CN211742031U - Wind scooper for AEP memory heat dissipation in server - Google Patents
Wind scooper for AEP memory heat dissipation in server Download PDFInfo
- Publication number
- CN211742031U CN211742031U CN202020527339.8U CN202020527339U CN211742031U CN 211742031 U CN211742031 U CN 211742031U CN 202020527339 U CN202020527339 U CN 202020527339U CN 211742031 U CN211742031 U CN 211742031U
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- Prior art keywords
- heat dissipation
- cover body
- wind scooper
- aep
- plastic cover
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 51
- 229920003023 plastic Polymers 0.000 claims abstract description 65
- 239000004033 plastic Substances 0.000 claims abstract description 65
- 238000009434 installation Methods 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 238000005452 bending Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model provides a AEP memory wind scooper for heat dissipation in server, the scheme of adoption is: the plastic cover comprises a plastic cover body and a fixed metal frame, wherein the fixed metal frame is attached to the outer surface of the plastic cover body, a left heat dissipation opening is formed in a left side plate of the plastic cover body, a right heat dissipation opening is formed in a right side plate of the plastic cover body, and installation positions are arranged on two sides of the fixed metal frame. Through the cover body made of plastic materials, the radiating holes are formed in the two sides of the cover body, and the cover body is fixed by the outer-layer fixing metal frame, so that the position disorder can be prevented, and a good radiating effect is achieved.
Description
Technical Field
The utility model relates to an heated board production facility field specifically is a wind scooper is used in AEP memory heat dissipation in server.
Background
In server design, heat dissipation equipment plays an increasingly important role, the performance of the heat dissipation equipment greatly affects the performance and power consumption of a server, and the wind scooper is an important component in the heat dissipation equipment, wherein the control of wind flow is very important in the design of the wind scooper. The wind scooper mainly acts on the situation that heat is quickly led out to form air volume circulation, quickly cool down parts, improve efficiency and prevent backflow risks.
Currently, with the development of cloud computing, an internet enterprise now needs more servers to build a server cluster. Therefore, more and more servers are placed in the computer room, and the required server capacity is larger and larger, so the AEP memory is generated at the same time. In order to ensure that the heat dissipation AEP memory of the servers does not exceed the temperature, a wind scooper configured for the AEP is urgently needed to be designed, and if the wind scooper is not available, the AEP memory cannot dissipate heat to generate high temperature, so that downtime is caused, a machine cannot normally work, and serious economic loss is directly caused.
Therefore, aiming at the problem that the AEP memory cannot dissipate heat to generate high temperature so as to cause downtime, the problem that the air guide cover which effectively dissipates heat of the AEP memory and simultaneously dissipates heat of a common memory needs to be solved urgently is researched.
SUMMERY OF THE UTILITY MODEL
In order to overcome not enough among the above-mentioned prior art, the utility model provides a wind scooper is used in AEP memory heat dissipation in server to thereby solve the unable heat dissipation of present AEP memory and produce the problem that high temperature leads to the machine of dying.
The utility model discloses a solve the technical scheme that above-mentioned technical problem adopted and be: the wind scooper for AEP memory heat dissipation in the server comprises a plastic cover body and a fixed metal frame, wherein the fixed metal frame is attached to the outer surface of the plastic cover body, a left heat dissipation port is formed in a left side plate of the plastic cover body, a right heat dissipation port is formed in a right side plate of the plastic cover body, and installation positions are arranged on two sides of the fixed metal frame. Through the cover body made of plastic materials, the radiating holes are formed in the two sides of the cover body, and the cover body is fixed by the outer-layer fixing metal frame, so that the position disorder can be prevented, and a good radiating effect is achieved.
Furthermore, a clamping plate is arranged on the left side of the plastic cover body and is located on the outer side of the left heat dissipation opening. The portion of the AEP memory exposed out of the left heat dissipation port is coated and positioned by utilizing the clamping plate.
Furthermore, the right part of screens board is connected with the roof of the plastics cover body, the left part of screens board is buckled downwards, the width of screens board is not more than the quarter of left thermovent width. Extend out the downward buckling from the roof of the plastics cover body through the screens board, form the screens structure, play the positioning action to the AEP memory, and have less width and thickness, reduce the area that blocks to left thermovent to do benefit to the heat dissipation.
Further, the bottom of the mounting position is higher than the bottom of the plastic cover body. That is to say that the installation position of fixed metal frame forms the difference in height with the bottom of the plastics cover body for the wind scooper installation back installation position and about 1cm of screw mouth difference in height on the server mainboard adopt 1 cm's of length high double-screw bolt to connect installation position and screw mouth, mainly be in order to prevent that the fixed metal frame of iron and mainboard chip contact can lead to the phenomenon of short circuit to take place.
Further, the installation position is provided with threely, is preceding installation position, back installation position and middle installation position respectively, preceding installation position is located anterior right side board department, back installation position is located the right side board department at rear portion, middle installation position is located screens board department. Through setting up three installation positions in front and back, and the both sides of the plastic cover body of living in, guarantee to avoid the thermovent on the basis of the fastening of plastic cover body and AEP memory, reach and do benefit to radiating effect.
Furthermore, a middle through hole is formed in the part, covering the top end face of the plastic cover body, of the fixed metal frame. Through setting up middle through-hole in order to do benefit to the heat dissipation of the plastics cover body, alleviate whole weight simultaneously, save the material of fixed metal frame.
Furthermore, the area of the middle through hole is not less than four fifths of the area of the top end face of the plastic cover body. And a sufficiently large heat dissipation area is ensured to facilitate heat dissipation.
Furthermore, the front part of the plastic cover body is provided with a front opening. The front opening is used for routing to enable connections between the AEP memory and other components.
Furthermore, a rear baffle is arranged at the rear part of the plastic cover body. Through the backplate, in addition left and right sides board, the location to the AEP memory is realized to the three cooperation.
Furthermore, the plastic cover body is formed by bending a 2mm plastic plate.
According to the technical scheme, the utility model has the advantages of it is following:
1. this scheme provides an AEP memory wind scooper for heat dissipation in efficient server, through the cover body that uses plastic material, has light advantage, offers the thermovent in both sides to utilize outer fixed metal frame to fix and can prevent the position disorder, have good radiating effect. Meanwhile, the portion, exposed out of the left heat dissipation opening, of the AEP memory is coated and positioned by the clamping plate extending out of one side, the clamping plate is small in width and thickness, the blocking area of the left heat dissipation opening is reduced, and heat dissipation is facilitated.
2. The part of the fixed metal frame covering the top end face of the plastic cover body is provided with a middle through hole. Through setting up middle through-hole in order to do benefit to the heat dissipation of the plastics cover body, alleviate whole weight simultaneously, save the material of fixed metal frame. The bottom of installation position is higher than the bottom of the plastic cover body on the fixed metal frame, and the installation position of also fixing the metal frame forms the difference in height with the bottom of the plastic cover body for screw mouth altitude difference about 1cm on installation position and the server mainboard after the wind scooper has installed adopts the 1cm high double-screw bolt of length to connect installation position and screw mouth, and the main fixed metal frame that is in order to prevent iron can lead to the phenomenon of short circuit to take place with the mainboard chip contact.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front side view of an embodiment of the present invention.
Fig. 2 is a rear side view of an embodiment of the present invention.
In the figure, 1, a plastic cover body, 2, an installation position, 3, a fixed metal frame, 4, a right heat dissipation opening, 5, a left heat dissipation opening, 6, a middle through hole, 7, a clamping plate, 11, a left side plate, 12, a right side plate, 13, a top plate, 14, a rear baffle, 21, a front installation position, 22, a rear installation position, 23 and a middle installation position.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.
As shown in fig. 1 and fig. 2, the utility model provides an AEP memory heat dissipation wind scooper in server, which comprises a plastic cover body 1 and a fixed metal frame 3, wherein the fixed metal frame 3 is attached to the outer surface of the plastic cover body 1, and the fixed metal frame 3 covers the plastic cover body 1 from the top surface downwards; the plastic cover body 1 is provided with a top plate 13, a left side plate 11, a right side plate 12 and a rear baffle plate 14, when in use, the plastic cover body 1 is buckled on the AEP memory, the AEP memory is positioned by the cooperation of the rear baffle plate 14 and the left side plate 12 and the right side plate 12, the left side plate 11 of the plastic cover body 1 is provided with a left heat dissipation port 5, the right side plate 12 of the plastic cover body 1 is provided with a right heat dissipation port 4, and the left heat dissipation port 5 and the right heat dissipation port 4 are provided with larger amplitude so as to ensure the heat dissipation effect on two sides of the AEP memory; be provided with screens board 7 on the left of the plastics cover body 1, screens board 7 is located the outside of left thermovent 5, through utilizing screens board 7 to expose the part of left thermovent 5 to the AEP memory and carry out the cladding location, the right part of screens board 7 is connected with the roof 13 of the plastics cover body 1, here screens board 7 and the plastics cover body 1 integrated into one piece, the left part of screens board 7 is buckled downwards, the width of screens board 7 is not more than the quarter of left thermovent 5 width, extend out the buckling downwards from the roof 13 of the plastics cover body 1 through screens board 7, form the screens structure, play the positioning action to the AEP memory, and have less width and thickness, reduce the area that blocks to left thermovent 5, in order to do benefit to the heat dissipation.
Wherein the fixed metal frame 3 is a rectangular frame seen from above, and comprises two transverse plates and two longitudinal plates, the four plates are all narrower, so as to reserve a large enough top space to ensure heat dissipation, the fixed metal frame 3 is provided with a bending part which is bent downwards, the fixed metal frame 3 utilizes the bending part to cover the plastic cover body 1 downwards and then protrudes outwards, the protruding part is an installation position 2, the installation position 2 is provided with a screw hole, the installation positions 2 are positioned at two sides of the fixed metal frame 3, the bottom of the installation position 2 is higher than the bottom of the plastic cover body 1, namely the installation position 2 of the fixed metal frame 3 forms a height difference with the bottom of the plastic cover body 1, make installation position 22 and server mainboard go up screw mouth difference in height about 1cm after the wind scooper has been installed, adopt the 1cm high double-screw bolt of length to connect installation position 2 and screw mouth, mainly be in order to prevent that the fixed metal frame 3 of iron and mainboard chip contact can lead to the phenomenon of short circuit to take place. Specifically, the installation positions 2 are three, namely a front installation position 21, a rear installation position 22 and a middle installation position 23, the front installation position 21 is located on the front right side plate 12, the rear installation position 22 is located on the rear right side plate 12, and the middle installation position 23 is located on the clamping plate 7. Through setting up three installation position 2 in front and back, and the both sides of the plastic cover body 1 of living in the branch, guarantee to keep away the thermovent on the basis of the fastening of plastic cover body 1 and AEP memory, reach and do benefit to radiating effect.
In addition, the part of the fixed metal frame 3 covering the top end face of the plastic cover body 1 is provided with a middle through hole 6, namely a middle hole of the rectangular frame, the area of the middle through hole 6 is not less than four fifths of the area of the top end face of the plastic cover body 1, so that a large enough heat dissipation area is ensured to be beneficial to heat dissipation, the middle through hole 6 is arranged to be beneficial to the heat dissipation of the plastic cover body 1, meanwhile, the whole weight is lightened, and the material of the fixed metal frame 3 is saved.
In addition, the front part of the plastic cover body 1 is provided with a front opening, the front opening is used for wiring to realize connection between the AEP memory and other components, and the plastic cover body 1 is formed by bending a 2mm plastic plate.
The terms "upper", "lower", "outside", "inside" and the like in the description and claims of the present invention and the above drawings, if any, are used to distinguish relative relationships in position, and are not necessarily qualitative. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a wind scooper for AEP memory heat dissipation in server, its characterized in that, includes the plastics cover body (1) and fixed metal frame (3), fixed metal frame (3) laminating is in the surface of the plastics cover body (1), the plastics cover body (1) includes left side board (11) and right side board (12), left thermovent (5) have been seted up on left side board (11), right thermovent (4) have been seted up on right side board (12), the both sides of fixed metal frame (3) are provided with installation position (2).
2. The AEP internal heat dissipation wind scooper in a server according to claim 1, wherein a clamping plate (7) is arranged on the left side of the plastic cover body (1), and the clamping plate (7) is positioned outside the left heat dissipation opening (5).
3. The AEP internal heat dissipation wind scooper in a server according to claim 2, wherein the right part of the blocking plate (7) is connected with the top plate (13) of the plastic cover body (1), the left part of the blocking plate (7) is bent downwards, and the width of the blocking plate (7) is not more than one fourth of the width of the left heat dissipation opening (5).
4. The AEP internal heat dissipation wind scooper in a server according to claim 3, wherein the bottom of the mounting position (2) is higher than the bottom of the plastic cover body (1).
5. The AEP internal heat dissipation wind scooper in a server according to claim 4, wherein the number of the mounting positions (2) is three, namely a front mounting position (21), a rear mounting position (22) and a middle mounting position (23), the front mounting position (21) is located at the front right side plate (12), the rear mounting position (22) is located at the rear right side plate (12), and the middle mounting position (23) is located at the clamping plate (7).
6. The AEP internal heat dissipation wind scooper in a server according to claim 1, wherein a middle through hole (6) is formed in a portion of the fixed metal frame (3) covering the top end face of the plastic cover body (1).
7. The AEP internal heat dissipation wind scooper of the server according to claim 6, wherein the area of the middle through hole (6) is not less than four fifths of the area of the top end face of the plastic cover (1).
8. The AEP internal heat dissipation wind scooper of the server according to claim 1, wherein the plastic hood (1) is provided with a front opening at the front.
9. The AEP internal heat dissipation wind scooper in server according to claim 8, wherein a rear baffle (14) is provided at the rear of the plastic hood (1).
10. The AEP internal heat dissipation wind scooper of the server according to claim 1, wherein the plastic cover (1) is formed by bending a 2mm plastic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020527339.8U CN211742031U (en) | 2020-04-10 | 2020-04-10 | Wind scooper for AEP memory heat dissipation in server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020527339.8U CN211742031U (en) | 2020-04-10 | 2020-04-10 | Wind scooper for AEP memory heat dissipation in server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211742031U true CN211742031U (en) | 2020-10-23 |
Family
ID=72853970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020527339.8U Active CN211742031U (en) | 2020-04-10 | 2020-04-10 | Wind scooper for AEP memory heat dissipation in server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211742031U (en) |
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2020
- 2020-04-10 CN CN202020527339.8U patent/CN211742031U/en active Active
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