CN219577357U - Insulation mounting structure of radiator - Google Patents
Insulation mounting structure of radiator Download PDFInfo
- Publication number
- CN219577357U CN219577357U CN202320338721.8U CN202320338721U CN219577357U CN 219577357 U CN219577357 U CN 219577357U CN 202320338721 U CN202320338721 U CN 202320338721U CN 219577357 U CN219577357 U CN 219577357U
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- insulating
- circuit board
- radiator
- heat sink
- frame
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Abstract
The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to an insulating mounting structure of a radiator, which comprises the radiator; the circuit board is connected with the radiator; the insulating frame that encloses is located between radiator and the circuit board, and the insulating frame that encloses includes plane portion and encloses the frame portion that the plane portion set up, and plane portion encloses into insulating space with enclosing the frame portion, and the circuit board is located insulating space. According to the utility model, the circuit board is located in the insulation space by surrounding the circuit board by the insulation surrounding frame, the circuit board is isolated from the shell of the radiator by the insulation surrounding frame, the safety insulation between each component of the circuit board and the metal shell of the radiator is ensured, the safety requirement of small space size can be met, the assembly is quick, the assembly efficiency is improved, the safety is higher, and the risk that an independent local attached insulation material is possibly omitted is avoided.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to an insulating mounting structure of a radiator.
Background
Along with the development of communication technology, the functions of the communication product are gradually increased, and the power consumption of the power module chip in the communication product is also gradually increased, so that a radiator is required to be installed on the power module for radiating the circuit board, so that the service life of each component of the circuit board is prolonged. Because the volume of the electronic equipment is limited by the installation space, the electric gap and the creepage distance between the radiator and the circuit board still need to be ensured to meet the safety regulations on the premise of unchanged equipment volume.
In general, in order to meet the requirements of electrical clearance and creepage distance of safety regulations, the creepage distance is often increased directly or an insulating material is locally applied, however, in this way, no suitable solution exists under the insulation requirements of small space structure, large safety regulation electrical clearance and creepage distance.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present utility model is to provide an insulating mounting structure of a radiator, which is used for solving the problem that the small space structure in the prior art is difficult to meet the requirement of safety regulations.
To achieve the above object and other related objects, the present utility model provides the following technical solutions:
an insulating mounting structure of a heat sink, comprising:
a heat sink;
the circuit board is connected with the radiator;
the insulating frame that encloses is located between radiator and the circuit board, the insulating frame that encloses includes plane portion and encloses the frame portion that the plane portion set up, plane portion encloses into insulating space with enclosing the frame portion, the circuit board is located insulating space is interior.
Optionally, one side of the plane part away from the circuit board is provided with a plurality of sleeve parts, the circuit board is connected with the radiator through insulation columns, and the insulation columns penetrate through the sleeve parts.
Optionally, the sleeve portion extends in a direction towards the heat sink, and the sleeve portion is cylindrical or polygonal.
Optionally, a positioning hole for installing an insulation column is formed in the radiator, and when the radiator is connected with the insulation surrounding frame, the sleeve part is inserted into the positioning hole.
Optionally, the plane portion, the surrounding frame portion and the sleeve portion are integrally formed.
Optionally, the size of the plane portion matches the size of the circuit board, and the height of the enclosure frame portion is greater than the height of the circuit board.
Optionally, a heat conducting pad is arranged between the insulating surrounding frame and the circuit board, a limit edge for limiting the heat conducting pad is arranged on one side, facing the circuit board, of the plane part, and each heat conducting pad corresponds to a group of diagonally or symmetrically arranged limit edges.
Optionally, a plurality of thickened ribs are arranged on one side, facing the circuit board, of the plane part of the insulating surrounding frame, the thickened ribs are arranged in a crossed mode, and the thickness of the thickened ribs is larger than that of the plane part.
Optionally, the inner wall of the surrounding frame part of the insulating surrounding frame is provided with a plurality of groups of supporting ribs, and each group of supporting ribs is perpendicular to the plane part.
Optionally, the insulating surrounding frame is made of silicon rubber or plastic-absorbing insulating material.
As described above, the insulating mounting structure of the radiator of the present utility model has the following advantageous effects:
the circuit board is surrounded by the insulating surrounding frame, so that the circuit board is positioned in the insulating space, the insulating surrounding frame is used for isolating the circuit board from the shell of the radiator, and safety insulation between each component of the circuit board and the metal shell of the radiator is ensured; the safety requirements of small space size can be met, the assembly is rapid, the assembly efficiency is improved, the safety is higher, and the risk that an insulating material is singly and locally attached is possibly omitted is avoided;
further, for different safety distance requirements, the requirements can be met by changing the height of the surrounding frame part and the height of the sleeve part.
Drawings
Fig. 1 is a schematic diagram of the overall structure of an insulating mounting structure of a radiator according to an embodiment of the present utility model;
FIG. 2 is an exploded view of an insulative mounting structure of a heat sink according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a heat sink according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram of an insulating enclosure according to an embodiment of the present utility model;
fig. 5 is a schematic structural diagram of an insulating enclosure in an embodiment of the utility model.
Description of the part reference numerals
10-a heat sink; 11-positioning surface; 12-radiating surfaces; 13-radiating fins; 14-positioning holes;
20-a circuit board; 21-a first mounting surface; 22-a second mounting surface;
30-an insulating surrounding frame; 31-a planar portion; 311-limiting edges; 312-thickening ribs; 32-a surrounding frame part; 321-supporting ribs; 33-a sleeve portion;
40-insulating columns; 50-thermal pad.
Detailed Description
Further advantages and effects of the present utility model will become apparent to those skilled in the art from the disclosure of the present utility model, which is described by the following specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.
In order to describe the present utility model in detail, the following describes an insulating mounting structure of a heat sink of the present utility model in detail:
referring to fig. 1 and 2, the present utility model provides an insulating mounting structure of a heat sink, comprising: radiator 10, circuit board 20 and insulating frame 30 that encloses, wherein, circuit board 20 with radiator 10 connects, and insulating frame 30 is located between radiator 10 and the circuit board 20, insulating frame 30 includes plane portion 31 and encloses frame portion 32 that surrounds plane portion 31 setting, plane portion 31 encloses into insulating space with enclosing frame portion 32, circuit board 20 is located insulating space.
Specifically, referring to fig. 3, the heat sink 10 has a positioning surface 11 and a heat dissipating surface 12 facing away from the positioning surface 11, the heat dissipating surface 12 is provided with a plurality of heat dissipating fins 13, and the circuit board 20 is connected with the positioning surface 11 of the heat sink 10; the circuit board 20 has a first mounting surface 21 and a second mounting surface 22 opposite to each other, the first mounting surface 21 of the circuit board 20 is used for arranging each circuit component, and the second mounting surface 22 of the circuit board 20 is used for connecting with the positioning surface 11 of the heat sink 10. The insulating enclosing frame 30 is located between the positioning surface 11 of the radiator 10 and the second mounting surface 22 of the circuit board 20, and an insulating space formed by enclosing the plane part 31 of the insulating enclosing frame 30 and the enclosing frame part 32 arranged around the plane part 31 is used for enabling the circuit board 20 to be located in the insulating space, so that safety insulation between the circuit board 20 and the metal shell of the radiator 10 is ensured.
The shape of the peripheral frame portion 32 is not particularly limited, and corners of the peripheral frame portion 32 are rounded to facilitate assembly. Through adopting insulating enclosing frame 30 to surround circuit board 20, make circuit board 20 is located insulating space, through insulating casing that encloses frame 30 isolated circuit board 20 and radiator 10, guarantee that the safety rule between each components and parts of circuit board 20 and the metal casing of radiator 10 is insulating, can satisfy the safety rule requirement of little space dimension, the assembly is swift, has improved assembly efficiency, and the security is higher, has avoided the risk that the attached insulating material of independent local probably missed.
Referring to fig. 4 and 5, in some embodiments, a plurality of sleeve portions 33 are disposed on a side of the planar portion 31 facing away from the circuit board 20, the circuit board 20 and the heat sink 10 are connected by an insulating column 40, and the insulating column 40 is disposed in the sleeve portions 33 in a penetrating manner. Specifically, in order to ensure that the connection fastening between the circuit board 20 and the radiator 10 meets the requirement of security, a plurality of sleeve parts 33 are disposed on one side of the plane part 31 of the insulating enclosure frame 30, which is away from the circuit board 20, and the circuit board 20 is connected with the radiator 10 through an insulating column 40. The arrangement positions and the number of the sleeve portions 33 are in one-to-one correspondence with the arrangement positions and the number of the insulating columns 40. During installation, the insulating column 40 is firstly installed on the radiator 10, the insulating surrounding frame 30 is assembled, the sleeve part 33 of the insulating surrounding frame 30 is sleeved on the insulating column 40, and the structure can further ensure that the requirements of safety electric gap and creepage distance between the radiator 10 and the circuit board 20 can be met. The insulating columns 40 are used to connect the circuit board 20 and the heat sink 10, and support the circuit board 20 fixed on the heat sink 10. The insulation column 40 is required to use a stud of an insulation property due to insulation and safety requirements. The length of the insulating column 40 is calculated and obtained according to the requirements of the creepage and the electric clearance of the insulating safety rule and the relative minimum thermal resistance of the heat dissipation channel of the power device on the circuit board 20.
In the above embodiment, the thickness of the insulating enclosure frame 30, the height of the enclosure frame portion 32, and the length of the sleeve portion 33 need to be determined according to the distance requirements of safety regulations and dangerous components on the circuit board 20. For different safety distance requirements, the requirements can be met by changing the height of the peripheral frame portion 32 and the height of the sleeve portion 33.
It will be appreciated that the sleeve portion 33 extends in a direction towards the heat sink 10, and that the sleeve portion 33 is cylindrical or polygonal. Specifically, when the insulating column 40 is mounted on the heat sink 10, the insulating enclosure frame 30 is connected to the heat sink 10, and the sleeve portion 33 extends in a direction toward the heat sink 10, so that the sleeve portion 33 can cover the insulating column 40 when connected. In order to adapt the sleeve portion 33 to the structure of the insulating column 40, the sleeve portion 33 is provided in a cylindrical shape, and the structure is more convenient to process. In other embodiments, the sleeve portion 33 may also be provided in a polygonal column shape (e.g., a quadrangular prism, a hexagonal prism, an octagonal prism, etc.).
Referring to fig. 3, in the above embodiment, the heat sink 10 is provided with a positioning hole 14 for mounting an insulating column 40, and the sleeve portion 33 is inserted into the positioning hole 14 when the heat sink 10 is connected to the insulating enclosure frame 30. Specifically, when the radiator 10 and the insulating enclosure frame 30 are installed, the insulating column 40 is firstly installed in the positioning hole 14 of the radiator 10, and then the insulating enclosure frame 30 and the circuit board 20 are connected, the sleeve portion 33 of the insulating enclosure frame 30 is inserted into the positioning hole 14, the insulating column 40 is inserted into the sleeve portion 33 and extends onto the circuit board 20, and correspondingly, a connecting hole corresponding to the positioning hole 14 is formed in the circuit board 20.
The flat portion 31, the surrounding frame portion 32, and the sleeve portion 33 are integrally formed. Specifically, the planar portion 31, the peripheral frame portion 32, and the sleeve portion 33 of the insulating peripheral frame 30 are integrally formed by an integrated process such as a suction molding process or a forming process. By adopting an integrally formed structure, the insulation between the circuit board 20 and the radiator 10 can be fully ensured to meet the safety insulation requirement, and the requirements of electric clearance and creepage distance are met. And moreover, the safety requirements of small space size can be met, and the assembly efficiency is improved.
In some embodiments, the planar portion 31 has a size that matches the size of the circuit board 20, and the peripheral frame portion 32 has a height that is greater than the height of the circuit board 20. The structure can meet the safety distance requirement. Specifically, in this embodiment, the projected area of the circuit board 20 on the heat sink 10 is smaller than the area of the positioning surface 11 of the heat sink 10, and correspondingly, the projected area of the planar portion 31 on the heat sink 10 is also smaller than the area of the positioning surface 11 of the heat sink 10. Also, the surrounding frame portion 32 partially surrounds the planar portion 31, and the structure of the planar portion 31 is adapted to the structure of the circuit board 20.
Referring to fig. 2 and 4, in addition, a thermal pad 50 is disposed between the insulating enclosure frame 30 and the circuit board 20, a spacing rib 311 for spacing the thermal pad 50 is disposed on a side of the planar portion 31 facing the circuit board 20, and each thermal pad 50 corresponds to a set of diagonally or symmetrically disposed spacing ribs 311. Specifically, in this embodiment, 4 thermal pads 50 are disposed between the insulating enclosure frame 30 and the circuit board 20, and the thermal pad 50 is provided to perform a thermal conduction function, so as to improve the thermal conduction effect of the heat sink 10 on the circuit board 20. By arranging the limiting ribs 311 on the side of the plane part 31 facing the circuit board 20, the heat conducting pad 50 is limited, and the heat conducting pad 50 is convenient to install. Specifically, the limiting ribs 311 may be diagonally arranged or symmetrically arranged, and may play a role in limiting the thermal pad 50. The specific arrangement position of the thermal pad 50 can be set according to the requirement, and is not limited herein.
Referring to fig. 4, in some embodiments, a plurality of thickened ribs 312 are disposed on a side of the planar portion 31 of the insulating enclosure frame 30 facing the circuit board 20, the plurality of thickened ribs 312 are arranged in a crossing manner, and the thickness of the thickened ribs 312 is greater than that of the planar portion 31. Specifically, in the present embodiment, the plurality of thickened ribs 312 are disposed on the planar portion 31 in a crossing manner, and the thickened ribs 312 can be cross-connected with the sleeve portion 33 on the planar portion 31, so that the planar portion 31 can be locally thickened by the thickened ribs 312 to enhance the overall strength of the planar portion 31. In addition, the thickened ribs 312 may also serve as an auxiliary limit for the thermal pad 50.
With continued reference to fig. 4, in the above embodiment, a plurality of groups of supporting ribs 321 are disposed on the inner wall of the peripheral frame portion 32 of the insulating peripheral frame 30, and each group of supporting ribs 321 is perpendicular to the planar portion 31. Specifically, the inner wall of the surrounding frame portion 32 is provided with a plurality of groups of supporting ribs 321, each group of supporting ribs 321 comprises two parallel supporting bars and a connecting plate connected between the two parallel supporting bars, the height of each supporting rib 321 is flush with the height of the surrounding frame portion 32, and the integral strength of the surrounding frame portion 32 can be enhanced by the plurality of groups of supporting ribs 321, so that the surrounding frame is prevented from tilting backwards, and the surrounding frame portion 32 is kept in an upright state.
It can be appreciated that the insulating enclosure frame 30 is made of silicone rubber or plastic-absorbing insulating material. By selecting silicon rubber or plastic-absorbing insulating materials, on one hand, the insulating surrounding frame 30 can be ensured to meet the insulating safety requirements; on the other hand, the integrated forming processing is convenient. In addition, the insulating enclosure frame 30 can also play a role in heat conduction, so that the material is preferably selected to have a heat conduction coefficient of 1W/m.K-2W/m.K.
In summary, according to the insulating mounting structure of the radiator provided by the utility model, the circuit board is surrounded by the insulating surrounding frame, so that the circuit board is positioned in the insulating space, and the insulating surrounding frame is used for isolating the circuit board from the shell of the radiator, so that safety insulation between each component of the circuit board and the metal shell of the radiator is ensured; the safety requirements of small space size can be met, the assembly is rapid, the assembly efficiency is improved, the safety is higher, and the risk that an insulating material is singly and locally attached is possibly omitted is avoided; further, for different safety distance requirements, the requirements can be met by changing the height of the surrounding frame part and the height of the sleeve part.
The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. An insulating mounting structure of a radiator, comprising:
a heat sink;
the circuit board is connected with the radiator;
the insulating frame that encloses is located between radiator and the circuit board, the insulating frame that encloses includes plane portion and encloses the frame portion that the plane portion set up, plane portion encloses into insulating space with enclosing the frame portion, the circuit board is located insulating space is interior.
2. The insulating mounting structure of a heat sink according to claim 1, wherein: the side of plane portion that deviates from the circuit board is provided with a plurality of sleeve pipe portions, connect through the insulating column between circuit board and the radiator, just the insulating column wears to establish in the sleeve pipe portion.
3. The insulating mounting structure of a heat sink according to claim 2, wherein: the sleeve portion extends in a direction toward the heat sink, and the sleeve portion is cylindrical or polygonal.
4. The insulating mounting structure of a heat sink according to claim 2, wherein: the radiator is provided with a positioning hole for installing the insulating column, and when the radiator is connected with the insulating surrounding frame, the sleeve part is inserted into the positioning hole.
5. The insulating mounting structure of a heat sink according to claim 2, wherein: the plane part, the surrounding frame part and the sleeve part are integrally formed.
6. The insulating mounting structure of a heat sink according to claim 1, wherein: the size of the plane part is matched with that of the circuit board, and the height of the surrounding frame part is larger than that of the circuit board.
7. The insulating mounting structure of a heat sink according to claim 1, wherein: the heat conducting pad is arranged between the insulating surrounding frame and the circuit board, a limit edge for limiting the heat conducting pad is arranged on one side, facing the circuit board, of the plane portion, and each heat conducting pad corresponds to a group of limit edges which are arranged diagonally or symmetrically.
8. The insulating mounting structure of a heat sink according to claim 1, wherein: the plane portion of insulating enclosing frame is provided with many thickening ribs towards one side of circuit board, and is many the thickening rib alternately arranges, just the thickness of thickening rib is greater than the thickness of plane portion.
9. The insulating mounting structure of a heat sink according to claim 1, wherein: the inner wall of the surrounding frame part of the insulating surrounding frame is provided with a plurality of groups of supporting ribs, and each group of supporting ribs is perpendicular to the plane part.
10. The insulating mounting structure of a heat sink according to claim 1, wherein: the insulating surrounding frame is made of silicon rubber or plastic-absorbing insulating materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320338721.8U CN219577357U (en) | 2023-02-24 | 2023-02-24 | Insulation mounting structure of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320338721.8U CN219577357U (en) | 2023-02-24 | 2023-02-24 | Insulation mounting structure of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219577357U true CN219577357U (en) | 2023-08-22 |
Family
ID=87665156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320338721.8U Active CN219577357U (en) | 2023-02-24 | 2023-02-24 | Insulation mounting structure of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219577357U (en) |
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2023
- 2023-02-24 CN CN202320338721.8U patent/CN219577357U/en active Active
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