CN213662043U

CN213662043U - Heat sink

Info

Publication number: CN213662043U
Application number: CN202021717808.9U
Authority: CN
Inventors: 郑晓红; 李文杰; 赵晓宇; 许阳斌
Original assignee: Hangzhou Shiteng Technology Co ltd
Current assignee: Hangzhou Shiteng Technology Co ltd
Priority date: 2020-08-17
Filing date: 2020-08-17
Publication date: 2021-07-09
Anticipated expiration: 2030-08-17

Abstract

The application discloses a radiating fin, its characterized in that, the first surface of radiating fin has sunkenly, sunken in the radiating fin with the second surface relative of first surface forms the arch, at least partial region of first surface is provided with and is used for radiating rib. The radiating fin can be used in electronic equipment such as various controllers, and the radiating fin has a larger radiating area through the design of the concave part and the convex part, and also has the function of plugging the opening of the shell. The components and parts on the circuit board have not only been dodged with protruding design to this fin, have still increased the circulation of air area, the utility model discloses an its simple structure of fin is reliable, and the processing degree of difficulty is lower, low in manufacturing cost is honest and clean, and the assembly is convenient, can be used for multiple heat dissipation occasion.

Description

Heat sink

Technical Field

The utility model relates to a heat dissipation technical field, concretely relates to fin of controller.

Background

Along with the rapid development of electronic technology, electronic products are smaller and lighter nowadays, the sizes of printed circuit boards inside the electronic products and electronic components on the printed circuit boards are smaller and smaller, the integration level of the components is higher and higher, and along with the continuous reduction of the sizes of the electronic components, the thermal power of the internal unit area of the electronic products is remarkably increased, but the heat dissipation area of the electronic components is reduced along with the reduction of the sizes, and the heat dissipation capacity of the electronic components becomes a key factor for limiting the performance of the electronic components. The conventional heat dissipation method comprises active heat dissipation and passive heat dissipation, a fan is usually adopted for the active heat dissipation, the passive heat dissipation usually comprises a heat conduction pipe, a heat dissipation fin and the like, the volume and the structure of a plurality of products are limited, a printed circuit board cannot adopt the fan and the heat conduction pipe for heat dissipation, and the heat dissipation fin can only be additionally arranged on the circuit board or an electronic component to increase the heat dissipation area and enhance the heat dissipation capacity, but the heat dissipation fin in the prior art is usually flat and is directly contacted with the component or the circuit board, the area of the heat dissipation fin is still relatively small, the heat dissipation requirement of continuous increase cannot be met, and the problems that the component on the circuit board cannot be avoided and the circuit board is short-circuited.

Therefore, in order to solve the above technical problems, it is an urgent need to design a heat sink with a large heat dissipation area and a simple structure.

Disclosure of Invention

In view of the above problem, an object of the present invention is to provide a heat sink, which is connected to a circuit board through a concave and convex design, and is disposed on the surface of a power device, so as to dissipate heat of the circuit board, further increase the heat dissipation area of the heat sink, and efficiently dissipate heat. The concave and convex design of the radiating fin avoids components on the circuit board and increases the air circulation area.

In order to achieve the above object, the present invention provides a heat sink, wherein the first surface of the heat sink has a recess, the recess is formed on the second surface of the heat sink opposite to the first surface to form a protrusion, and at least a partial region of the first surface is provided with ribs for heat dissipation.

Preferably, a connecting hole is formed in the recess, and the connecting hole is used for connecting the heat sink with a heat source.

Preferably, the connecting holes penetrate through the heat radiating fin, the number of the connecting holes is at least 2, and the at least 2 connecting holes are symmetrically arranged at two ends of the heat radiating fin.

Preferably, the recess further comprises a hole site region, and the hole site region comprises a vicinity of a connecting line of the at least 2 connecting holes.

Preferably, the heat sink further comprises a first heat dissipation area and a second heat dissipation area which are respectively connected with the hole area, and the ribs are arranged on the first heat dissipation area and the second heat dissipation area.

Preferably, the first heat dissipation area and the second heat dissipation area have the same area.

Preferably, the heat dissipation plate is any one of a circle, a semicircle and a polygon.

Preferably, the recess extends at the first surface to an edge of the heat sink.

Preferably, the protrusion is located at a position close to the side edge in the middle of the heat sink.

Preferably, the raised area is smaller than the area of the heat sink.

Preferably, the ribs are at least partially located in the recesses, the outboard end faces of the ribs in the recesses being coplanar with the outboard end faces of the ribs in the first surface non-recesses.

To sum up, the embodiment of the utility model has following advantage or beneficial effect: the radiating fin provided by the utility model can be used in electronic equipment such as various controllers, through the design of the concave and convex parts, the radiating fins have larger radiating area and also have the function of plugging the opening of the shell, by arranging the power device on one side of the circuit board and arranging the radiating fin of the utility model on the other side of the circuit board opposite to the power device, the insulating gasket is arranged between the radiating fin and the circuit board for electric isolation and heat conduction, because of the good thermal conductivity of copper in the circuit board, the power device increases the heat dissipation area through the copper foil of the circuit board, and conduct and link to each other with circuit board another side the utility model discloses an on the fin, make the fin not directly set up the surface at power device, make this fin can dispel the heat for whole circuit board, further increased the heat radiating area of fin, can high-efficiently effluvium of heat. Further, the components and parts on the circuit board have not only been dodged with protruding design to the sunken of this fin, have still increased the circulation of air area, the utility model discloses an its simple structure of fin is reliable, and the processing degree of difficulty is lower, low in manufacturing cost is honest and clean, and the assembly is convenient, can be used for multiple heat dissipation occasion.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view of a heat sink in an embodiment of the present invention;

FIG. 2 is a side view of a heat sink in accordance with an embodiment of the present invention;

FIG. 3 is a front view of a heat sink in accordance with an embodiment of the present invention;

FIG. 4 is a rear view of a heat sink in accordance with an embodiment of the present invention;

fig. 5 is a rear view of a heat sink in accordance with another embodiment of the present invention;

fig. 6 is a schematic view of an application of the heat sink according to an embodiment of the present invention.

Detailed Description

Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.

The present invention is not limited to these embodiments. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and procedures have not been described in detail so as not to obscure the present invention.

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples.

FIG. 1 is a perspective view of a heat sink according to an embodiment of the present invention, which is seen to be substantially flat and plate-shaped and includes a first surface 110 and a second surface 120 opposite to the first surface 110, wherein ribs 111 for dissipating heat are provided on the first surface 110, a region of the middle portion of the first surface 110 slightly near the lower side edge has a recess 112 extending transversely to the left and right side edges, the recess 112 is rectangular and forms a corresponding protrusion 121 on the second surface 120, the recess 112 includes at least 2 connection holes 114, for example, 2 connection holes 114, respectively symmetrically disposed at the left and right ends of the heat sink, the connecting holes are used for connecting the radiating fin with a heating source, the heating source is a circuit board for example, the connecting line of 2 connecting holes and the adjacent area are hole site areas 113, ribs 111 are not arranged on the hole site areas 113, and the radiating fin is divided into a first radiating area 115 positioned on the upper side of the hole site areas 113 and a second radiating area 116 positioned on the lower side of the hole site areas 113 by the hole site areas 113.

Fig. 2 and fig. 3 are a side view and a front view of the heat sink according to an embodiment of the present invention, respectively, and it can be seen from the side view that the hole site area 113 is not located in the middle of the recess 112, but located in the middle of the recess 112 near the upper position, the area of the non-hole site area 113 of the recess 112 is also provided with ribs 111, and the height of the ribs 111 in the recess 112 is greater than the height of the ribs 111 in the non-recess 112 area, so that the end surfaces of the ribs 111 on the first surface 110 are flush. As can be seen from the front view of the heat sink, the hole area 113 is located at the middle of the heat sink, for example, and divides the heat sink into a first heat dissipation area 115 and a second heat dissipation area 116 located at two sides of the hole area 113, in this embodiment, the areas of the first heat dissipation area 115 and the second heat dissipation area 116 are the same, and of course, the areas of the first heat dissipation area 115 and the second heat dissipation area 116 may also be different and may be set according to actual needs.

Fig. 4 is a rear view of a heat sink according to an embodiment of the present invention, in which it can be seen that the protrusion 121 of the heat sink is located at a position close to the lower side edge in the middle of the heat sink, that is, the area of the protrusion 121 located in the second heat dissipation area 116 is larger than the area of the protrusion located in the first heat dissipation area 115, naturally, the protrusion 121 may also be located at an intermediate position or other positions of the heat sink, and may be set according to actual needs, the protrusion 121 is, for example, rectangular, and the protrusion 121 is used for being connected to a circuit board to guide out heat on the circuit board. Due to the arrangement of the protrusions 121, other areas of the radiating fin can keep a certain distance from the circuit board to avoid partial components on the circuit board, and the design is also favorable for air circulation, so that the radiating capacity of the radiating fin is further enhanced. The circuit board that links to each other with this fin can concentrate its power components and parts and set up at a side surface, and the opposite side surface of circuit board can with the utility model discloses a protrusion 121 of fin links to each other.

Fig. 5 is a rear view of another embodiment of the heat sink of the present invention, in order to increase the contact area with the circuit board, the protrusion 121 may be set in other shapes, and correspondingly, the shape of the recess 112 may be changed correspondingly, and the protrusion in fig. 5 is set in an oblique direction, for example, to obtain a larger area than the rectangle, and is more fully contacted with the circuit board to provide better heat dissipation capability.

Fig. 6 is an application schematic diagram of an embodiment of the present invention, in order to clearly show the connection relationship, a sectional view after detachment is selected, and the application schematic diagram includes a heat sink 100, a circuit board 200, an insulating spacer 300, and a housing 400, wherein at least portions of the circuit board 200, the insulating spacer 300, and the heat sink 100 are all located in an opening of the housing 400. The circuit board 200 is provided with a power device on one side surface facing the housing 400, the edge of the circuit board 200 is further provided with a connection terminal 220, and the other side surface of the circuit board 200 opposite to the power device is connected with the protrusion 121 of the heat sink 100 through an insulating gasket 300 to enhance the heat dissipation capability thereof. All be provided with the connecting hole on fin 100, insulating washer 300 and the circuit board 200, casing 400 is provided with and is provided with the screw hole on the spliced pole corresponding with the connecting hole, and after each part was placed in place, use the screw to pass the connecting hole of each part in proper order and screw in the screw hole of spliced pole, fixes each part, accomplishes the equipment of controller, and the size of fin 100 and the opening size phase-match of casing 400 make it can be exactly with circuit board 200 shutoff in the opening. Interference of the circuit board 200 from the outside is prevented.

To sum up, the embodiment of the utility model has following advantage or beneficial effect: the utility model provides a heat sink, through its sunken and bellied design, make the fin have bigger heat radiating area, still can have certain shutoff controller shell open-ended function concurrently, through setting up the power device in a side of circuit board, and set up at the another side rather than relative circuit board the utility model discloses a fin, set up insulating gasket between fin and the circuit board and carry out the electrical isolation and conduct heat, because the good heat conductivity of copper in the circuit board, the copper foil that the power device passes through the circuit board has increased heat radiating area, and conduct and link to each other with circuit board another side the utility model discloses an on the fin, make the fin not directly set up the surface at the power device, but make this fin can dispel the heat for whole circuit board, further increased the heat radiating area of fin, can dispel the heat high-efficiently. Further, the components and parts on the circuit board have not only been dodged with protruding design to the sunken of this fin, have still increased the circulation of air area, the utility model discloses an its simple structure of fin is reliable, and the processing degree of difficulty is lower, low in manufacturing cost is honest and clean, and the assembly is convenient, can be used for multiple heat dissipation occasion.

It should be noted that, in the description of the present invention, the terms "first" and "second" are only used for convenience in describing different components, and are not to be construed as indicating or implying a sequential relationship, relative importance or implicitly indicating the number of technical features indicated.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat sink is characterized in that a first surface of the heat sink is provided with a recess, the recess forms a protrusion on a second surface of the heat sink opposite to the first surface, and at least a partial area of the first surface is provided with ribs for heat dissipation.

2. A heat sink as recited in claim 1, wherein the recess has an attachment hole disposed therein for attaching the heat sink to a heat generating source.

3. The heat sink as claimed in claim 2, wherein the connection holes penetrate through the heat sink, the number of the connection holes is at least 2, and at least 2 of the connection holes are symmetrically arranged at two ends of the heat sink.

4. A heat sink as recited in claim 3, wherein said depression further comprises a void site area, said void site area comprising at least 2 vicinities of said connection hole connections.

5. A heat sink as claimed in claim 4, further comprising first and second heat dissipation areas connected to the aperture area, respectively, the first and second heat dissipation areas being provided with said ribs.

6. A heat sink as recited in claim 5, wherein the first heat dissipation area is the same area as the second heat dissipation area.

7. The fin according to claim 1, wherein the fin is any one of a circle, a semicircle and a polygon.

8. A heat sink as recited in claim 1 wherein the depression extends at the first surface to an edge of the heat sink.

9. A heat sink as recited in claim 1, wherein the protrusions are located in a middle portion of the heat sink adjacent to the side edges.

10. A heat sink as recited in claim 9 wherein the raised area is less than the area of the heat sink.

11. A heat sink as recited in claim 1 wherein the ribs are at least partially located in the depressions, the outboard end faces of the ribs in the depressions being coplanar with the outboard end faces of the ribs in the first surface non-depressions.