CN210670506U

CN210670506U - Intelligent sound box

Info

Publication number: CN210670506U
Application number: CN201922216895.3U
Authority: CN
Inventors: 黄雷; 李林森
Original assignee: Goertek Techology Co Ltd
Current assignee: Goertek Techology Co Ltd
Priority date: 2019-12-13
Filing date: 2019-12-13
Publication date: 2020-06-02
Anticipated expiration: 2029-12-13

Abstract

The utility model belongs to the technical field of intelligent house product, especially, relate to an intelligent sound box, the power distribution box comprises a box body, fixed mounting is at the mainboard subassembly in the cavity that the box encloses, and loudspeaker, form the vocal cavity between the cavity that loudspeaker and box enclose, be equipped with a plurality of phonate holes on the box body part that corresponds the vocal cavity, still including installing the elastic support that can conduct heat on the chamber wall in vocal cavity, the heat conduction piece of setting between mainboard subassembly and elastic support, and fixed connection is close to the fin on phonate hole one side at the elastic support, leave the interval between fin and the box body part that sets up the phonate hole. Can pass through on heat conduction piece, the elastic support conduction to the fin with the heat that mainboard subassembly produced, the rethread phonate hole dispels to the audio amplifier outside, and the during operation, the fin is in vibration state moreover and can makes phonate hole department produce the air flow, can strengthen the radiating efficiency, has solved the unable problem of dispelling to the audio amplifier outside of heat that current intelligent audio amplifier produced.

Description

Intelligent sound box

Technical Field

The utility model belongs to the technical field of intelligent house product, especially, relate to an intelligent sound box.

Background

At present, as the functions of the intelligent sound box are more and more, the number of corresponding chips mounted on the PCB is more and more, and the problem that the generated heat is greatly increased is solved. In order to facilitate heat dissipation, the heat dissipation fins are arranged at positions corresponding to the PCB inside the sound box to dissipate heat, but after heat dissipation of the heat dissipation fins, a large part of heat is still remained inside the sound box, and the heat cannot be dissipated to the outside of the sound box.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an intelligent sound box aims at solving the unable problem of loosing to the audio amplifier outside of heat that current intelligent sound box produced.

The utility model discloses an intelligent sound box, which comprises a box body, a mainboard assembly and a loudspeaker, wherein the mainboard assembly and the loudspeaker are fixedly installed in a cavity enclosed by the box body, a sound cavity is formed between the loudspeaker and the cavity enclosed by the box body, and a plurality of sound holes are arranged on a box body part corresponding to the sound cavity; the heat dissipation plate is characterized by further comprising an elastic support which is arranged on the cavity wall of the sound cavity and can conduct heat, a heat conduction piece which is arranged between the main plate assembly and the elastic support, and a heat dissipation plate which is fixedly connected to one side, close to the sound outlet hole, of the elastic support, and a distance is reserved between the heat dissipation plate and the box body part provided with the sound outlet hole.

As an improvement, the elastic bracket includes an annular outer edge portion, a mounting plate portion disposed at an interval from the outer edge portion, and a corrugated portion connected between an outer peripheral side of the mounting plate portion and an inner peripheral edge of the outer edge portion, the heat sink is fixedly connected to the mounting plate portion, and the heat conductive member is disposed between a chip of the main board assembly and the outer edge portion.

As an improvement, the elastic support is an integrated piece formed by injection molding of an elastic material added with heat conducting particles, and a clamping groove is formed in the mounting plate part; the radiating fin comprises a plate body arranged in the clamping groove and a plurality of radiating fins arranged on the side face of the plate body and extending towards one side of the sound outlet hole.

As an improvement, the box body comprises an outer shell, an inner shell fixedly installed in a cavity enclosed by the outer shell, the sound outlet hole is formed in the outer shell, the main board assembly is fixedly installed in the cavity enclosed by the inner shell, the elastic support is installed on the side wall of the inner shell, the horn is installed on the inner shell and forms the sound cavity with the cavity enclosed by the inner shell, and the sound box further comprises a mesh cloth wrapped on the outer peripheral side of the outer shell.

As an improvement, be equipped with the depressed area on the lateral wall outside of inner shell be equipped with on the bottom surface of depressed area with the inner shell encloses into the installation through-hole of cavity intercommunication, outer fringe portion sets up in the depressed area installation board with folded ring portion sets up installation through-hole department.

As an improvement, an annular connecting frame made of a metal material is connected between the outer edge portion and the bottom surface of the recessed area, and the heat conducting member is in contact with the chip of the motherboard assembly and the annular connecting frame respectively.

As an improvement, the heat conducting member is a metal gasket, and one metal gasket is respectively arranged at a position corresponding to each chip.

As an improvement, the outer shell is cylindrical, the shape of the inner shell is matched with the shape of a cylinder cavity of the outer shell and is sleeved together, two horn ports of the inner shell are respectively provided with one horn, the two horns and the cylinder cavity of the inner shell form the sound cavity, and the position of the outer shell, which is just opposite to the elastic support and the radiating fins, is provided with a placing plane.

As an improvement, an auxiliary heat dissipation plate is arranged between the outer shell and the inner shell at a position corresponding to the main board assembly.

As an improvement, the auxiliary heat dissipation plate is made of a graphite sheet.

Since the technical scheme is used, the utility model discloses an intelligence audio amplifier includes the box, fixed mounting is at the mainboard subassembly in the box enclosure becomes the cavity, and loudspeaker, form the vocal cavity between loudspeaker and the box enclosure becomes the cavity, be equipped with a plurality of phonate holes on the box body part that corresponds the vocal cavity, still including installing the elastic support that can conduct heat on the chamber wall in vocal cavity, the heat-conducting piece of setting between mainboard subassembly and elastic support, and fixed connection is close to the fin on phonate hole one side at the elastic support, leave the interval between fin and the box body part that sets up the phonate hole. When the intelligent sound box works, the loudspeaker can vibrate, make elastic support produce the vibration through resonance, drive the fin simultaneously and vibrate, owing to be equipped with the heat-conducting piece between mainboard subassembly and elastic support, elastic support can conduct heat, can pass through the heat-conducting piece with the heat that mainboard subassembly produced, elastic support conducts to the fin, dispel to the audio amplifier outside through the sound outlet, and the fin is in vibration state and can makes sound outlet department produce the air flow in addition, can strengthen the radiating efficiency, the utility model discloses an intelligent sound box can dispel the inside heat of audio amplifier to the audio amplifier outside, has solved the unable problem of dispelling to the audio amplifier outside of heat that current intelligent sound box produced.

Drawings

Fig. 1 is a schematic view of the structure of the intelligent sound box of the present invention;

fig. 2 is a schematic diagram of a right-view structure of the intelligent sound box of the present invention;

fig. 3 is an installation schematic view of the heat dissipation part of the smart speaker of the present invention;

fig. 4 is a schematic cross-sectional view of the heat dissipating portion of the smart speaker of the present invention;

fig. 5 is an exploded schematic view of the heat dissipating portion of the smart speaker of the present invention;

the PCB comprises a first outer shell, a first inner shell, a second inner shell, a first sound outlet hole, a first outer shell, a first inner shell, a second outer shell, a second inner shell, a recess area, a mounting through hole, a first mesh cloth, a second mesh cloth, a placing plane, a first PCB board, a second PCB board, a chip, a first elastic support, a second elastic.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Fig. 1 to fig. 5 are the structural schematic diagram of the intelligent sound box of the present invention, wherein, fig. 1 shows the utility model discloses the main structure schematic diagram of looking of intelligent sound box, fig. 2 shows the utility model discloses the right side structure schematic diagram of intelligent sound box, fig. 3 shows the utility model discloses the installation schematic diagram of the heat dissipation part of intelligent sound box, fig. 4 shows the utility model discloses a cross-sectional schematic diagram of the heat dissipation part of intelligent sound box, fig. 5 shows the utility model discloses a decomposition schematic diagram of the heat dissipation part of intelligent sound box. For the sake of convenience, only the parts relevant to the present invention are shown in the drawings.

As can be seen from fig. 1, 2, 3, 4 and 5, the smart speaker includes a box body, a main board assembly fixedly installed in a cavity defined by the box body, and a speaker installed on the box body, wherein an acoustic cavity is formed between the speaker and the cavity defined by the box body, and a plurality of sound outlet holes 111 are formed in a portion of the box body corresponding to the acoustic cavity; the sound cavity structure further comprises an elastic support 30 which is arranged on the cavity wall of the sound cavity and can conduct heat, a heat conducting piece arranged between the main board assembly and the elastic support 30, and a radiating fin 40 fixedly connected to one side, close to the sound outlet 111, of the elastic support 30, wherein a distance is reserved between the radiating fin 40 and the box body part provided with the sound outlet 111.

When the intelligent sound box works, the loudspeaker can vibrate, make elastic support 30 produce the vibration through resonance, drive fin 40 simultaneously and vibrate, because be equipped with the heat-conducting piece between mainboard subassembly and elastic support 30, elastic support 30 can conduct heat, can pass through the heat-conducting piece with the heat that mainboard subassembly produced, elastic support 30 conducts to fin 40 on, it is outside to dispel to the audio amplifier through sound hole 111, and fin 40 is in vibration state and can makes sound hole 111 department produce the air flow, can strengthen the radiating efficiency, the utility model discloses an intelligent sound box can dispel the inside heat of audio amplifier to the audio amplifier outside, has solved the unable problem of dispelling to the audio amplifier outside of the heat that current intelligent sound box produced.

In the present embodiment, the main board assembly includes a PCB board 21, and a plurality of chips 22 mounted on the PCB board 21; the elastic bracket 30 comprises an annular outer edge part 31, an installation plate part 32 arranged at an interval with the outer edge part 31, and a folded ring part 33 connected between the outer periphery side of the installation plate part 32 and the inner ring edge of the outer edge part 31, wherein a plurality of heat conducting particles are embedded in the outer edge part 31, the folded ring part 33 and the installation plate part 32 respectively; the heat sink 40 is fixedly connected to the mounting plate portion 32, and the heat conductor is provided between the chip 22 and the outer edge portion 31 of the main board assembly.

Specifically, the elastic support 30 is an integral piece injection-molded by an elastic material added with heat conducting particles, and the mounting plate portion 32 is provided with a clamping groove, wherein the elastic material is rubber or silica gel, and the like, and the heat conducting particles are aluminum powder or copper powder, and the like; the heat sink 40 includes a plate body mounted in the card slot, and a plurality of heat dissipation fins provided on a side surface of the plate body and extending toward the side of the sound outlet hole 111, and generally, the heat sink 40 is made of a metal material having an excellent heat conductive property such as copper, aluminum alloy, or the like. The heat sink 40 is fixedly connected to the mounting plate portion 32 of the elastic support 30, so that the vibration performance of the elastic support 30 can be enhanced, the heat exchange area can be increased, the heat dissipation efficiency can be further improved, and the space can be saved.

In this embodiment, the box includes the shell, the inner shell in the cavity is enclosed to the shell to fixed mounting, and the sound outlet 111 sets up on the shell, mainboard subassembly fixed mounting in the cavity is enclosed to the inner shell, and elastic support 30 installs on the lateral wall of inner shell, loudspeaker install on the inner shell and the inner shell encloses between the cavity and form the sound chamber, still includes the screen cloth of parcel on the shell periphery side.

In order to facilitate the installation of the elastic bracket 30, a recessed area 121 is provided on the outer side of the side wall of the inner shell, an installation through hole 122 communicating with a cavity enclosed by the inner shell is provided on the bottom surface of the recessed area 121, the outer edge portion 31 is provided in the recessed area 121, and the installation plate portion 32 and the folded ring portion 33 are provided at the installation through hole 122.

In order to facilitate the installation of the elastic support 30 and the conduction of the heat of the motherboard assembly to the elastic support 30, an annular connecting frame 60 made of metal material is connected between the outer edge portion 31 and the bottom surface of the recessed area 121, and the heat conducting members are respectively in contact with the chip 22 of the motherboard assembly and the annular connecting frame 60; usually, the annular connecting frame 60 is made of aluminum alloy or copper, and the bottom surfaces of the outer edge portion 31 and the recessed area 121 are fixedly connected to the corresponding side surfaces of the annular connecting frame 60 through heat conducting glue. The heat conducting member is a metal pad 70, and the metal pad 70 may be disposed corresponding to each chip 22, or one metal pad 70 may be shared by a plurality of chips 22.

Specifically speaking, the outer shell is cylindric, the shape of inner shell and the barrel cavity shape looks adaptation of outer shell and cup joint together, installs a loudspeaker respectively on two nozzle ends of inner shell, forms the acoustic cavity between the barrel cavity of two loudspeakers and inner shell, is equipped with the plane of placing 14 in the position department that the outer shell just right elastic support 30, fin 40, and when the intelligent audio amplifier used, can be through placing on the desktop steadily placing plane 14. Generally, the inner shell comprises a first inner shell 12a and a second inner shell 12b which are buckled together, and a fastener such as a screw is arranged between the first inner shell 12a and the second inner shell 12b to fixedly connect the first inner shell 12a and the second inner shell 12b together; the housing may be an integral structure, or may be a split structure, and includes a first housing 11 and a second housing (not shown in the drawings) which are fastened together, the adjoining surfaces of the first housing 11 and the second housing are inclined, the elastic support 30 and the heat sink 40 are fixed at the upper portion of the first housing 11, and the placement plane 14 is disposed at the lower portion of the second housing, so that the elastic support 30 and the main board assembly are conveniently mounted on the first housing 11; correspondingly, the mesh cloth can be an integrated structure or a split structure, and comprises a first mesh cloth 13a and a second mesh cloth 13b which are respectively wrapped on the peripheral sides of the first shell 11 and the second shell.

In the present embodiment, in order to prevent the local hot spot from being present at the position corresponding to the chip 22 outside the case, an auxiliary heat dissipation plate 50 is provided between the outer case and the inner case at the position corresponding to the main board assembly, and generally, the auxiliary heat dissipation plate 50 is made of a graphite sheet.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An intelligent sound box comprises a box body, a main board assembly and a loudspeaker, wherein the main board assembly is fixedly installed in a cavity defined by the box body; the heat dissipation plate is characterized by further comprising an elastic support which is arranged on the cavity wall of the sound cavity and can conduct heat, a heat conduction piece which is arranged between the main plate assembly and the elastic support, and a heat dissipation plate which is fixedly connected to one side, close to the sound outlet hole, of the elastic support, and a distance is reserved between the heat dissipation plate and the box body part provided with the sound outlet hole.

2. The smart sound box of claim 1, wherein the resilient support includes an annular outer edge portion, a mounting plate portion spaced apart from the outer edge portion, and a corrugated portion connected between an outer peripheral side of the mounting plate portion and an inner peripheral edge of the outer edge portion, wherein the heat sink is fixedly connected to the mounting plate portion, and the heat conductor is disposed between the chip of the main plate assembly and the outer edge portion.

3. The smart sound box according to claim 2, wherein the elastic support is an integral piece injection molded by an elastic material with heat conducting particles, and a slot is provided on the mounting plate portion; the radiating fin comprises a plate body arranged in the clamping groove and a plurality of radiating fins arranged on the side face of the plate body and extending towards one side of the sound outlet hole.

4. The smart sound box according to claim 2 or 3, wherein the box body comprises an outer shell, an inner shell fixedly installed in a cavity enclosed by the outer shell, the sound outlet is disposed on the outer shell, the main board assembly is fixedly installed in the cavity enclosed by the inner shell, the elastic support is installed on a side wall of the inner shell, the speaker is installed on the inner shell, and the sound cavity is formed between the speaker and the cavity enclosed by the inner shell, and the smart sound box further comprises a mesh cloth wrapped on an outer peripheral side of the outer shell.

5. The intelligent sound box according to claim 4, wherein a recessed area is provided on an outer side of the side wall of the inner housing, a mounting through hole communicating with a cavity surrounded by the inner housing is provided on a bottom surface of the recessed area, the outer edge portion is provided in the recessed area, and the mounting plate portion and the folded ring portion are provided at the mounting through hole.

6. The smart sound box of claim 5, wherein a ring-shaped connecting frame made of metal material is connected between the outer edge portion and the bottom surface of the recessed area, and the heat conducting member is in contact with the chip of the main board assembly and the ring-shaped connecting frame, respectively.

7. The smart sound box of claim 6, wherein the heat conducting member is a metal gasket, and one metal gasket is disposed at a position corresponding to each chip.

8. The intelligent sound box according to claim 4, wherein the outer shell is cylindrical, the shape of the inner shell is matched with the shape of the cylindrical cavity of the outer shell and is sleeved together, two horn ports of the inner shell are respectively provided with one horn, the acoustic cavity is formed between the two horns and the cylindrical cavity of the inner shell, and a placing plane is arranged at the position of the outer shell, which is opposite to the elastic support and the radiating fins.

9. The smart sound box according to claim 4, wherein an auxiliary heat dissipation plate is provided between the outer case and the inner case at a position corresponding to the main board assembly.

10. The smart sound box of claim 9, wherein the auxiliary heat sink is made of a graphite sheet.