CN221127475U - Speaker support and speaker device - Google Patents

Abstract

The application provides a loudspeaker bracket and a loudspeaker device, wherein the loudspeaker bracket comprises a bracket body and a supporting piece; the bracket body is provided with radiating fins and bosses, and the bosses are connected with the radiating fins; the support member is formed by the upward bulge of the bracket body. The loudspeaker bracket with the heat dissipation function is characterized in that the loudspeaker main board is arranged above the bracket body, heat can be dissipated to the outside through the radiating fins, and effective heat exchange is performed, so that the temperature of the loudspeaker main board and other components is reduced, and the safe operation of the loudspeaker main board is ensured. The loudspeaker device comprises a first loudspeaker assembly, a second loudspeaker assembly, a loudspeaker main board and a support body which are connected, and a plurality of supporting pieces which are fixed between the first loudspeaker assembly and the second loudspeaker assembly, wherein the support body is provided with radiating fins and a boss which are connected, the supporting pieces are formed by upward uplift of the support body, and electronic elements of the loudspeaker main board are attached to the boss.

Description

Speaker support and speaker device

Technical Field

The application relates to the technical field of loudspeaker production, in particular to a loudspeaker bracket with a heat dissipation function and a loudspeaker device.

Background

The speaker is an electroacoustic transducer, and 90% of the electrical energy is converted into joule heat of the speaker during the input of electrical energy, which causes the temperature of the entire speaker to rise.

In order to reduce the overall temperature of a loudspeaker, in the existing loudspeaker structure, a radiator is usually locked above a PCB (main board), and the heat of the PCB is taken away by increasing the heat dissipation area. However, as the PCB is arranged in the sound box, when the loudspeaker is in operation, heat emitted by the IC module and the loudspeaker is generally gathered from bottom to top in the sound box, and the heat cannot be discharged to cause damage of the IC module.

The utility model discloses a chinese patent of CN208623886U, a bluetooth speaker with heat dissipation function is provided, which comprises a base, the middle part fixed mounting of base upper surface has the audio amplifier body, fixed mounting has the disc between the inner wall of audio amplifier body, the fixed mounting of the upper surface of disc has two symmetrical support frames, and fixed mounting has the electric fan between the side that two support frames are close to mutually, audio amplifier body inner wall fixed mounting has two first supports, and fixed mounting has water cooling plant between the one end that two first supports are close to mutually, water cooling plant's top is provided with the heating panel, audio amplifier body inner wall fixed mounting has two second supports, and fixed mounting has the circuit motherboard between the one end that two second supports are close to mutually. In this bluetooth speaker, mainly dispel the heat to inside part through fan and water cooling plant, its support mainly plays fixed effect that maintains.

Therefore, how to optimally design the existing speaker bracket, so that the existing speaker bracket can support the whole component and simultaneously play a role in heat dissipation is a technical problem which needs to be solved by the person skilled in the art.

Disclosure of utility model

In order to solve the problems in the prior art, the utility model provides a loudspeaker bracket with a heat dissipation function, wherein a loudspeaker main board is arranged above a bracket body, and heat can be dissipated to the outside through a heat sink to perform effective heat exchange, so that the temperature of the loudspeaker main board and other components is reduced, and the safe operation of the loudspeaker main board is ensured.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

a speaker bracket including a bracket body and a support member;

The bracket body is provided with radiating fins and bosses, and the bosses are connected with the radiating fins;

The support member is formed by the upward bulge of the bracket body.

On the one hand, the loudspeaker support plays a role in accommodating and supporting the loudspeaker components in the interior, and on the other hand, as the radiating fins and the lug boss are arranged, the electronic component attached to the lug boss can timely radiate heat through the radiating fins, and heat exchange is preferentially carried out, so that the normal and safe operation of the internal component is ensured.

As a further description of the technical solution of the present utility model, the boss is connected with more than two heat sinks.

As a further description of the technical solution of the present utility model, the boss is located at an end of the heat sink.

As a further description of the technical solution of the present utility model, the boss is located between the heat radiating fins.

The boss is connected with the radiating fins, and the boss can be arranged at the tail end of the radiating fins or positioned between the radiating fins, or the radiating fins can penetrate through the boss; and the radiating fins with larger radiating areas extend to the surface of the bracket body, so that heat conducted into the boss can be radiated to the outside of the loudspeaker bracket, and the overall temperature of the loudspeaker is reduced.

As a further description of the technical scheme of the utility model, the bracket body is connected with the speaker main board, and the electronic element of the speaker main board is connected above the boss in a fitting way.

As a further description of the technical scheme of the utility model, the loudspeaker comprises a connecting piece, wherein the bracket body is fixedly connected with the loudspeaker main board through the connecting piece.

The connecting piece is connected the speaker mainboard in the top of support body, and the electronic component and the boss of speaker are connected, and the heat that electronic component distributes when the during operation like this can conduct the boss, later distributes the surface to the support through the fin.

As a further description of the technical solution of the present utility model, the shape of the bracket body is circular, elliptical or rectangular.

As a further description of the technical solution of the present utility model, the supporting member is disposed at an outer edge of the bracket body.

As a further description of the technical scheme of the utility model, the loudspeaker support is integrally formed by die-casting aluminum.

The loudspeaker bracket with the functions of accommodating and supporting also has the function of heat dissipation by changing the material of the loudspeaker from plastic PC to die casting aluminum, and can be used as a heat dissipation piece.

In addition, according to the design needs of heat dissipation demand and speaker appearance, the support body can set up to other shapes such as circular, oval or rectangle, and the mode of arranging of fin also can adjust the setting according to the demand.

Based on the technical scheme, the utility model has the following technical effects:

The loudspeaker bracket provided by the utility model has the functions of accommodating, supporting and radiating. According to the loudspeaker support, the radiating fins and the bosses are arranged on the support body, so that the electronic element attached to the bosses can radiate heat timely through the radiating fins, heat exchange is conducted preferentially, and normal and safe operation of the internal elements of the loudspeaker is ensured.

Drawings

Fig. 1 is a schematic structural view of a speaker stand according to the present application.

Fig. 2 is a schematic diagram illustrating connection between a speaker stand and a speaker motherboard according to the present application.

Fig. 3 is a schematic combination diagram of a speaker stand and a speaker motherboard according to the present application.

Fig. 4 is a schematic diagram illustrating connection between a heat sink and a boss according to the present application.

Fig. 5 is a schematic diagram of a speaker motherboard according to the present embodiment.

Fig. 6 is a schematic combination diagram of the whole speaker device and the speaker stand according to the present embodiment.

Detailed Description

For an understanding of the present application, reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Example 1

Fig. 1 shows a schematic structural view of a speaker stand according to this embodiment, fig. 2 shows a schematic connecting view of the speaker stand according to this embodiment and a speaker main board, fig. 3 shows a schematic connecting view of a heat sink and a boss according to this embodiment, fig. 4 shows a schematic connecting view of a speaker main board according to this embodiment, fig. 5 shows a schematic connecting view of a speaker device according to this embodiment, fig. 6 shows a schematic connecting view of an integral speaker apparatus according to this embodiment and a speaker stand, and fig. 1 to 6, a speaker stand 100 has a bottom surface forming a supporting surface for mainly supporting and accommodating components inside a speaker or a sound, and a speaker main board 200 is mounted above the speaker stand 100, and the speaker main board 200 is a PCB board provided with a plurality of electronic components, and during operation, the electronic components of the PCB board, such as an IC module, generate heat and are gathered inside the speaker. In order to timely radiate the heat, the whole loudspeaker support of the embodiment adopts die-cast aluminum with good heat conduction performance.

As shown in fig. 1, the speaker bracket 100 includes a bracket body 1, a heat sink 11, a boss 12, a support member 2 and a connecting member 3 are disposed above the bracket body 1, and these components may be integrally formed by a mold, or may be fixed on the bracket body 1 by punching, bonding, clamping or locking after the die-casting of the bracket body 1. The first speaker unit 110 in the first speaker assembly 120 has its speaker diaphragm 111 facing upward, toward the bottom surface of the holder body 1 of the speaker holder 100. In the present embodiment, in order to match the overall construction of the speaker, the bracket body 1 is provided in a circular structure; meanwhile, in order to increase the connection effect of the speaker stand 100 with other components, the support 2 is provided at the outer circumference of the stand body 1 and is evenly arranged. Of course, the bracket body 1 can be die-cast into an elliptical shape or a rectangular shape and other characteristic shapes according to the design requirement, and the position of the supporting piece 2 can be changed accordingly.

The heat sink 11 serves as a main heat sink member, one end of which is connected to the boss 12 and the other end of which extends to the surface of the bracket body 1, i.e., the other end of which is directly exposed to the outside and is flush and in contact with the surface of the bracket body 1. In order to increase the heat dissipation area, the heat dissipation fins 11 may be provided in a fin shape, and in the present embodiment, each boss 12 is connected to two or more heat dissipation fins 11. I.e. at least two cooling fins 11 are connected to the periphery of the boss 12. On the bracket body 1, some heat dissipation fins 11 are arranged in parallel, other heat dissipation fins 11 are arranged in a mutually perpendicular mode, and some heat dissipation fins 11 are mutually crossed. That is, the heat radiating fins 11 and the corresponding bosses 12 connected thereto constitute heat radiating units, and the arrangement of each of the heat radiating units on the bracket body 1 may be parallel to each other, perpendicular to each other, staggered, or aligned/non-aligned. The boss 12 may be square, round or oval, and its lower surface contacts the bracket body 1, and the heat sink 11 and the boss 12 may be integrally formed or combined by combining. The material of the heat sink 11 and the boss 12 may be the same material, such as die-cast aluminum, or different materials or other materials with better heat conduction function.

Referring to fig. 4, in the connection manner of the heat sink 11 and the boss 12, the boss 12 in the portion 3A in fig. 4 is located at the ends of the two heat sinks 11, the boss 12 in the portion 3B in fig. 4 is located between the two heat sinks 11, and the boss 12 in the portion 3C in fig. 4 combines the connection manner of the portion 3A in fig. 4 and the portion 3B in fig. 4, that is, the boss 12 is located at both the ends of the heat sinks 11 and between the heat sinks 11. The boss 12 and the heat sink 11 may be connected in different manners, and the main purpose of the connection is to efficiently dissipate the heat conducted to the boss 12 through the heat sink 11.

The heat from the boss 12, which is again from the electronic components on the speaker motherboard 200, as shown in fig. 2 and 3, the speaker motherboard 200 is fastened above the speaker bracket 100 and connected by the connector 3. As shown in fig. 5, a surface (e.g., an upper surface) of the speaker motherboard 200 (e.g., a PCB board) is provided with a plurality of main electronic components 131 and 132, such as IC modules, which are sources of main heat generation of the speaker motherboard 200, while another surface (e.g., a lower surface) of the speaker motherboard 200 is provided with other electronic components and circuits which generate less heat. When the speaker motherboard 200 is assembled, the surfaces (e.g., upper surfaces) of the electronic components 131 and 132 are mounted downward, so that the electronic components 131 and 132 can be aligned with the corresponding bosses 12 in close contact with each other, and the other surface (e.g., lower surface) of the speaker motherboard 200 is directed upward. Specifically, as shown in fig. 3, the speaker main board 200 may be locked to the speaker bracket 100 by screwing the screw 31 into the connector 3, and the electronic components 131 and 132 are closely attached to the boss 12. In this way, the heat emitted from the electronic components 131 and 132 during operation can be conducted to the boss 12 and then emitted to the outer surface of the speaker bracket 100 through the heat sink 11. It is specifically mentioned that each boss 12 may be respectively corresponding to and attached to one electronic component or a plurality of electronic components.

Fig. 6 is a schematic combination diagram of the whole speaker device and speaker bracket of the present embodiment, the speaker device 10 includes a first speaker assembly 120 and a second speaker assembly 130, the speaker bracket 100 is disposed and fixed between the first speaker assembly 120 and the second speaker assembly 130, and the second speaker assembly 130 is provided with a second speaker unit 122. The first speaker assembly 120 and the second speaker assembly 130 are supported and fixed by the supporting members 2 of the speaker stand 100, and a gap exists between two adjacent supporting members 2 to expose at least a portion of the speaker motherboard 200 for enhancing air circulation and heat dissipation. The first speaker unit 120 is provided therein with a first speaker unit 110 (as shown in fig. 2) having a diaphragm 111 directed in an upward vertical direction, and a second speaker unit 122 of the second speaker unit 130 having a diaphragm directed in a horizontal direction in a right-left direction or in an oblique direction at an acute angle to the horizontal direction. Speaker bracket 100 may be directly connected to the housings or shields of first speaker assembly 120 and second speaker assembly 130. In one embodiment, the housings or shields of the first speaker assembly 120 and the second speaker assembly 130 may be made of die-cast aluminum or other materials with heat conducting function.

In summary, the speaker stand 100 provided in the present embodiment has the functions of accommodating, supporting and dissipating heat, and can save the internal space and the cost. The radiating fins and the bosses are arranged on the support body, so that the electronic elements of the main heat source on the loudspeaker main board (PCB) are connected with the bosses in a fitting manner, heat is emitted out in time through the bosses, the radiating fins and the support body, heat exchange is preferentially carried out, and the normal and safe operation of the internal elements of the loudspeaker is ensured. Furthermore, since one side of the speaker main board with the electronic component faces the speaker bracket and is in direct contact with the speaker bracket, and other components of the speaker main board are arranged on the other side of the speaker main board, the two-sided arranged speaker main board can effectively realize heat dissipation by matching with the speaker bracket of the invention.

The foregoing is merely illustrative and explanatory of the application as it is described in more detail and is not thereby to be construed as limiting the scope of the application. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the application, and that these obvious alternatives fall within the scope of the application.

Claims (16)

1. A loudspeaker support, characterized by comprising a support body (1) and a support (2);

The bracket body (1) is provided with radiating fins (11) and bosses (12), and the bosses (12) are connected with the radiating fins (11);

the support (2) is formed by the upward bulge of the bracket body (1).

2. Loudspeaker support according to claim 1, characterized in that the boss (12) is connected to more than two heat sinks (11).

3. Loudspeaker support according to claim 2, characterized in that the boss (12) is located at the end of the heat sink (11).

4. Loudspeaker support according to claim 2, characterized in that the boss (12) is located between the cooling fins (11).

5. Loudspeaker support according to claim 1, characterized in that the support body (1) is connected with a loudspeaker motherboard (200) and the electronic components of the loudspeaker motherboard are attached above the boss (12).

6. The loudspeaker support according to claim 5, further comprising a connector (3), wherein the support body (1) is fixedly connected to the loudspeaker motherboard (200) by the connector (3).

7. Loudspeaker support according to claim 1, characterized in that the support body (1) has a circular, oval or rectangular shape.

8. Loudspeaker support according to claim 6, characterized in that the support (2) is arranged at the outer edge of the support body (1).

9. A loudspeaker support according to any one of claims 1-8, wherein the loudspeaker support is die cast aluminium integrally stamped.

10. A speaker device, characterized by comprising a first speaker assembly (120), a second speaker assembly (130), a speaker main board (200), a bracket body (1) and a plurality of support members (2), wherein the support members (2) are fixed between the first speaker assembly (120) and the second speaker assembly (130);

The bracket body (1) is provided with radiating fins (11) and bosses (12), and the bosses (12) are connected with the radiating fins (11);

The support piece (2) is formed by the upward bulge of the bracket body (1);

The loudspeaker main board (200) is connected with the bracket body (1), and the electronic element of the loudspeaker main board is connected above the boss (12) in a fitting way.

11. Loudspeaker device according to claim 10, wherein the boss (12) is connected to more than two heat sinks (11).

12. Loudspeaker device according to claim 11, wherein the boss (12) is located at the end of the heat sink (11).

13. Loudspeaker device according to claim 12, wherein the boss (12) is located between the heat sinks (11).

14. The speaker arrangement according to claim 10, characterized in that the first speaker assembly (120) comprises a first speaker unit (110) with a loudspeaker diaphragm (111) facing the bottom surface of the holder body (1).

15. Loudspeaker device according to claim 10, wherein a gap is present between adjacent support members (2) exposing at least part of the loudspeaker main board (200).

16. The speaker apparatus according to claim 10, wherein the first speaker unit (110) is provided in the first speaker unit (120) with the diaphragm oriented in the upward vertical direction, and the second speaker unit (122) is provided in the second speaker unit (130) with the diaphragm oriented in the horizontal direction.