) and between an air outlet (12) of the radiating pipe (1) and the shell (100);

the heat conducting piece (3), one end of the heat conducting piece (3) is contacted with the electronic component (200), and the other end is positioned in the radiating pipe (1);

the fan (4) is arranged in the radiating pipe (1) and used for blowing gas to the air outlet (12) from the air inlet (11).

2. The heat dissipating structure according to claim 1, further comprising a heat conductive sealing member (5), wherein the heat dissipating pipe (1) is provided with a heat conductive hole (13), the heat conductive member (3) is embedded in the heat conductive hole (13), and the heat conductive sealing member (5) is disposed between the heat conductive member (3) and the heat dissipating pipe (1).

3. The heat dissipating structure of claim 1, wherein the heat conductive member (3) is integrally formed with the heat dissipating pipe (1).

4. The heat radiating structure according to claim 1, wherein the heat radiating pipe (1) is provided with a wire hole penetrating to the inside of the housing (100), the power cord (41) of the fan (4) passes through the wire hole, and the heat radiating pipe (1) and the power cord (41) are sealed by a wire sealing member (42).

5. The heat dissipating structure of claim 1, further comprising a bracket (6), wherein the bracket (6) is disposed inside the heat dissipating pipe (1), and the fan (4) is mounted on the bracket (6).

6. The heat dissipating structure of claim 5, wherein the bracket (6) and the heat dissipating pipe (1) are integrally formed.

7. The heat dissipating structure of any one of claims 1 to 6, wherein the heat conductive member (3) comprises a heat conductive plate (31) and heat dissipating fins (32) provided on the heat conductive plate (31), the heat conductive plate (31) being in contact with an electronic component (200), the heat dissipating fins (32) being located inside the heat dissipating pipe (1).

8. The heat dissipation structure according to claim 7, wherein the heat conductive plate (31) and the electronic component (200) are screw-coupled.

9. The heat dissipation structure of claim 7, wherein the heat conductive plate (31) is provided in two, and the heat dissipation fins (32) are provided between the two heat conductive plates (31); the two heat conduction plates (31) are respectively in contact with the two electronic components (200).

10. The heat dissipating structure according to any one of claims 1 to 6, wherein the heat conducting member (3) is provided in a plurality, and the plurality of heat conducting members (3) are provided in one-to-one correspondence with the plurality of electronic components (200) for conducting heat to the plurality of electronic components (200); or

A plurality of the heat-conducting members (3) are each adapted to conduct heat for one of the electronic components (200).