CN215202059U - Heat radiation structure, control device and security patrol robot - Google Patents

Abstract

The utility model relates to a heat radiation structure, controlling means and security protection patrol robot, include: a housing; the circuit board is arranged in the shell; the microelectronic device is electrically connected to the peripheral part of the circuit board and is attached to the inner side wall of the shell; and the fixed support is arranged on the shell and fixes the microelectronic device. The microelectronic device can not occupy most of the middle space of the circuit board, so that the occupied space of the microelectronic device can be reduced, more space can be uniformly formed on the circuit board for mounting other devices, and the integration capability of the circuit board is improved; because the microelectronic device is directly attached to the inner side wall of the shell, heat generated by the microelectronic device during working can be quickly conducted to the fixing support and the shell and finally quickly dissipated, and the problem that the microelectronic device works in a high-temperature environment for a long time due to insufficient heat dissipation efficiency to influence the working reliability of the microelectronic device is solved.

Description

Heat radiation structure, control device and security patrol robot

Technical Field

The utility model relates to a service robot technical field especially relates to a heat radiation structure, controlling means and security protection patrol robot.

Background

Currently, in a control device of a robot, a circuit board is fixed inside a housing in a screw connection manner, and various microelectronic devices, such as MOS, are welded and fixed on the circuit board, so that the control device can realize a control function. However, because the conventional MOS is generally vertically installed in the middle of the circuit board or close to the middle of the circuit board, and the top end of the MOS is spaced from the housing, the MOS not only occupies too much installation space on the circuit board, and reduces the integration capability of the circuit board, but also a large amount of heat generated by the MOS cannot be rapidly and effectively dissipated from the housing, so that the reliability is affected when the MOS works in a high-temperature environment for a long time.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide a heat dissipation structure, a control device and a security patrol robot, and the heat dissipation structure, the control device and the security patrol robot are used for solving the problems that the board surface space utilization rate of a circuit board is low, the heat dissipation capability is poor and the working reliability is affected in the prior art.

In one aspect, the present application provides a heat dissipation structure, the heat dissipation structure comprising:

a housing;

a circuit board disposed within the housing;

the microelectronic device is electrically connected to the periphery of the circuit board and is attached to the inner side wall of the shell; and

a mounting bracket disposed on the housing and mounting the microelectronic device.

In the heat dissipation structure of the scheme, the microelectronic devices mounted on the circuit board are arranged on the periphery of the circuit board, so that most of the space in the middle of the circuit board is not occupied, the occupied space of the microelectronic devices can be reduced, more spaces can be uniformly formed on the circuit board for mounting other devices, and the integration capacity of the circuit board is improved; in addition, because the microelectronic device is directly laminated with the inner side wall of the shell, and the fixing support further fastens and fixes the microelectronic device on the shell, the microelectronic device can be stably installed at the moment, and meanwhile, heat generated by the microelectronic device during working can be rapidly conducted to the fixing support and the shell and finally rapidly dissipated, so that the problem that the microelectronic device works in a high-temperature environment for a long time due to insufficient heat dissipation efficiency and the working reliability of the microelectronic device is influenced is solved.

The technical solution of the present application is further described below:

in one embodiment, the microelectronic device is vertically arranged at the edge part of the circuit board, and the side surface of the microelectronic device is completely attached to the inner side wall of the shell.

In one embodiment, the heat dissipation structure further includes a heat dissipation silicone sheet, the heat dissipation silicone sheet is disposed on an inner side wall of the housing, and the microelectronic device is attached to the heat dissipation silicone sheet.

In one embodiment, the fixing support comprises a mounting plate, a connecting plate and a buckling plate which are sequentially connected, the mounting plate is provided with a first connecting portion, the housing is provided with a second connecting portion, the first connecting portion and the second connecting portion are fixedly connected through a fastener, a containing groove is formed between the buckling plate and the inner side wall of the housing at an interval, the microelectronic device is inserted in the containing groove, the buckling plate is buckled on the surface of the microelectronic device, and the notch of the containing groove faces downward to the circuit board.

In one embodiment, the heat dissipation structure further comprises a flexible pad disposed between the retaining plate and the microelectronic device.

In one embodiment, the heat dissipation structure further includes a heat sink disposed on an outer sidewall of the housing facing away from the microelectronic device, and a mounting position of the heat sink corresponds to a mounting position of the microelectronic device.

In one embodiment, the heat sink includes a heat dissipating substrate attached to the housing, and heat dissipating fins disposed on the heat dissipating substrate, the heat dissipating fins extending freely to an external environment.

In one embodiment, the number of the heat dissipation fins is multiple, the heat dissipation fins are arranged in an array structure, a transverse convection channel is formed between any two adjacent rows of the heat dissipation fins at intervals, and a vertical convection channel is formed between any two adjacent rows of the heat dissipation fins at intervals.

In one embodiment, the microelectronic device is a MOS.

In another aspect, the present application further provides a control device, which includes the heat dissipation structure as described above.

In addition, this application still provides a security protection patrol robot, and it includes controlling means as above.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural view of a heat dissipation structure according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a portion of the exploded structure of FIG. 1;

FIG. 3 is a schematic view of the structure of FIG. 1 from another perspective;

fig. 4 is a partially enlarged schematic view of a portion a in fig. 1.

Description of reference numerals:

10. a housing; 20. a circuit board; 30. a microelectronic device; 40. fixing a bracket; 41. mounting a plate; 42. a connector tile; 43. buckling and pressing a plate; 50. a containing groove; 60. a heat sink; 61. a heat-dissipating substrate; 62. a heat dissipating fin; 70. a transverse convection channel; 80. a vertical convective pathway.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

The embodiment of the application provides a security patrol robot, which has the autonomous moving capacity and can complete patrol and safety protection tasks, can replace traditional manpower security, and can execute patrol and security protection tasks in places such as residential communities, industrial parks, stadiums, logistics parks and the like, so that the cost and labor intensity of people can be reduced, meanwhile, people can be replaced to face some emergency situations, and the possible safety threats to people are eliminated.

Illustratively, the security patrol robot mainly comprises a mobile chassis, a robot main body, a radar, a camera and a control device. The mobile chassis provides power required by the security patrol robot to move and is used for installing and supporting other functional components such as a robot main body and a radar. Alternatively, the mobile chassis may be, but is not limited to, a wheeled chassis, a tracked chassis, or the like.

The robot main part is installed on removing the chassis, for the security protection patrols the major component of robot, can be used to bear radar, camera etc. can further install other functional module simultaneously, or accomodate some security protections and patrol the article that need be used.

The radar realizes planning and navigation of the moving direction and the path of the security patrol robot and enables the security patrol robot to have obstacle avoidance capability. Alternatively, the radar may be, but is not limited to, a 3D lidar, an infrared radar, a microwave radar, an over-the-horizon radar, a pulse radar, a phased array radar, or the like. The radar can be installed on the moving chassis, or between the moving chassis and the robot body, or on the upper end of the robot body. In this embodiment, it is preferable that a support seat is installed between the mobile chassis and the robot body so as to form a space-avoiding chamber between the mobile chassis and the robot body, and the radar is installed in the space-avoiding chamber, thereby enabling 360-degree full circumferential scanning.

The control device is a control center of the security patrol robot and is used for sending instructions to all functional components, so that the whole security patrol robot can reliably and autonomously operate. The control device is optionally mounted in a chamber formed by the moving chassis or inside the robot body. In this embodiment, the control device is preferably mounted in the mobile chassis. Specifically, the control device comprises a chip for controlling, various circuit boards, various electronic devices and the like.

The camera is installed on the top of robot main part, and the camera is in suitable higher position this moment, helps acquireing open field of vision, avoids receiving and shelters from. The camera can shoot images of the surrounding environment in real time, so that the purpose of security patrol is achieved. Alternatively, the camera may be any type and structure of camera equipment in the prior art, such as a monocular camera, a binocular camera, a spherical camera, a video camera, etc.; the concrete selection can be carried out according to the actual requirement.

Because a large number of electronic devices and chips are installed in the control device, and a single working cycle of the security patrol robot is generally long (for example, the security patrol robot continuously works from 8 o 'clock in the evening to 8 o' clock in the next morning), a large amount of heat can be continuously generated by the chips and the electronic devices in the working process, if the heat cannot be timely dissipated from the inside of the control device to the outside, the chips and the electronic devices can be caused to work in a high-temperature environment for a long time, the aging and other problems are inevitably accelerated, and the service life is influenced. Based on this, a heat radiation structure is designed and manufactured on the control device in the scheme, the problem of rapid and effective heat radiation is solved, and the continuous and reliable working capacity of the security patrol robot is ensured.

As shown in fig. 1 and fig. 2, a heat dissipation structure according to an embodiment of the present application includes: a housing 10; a circuit board 20, a microelectronic device 30, and a mounting bracket 40. The housing 10 is formed in a square structure, but other embodiments may be formed in other structures such as a cylinder. The interior of the housing 10 is hollow to form a mounting chamber for carrying chips, circuit boards 20, microelectronic devices 30, etc. In order to improve the heat conduction performance, the housing 10 is preferably made of a metal material or a composite material with a high heat transfer coefficient, such as copper alloy, aluminum alloy, etc.

The microelectronic device 30 is an executive electrical element of the control device that performs part of its necessary functions. The microelectronic device 30 in this embodiment may be a MOS, for example. The MOS is fixed to the circuit board 20, and preferably the MOS is soldered to the circuit board 20. The MOS is referred to as a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), and is suitable for high-frequency and high-speed circuits to transmit large current. The circuit board 20 is disposed in the housing 10.

In particular, in the present embodiment, the microelectronic device 30 is electrically connected to the outer periphery of the circuit board 20, and the microelectronic device 30 is attached to the inner sidewall of the housing 10. For example, when the circuit board 20 is rectangular, the microelectronic device 30 may be mounted in a ring-shaped area formed 3-5cm from the board edge. The fixing bracket 40 is disposed on the housing 10 and fixes the microelectronic device 30.

With continuing reference to fig. 1 and fig. 2, in summary, the following advantages will be achieved by implementing the technical solution of the present embodiment: in the heat dissipation structure of the above scheme, the microelectronic devices 30 mounted on the circuit board 20 are arranged on the peripheral portion of the circuit board 20, so that most of the space in the middle of the circuit board 20 is not occupied, the occupied space of the microelectronic devices 30 can be reduced, more space can be uniformly formed on the circuit board for mounting other devices, and the integration capability of the circuit board is improved; in addition, because microelectronic device 30 is with the inside wall direct laminating of shell 10 to fixed bolster 40 still further fixes microelectronic device 30 on shell 10, not only can guarantee that microelectronic device 30 installs firmly this moment, and the heat that microelectronic device 30 work produced can conduct to fixed bolster 40 and shell 10 fast simultaneously, and finally dispel rapidly, avoided because of the radiating efficiency is not enough, lead to microelectronic device 30 to work in high temperature environment for a long time, and influence its operational reliability's problem takes place. Further, when the microelectronic device 30 is an MOS device, since the MOS device has a large heat during operation, the heat generated by the MOS device can be rapidly transmitted to the housing 10 and the fixing bracket 40, and thus the heat is effectively dissipated to the environment through the housing 10 and the fixing bracket 40, so as to achieve the purpose of avoiding the MOS device from being affected by high temperature.

On the basis of the above embodiment, preferably, the microelectronic device 30 is vertically disposed at the edge portion of the circuit board 20, and the side surface of the microelectronic device 30 completely fits the inner side wall of the housing 10. Since the microelectronic device 30 is mounted vertically on the circuit board 20, a significant portion of the microelectronic device 30 is disposed away from the circuit board 20 without interference from the circuit board 20. On this basis, the microelectronic device 30 is disposed as close to the edge of the circuit board 20 as possible, the microelectronic device 30 can be completely attached to the housing 10 in a large area, and the contact area is large, so that the amount of heat conducted in unit time is increased, and the heat dissipation capability is further enhanced.

Further, in the present embodiment, the microelectronic devices 30 are disposed side by side and closely attached to the inner sidewall of the housing 10, which is helpful to greatly improve the heat dissipation effect through the heat transfer capability of the housing 10.

In addition, in some embodiments, the heat dissipation structure further includes a heat dissipation silicone sheet (not shown), the heat dissipation silicone sheet is disposed on an inner sidewall of the housing 10, and the microelectronic device 30 is attached to the heat dissipation silicone sheet. Because the inner side wall of the shell 10 is bonded with the heat dissipation silica gel sheet, the microelectronic device 30 can be indirectly contacted with the shell 10 through the heat dissipation silica gel sheet, and the heat dissipation silica gel sheet has excellent heat transfer efficiency, the gap between the microelectronic device 30 and the inner side wall of the shell 10 can be effectively filled, heat can be quickly transferred to the shell 10 from one side of the microelectronic device 30, and finally the heat is dissipated to the environment from the shell 10. In addition, because the heat dissipation silica gel piece is soft, the heat dissipation silica gel piece can also play a certain role in buffering, damping and sealing the microelectronic device 30.

Optionally, the heat dissipation silica gel piece can be single one deck, also can pile simultaneously and establish two-layer or even more multilayer, specifically can select according to actual need.

With reference to fig. 2, in still other embodiments, the fixing bracket 40 includes a mounting plate 41, a connecting plate 42, and a pressing plate 43, which are sequentially connected to each other, the mounting plate 41 has a first connecting portion, the housing 10 has a second connecting portion, the first connecting portion and the second connecting portion are connected and fixed by a fastener, a receiving groove 50 is formed between the pressing plate 43 and an inner side wall of the housing 10 at an interval, the microelectronic device 30 is inserted into the receiving groove 50, the pressing plate 43 is fastened to a surface of the microelectronic device 30, and a notch of the receiving groove 50 faces the circuit board below.

Referring to fig. 2 and 4, in this embodiment, the mounting plate 41, the connecting plate 42 and the retaining plate 43 cooperate to form a Z-shaped structure, and preferably, the connecting plate 42 is vertically connected to the mounting plate 41 and the retaining plate 43, so that when the mounting plate 41 is assembled with the housing 10, the connecting plate 42 supports the retaining plate 43 in a suspended structure extending toward the middle of the housing 10, and at this time, the retaining plate 43 can form a receiving slot 50 with the inner side wall of the housing 10, the receiving slot 50 is used for inserting the microelectronic device 30, and the retaining plate 43 can fix the microelectronic device 30. And because the notch of the containing groove 50 is arranged downwards, when the fixing bracket 40 is installed or dismantled, only one corresponding action of downward inserting or upward lifting is needed, which is beneficial to reducing the difficulty of the assembling and disassembling operation and improving the assembling and disassembling efficiency.

Optionally, in this embodiment, the first connecting portion is a threaded hole, the second connecting portion is a through hole, and a threaded member such as a screw penetrates through the through hole to be screwed with the threaded hole, so as to fix the fixing bracket 40 fast and firmly. Of course, in other embodiments, the first connecting portion may also be a fastener, and the second connecting portion may also be a fastener, where the fastener is connected with the fastener in a snap-fit manner; or the first connecting part can also be a first magnet, the second connecting part can also be a second magnet, and the first magnet and the second magnet are fixed in a magnetic attraction mode.

Further, the heat dissipation structure further includes a flexible pad (not shown) disposed between the chucking plate 43 and the microelectronic device 30. Because the retaining plate 43 is indirectly pressed on the microelectronic device 30 through the flexible pad, the retaining plate 43 does not cause direct rigid damage to the microelectronic device 30, that is, the flexible pad can protect the microelectronic device 30.

Alternatively, the flexible pad may be a rubber pad, a foam pad, a PP pad, or the like; the concrete selection can be carried out according to the actual requirement.

With continued reference to fig. 1 to fig. 3, in addition, on the basis of any of the above embodiments, the heat dissipation structure further includes a heat sink 60, the heat sink 60 is disposed on an outer side wall of the housing 10 facing away from the microelectronic device 30, and a mounting position of the heat sink 60 corresponds to a mounting position of the microelectronic device 30. Thus, since the heat sink 60 is additionally installed on the outer side wall of the housing 10, and the installation position of the heat sink 60 corresponds to the installation position of the microelectronic device 30 located inside, the heat transferred from the microelectronic device 30 to the housing 10 can be further transferred to the heat sink 60 through the shortest path, and finally the heat can be further rapidly dissipated to the environment by virtue of the excellent heat dissipation capability of the heat sink 60, so as to improve the overall heat dissipation efficiency of the heat dissipation structure.

With reference to fig. 2 and fig. 3, in the above embodiment, the heat sink 60 includes a heat dissipating substrate 61 and heat dissipating fins 62 disposed on the heat dissipating substrate 61, the heat dissipating substrate 61 is connected to the housing 10, and the heat dissipating fins 62 freely extend to the external environment.

The heat dissipation substrate 61 and the heat dissipation fins 62 are made of a metal material with a high heat transfer coefficient, such as copper, copper alloy, aluminum alloy, and the like. The area of the heat dissipation substrate 61 is set to be not smaller than the area of the microelectronic device 30, and the heat sink 60 should be designed as large as possible without being limited by the installation space, so that the amount of heat absorbed per unit time can be increased, and the heat dissipation efficiency can be improved.

In this embodiment, a threaded hole is formed in the heat dissipation substrate 61, a through hole corresponding to the threaded hole is formed in the housing 10, and at this time, a threaded member such as a bolt is screwed into the threaded hole after penetrating through the through hole, so that the heat sink 60 can be quickly and firmly mounted and fixed.

And because the radiating fins 62 are vertically installed on the radiating base plate 61 and extend towards the external environment, the radiating fins 62 are ensured to be fully contacted with the air in the environment, and further the heat transfer capacity of the radiating fins 62 is improved. Particularly, the surface of the heat dissipation fin 62 can be further designed to manufacture fork-shaped fine heat dissipation teeth, so that the contact area between the heat dissipation fin 62 and the air can be further increased, and the effect of quickly dissipating heat is achieved.

With reference to fig. 3, further, on the basis of the above embodiment, a plurality of heat dissipation fins 62 are provided, and the heat dissipation fins 62 are arranged in an array structure, a transverse convection channel 70 is formed between any two adjacent rows of the heat dissipation fins 62 at intervals, and a vertical convection channel 80 is formed between any two adjacent rows of the heat dissipation fins 62 at intervals.

In this way, when the security patrol robot moves, the head-on airflow can respectively flow through the transverse convection channel 70 and the vertical convection channel 80, the rapidly flowing cold air can rapidly take away the heat transferred to the heat dissipation fins 62, and the cold air can continuously flow through the transverse convection channel 70 and the vertical convection channel 80, so that the heat dissipation capability of the heat dissipation fins 62 is greatly enhanced.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Claims (11)

1. A heat dissipation structure, comprising:

a housing;

a circuit board disposed within the housing;

the microelectronic device is electrically connected to the periphery of the circuit board and is attached to the inner side wall of the shell; and

a mounting bracket disposed on the housing and mounting the microelectronic device.

2. The heat dissipation structure of claim 1, wherein the microelectronic device is vertically disposed at an edge portion of the circuit board, and a side surface of the microelectronic device completely abuts against an inner side wall of the housing.

3. The heat dissipation structure of claim 2, further comprising a heat dissipation silicone sheet disposed on an inner sidewall of the housing, wherein the microelectronic device is attached to the heat dissipation silicone sheet.

4. The heat dissipating structure of any one of claims 1 to 3, wherein the fixing bracket comprises a mounting plate, a connecting plate and a retaining plate connected in sequence, the mounting plate is provided with a first connecting portion, the housing is provided with a second connecting portion, the first connecting portion and the second connecting portion are connected and fixed by a fastener, a receiving groove is formed between the retaining plate and an inner side wall of the housing at an interval, the microelectronic device is inserted into the receiving groove, the retaining plate is fastened to a surface of the microelectronic device, and a notch of the receiving groove faces the circuit board below.

5. The heat dissipation structure of claim 4, further comprising a compliant pad disposed between the retaining plate and the microelectronic device.

6. The heat dissipation structure of claim 4, further comprising a heat sink disposed on an outer sidewall of the housing facing away from the microelectronic device, wherein a mounting position of the heat sink corresponds to a mounting position of the microelectronic device.

7. The heat dissipating structure of claim 6, wherein the heat sink comprises a heat dissipating substrate and heat dissipating fins disposed on the heat dissipating substrate, the heat dissipating substrate is connected to the housing, and the heat dissipating fins extend freely to the external environment.

8. The heat dissipation structure of claim 7, wherein the heat dissipation fins are provided in plurality, and the plurality of heat dissipation fins are arranged in an array structure, a transverse convection channel is formed between any two adjacent rows of the heat dissipation fins at intervals, and a vertical convection channel is formed between any two adjacent rows of the heat dissipation fins at intervals.

9. The heat dissipation structure of claim 1, wherein the microelectronic device is a MOS.

10. A control device comprising the heat dissipation structure according to any one of claims 1 to 9.

11. A security patrol robot comprising a control device according to claim 10.

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