CN201403273Y - Radiating structure of electronic device - Google Patents

Radiating structure of electronic device Download PDF

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Publication number
CN201403273Y
CN201403273Y CN2009201358494U CN200920135849U CN201403273Y CN 201403273 Y CN201403273 Y CN 201403273Y CN 2009201358494 U CN2009201358494 U CN 2009201358494U CN 200920135849 U CN200920135849 U CN 200920135849U CN 201403273 Y CN201403273 Y CN 201403273Y
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CN
China
Prior art keywords
electronic equipment
circuit board
radiator structure
heat
radiating subassembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009201358494U
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Chinese (zh)
Inventor
左家根
郑楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN SUNFAR ELECTRIC TECHNOLOGIES Co Ltd
Original Assignee
SHENZHEN SUNFAR ELECTRIC TECHNOLOGIES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN SUNFAR ELECTRIC TECHNOLOGIES Co Ltd filed Critical SHENZHEN SUNFAR ELECTRIC TECHNOLOGIES Co Ltd
Priority to CN2009201358494U priority Critical patent/CN201403273Y/en
Application granted granted Critical
Publication of CN201403273Y publication Critical patent/CN201403273Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a radiating structure of electronic device. An electronic device comprises a circuit board and electronic components arranged on the circuit board, and further consists ofa radiating assembly, wherein the radiating assembly comprises a heat conducting plate which is parallel to the surface of the circuit board and two cooling plates which are formed through extendingtowards the vertical direction of the heat conducting plate from the two sides of the heat conducting plate. Heat energy exhausted by the circuit board and high-power components on the circuit board can be fast discharged through a radiating channel consisting of a half-enclosure structure of the cooling plates and the heat conducting plate, thereby keeping each part in the electronic device undernormal working temperature.

Description

The radiator structure of electronic equipment
Technical field
The utility model relates to the electronic equipment dissipating heat field, particularly a kind of radiator structure of electronic equipment.
Background technology
Common electronic equipment (for example frequency converter) comprises housing and is positioned at the circuit board of housing, then is provided with a large amount of electronic devices and components (for example resistance, electric capacity etc.) on the circuit board, and these electronic devices and components will produce heat when energising work.When this electronic equipment works long hours, the temperature of fuselage will increase, thereby influence the performance of electronic equipment.
For the ease of discharging the heat that produces when the electronic equipment internal electronic devices and components are worked, louvre (can in conjunction with radiator fan) usually is set on the housing of electronic equipment, promptly locate grid is set so that enclosure interior and air outside exchange, thereby the heat in the housing is come out by grid in the side panel of housing or back panel etc.
Though above-mentioned louvre can help heat radiation to a certain extent, but for the high performance components on circuit board or the circuit board (for example high power capacity), heat rapid accumulation during its energising work, above-mentioned louvre can't be derived the heat on these components and parts fast.If above-mentioned components and parts are in hot environment for a long time, will shorten greatly its useful life; In case the heat of piling up on the above-mentioned components and parts reaches a certain amount of, with badly damaged this electronic equipment.
In the existing electronic equipment, realize the quick heat radiating of single components and parts, for example radiator of computer CPU by the mode that radiator is set for the electronic devices and components on the circuit board.But if having more heating components and parts on the circuit board, then a plurality of individual heat sinks need be set, the higher and installation and maintenance trouble of cost.
The utility model content
The technical problems to be solved in the utility model is, at high performance components heat in the above-mentioned electronic equipment can't instant-free problem, a kind of radiator structure of electronic equipment is provided.
The technical scheme that the utility model solves the problems of the technologies described above is, a kind of radiator structure of electronic equipment is provided, described electronic equipment comprises circuit board and is positioned at electronic devices and components on the circuit board, also comprise radiating subassembly, described radiating subassembly comprises the heat-conducting plate parallel with described circuit board surface and two heating panels that extended to form by the vertical direction of two these heat-conducting plates of side direction of described heat-conducting plate.
In the radiator structure of electronic equipment described in the utility model, each described heating panel is provided with perpendicular to this heating panel and towards the radiating fin of this heating panel inboard.
In the radiator structure of electronic equipment described in the utility model, comprise at least one high performance components on the face that described circuit board and described heat-conducting plate join, position corresponding with described at least one high-power components on the described heat-conducting plate is provided with through hole, and described high performance components passes described through hole and arrives between two heating panels.
In the radiator structure of electronic equipment described in the utility model, described high performance components is an electric capacity.
In the radiator structure of electronic equipment described in the utility model, described radiating subassembly also comprises the fixture that the components and parts on the circuit board are attached to the heating panel outside and fix with heating panel.
In the radiator structure of electronic equipment described in the utility model, an end of described radiating subassembly is provided with fan, and the other end is provided with opening.
In the radiator structure of electronic equipment described in the utility model, vertical setting of described radiating subassembly and described fan are positioned at the upper end of radiating subassembly.
In the radiator structure of electronic equipment described in the utility model, place, two of corresponding radiating subassembly ends is provided with air admission hole and venthole respectively on the described electronic equipment casing.
In the radiator structure of electronic equipment described in the utility model, described electronic equipment is a frequency converter.
The radiator structure of implementing electronic equipment of the present utility model has following beneficial effect: by the heat dissipation channel that partly surrounds structure formation of heating panel and heat-conducting plate, can with circuit board and on the heat that discharges of high performance components discharge rapidly, each several part all is in the normal working temperature in the electronic equipment thereby make.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation that radiating subassembly combines with circuit board in the radiator structure of electronic equipment of the present utility model;
Fig. 2 is the schematic diagram of embodiment of the radiator structure of electronic equipment of the present utility model;
Fig. 3 is the upward view of the radiator structure of the electronic equipment among Fig. 2;
Fig. 4 is the sectional view of the radiator structure of the electronic equipment among Fig. 2.
Embodiment
The radiator structure of electronic equipment of the present utility model forms a gas channel by by heat-conducting plate and two radiating subassemblies that partly surround that heating panel is formed, thereby the heat that discharges during with the work of electronic equipment internal circuit board and high performance components is discharged.
As shown in Figure 1, the radiator structure of electronic equipment of the present utility model comprises the radiating subassembly 20 that is fixed in circuit board 10 1 sides, is provided with fan 21 at an end of this radiating subassembly 20, to quicken the air flows in the radiating subassembly, is convenient to the quick discharge of heat.
In the present embodiment, circuit board 10 is provided with a plurality of heating components and parts, and heat radiation is set up 20 and is these a plurality of heating components and parts heat radiations simultaneously.
Shown in Fig. 2-4, radiating subassembly 20 comprises heat-conducting plate 22 and two blocks of relative heating panels 23.Wherein heat-conducting plate and circuit board surface be arranged in parallel, and it is fixing with circuit board 10 by bolt or buckle etc., two blocks of heating panels 23 extend (rightabout of circuit board 10) by the vertical direction of this heat-conducting plate 22 of two side direction of heat-conducting plate 22 respectively and form, thereby heat-conducting plate 22 and two blocks of heating panels 23 have constituted one and half gas channels that surround.When this gas channel is vertical when being provided with, hot-air is discharged from the top of this gas channel, and cold air enters from the bottom of gas channel, thereby has finished distributing of heat.
At an end opening of radiating subassembly 21, the other end is provided with fan 21 (when radiating subassembly is vertical when being provided with, fan 21 is positioned at the upper end of radiating subassembly 21).This fan 21 can quicken the flowing velocity of air in the gas channel, thereby is more conducive to the release of heat.In addition, be respectively equipped with air admission hole and venthole in two ends of the radiating subassembly 20 of electronic equipment casing, with further raising radiating efficiency.
Be further to strengthen radiating efficiency, can on each heating panel 23, be provided with perpendicular to this heating panel 23 and towards a plurality of radiating fins 24 of these heating panel 23 inboards.
For solving the heat dissipation problem of a plurality of high performance components 11 (for example electric capacity) on the circuit board 10, position corresponding with high performance components 11 on the heat-conducting plate 22 of radiating subassembly 20 is provided with through hole, and high performance components 11 passes above-mentioned through hole and arrives between two heating panels 23.The heat of above-mentioned high performance components 11 is transmitted to rapidly on heating panel 23, heat-conducting plate 22 and the radiating fin 24, because the area that contacts with air of heating panel 23, heat-conducting plate 22 and radiating fin 24 is bigger, therefore can rapidly heat be dispersed in the air, hot-air is discharged rapidly under the effect of fan 21.
Radiating subassembly 20 also comprise with the components and parts on the circuit board 10 12 attach to heating panel 23 the outside and with the fixing fixture 25 of heating panel 23.
Above-mentioned radiator structure can be applicable to frequency converter or other equipment.
The above; it only is the preferable embodiment of the utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.

Claims (9)

1, a kind of radiator structure of electronic equipment, described electronic equipment comprises circuit board and is positioned at electronic devices and components on the circuit board, it is characterized in that, also comprise radiating subassembly, described radiating subassembly comprises the heat-conducting plate parallel with described circuit board surface and two heating panels that extended to form by the vertical direction of two these heat-conducting plates of side direction of described heat-conducting plate.
2, the radiator structure of electronic equipment according to claim 1 is characterized in that, each described heating panel is provided with perpendicular to this heating panel and towards the radiating fin of this heating panel inboard.
3, the radiator structure of electronic equipment according to claim 1 and 2, it is characterized in that, comprise at least one high performance components on the face that described circuit board and described heat-conducting plate join, position corresponding with described at least one high-power components on the described heat-conducting plate is provided with through hole, and described high performance components passes described through hole and arrives between two heating panels.
4, the radiator structure of electronic equipment according to claim 3 is characterized in that, described high performance components is an electric capacity.
5, the radiator structure of electronic equipment according to claim 3 is characterized in that, described radiating subassembly also comprises the fixture that the components and parts on the circuit board are attached to the heating panel outside and fix with heating panel.
6, the radiator structure of electronic equipment according to claim 1 is characterized in that, an end of described radiating subassembly is provided with fan, and the other end is provided with opening.
7, the radiator structure of electronic equipment according to claim 6 is characterized in that, vertical setting of described radiating subassembly and described fan are positioned at the upper end of radiating subassembly.
8, the radiator structure of electronic equipment according to claim 1 is characterized in that, place, two of corresponding radiating subassembly ends is provided with air admission hole and venthole respectively on the described electronic equipment casing.
9, the radiator structure of electronic equipment according to claim 1 is characterized in that, described electronic equipment is a frequency converter.
CN2009201358494U 2009-03-24 2009-03-24 Radiating structure of electronic device Expired - Lifetime CN201403273Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201358494U CN201403273Y (en) 2009-03-24 2009-03-24 Radiating structure of electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201358494U CN201403273Y (en) 2009-03-24 2009-03-24 Radiating structure of electronic device

Publications (1)

Publication Number Publication Date
CN201403273Y true CN201403273Y (en) 2010-02-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201358494U Expired - Lifetime CN201403273Y (en) 2009-03-24 2009-03-24 Radiating structure of electronic device

Country Status (1)

Country Link
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103051156A (en) * 2012-06-14 2013-04-17 深圳市正弦电气股份有限公司 Frequency converter
CN104901514A (en) * 2015-05-16 2015-09-09 厦门科华恒盛股份有限公司 High-density power module structure
CN105939594A (en) * 2016-06-30 2016-09-14 海信集团有限公司 Radiating apparatus for electronic equipment and electronic equipment
CN107113999A (en) * 2015-05-07 2017-08-29 富士电机株式会社 Ventilation duct radiator structure and the power inverter for including the ventilation duct with the ventilation duct radiator structure
CN107482878A (en) * 2017-08-17 2017-12-15 重庆路格科技有限公司 Dew removing cooling Switching Power Supply
CN109488616A (en) * 2017-09-13 2019-03-19 信浓绢糸株式会社 Blower device
CN110325017A (en) * 2018-03-30 2019-10-11 株式会社安川电机 A kind of servo controller
WO2021253682A1 (en) * 2020-06-19 2021-12-23 深圳由莱智能电子有限公司 Hair removal device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103051156A (en) * 2012-06-14 2013-04-17 深圳市正弦电气股份有限公司 Frequency converter
CN107113999A (en) * 2015-05-07 2017-08-29 富士电机株式会社 Ventilation duct radiator structure and the power inverter for including the ventilation duct with the ventilation duct radiator structure
CN107113999B (en) * 2015-05-07 2020-01-24 富士电机株式会社 Ventilation pipe heat radiation structure and power conversion device comprising ventilation pipe with ventilation pipe heat radiation structure
CN104901514A (en) * 2015-05-16 2015-09-09 厦门科华恒盛股份有限公司 High-density power module structure
CN105939594A (en) * 2016-06-30 2016-09-14 海信集团有限公司 Radiating apparatus for electronic equipment and electronic equipment
CN107482878A (en) * 2017-08-17 2017-12-15 重庆路格科技有限公司 Dew removing cooling Switching Power Supply
CN109488616A (en) * 2017-09-13 2019-03-19 信浓绢糸株式会社 Blower device
CN110325017A (en) * 2018-03-30 2019-10-11 株式会社安川电机 A kind of servo controller
WO2021253682A1 (en) * 2020-06-19 2021-12-23 深圳由莱智能电子有限公司 Hair removal device

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Granted publication date: 20100210