CN219938797U - Heat dissipation mechanism and energy storage equipment - Google Patents
Heat dissipation mechanism and energy storage equipment Download PDFInfo
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- CN219938797U CN219938797U CN202320471446.7U CN202320471446U CN219938797U CN 219938797 U CN219938797 U CN 219938797U CN 202320471446 U CN202320471446 U CN 202320471446U CN 219938797 U CN219938797 U CN 219938797U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 82
- 238000004146 energy storage Methods 0.000 title claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims description 49
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model relates to the field of heat dissipation, and particularly provides a heat dissipation mechanism and energy storage equipment. The first heat sink is configured to be disposed on a circuit board of the energy storage device and includes a first contact surface configured to be attached to a first heat generating device disposed on the circuit board. The second radiator is connected with the first radiator and is configured to be arranged at intervals with the circuit board, and comprises a second contact surface which is not coplanar with the first contact surface and is connected with a second heating device arranged on the circuit board so as to radiate heat to the second heating device. The first heat sink radiates heat to the first heat-generating device. The second radiator radiates heat to the second heating device. The second heating device which cannot be attached to the first contact surface can be connected with the second contact surface to dissipate heat, the second radiator is in a suspended state relative to the circuit board, the arrangement space of the circuit board cannot be occupied, and the heat dissipation mechanism is compact in structure.
Description
Technical Field
The present disclosure relates to heat dissipation, and particularly to a heat dissipation mechanism and an energy storage device.
Background
The contravariant module of energy storage equipment includes a plurality of heating devices, and energy storage equipment can produce heat at the during operation heating device, in order to generate heat the device and can in time dispel the heat, guarantees to generate heat the normal operating of device, can set up the fin alone at the great heating device of calorific capacity in the correlation technique, and the fin area is big, and every heating device alone sets up the fin and can occupy great space, is unfavorable for energy storage equipment miniaturized setting.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a heat dissipation mechanism and an energy storage device that are compact.
The embodiment of the utility model provides a heat dissipation mechanism which is applied to energy storage equipment and comprises a first heat radiator and a second heat radiator. The first heat sink is configured to be disposed on a circuit board of the energy storage device and includes a first contact surface configured to be attached to a first heat generating device disposed on the circuit board. The second radiator is connected with the first radiator and is configured to be arranged at intervals with the circuit board, and comprises a second contact surface which is not coplanar with the first contact surface and is connected with a second heating device arranged on the circuit board so as to radiate heat to the second heating device.
In the heat dissipation mechanism of the above embodiment, the first contact surface of the first heat spreader contacts the first heat generating device to dissipate heat from the first heat generating device. The second contact surface of the second radiator is connected with the second heating device so as to radiate heat of the second heating device. Because the first contact surface and the second contact surface are not coplanar, the second heating device which cannot be attached to the first contact surface can be connected with the second contact surface to dissipate heat, and the second radiator and the circuit board are arranged at intervals, so that the second radiator is in a suspended state relative to the circuit board and cannot occupy the arrangement space of the heating devices on the circuit board, and therefore, compared with the case that each heating device is independently provided with a radiating fin, the radiating mechanism is more compact in structure and smaller in occupied space.
In at least one embodiment, the heat-conducting layer is disposed on the second contact surface and is configured to be adapted to the shape of the side facing away from the second heat sink, so as to dissipate heat from the second heat-generating device.
In the heat dissipation mechanism of the above embodiment, the heat conduction coefficient of the heat conduction layer is high, the thermal resistance is low, heat can be effectively transferred to the second heating device, and the shape of the heat conduction layer facing to one side of the second heating device is adapted to the second heating device, so that the contact area between the heat conduction layer and the second heating device is increased, and the heat dissipation effect is improved.
In at least one embodiment, the heat conducting layer further comprises an insulating sheet disposed between the heat conducting layer and the second contact surface.
In the heat dissipation mechanism of the above embodiment, the insulating sheet is used to separate the second heat sink and the second heat generating device, so as to perform an insulating function.
In at least one embodiment, the first heat sink comprises a first substrate and a plurality of first heat dissipation fins. The first substrate is configured to be arranged on the circuit board, and the first contact surface is positioned on the first substrate. The plurality of first radiating fins are distributed on two opposite sides of the first substrate, and the first radiating fins on the same side are arranged at intervals.
In the heat dissipation mechanism of the above embodiment, the heat of the first heat generating device is transferred to the first substrate, and the first substrate is transferred to the first heat dissipation fins. The first radiating fins have larger contact area with air so as to radiate heat of the first heating device.
In at least one embodiment, the first heat sink further comprises an extension comprising a base and a plurality of extension fins. The base body is arranged on one side of the first substrate and is configured to be attached to a third heating device arranged on the circuit board. The plurality of extending fins are arranged on the base body at intervals, and the interval directions of the plurality of extending fins positioned on the same side are perpendicular to the interval directions of the plurality of first radiating fins.
In the heat dissipation mechanism of the above embodiment, the contact area between the first radiator and the air can be increased through the extension portion, so that the heat dissipation effect is improved.
In at least one embodiment, the second heat sink includes a second substrate, a connection portion, and a second heat sink fin. The second substrate is positioned at one side of the first radiator, and the second contact surface is positioned at the second substrate. The connecting part is arranged on the second substrate and is connected with the first radiating fins. The second radiating fins are arranged on the second substrate at intervals, and the interval directions of the second radiating fins are perpendicular to the interval directions of the first radiating fins.
In the heat dissipation mechanism of the above embodiment, the second heat generating device is connected to the second heat generating device through the second contact surface, so that heat of the second heat generating device is transferred to the second substrate, and the heat is dissipated through the second heat dissipation fins. The second substrate is connected with the first radiating fins through the connecting part, and heat of the second radiator can be transferred to the first radiator to further improve the radiating effect.
In at least one embodiment, the second radiator is provided with an avoidance hole, the avoidance hole is configured to be used for the second heating devices to penetrate, and the second contact surface is connected with the other second heating device, so that the second radiator radiates heat to the two second heating devices.
In the heat dissipation mechanism of the above embodiment, the heat of the second heat generating device penetrating through the avoidance hole is transferred to the second heat sink, and the second contact surface is connected with the other heat generating device, so that one second heat sink can dissipate heat of two adjacent second heat generating devices with different shapes at the same time.
In at least one embodiment, the second contact surface is configured to adapt in shape to the shape of the second heat generating device.
In the heat dissipation mechanism of the above embodiment, when the second contact surface is directly in contact connection with the second heat generating device, the contact area with the second heat generating device can be increased, and when the second contact surface is in contact with the second heat generating device through the heat conduction layer, a layer of heat conduction layer is directly coated on the second contact surface, and the shape of the heat conduction layer is adapted to the shape of the second heat generating device, so that the shape of the heat conduction layer does not need to be specially adjusted.
In at least one embodiment, the heat dissipation mechanism includes a plurality of second heat sinks, and the plurality of second heat sinks are disposed at intervals on the same first heat sink.
In the heat dissipation mechanism of the above embodiment, the number of the second heat sinks can be selected correspondingly according to the positions of the first heat generating device and the second heat generating device and the number of the second heat generating devices.
The embodiment of the utility model also provides energy storage equipment, which comprises a shell and an inversion module, wherein the inversion module is arranged in the shell and comprises a circuit board, a first heating device and a second heating device which are arranged on the circuit board, and the inversion module further comprises a heat dissipation mechanism which is arranged on the circuit board.
In the heat radiation mechanism and the energy storage device, the first heat radiator radiates heat to the first heating device, and the second heat radiator radiates heat to the second heating device. The first contact surface and the second contact surface are not coplanar, so that the second heating device which cannot be contacted with the first contact surface can radiate heat through the second radiator. The second radiator and the circuit board are arranged at intervals, so that the second radiator is suspended relative to the circuit board, the arrangement space of the first heating device and the second heating device cannot be occupied, and the heat dissipation mechanism is compact in structure. The second heating device penetrates through the avoidance hole in the second radiator, and the other second heating device is connected with the second contact surface, so that one second radiator can radiate heat to two adjacent second heating devices at the same time. The first radiator and the second radiator are detachably connected, so that the radiator can be automatically combined according to the needs, and the applicability is strong.
Drawings
Fig. 1 is a perspective view of an energy storage device according to an embodiment of the present utility model.
Fig. 2 is an exploded view of the energy storage device of fig. 1.
Fig. 3 and 4 are perspective view of the inverter module and the heat dissipation mechanism in fig. 2 at different angles.
Fig. 5 is a perspective view of the heat dissipating mechanism of fig. 2.
Fig. 6 is a perspective view of a heat dissipating mechanism according to another embodiment of the present utility model.
Fig. 7 is an enlarged view of I in fig. 6.
Fig. 8 is a perspective view of the inverter module and the heat dissipation mechanism of fig. 2 at another angle.
Fig. 9 is an enlarged view of II in fig. 8.
Description of the main reference signs
100-energy storage device 10-housing 11-upper cover
12-base 20-inversion module 21-circuit board
22-first heat generating device 23-second heat generating device 24-third heat generating device
30-Heat dissipation mechanism 31-first heat sink 311-first substrate
3111-first contact surface 312-first fin 313-extension
3131-base 3132-extended fins 32-second heat spreader
321-second substrate 3211-second contact surface 322-connection portion
323-second radiating fin 324-dodging hole 33-insulating sheet
34-Heat conducting layer
Detailed Description
The following description of the technical solutions according to the embodiments of the present utility model will be given with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments.
It is noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed" on another element, it can be directly on the other element or intervening elements may also be present. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "rear," and the like are used herein for illustrative purposes only.
When two elements (planes, lines) are arranged in parallel, it is understood that the relationship between the two elements includes both parallel and substantially parallel. Wherein substantially parallel is understood to mean that there may be an angle between the two elements that is greater than 0 deg. and less than or equal to 10 deg..
When two elements (planes, lines) are disposed vertically, it is understood that the relationship between the two elements includes both vertically and generally vertically. Wherein substantially perpendicular is understood to mean that the angle between the two elements is greater than or equal to 80 deg. and less than 90 deg..
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
The contravariant module of energy storage equipment includes a plurality of heating devices, and energy storage equipment can produce heat at the during operation heating device, in order to generate heat the device and can in time dispel the heat, guarantees to generate heat the normal operating of device, can set up the fin alone at the great heating device of calorific capacity in the correlation technique, and the fin area is big, and every heating device alone sets up the fin and can occupy great space, is unfavorable for energy storage equipment miniaturized setting.
In view of the foregoing, some embodiments of the present utility model provide a heat dissipation mechanism for an energy storage device, which includes a first heat sink and a second heat sink. The first heat sink is configured to be disposed on a circuit board of the energy storage device and includes a first contact surface configured to be attached to a first heat generating device disposed on the circuit board. The second radiator is connected with the first radiator and is configured to be arranged at intervals with the circuit board, and comprises a second contact surface which is not coplanar with the first contact surface and is connected with a second heating device arranged on the circuit board so as to radiate heat to the second heating device.
In the heat dissipation mechanism of the above embodiment, the first contact surface of the first heat spreader contacts the first heat generating device to dissipate heat from the first heat generating device. The second contact surface of the second radiator is connected with the second heating device so as to radiate heat of the second heating device. Because the first contact surface and the second contact surface are not coplanar, the second heating device which cannot be attached to the first contact surface can be connected with the second contact surface to dissipate heat, and the second radiator and the circuit board are arranged at intervals, so that the second radiator is in a suspended state relative to the circuit board and cannot occupy the arrangement space of the heating devices on the circuit board, and therefore, compared with the case that each heating device is independently provided with a radiating fin, the radiating mechanism is more compact in structure and smaller in occupied space.
Some embodiments of the present utility model will be described below with reference to the accompanying drawings. The embodiments described below and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, an embodiment of the present utility model provides an energy storage device 100, where the energy storage device 100 is used for storing energy, and when a device to be released, for example, the energy storage device 100 is an energy storage power source, electric energy can be stored in advance, and the energy storage device is used for home emergency, outdoor operation, open camping, night-time market, etc.
Referring to fig. 2, the energy storage device 100 includes a housing 10, an inverter module 20, and a heat dissipation mechanism 30. The inverter module 20 and the heat dissipation mechanism 30 are both disposed in the housing 10, the inverter module 20 is configured to convert dc power into ac power, and the heat dissipation mechanism 30 is connected to the inverter module 20 and is configured to dissipate heat from the inverter module 20.
The casing 10 includes an upper cover 11 and a base 12, the upper cover 11 is matched with the base 12 and fixedly connected with the base 12 through bolts, the inverter module 20 and the heat dissipation mechanism 30 are both located on the base 12, and the upper cover 11 shields the inverter module 20 and the base 12.
Referring to fig. 3, 4 and 5, the inverter module 20 includes a circuit board 21, a first heat generating device 22 and a second heat generating device 23, the circuit board 21 is mounted on the base 12, and the first heat generating device 22 and the second heat generating device 23 are disposed on the circuit board 21. The heat dissipation mechanism 30 includes a first heat sink 31 and a second heat sink 32, the first heat sink 31 is disposed on the circuit board 21, and the first heat sink 31 includes a first contact surface 3111, and the first contact surface 3111 is attached to the first heat generating device 22 for dissipating heat from the first heat generating device 22. The second heat spreader 32 is connected to the first heat spreader 31 and spaced apart from the circuit board 21, the second heat spreader 32 includes a second contact surface 3211, the second contact surface 3211 is not coplanar with the first contact surface 3111, and the second contact surface 3211 is connected to the second heat generating device 23 for dissipating heat from the second heat generating device 23.
Since the first contact surface 3111 and the second contact surface 3211 are not coplanar, when it appears that the first contact surface 3111 cannot be attached to the first heat generating device 22 and the second heat generating device 23 at the same time due to the positional relationship of the first heat generating device 22 and the second heat generating device 23, the first heat generating device 22 may be attached to the second contact surface 3211 and the second heat generating device 23 may be connected to achieve heat dissipation of the first heat generating device 22 and the second heat generating device 23. Because the second radiator 32 is arranged at intervals with the circuit board 21, the second radiator 32 is suspended relative to the circuit board 21, and does not occupy the arrangement space of the first heating device 22 and the second heating device 23 arranged on the circuit board 21, so that compared with the scheme that the first heating device 22 and the second heating device 23 are independently provided with one radiating fin, the radiating mechanism 30 is more compact in structure and smaller in occupied space. The first radiator 31 is connected to the second radiator 32, and the heat of the first radiator 31 and the heat of the second radiator 32 can be transferred to each other, so that the heat of the first heat generating device 22 and the heat of the second heat generating device 23 can be emitted not only by the corresponding first radiator 31 and the second radiator 32, but also by the first radiator 31 and the second radiator 32 at the same time, and the heat emission effect is good.
Optionally, the first heating device 22 is a MOS (Metal-oxide-semiconductor) tube, and the first contact surface 3111 can be attached to the MOS tube, so as to effectively dissipate heat from the MOS tube. The second heat generating device 23 is an inductance. It is understood that the structures of the first heat generating device 22 and the second heat generating device 23 are not limited thereto, but may be other, for example, an integrated circuit or the like. The first heat generating device 22 and the second heat generating device 23 may be the same device, for example, the first heat generating device 22 and the second heat generating device 23 are both MOS transistors.
The first heat sink 31 includes a first substrate 311 and a plurality of first heat dissipation fins 312, the first substrate 311 is disposed on the circuit board 21, and the first substrate 311 has a first contact surface 3111. When the energy storage device 100 is in a normal use state, the first contact surface 3111 is disposed vertically. The plurality of first heat dissipation fins 312 are disposed on the first substrate 311 at intervals, and the heat of the first heat generating device 22 is transferred to the first substrate 311, and then the first substrate 311 is transferred to the first heat dissipation fins 312. The first heat dissipation fins 312 have a larger contact area with air to dissipate heat of the first heat generating device 22.
Optionally, the number of the first heat dissipation fins 312 is two, and the first heat dissipation fins 312 are disposed on two opposite sides of the first substrate 311, each row of the first heat dissipation fins 312 is disposed at intervals along the vertical direction, the first heat dissipation fins 312 in the same row have the same size, the length direction of the first heat dissipation fins 312 is parallel to the length direction of the first substrate 311, and the width of the first heat dissipation fins 312 is perpendicular to the length direction and the vertical direction. The lengths of the two rows of first heat dissipation fins 312 are the same, and the widths thereof can be selected according to the positions of the specific first heat generating device 22 and the specific second heat generating device 23, so as to ensure that the first heat sink 31 does not interfere with the first heat generating device 22 or the second heat generating device 23. It is to be understood that the arrangement direction of the first heat dissipation fins 312 is not limited to be arranged at intervals along the vertical direction, but may be other, for example, arranged at intervals along the length direction of the first substrate 311, where the length direction of the first heat dissipation fins 312 is parallel to the vertical direction.
Referring to fig. 6 in combination, optionally, in some embodiments, the first heat spreader 31 further includes an extension portion 313, the extension portion 313 includes a base 3131 and a plurality of extension fins 3132, the base 3131 is disposed on one side of the first substrate 311, and the plurality of extension fins 3132 are disposed at intervals along a width direction of the first heat dissipation fins 312, so that an arrangement direction of the extension fins 3132 is perpendicular to an arrangement direction of the first heat dissipation fins 312. The contact area between the first radiator 31 and the air can be increased by the extension 313, thereby improving the heat dissipation effect. The inverter module 20 further includes a third heat generating device 24, the third heat generating device 24 is disposed on the circuit board 21 and adjacent to the first heat generating device 22, the substrate 3131 is attached to the third heat generating device 24 to dissipate heat of the third heat generating device 24, and the first radiator 31 can radiate heat of the first heat generating device 22 and the third heat generating device 24 at the same time, so that heat dissipation efficiency is good.
The second heat spreader 32 is located at one side of the first heat spreader 31, and the second heat spreader 32 includes a second substrate 321, a connecting portion 322, and second heat dissipation fins 323. The connection portion 322 is connected to the first heat dissipation fins 312, the second substrate 321 is disposed at the connection portion 322 and located at one side of the first heat sink 31, the second substrate 321 is spaced from the circuit board 21, so that the second heat sink 32 is suspended, and the second contact surface 3211 is located on the second substrate 321. The number of the second heat dissipation fins 323 is a plurality, and the plurality of second heat dissipation fins 323 are arranged on the second substrate 321 at intervals, and the interval direction of the second heat dissipation fins 323 is perpendicular to the interval direction of the first heat dissipation fins 312. Optionally, the second heat dissipation fins 323 are located on top of the second substrate 321.
The second heat generating device 23 is connected to the second substrate 321 through the second contact surface 3211, so that heat of the second heat generating device 23 is transferred to the second substrate 321 and dissipated through the second heat dissipating fins 323. The second substrate 321 is connected to the first heat dissipation fins 312 through the connection portion 322, and the heat of the second heat sink 32 can be transferred to the first heat sink 31 to further enhance the heat dissipation effect.
Alternatively, the connecting portion 322 is substantially L-shaped, and has one side detachably connected to the first heat dissipating fin 312 and the other side integrally connected to the second substrate 321. The connection portion 322 is connected to the top one of the rows of first heat dissipation fins 312, so that the connection portion 322 has enough space to connect with the first heat dissipation fins 312, and the assembly and the disassembly are more convenient. The first heat dissipation fins 312 and the connecting portions 322 are respectively provided with a connecting hole at a corresponding position and are connected by bolts. Optionally, a plurality of connection holes are disposed on the first fin at the top, so that one first heat sink 31 can be detachably connected with two or more second heat sinks 32, and the number of second heat sinks 32 can be correspondingly selected according to the positions of the first heat generating device 22 and the second heat generating device 23 and the number of second heat generating devices 23.
It is understood that when the plurality of second heat sinks 32 are connected to one first heat sink 31, the plurality of second heat sinks 32 may be located on the same side of the first heat sink 31, on opposite sides or adjacent sides of the first heat sink 31, or the like. The connection between the first radiator 31 and the second radiator 32 is not limited to the connection by bolts, and the connection can be easily made by a detachable connection mode such as a snap connection so as to adapt to the heat dissipation of different situations, or an integral forming mode so as to improve the connection stability of the first radiator 31 and the second radiator 32.
The second substrate 321 extends along a spacing direction of the second heat dissipating fins 323, and the second contact surface 3211 is located at a side of the second substrate 321 away from the second heat dissipating fins 323.
In some embodiments, the second contact surface 3211 is directly in contact with the second heat generating device 23 so that the second heat generating device 23 directly transfers heat to the second heat sink 32.
In other embodiments, the heat dissipation mechanism 30 further includes a heat conducting layer 34, where one side of the heat conducting layer 34 is attached to the second contact surface 3211, and the other side of the heat conducting layer 34 is directly contacted with the second heat generating device 23, so that the second contact surface 3211 is connected with the second heat generating device 23 through the heat conducting layer 34. Optionally, the heat conducting layer 34 is a heat conducting mud, and the heat conducting mud has high heat conductivity and low thermal resistance, so that heat can be effectively transferred to the second heating device 23, and the heat conducting mud has good adhesion with the second heating device 23 and has large contact area with the second heating device 23.
Since the second heat generating devices 23 are diverse in kind, the shape and volume of each kind of second heat generating device 23 are different, and even the same kind of second heat generating device 23 is different in model. Therefore, in order to increase the heat radiation effect of the second heat sink 32, the shape of the second contact surface 3211 is configured to be adapted to the shape of the second heat generating device 23. When the second contact surface 3211 is directly connected with the second heat generating device 23 in a contact manner, the contact area with the second heat generating device 23 can be increased, and when the second contact surface 3211 is in contact with the second heat generating device 23 through the heat conducting layer 34, a layer of heat conducting layer 34 is directly coated on the second contact surface 3211, and the shape of the heat conducting layer 34 is adapted to the shape of the second heat generating device 23 without specially adjusting the shape of the heat conducting layer 34.
It will be appreciated that the shape of the second contact surface 3211 is not limited to being adapted to the shape of the second heat generating device 23, and in other embodiments, the shape of the second contact surface 3211 is not limited, and one side of the heat conductive layer 34 is configured to be adapted to the shape of the second contact surface 3211, and the other side is configured to be adapted to the shape of the second heat generating device 23, so that the heat conductive layer 34 has a larger contact area with the second heat generating device 23.
In some embodiments, the second heat generating device 23 is a circular inductor, and the shape of the second contact surface 3211 is arc-shaped and matches the shape of the second heat generating device 23. In other embodiments, the second heat generating device 23 is an inductor with a planar top surface, and the second contact surface 3211 is planar in shape.
It should be understood that, among the plurality of second heat sinks 32 connected to the first heat sink 31, the structures of the plurality of second heat sinks 32 are not limited, and may be the same or different, for example, one first heat sink 31 connects two second heat sinks 32, the second contact surface 3211 of one second heat sink 32 is arc-shaped, and the second contact surface 3211 of the other second heat sink 32 is plane.
Referring to fig. 5, 6, 7 and 8, in some embodiments, the second heat sink 32 is provided with a avoiding hole 324, the second heat generating device 23 is disposed through the avoiding hole 324, and heat of the second heat generating device 23 is transferred to the second heat sink 32 through air, so that the second heat sink 32 dissipates heat.
In other embodiments, a heat conducting layer 34 is filled between the dodging holes 324 and the second heat generating device 23, and heat of the second heat generating device 23 is transferred to the second heat sink 32 through the heat conducting layer 34.
Since the number of the second heat generating devices 23 provided to the circuit board 21 is large and part of the second heat generating devices 23 are spaced apart by a short distance, the second heat sink 32 is liable to be oversized, and each of the second heat generating devices 23 cannot be provided with one second heat sink 32. While the shapes of the portions of the second heat generating devices 23 are different, it is difficult for one second contact surface 3211 to be connected to two different shapes of the second heat generating devices 23. For example, two adjacent second heating devices 23, one is an inductor with a circular shape, the other is a MOS tube with a planar top surface, the inductor is higher than the MOS tube, and one second contact surface 3211 cannot be connected to the inductor and the MOS tube at the same time. The inductance penetrates through the avoidance holes 324, so that heat is conducted to the second radiator 32, and the second contact surface 3211 is in contact with the MOS tube through the heat conducting layer 34 so as to transfer the heat of the MOS tube to the second radiator 32, so that one second radiator 32 can radiate heat to two adjacent second heating devices 23 at the same time. It will be appreciated that the second heat sink 32 may optionally include or exclude the second heat sink fins 323, depending on the actual requirements. For example, as shown in fig. 6, the second heat sink 32 includes a connection portion 322 and a second substrate 321, and the second substrate 321 is provided with a relief hole 324 and is not provided with second heat dissipation fins 323.
Optionally, in some embodiments, the heat dissipation mechanism 30 further includes an insulating sheet 33, where the insulating sheet 33 is disposed between the second contact surface 3211 and the heat conducting layer 34, for separating the second heat sink 32 from the second heat generating device 23 to perform an insulating function.
In summary, in the embodiment of the present utility model, the energy storage device 100 dissipates heat from the first heat generating device 22 through the first heat sink 31, and dissipates heat from the second heat generating device 23 through the second heat sink 32. Since the first contact surface 3111 and the second contact surface 3211 are not coplanar, the second heat generating device 23 that cannot be in contact with the first contact surface 3111 can radiate heat through the second heat sink 32. The second radiator 32 is spaced from the circuit board 21, so that the second radiator 32 is suspended relative to the circuit board 21, and therefore, the arrangement space of the first heating device 22 and the second heating device 23 is not occupied, and the heat dissipation mechanism 30 is compact in structure. The other second heat generating device 23 is connected with the second contact surface 3211 through the avoidance hole 324 penetrating through the second heat generating device 23 on the second heat sink 32, so that the second heat sink 32 can radiate heat to two adjacent second heat generating devices 23 at the same time. The first radiator 31 and the second radiator 32 are detachably connected, so that the heat radiator can be automatically combined according to the needs, and the applicability is high.
In addition, those skilled in the art will recognize that the foregoing embodiments are merely illustrative of the present utility model and are not intended to be limiting, as appropriate modifications and variations of the foregoing embodiments are within the scope of the present disclosure.
Claims (10)
1. A heat dissipation mechanism for an energy storage device, comprising:
a first heat sink configured to be disposed on a circuit board of the energy storage device and including a first contact surface configured to be attached to a first heat generating device disposed on the circuit board;
the second radiator is connected with the first radiator and is configured to be arranged at intervals with the circuit board, and the second radiator comprises a second contact surface which is not coplanar with the first contact surface and is connected with a second heating device arranged on the circuit board so as to radiate heat to the second heating device.
2. The heat dissipation mechanism of claim 1, further comprising a thermally conductive layer disposed on the second contact surface and configured to adapt to the shape of the side facing away from the second heat sink to dissipate heat from the second heat generating device.
3. The heat dissipation mechanism of claim 2, further comprising an insulating sheet disposed between the thermally conductive layer and the second contact surface.
4. The heat dissipation mechanism of claim 1, wherein the first heat sink comprises:
a first substrate configured to be disposed on the circuit board, the first contact surface being located on the first substrate;
the first radiating fins are distributed on two opposite sides of the first substrate, and the first radiating fins on the same side are arranged at intervals.
5. The heat dissipation mechanism of claim 4, wherein the first heat sink further comprises an extension comprising:
a base disposed on one side of the first substrate and configured to be attached to a third heat generating device disposed on the circuit board;
the plurality of extension fins are arranged on the base body at intervals, and the interval directions of the plurality of extension fins positioned on the same side are perpendicular to the interval directions of the plurality of first radiating fins.
6. The heat dissipation mechanism of claim 4, wherein the second heat sink comprises:
the second substrate is positioned at one side of the first radiator, and the second contact surface is positioned at the second substrate;
the connecting part is arranged on the second substrate and is connected with the first radiating fins;
the second radiating fins are arranged on the second substrate at intervals, and the interval directions of the second radiating fins are perpendicular to the interval directions of the first radiating fins.
7. The heat dissipation mechanism as recited in claim 1, wherein the second heat sink is provided with a relief hole configured to be penetrated by the second heat generating device, and the second contact surface is connected with the other second heat generating device so that the second heat sink dissipates heat from the two second heat generating devices.
8. The heat dissipation mechanism of claim 1, wherein the second contact surface is configured to conform to a shape of the second heat generating device.
9. The heat dissipation mechanism according to any one of claims 1 to 8, wherein the heat dissipation mechanism includes a plurality of second heat sinks, the plurality of second heat sinks being disposed at intervals to the same first heat sink.
10. An energy storage device, comprising a housing and an inverter module, wherein the inverter module is arranged in the housing, the inverter module comprises a circuit board, a first heating device and a second heating device, and the inverter module is characterized by further comprising a heat dissipation mechanism according to any one of claims 1 to 9, and the heat dissipation mechanism is arranged on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320471446.7U CN219938797U (en) | 2023-03-02 | 2023-03-02 | Heat dissipation mechanism and energy storage equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320471446.7U CN219938797U (en) | 2023-03-02 | 2023-03-02 | Heat dissipation mechanism and energy storage equipment |
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| Publication Number | Publication Date |
|---|---|
| CN219938797U true CN219938797U (en) | 2023-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320471446.7U Active CN219938797U (en) | 2023-03-02 | 2023-03-02 | Heat dissipation mechanism and energy storage equipment |
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| Country | Link |
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| CN (1) | CN219938797U (en) |
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Address after: 518000 Factory Building 401, Runheng Industrial Plant 1, Fuyuan Road, Zhancheng Community, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhenghao Innovation Technology Co.,Ltd. Country or region after: China Address before: 518000, 1st Floor, Building E, Jiehe Industrial City, Shuitian Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhenghao Innovation Technology Co.,Ltd. Country or region before: China |