CN113939132A

CN113939132A - Laminated vehicle-mounted host structure

Info

Publication number: CN113939132A
Application number: CN202111179612.8A
Authority: CN
Inventors: 刘天安; 吴志党; 黄金章; 黄传明; 黄思滔
Original assignee: Huizhou Desay SV Automotive Co Ltd
Current assignee: Huizhou Desay SV Automotive Co Ltd
Priority date: 2021-10-11
Filing date: 2021-10-11
Publication date: 2022-01-14
Anticipated expiration: 2041-10-11
Also published as: CN113939132B

Abstract

The invention relates to the technical field of vehicle-mounted hosts, in particular to a laminated vehicle-mounted host structure, which comprises a main PCB (printed circuit board) and a middle frame main body; the middle frame main body comprises a base panel and a side plate formed on the base panel in an extending mode along the thickness direction of the base panel; the side plates divide the front surface and the back surface of the base panel respectively to form a plurality of mounting areas; and a heat dissipation area is also arranged on the basic panel. The invention aims to provide a laminated vehicle-mounted host structure, and the technical scheme provided by the invention can effectively solve the problems of electrical isolation and heat dissipation of a main PCB and a switching PCB.

Description

Laminated vehicle-mounted host structure

Technical Field

The invention relates to the technical field of vehicle-mounted hosts, in particular to a laminated vehicle-mounted host structure.

Technical Field

The vehicle-mounted host is an indispensable part of the automobile and provides various functions of radio reception, navigation, video decoding, USB, Ethernet and the like.

The current common structural scheme of the vehicle-mounted host computer is shown in fig. 1, and comprises a middle frame main body 10, a main PCB 20, a bottom cover 30, screws 40, an adapter PCB 50 and an adapter bracket 60. The main PCB 20 is embedded between the middle frame body 10 and the bottom cover 30, and when the function needs to be expanded, the adaptor PCB 50 is erected above the main PCB 20, the adaptor PCB 50 is connected to the main PCB 20 by using the adaptor bracket 60, and the main PCB 20 and the adaptor PCB 50 are embedded between the middle frame body 10 and the bottom cover 30.

This scheme needs the expanded function to increase the switching PCB board, and it is great to the change of center frame body to main PCB board and switching PCB board do not carry out effective isolation, and the inner space electron radiation is great mutually, influences the host computer performance.

When the heat productivity of the main PCB chip is continuously increased, the heat dispersion performance of the host can not be improved almost, and only a host can be newly developed, so that the structure is not high in universality.

Disclosure of Invention

The invention aims to provide a laminated vehicle-mounted host structure, and the technical scheme provided by the invention can effectively solve the problems of electrical isolation and heat dissipation of a main PCB and a switching PCB.

In order to solve the above technical problems, the present invention provides a stacked vehicle-mounted host structure, which includes a main PCB and a middle frame main body; the middle frame main body comprises a base panel and a side plate formed on the base panel in an extending mode along the thickness direction of the base panel; the side plates divide the front surface and the back surface of the base panel respectively to form a plurality of mounting areas; and a heat dissipation area is also arranged on the basic panel.

Preferably, the heat dissipation areas are distributed on the front surface and the back surface of the base panel, wherein a heat dissipation boss is arranged on one surface, and heat dissipation fins connected with the heat dissipation boss are arranged on the other surface.

Preferably, an air duct with two through ends is attached to the heat dissipation fins.

Preferably, the mounting area includes a main PCB mounting area, an adapting PCB mounting area, and a heat dissipation fan mounting area.

Preferably, the main PCB and the through PCB are respectively mounted on the upper and lower surfaces of the substrate panel; and the heat dissipation boss of the heat dissipation area is abutted against the chip of the main PCB.

Preferably, an inward recess is formed at the air duct to form the heat dissipation fan mounting area.

Preferably, screw posts for mounting electronic devices are respectively provided on the base panel and the side panels.

Preferably, the PCB further comprises a bottom cover and a top cover which are used for buckling the main PCB and the middle frame main body.

From the above, the application of the technical scheme provided by the invention has the following beneficial effects: reform transform the center main part, main function and extended function set up the both sides at the center main part to the demand of different host computer factories is dealt with in a flexible way, utilizes the center main part that is located the centre simultaneously and separates main PCB board and switching PCB board with bottom, top cap and be independent, is favorable to reducing electron radiation and disturbs.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

FIG. 1 is a schematic diagram of a conventional vehicle-mounted host;

FIG. 2 is a schematic structural diagram of a stacked vehicle-mounted host according to an embodiment of the present invention;

FIG. 3 is a first diagram illustrating a frame body structure according to an embodiment of the present invention;

FIG. 4 is a second schematic diagram of a frame main structure according to an embodiment of the present invention;

FIG. 5 is a perspective view of a stacked vehicle-mounted host structure according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a main PCB structure according to an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

At present, due to the PCB structure, the extension function needs to be added with the switching PCB, the change of the middle frame body is large, the main PCB and the switching PCB are not effectively isolated, the electronic radiation in the inner space interferes with each other greatly, and the performance of a host is influenced. When the heat productivity of the main PCB chip is continuously increased, the heat dispersion performance of the host can not be improved almost, and only a host can be newly developed, so that the structure is not high in universality.

Referring to fig. 1 to 6, in order to solve the technical problem described in the background, an innovative solution is needed to be found, that is, the middle frame body is modified, the main function and the expansion function are disposed at two sides of the middle frame body, so as to flexibly meet the requirements of different host factories, and the middle frame body, the bottom cover and the top cover are used to separate the main PCB from the adapting PCB, which is beneficial to reducing the electronic radiation crosstalk.

The present embodiment provides a stacked in-vehicle host structure, which includes a main PCB board 20 and a middle frame body 10. As a complete vehicle-mounted host, the vehicle-mounted host further comprises a bottom cover 30, and when the host is simple in function, a few external connectors are needed, and the heat productivity of a main chip on the main PCB 20 is not high, the structure forms the complete vehicle-mounted host.

When the functions of the host factory are increased and the heat generation amount of the main chip is increased, the adapter PCB 50, the heat dissipation fan 60, the top cover 70, and the like need to be extended above the middle frame body 10.

Specifically, the center body 10 includes a base panel 11 and side panels formed on the base panel 11 to extend in the thickness direction thereof, as key structural parts of the entire in-vehicle main unit. The side plates divide the front surface and the back surface of the basic panel 11 into a plurality of installation areas; a heat dissipation area is also provided on the base panel 11.

The heat dissipation areas are distributed on the front and back sides of the base panel 11, wherein one side is provided with a heat dissipation boss 12, and the other side is provided with a heat dissipation fin 19 connected with the heat dissipation boss 12. The heat generating chip of the main PCB 20 abuts against the heat dissipating boss 12, so that the heat dissipating boss 12 realizes the heat conduction effect of the heat generating chip, and further conducts the heat to the heat dissipating fins 19, thereby realizing the heat dissipating effect.

In order to further improve the heat dissipation effect, the heat dissipation fins 19 of this embodiment are further attached with an air duct having two through ends, and the heat driving can be completed at the air duct by the heat dissipation fan 60.

Based on the above structure, the mounting areas of the present embodiment include a main PCB mounting area, an adaptor PCB mounting area 17 and a heat dissipation fan mounting area 18.

Specifically, the side panel includes a front side 13, a rear side 16, a left side 15, and a right side 14. Several bosses attached to the rear side 16 are grounded to the main PCB 20 to improve EMC. Screw columns for fixing the PCB are attached to the base panel 11 and each side surface; screw columns for fixing and installing the bracket are also attached to the left side surface 14 and the right side surface 14; the rear side 16 separates the external connectors on the main PCB 20 from the electronic modules (main chip module, power module, conversion module, etc.) on the main PCB 20, and also separates the electronic modules on the main PCB 20 from the outside, thereby reducing the electronic radiation interference.

The back of the basic panel 11 is attached with a switching PCB board mounting area 17; a radiator fan installation region 18; heat dissipation fins 19 and an air duct. The transit PCB 50 is installed at the transit PCB installation region 17, and is locked by screws to screw posts attached to the base plate; the heat dissipation fan 60 is installed on the heat dissipation fan installation region 18 and pressed by the convex hull of the top cover 70, and if necessary, a buffer foam is disposed between the top cover 70 and the heat dissipation fan 60. The heat dissipating fan 60 does not directly blow toward the main PCB 20, but blows the heat dissipating fins 19 outside the middle frame main body 10, and takes the heat of the middle frame main body 10 to lower the temperature of the middle frame main body, and thus, the temperature of the heat generating chip on the main PCB 20.

As shown in fig. 5, which is a projection view of the vehicle-mounted host, the top cover 70 is provided with a vent hole corresponding to the heat dissipation fan 60, when the air inlet of the heat dissipation fan 60 faces the top cover 70, and the heat dissipation fan 60 works, the cool air around the top cover 70 enters the middle frame body from the vent hole and exchanges heat with the middle frame body to be discharged from the heat dissipation fin air channel, so that the heat is continuously circulated back and forth, the heat of the heating element on the main PCB board 20 is transferred to the external environment through the heat conduction of the middle frame body and the air convection of the active heat dissipation of the heat dissipation fan 60, the internal temperature is kept to be dynamically balanced, and the host works normally.

As shown in fig. 6, is a front view of the main PCB 20, which is composed of a PCB, a main chip module, an external connector, etc.; the main PCB 20 is provided with 4 elastic structures and screw holes for fixing, the elastic structures are separated from the inside of the main PCB 20 by U-shaped grooves, the elastic structures are designed to absorb tolerance, the gap between the main chip module and the middle frame main body 10 can be reduced, and heat conduction resistance is reduced.

In summary, the stacked vehicle-mounted host structure provided by the embodiment can be built according to the requirements of a host factory, has high flexibility, is adapted to the configuration of different vehicle types of the host factory, and has high universality; and the main PCB and the switching PCB are separated by the middle frame host machine at the upper layer and the lower layer, and the influence of electronic radiation crosstalk is less.

The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.

Claims

1. The utility model provides a range upon range of formula on-vehicle host computer structure which characterized in that: comprises a main PCB and a middle frame main body; the middle frame main body comprises a base panel and a side plate formed on the base panel in an extending mode along the thickness direction of the base panel; the side plates divide the front surface and the back surface of the base panel respectively to form a plurality of mounting areas; and a heat dissipation area is also arranged on the basic panel.

2. The stacked vehicle-mounted host structure according to claim 1, characterized in that: the heat dissipation areas are distributed on the front surface and the back surface of the base panel, heat dissipation bosses are arranged on one surface of the base panel, and heat dissipation fins connected with the heat dissipation bosses are arranged on the other surface of the base panel.

3. The stacked vehicle-mounted host structure according to claim 2, characterized in that: and air ducts with two through ends are attached to the radiating fins.

4. The stacked vehicle-mounted host structure according to claim 3, characterized in that: the mounting area comprises a main PCB mounting area, a switching PCB mounting area and a cooling fan mounting area.

5. The stacked vehicle-mounted host structure according to claim 4, characterized in that: the main PCB and the switching PCB are respectively arranged on the upper surface and the lower surface of the substrate panel; and the heat dissipation boss of the heat dissipation area is abutted against the chip of the main PCB.

6. The stacked vehicle-mounted host structure according to claim 5, characterized in that: an inward concave part is formed at the air duct to form the cooling fan mounting area.

7. The stacked vehicle-mounted host structure according to claim 6, characterized in that: screw posts for mounting electronic devices are respectively provided on the base panel and the side panels.

8. The stacked vehicle-mounted host structure according to any one of claims 1 to 7, characterized in that: the PCB comprises a main PCB board and a middle frame body, and further comprises a bottom cover and a top cover which are used for buckling the main PCB board and the middle frame body.