CN211827100U - Intelligent interaction module and case with same - Google Patents
Intelligent interaction module and case with same Download PDFInfo
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- CN211827100U CN211827100U CN201922333258.4U CN201922333258U CN211827100U CN 211827100 U CN211827100 U CN 211827100U CN 201922333258 U CN201922333258 U CN 201922333258U CN 211827100 U CN211827100 U CN 211827100U
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- circuit board
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- interaction module
- sidewall
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Abstract
The utility model relates to an intelligent interaction module and have this intelligent interaction module's quick-witted case. The intelligent interaction module comprises: the device comprises a support, a main circuit board, a CPU, a GPU and a sub-circuit board. The main circuit board is mounted on the bracket. And the CPU and the GPU are fixed on the main circuit board. The sub circuit board is arranged on the support, the sub circuit board and the main circuit board are positioned on different sides of the support, and the sub circuit board is in communication connection with the main circuit board. According to the intelligent interaction module, the circuit board is designed into the main circuit board and the sub circuit board, the CPU, the GPU and other main chips are fixed on the main circuit board, the main circuit board is in communication connection with the sub circuit board, and the main circuit board and the sub circuit board are installed on different sides of the support, so that the circuit board occupies a small area, the intelligent interaction module is compact in structure and easy to arrange in a limited space of a case.
Description
Technical Field
The utility model relates to a quick-witted case technical field, especially intelligent interaction module and have this intelligent interaction module's quick-witted case.
Background
The chassis is widely applied to vehicle-mounted, airborne, ship-based and other equipment and is often used in severe environment. The size of the chassis is typically limited. The intelligent interaction module comprises a plurality of high-performance chips. In order to meet the requirement of the intelligent interaction module and the complete machine in matched use, the size of the intelligent interaction module needs to be designed to be very small, so that a plurality of high-performance chips are difficult to arrange. Therefore, the traditional case has the problems that the space is very limited and the intelligent interaction module is difficult to arrange.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide an intelligent interactive module with a compact structure and a chassis having the intelligent interactive module, aiming at the problem that the traditional chassis has a very limited space and is difficult to arrange the intelligent interactive module.
The application provides an intelligent interaction module, include:
a support;
a main circuit board mounted on the bracket;
the CPU and the GPU are fixed on the main circuit board; and
the sub-circuit board is arranged on the support, the sub-circuit board and the main circuit board are positioned on different sides of the support, and the sub-circuit board is in communication connection with the main circuit board.
According to the intelligent interaction module, the circuit board is designed into the main circuit board and the sub circuit board, the CPU, the GPU and other main chips are fixed on the main circuit board, the main circuit board is in communication connection with the sub circuit board, and the main circuit board and the sub circuit board are installed on different sides of the support, so that the circuit board occupies a small area, the intelligent interaction module is compact in structure and easy to arrange in a limited space of a case.
In an embodiment, the smart interactive module further includes an XMC connector, and the XMC connector is used for data signal transmission between the main circuit board and the sub-circuit board.
In an embodiment, the smart interactive module further includes miniSATA mounted on the sub-circuit board.
In an embodiment, the intelligent interaction module further comprises a GPU heat conducting portion, the GPU heat conducting portion is fixedly connected with the bracket, and the GPU heat conducting portion is attached to the GPU.
In an embodiment, the intelligent interaction module further includes a CPU heat conducting portion, the CPU heat conducting portion has a first side wall, a second side wall opposite to the first side wall, and a bottom wall fixedly connected to the first side wall and the second side wall, respectively, a groove is defined by the first side wall, the second side wall, and the bottom wall, the sub-circuit board is located in the groove, a through hole is provided on the bracket, the first side wall is located in the through hole, and an outer surface of the first side wall is attached to the CPU.
In an embodiment, the intelligent interactive module further includes a cover covering a surface of the sub-circuit board facing away from the main circuit board, the cover having a hollow area, and the CPU heat conducting portion being exposed from the hollow area.
In one embodiment, the CPU heat conducting portion includes a connecting portion, the connecting portion is fixedly connected to an outer surface of the bottom wall, and the connecting portion is fixedly connected to the bracket.
In one embodiment, the CPU heat conducting portion is fixedly connected to the sub-circuit board.
In one embodiment, the material used for the CPU thermal conductor is copper.
The application also provides a case, which comprises a case body and the intelligent interaction module, wherein the intelligent interaction module is positioned in the case body.
In an embodiment, the intelligent interactive module further comprises a cover body, the cover body covers the surface of the sub-circuit board, which faces away from the main circuit board, a hollow area is formed on the cover body, and the CPU heat conducting part is exposed from the hollow area;
the case also comprises a heat-conducting plate, the heat-conducting plate is attached to the cover body, and the heat-conducting plate is attached to the heat-conducting part of the CPU.
In an embodiment, the chassis further includes a fan, the fan is connected to the heat conducting plate, and the fan is located on a side of the heat conducting plate opposite to the cover.
Drawings
FIG. 1 is a schematic structural diagram of an intelligent interaction module according to an embodiment;
FIG. 2 is a schematic diagram of the CPU heat-conducting portion of the intelligent interactive module shown in FIG. 1;
FIG. 3 is a schematic view of FIG. 2 from another perspective;
fig. 4 is a schematic structural diagram of a chassis according to an embodiment.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It should be noted that when a portion is referred to as being "secured to" another portion, it can be directly on the other portion or there can be an intervening portion. When a portion is said to be "connected" to another portion, it may be directly connected to the other portion or intervening portions may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, an embodiment of the present application provides an intelligent interactive module 100. The intelligent interaction module 100 includes: bracket 110, main circuit board 120, CPU and GPU, sub circuit board 130.
The main circuit board 120 is mounted on the bracket 110. The CPU and GPU are mounted on the main circuit board 120.
Specifically, the smart interaction module 100 further includes a DDR. The main chips such as the CPU, the GPU, and the DDR can be fixed on the main circuit board 120 by soldering, which is favorable for the stability of signal transmission.
The material used by the support 110 may be aluminum, which has good thermal conductivity and strength, can ensure the strength of the intelligent interactive module 100, and is beneficial to heat dissipation. Meanwhile, the aluminum material is light, and when the intelligent interaction module 100 is arranged in the case, the reduction of the quality of the case is facilitated.
The sub-circuit board 130 is mounted on the support 110. The sub-circuit board 130 is located on a different side of the support 110 than the main circuit board 120.
Specifically, the smart interactive module 100 further includes a voice chip (not shown), miniSATA (not shown). A voice chip, miniSATA, may be mounted on the sub-wiring board 130.
The daughter board 130 is communicatively coupled to the main board 120.
Specifically, the intelligent interaction module 100 further includes an XMC connector 140, and the XMC connector 140 connects the main circuit board 120 and the sub-circuit board 130, so that data signal transmission between the main circuit board 120 and the sub-circuit board 130 can be realized.
In the intelligent interaction module 100, the circuit boards are designed into the main circuit board 120 and the sub-circuit board 130, the main chips such as the CPU and the GPU are fixed on the main circuit board 120, the main circuit board 120 is in communication connection with the sub-circuit board 130, and the main circuit board 120 and the sub-circuit board 130 are mounted on different sides of the bracket 110, so that the circuit boards occupy a small area, and further the intelligent interaction module 100 has a compact structure and is easy to arrange in a limited space of a chassis.
In an embodiment, the intelligent interactive module 100 further includes a GPU heat conducting portion (not shown), the GPU heat conducting portion is fixedly connected to the bracket 110, and the GPU heat conducting portion is attached to the GPU, so that the GPU heat conducting portion and the GPU have a larger contact area, and the GPU heat conducting portion can perform good heat dissipation on the GPU.
Specifically, the GPU heat-conducting portion may be integrally formed with the bracket 110 by using the same material, thereby facilitating processing and saving installation processes. The GPU heat-conducting portion and the bracket 110 may also be separate structures, and the two are fixedly connected together.
In one embodiment, the smart interaction module 100 further comprises a CPU thermal conductor 150. Referring to fig. 2 and 3, the CPU heat conduction portion 150 has a first sidewall 151, a second sidewall 152, and a bottom wall 153. The second sidewall 152 is opposite to the first sidewall 151. The bottom wall 153 is fixedly connected to the first and second sidewalls 151 and 152, respectively. The first sidewall 151, the second sidewall 152, and the bottom wall 153 enclose the recess 101. The sub-wiring board 130 is located in the recess 101. The bracket 110 is provided with a through hole 102, and the first sidewall 151 is located in the through hole 102. The outer surface of the first sidewall 151 is attached to the CPU.
In particular, the recess 101 is adapted to the sub circuit board 130, thereby facilitating the compact structure of the intelligent interactive module 100. The CPU heat conducting portion 150 and the sub-circuit board 130 may be fixedly connected by screws.
The bracket 110 is provided with a through hole 102, and the first sidewall 151 is positioned in the through hole 102 so that the outer surface of the first sidewall 151 can contact the CPU through the through hole 102.
The outer surface of the first sidewall 151 is attached to the CPU, so that heat generated by the CPU can be transferred to the bottom wall 153 through the first sidewall 151 and then transferred from the bottom wall 153 to the second sidewall 152. Since the outer surface of the second sidewall 152 is located on the side of the sub circuit board 130 facing away from the main circuit board 120, heat can be dissipated through the second sidewall 152 without being trapped between the main circuit board 120 and the sub circuit board 130, thereby improving heat dissipation efficiency.
Further, since the CPU heat conduction portion 150 is attached to the outer surface of the first sidewall 151, the CPU heat conduction portion 150 and the first sidewall 151 have a large contact area, so that the first sidewall 151 can radiate heat to the CPU well.
The first side wall 151, the second side wall 152 and the bottom wall 153 may be integrally formed, which is convenient for processing and saves mounting parts, thereby facilitating the compact structure of the intelligent interactive module 100.
Referring to fig. 4, in an embodiment, the intelligent interactive module 100 further includes a cover 160. The cover 160 covers the surface of the sub-circuit board 130 facing away from the main circuit board 120, so as to protect the sub-circuit board 130. The cover 160 has a hollow area (not shown) from which the CPU heat conduction portion 150 is exposed.
Specifically, the CPU heat conducting portion 150 is exposed from the hollow area of the cover, and the outer surface of the second sidewall 152 is exposed from the hollow area, so that heat can be dissipated from the second sidewall 152 without being blocked by the cover, which is beneficial to dissipating heat of the CPU.
In one embodiment, the material used for the CPU thermal conductor 150 is copper, which has good thermal conductivity, so as to improve the heat dissipation efficiency of the CPU.
In one embodiment, the CPU heat conducting portion 150 includes a connecting portion 154, the connecting portion 154 is fixedly connected to the outer surface of the bottom wall 153, and the connecting portion 154 is fixedly connected to the bracket 110.
Specifically, the connection portion 154 may be fixedly connected to the bracket 110 by a screw. The connecting portion 154 may be integrally formed with the bottom wall 153 of the same material, thereby facilitating processing and saving the assembly process. The connecting portion 154 and the bottom wall 153 may be separate structures, and they are fixedly connected together.
Referring to fig. 4, another embodiment of the present application further provides a chassis 10, where the chassis 10 includes a box (not shown) and the intelligent interactive module 100 in any of the above embodiments. The intelligent interaction module 100 is arranged inside the box body.
In the case 10, the intelligent interaction module 100 is disposed in the case body, the circuit board of the intelligent interaction module 100 is designed to be the main circuit board 120 and the sub-circuit board 130, the main chips such as the CPU and the GPU are fixed on the main circuit board 120, the main circuit board 120 and the sub-circuit board 130 are in communication connection, and the main circuit board 120 and the sub-circuit board 130 are mounted on different sides of the bracket 110, so that the circuit board occupies a small area, and further, the intelligent interaction module 100 has a compact structure and is easily disposed in a limited space of the case 10.
In one embodiment, the chassis 10 further includes a thermally conductive plate 11. The heat conducting plate 11 is attached to the cover 160, so that heat generated by the operation of the intelligent interactive module 100 can be transferred from the cover 160 to the heat conducting plate 11, and then the heat conducting plate 11 dissipates heat, which is beneficial to improving the heat dissipation efficiency of the case 10.
The heat conductive plate 11 is attached to the CPU heat conductive portion 150. Specifically, the CPU heat conducting portion 150 is exposed from the hollow area of the cover 160, and the outer surface of the second sidewall 152 is attached to the heat conducting plate 11, so that the heat generated by the CPU is transferred to the bottom wall 153 through the first sidewall 151, transferred to the second sidewall 152 through the bottom wall 153, transferred to the heat conducting plate 11 through the second sidewall 152, and then dissipated out through the heat conducting plate 11, which is beneficial to improving the heat dissipation efficiency of the intelligent interactive module 100.
In one embodiment, the enclosure 10 further includes a fan (not shown). The fan is connected to the heat conducting plate 11. The fan is located on the side of the heat conducting plate 11 opposite to the cover 160, so that the fan can accelerate the heat dissipation of the case 10.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (12)
1. An intelligent interactive module, comprising:
a support;
a main circuit board mounted on the bracket;
the CPU and the GPU are fixed on the main circuit board;
the sub-circuit board is arranged on the support, the sub-circuit board and the main circuit board are positioned on different sides of the support, and the sub-circuit board is in communication connection with the main circuit board.
2. The intelligent interaction module of claim 1, further comprising an XMC connector for data signal transmission of the main wiring board and the sub-wiring board.
3. The smart interactive module of claim 1, further comprising miniSATA mounted on the sub-circuit board.
4. The intelligent interaction module of claim 1, further comprising a GPU heat spreader, the GPU heat spreader fixedly connected to the support, the GPU heat spreader attached to the GPU.
5. The intelligent interaction module of claim 1, further comprising a CPU thermal conductor having a first sidewall, a second sidewall opposite to the first sidewall, and a bottom wall fixedly connected to the first sidewall and the second sidewall, wherein the first sidewall, the second sidewall, and the bottom wall enclose a groove, the sub-circuit board is located in the groove, the bracket is provided with a through hole, the first sidewall is located in the through hole, and an outer surface of the first sidewall is attached to the CPU.
6. The intelligent interaction module of claim 5, further comprising a cover covering a surface of the sub-circuit board facing away from the main circuit board, wherein the cover has a hollowed-out area, and the CPU heat conducting portion is exposed from the hollowed-out area.
7. The intelligent interaction module of claim 5, wherein the CPU thermal conductor comprises a connection portion, the connection portion is fixedly connected with the outer surface of the bottom wall, and the connection portion is fixedly connected with the bracket.
8. The intelligent interactive module of claim 5, wherein the CPU thermal conductor is fixedly connected to the sub-circuit board.
9. The intelligent interactive module of claim 5, wherein the CPU thermal conductor is made of copper.
10. A case, characterized by comprising a case body and the intelligent interaction module as claimed in any one of claims 1 to 9, wherein the intelligent interaction module is located inside the case body.
11. A cabinet according to claim 10,
the intelligent interaction module further comprises a cover body, the cover body covers the surface, back to the main circuit board, of the sub-circuit board, a hollow area is formed in the cover body, and the CPU heat conducting part is exposed out of the hollow area;
the case also comprises a heat-conducting plate, the heat-conducting plate is attached to the cover body, and the heat-conducting plate is attached to the heat-conducting part of the CPU.
12. A cabinet according to claim 11, further comprising a fan, the fan being coupled to the thermally conductive plate, the fan being located on a side of the thermally conductive plate facing away from the cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922333258.4U CN211827100U (en) | 2019-12-23 | 2019-12-23 | Intelligent interaction module and case with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922333258.4U CN211827100U (en) | 2019-12-23 | 2019-12-23 | Intelligent interaction module and case with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211827100U true CN211827100U (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922333258.4U Active CN211827100U (en) | 2019-12-23 | 2019-12-23 | Intelligent interaction module and case with same |
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| CN (1) | CN211827100U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677156A (en) * | 2021-08-16 | 2021-11-19 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
| CN113939132A (en) * | 2021-10-11 | 2022-01-14 | 惠州市德赛西威汽车电子股份有限公司 | Laminated vehicle-mounted host structure |
-
2019
- 2019-12-23 CN CN201922333258.4U patent/CN211827100U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677156A (en) * | 2021-08-16 | 2021-11-19 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
| CN113939132A (en) * | 2021-10-11 | 2022-01-14 | 惠州市德赛西威汽车电子股份有限公司 | Laminated vehicle-mounted host structure |
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