CN215264695U

CN215264695U - VC radiator used on integrated board

Info

Publication number: CN215264695U
Application number: CN202121885097.0U
Authority: CN
Inventors: 杨旭生; 江现昌; 白庆; 周凌昊; 吴汶钊; 文国波; 白杨; 徐雁
Original assignee: Nanchang Rail Transit Group Co ltd; Chengdu Yunda Technology Co Ltd
Current assignee: Nanchang Rail Transit Group Co ltd; Chengdu Yunda Technology Co Ltd
Priority date: 2021-08-12
Filing date: 2021-08-12
Publication date: 2021-12-21
Anticipated expiration: 2031-08-12

Abstract

The utility model discloses a VC radiator used on an integrated board, which comprises a VC soaking plate and a radiator, wherein the VC soaking plate is contacted with a heat source piece on the integrated board to absorb heat, and the radiator is arranged on the VC soaking plate to radiate the heat; the VC soaking plate is provided with a plurality of contact plates for contacting heat source pieces positioned on different height planes; the VC soaking plate can simultaneously dissipate heat of a plurality of heat source pieces, and the heat source pieces at different heights can be dissipated through the same radiator, so that the heat dissipation effect is effectively improved, and the material and energy consumption is reduced; the radiator is provided with a radiating fan, so that the radiating effect is not poor under the condition of a plurality of high-power heat sources.

Description

VC radiator used on integrated board

Technical Field

The utility model relates to a heat dissipation technical field particularly, relates to a VC radiator for on integrated board.

Background

The core board of the intelligent detection anti-collision system host is an integrated module of a CPU chip and a GPU chip, when the host works, the two high-power heat dissipation sources can simultaneously dissipate a large amount of heat, and the heat dissipated by the two heat sources needs to be rapidly dissipated so as to ensure that the host can normally work; to the heat source on an integrated board, use monoblock soaking plate contact absorption heat usually, but monoblock soaking plate can only contact a heat dissipation source or at the heat dissipation source of coplanar, can't satisfy two heat dissipation source heat dissipations that have the difference in height simultaneously, can't realize the radiating effect who wants.

The existing radiator needs a plurality of radiators to respectively radiate heat for an integrated board with a plurality of height-difference high-power heat sources, and energy and material consumption are huge.

In view of this, the present application is specifically made.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that current radiator can't satisfy the heat dissipation of the integrated board that has the high-power heat source of difference in height simultaneously, the utility model aims to provide a VC radiator of being used in on the integrated board carries out structural improvement based on current heating panel, can compromise the heat dissipation of the high-power heat source of different differences in height, adds the fan for the radiator simultaneously and forces the convection current, effectively improves the radiating effect, reduces material and energy resource consumption.

The utility model discloses a following technical scheme realizes:

the scheme provides a VC radiator used on an integrated board, which comprises a VC soaking plate and a radiator, wherein the VC soaking plate is contacted with a heat source piece on the integrated board to absorb heat, and the radiator is arranged on the VC soaking plate to radiate the heat;

the VC soaking plate is provided with a plurality of contact plates for contacting heat source pieces positioned on different height planes.

The working principle of the scheme is as follows: to the heat source on an integrated board, use monoblock soaking plate contact absorption heat usually, but monoblock soaking plate can only contact a heat dissipation source or at the heat dissipation source of coplanar, can't satisfy two heat dissipation source heat dissipations that have the difference in height simultaneously, can't realize the radiating effect who wants. This scheme provides a VC radiator for on integrated board, carries out structural improvement based on current heating panel, sets up a plurality of contact plates on a VC soaking pit and is used for the contact to be located the planar heat source spare of co-altitude, and the VC soaking pit can dispel the heat to a plurality of heat source spares simultaneously, can realize the heat dissipation through same radiator in the heat source spare of co-altitude, effectively improves the radiating effect, reduces material and energy resource consumption.

The VC soaking plate comprises a connecting plate and at least 2 contact plates, the radiator is arranged on the front surface of the connecting plate, the contact plates are vertically arranged on the back surface of the connecting plate, and the contact plates are positioned on planes with different heights. Different heat source pieces on the integrated board are matched with one contact plate, the contact plates are in full contact with the heat source pieces respectively to absorb heat, the connection plate is subjected to primary heat dissipation through a large area, and the rest heat is dissipated by the heat dissipater in a concentrated mode. The VC soaking plate has the advantages of low expansion thermal resistance, uniform heat flux, rapid heat diffusion, light weight and the like, can quickly take away the heat of each heat source, meets the heat dissipation requirement of a system host, does not need to occupy larger space, and can improve the space utilization rate.

The fan is arranged on the front face of the connecting plate and is used for blowing air to the radiator.

The heat sink is provided with a heat radiation fan, absorbed heat on the VC soaking plate is quickly radiated from the lateral surface of the heat sink machine in a forced convection mode, and the heat radiation effect is not poor under the condition of a plurality of high-power heat sources.

The further optimized scheme is that the radiator is in a cuboid shape formed by brazing copper fins, and nickel is plated on the surface of the radiator.

The further optimized proposal is that the thickness of the copper fin is at least 0.4mm, and the thickness of the plating layer is at least 10 μm.

The further optimization scheme is that the fan further comprises an insulating and heat-insulating cushion, and the fan and the connecting plate are spaced through the insulating and heat-insulating cushion. In order to prevent the fan from being damaged by overheating, an insulating and heat-insulating cushion interval is arranged between the fan and the connecting plate, meanwhile, heat on the connecting plate is separated by the insulating and heat-insulating cushion, and the wind blowing to the radiator by the fan cannot carry the heat on the connecting plate unnecessarily.

The further optimization scheme is that the insulating and heat-insulating soft cushion is a ceramic fiber soft cushion.

The contact plate is in a cuboid shape, the surface A of the contact plate is arranged on the back of the connection plate, the surface B parallel to the surface A contacts the heat source element, and the area of the surface B is larger than or equal to the vertical projection area of the heat source element on the connection plate.

The further optimization scheme is that the heat source device further comprises a filling soaking plate, and when the surface B of the contact plate is in contact with the heat source piece through the filling soaking plate.

In practical application, because a processing error exists when the contact plate of the VC-radiator is processed, air gaps between the contact plate and a heat source can be filled by the heat-conducting silicone grease or the heat-conducting pad, and air thermal resistance is reduced.

Compared with the prior art, the utility model, following advantage and beneficial effect have:

1. the embodiment of the utility model provides a VC radiator for on integrated board carries out structural improvement based on current heating panel, sets up a plurality of contact plates on a VC soaking pit for the contact lies in the heat source piece of different height planes, and the VC soaking pit can dispel the heat to a plurality of heat source pieces simultaneously, can realize the heat dissipation through same radiator in the heat source piece of different height, effectively improves the radiating effect, reduces material and energy consumption;

2. the embodiment of the utility model provides a VC radiator for on integrated board, for the radiator is equipped with installation radiator fan, distribute away the heat that absorbs on the VC soaking plate from the radiator side fast through the forced convection mode, under the condition of a plurality of high-power heat sources, the radiating effect can not be poor either;

3. the embodiment of the utility model provides a pair of be used in VC radiator on integrated board fills the air gap between contact plate and the heat source through heat conduction silicone grease or heat conduction pad, reduces the air thermal resistance.

Drawings

In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural view of a VC heat sink according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of an integrated module structure with a core board being a CPU chip and a GPU chip;

fig. 3 is a top view of the VC heat sink with the fan removed according to an embodiment.

Reference numbers and corresponding part names in the drawings:

1-VC soaking plate, 11-connecting plate, 12-contact plate, 2-radiator, 3-fan and 4-insulating and heat-insulating soft cushion.

Detailed Description

To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the present invention. In other instances, well-known structures, circuits, materials, or methods have not been described in detail so as not to obscure the present invention.

Throughout the specification, reference to "one embodiment," "an embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the present invention. Thus, the appearances of the phrases "one embodiment," "an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the description of the present invention, the terms "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", "outer", etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the scope of the present invention.

Examples

As shown in fig. 2, for the problem of high-power heat dissipation of an integrated module of a CPU chip and a GPU chip, because the CPU chip and the GPU chip have a height difference on a main control PCB (the vertical height difference between the CPU chip and the GPU chip is 4.51mm), the CPU power consumption is about 45W, the GPU power consumption is about 90W, a common vapor chamber structure can only contact one heat source or a heat source on the same plane, and cannot simultaneously satisfy heat dissipation of two heat sources having a height difference, and the structural form of the heat sink is modified at present:

the appearance size of a contact surface is considered, the two CPU chips and the GPU chip are in full contact with the contact surface, the PCB is fixed with the VC-radiator by using copper columns with different heights, a heat source is ensured to be in full contact with a VC-radiator contact plate under proper pressure, and the heat of the two heat sources is taken away quickly by using the advantages of low expansion thermal resistance, uniform heat flux, quick heat diffusion, light weight and the like of the VC-soaking plate, so that the heat dissipation requirement of a system host is met, and the device layout requirement in a limited structural space is met;

a fin radiator consisting of a copper sheet with the thickness of 0.4mm is welded on the VC soaking plate, two axial flow fans (the size is 60x60x38mm) are installed on the radiator above a heat source of a CPU chip, and heat absorbed on the VC soaking plate is quickly radiated from the side surface of a host machine in a forced convection mode.

As shown in fig. 1 and fig. 3, the present embodiment provides a VC heat sink for an integrated board, which includes a VC soaking plate 1 and a heat sink 2, where the VC soaking plate 1 contacts a heat source on the integrated board to absorb heat, and the heat sink 2 is mounted on the VC soaking plate 1 to dissipate heat;

VC soaking plate 1 includes a connecting

plate

11 and 2 at least contact pads 12, radiator 2 installs in connecting plate 11 openly, and contact pads 12 are installed perpendicularly in the connecting plate 11 back, and each contact pad 12 lies in different height planes.

And a fan 3, wherein the fan 3 is arranged on the front surface of the connecting plate 11 and is used for blowing air to the radiator 2.

The radiator 2 is in a cuboid shape formed by brazing copper fins, and nickel is plated on the surface of the radiator.

The thickness of the copper fin is at least 0.4mm, and the thickness of the plating layer is at least 10 mu m.

The fan is characterized by further comprising insulating and heat-insulating soft cushions 4, and the fan 3 and the connecting plate 11 are separated through the insulating and heat-insulating soft cushions 4.

The insulating and heat-insulating soft cushion 4 is a ceramic fiber soft cushion.

The contact plate 12 is in a cuboid shape, a surface A of the contact plate 12 is arranged on the back of the connecting plate 11, a surface B parallel to the surface A contacts the heat source element, and the area of the surface B is larger than or equal to the vertical projection area of the heat source element on the connecting plate 11.

And a filling soaking plate is also included, and when the surface B of the contact plate 12 is contacted with the heat source piece through the filling soaking plate.

The scheme solves the heat dissipation requirements of two high-power integrated chips, the whole machine is assembled, in actual application, because processing errors exist when two contact plates of the VC-radiator are processed, air gaps between the soaking plate and the heat source chip can be filled through the heat-conducting silicone grease or the heat-conducting pad, the air thermal resistance is reduced, and the technological requirements of system assembly are met.

The core temperature of the CPU chip is tested to be 92 ℃ and the core temperature of the GPU chip is tested to be 96 ℃ through the early-stage scheme thermal simulation result and the actual high-temperature experimental test (the environmental temperature is 70 ℃), the requirement of the type test of being less than or equal to 100 ℃ is met, and the system operates normally.

The VC-radiator and the panel structural member of the integrated module are integrated into a small case module, so that the maintenance, pulling and plugging of the host are facilitated.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. The VC heat radiator used on the integrated board is characterized by comprising a VC soaking plate (1) and a heat radiator (2), wherein the VC soaking plate (1) is contacted with a heat source part on the integrated board to absorb heat, and the heat radiator (2) is arranged on the VC soaking plate (1) to radiate the heat;

the VC soaking plate (1) is provided with a plurality of contact plates (12) for contacting heat source pieces positioned on different height planes.

2. A VC heat sink for use on integrated boards according to claim 1 wherein the VC soaking plate (1) comprises one connecting plate (11) and at least 2 contact plates (12), the heat sink (2) is mounted on the front side of the connecting plate (11), the contact plates (12) are mounted vertically on the back side of the connecting plate (11), and the contact plates (12) are located at different height planes.

3. A VC heat sink for use on board boards according to claim 2 further comprising a fan (3), said fan (3) being mounted on the front side of the web (11) and blowing air against the heat sink (2).

4. A VC heat sink for use on integration boards according to claim 3 wherein the heat sink (2) is brazed from copper fins in a cuboid shape and is nickel plated on the outside.

5. A VC heat sink for use on an integrated board as claimed in claim 4, wherein the copper fins are at least 0.4mm thick and the plating is at least 10 μm thick.

6. A VC heat sink for use on a board according to claim 3 further comprising an insulating and heat insulating cushion (4), the fan (3) being spaced from the connection plate (11) by the insulating and heat insulating cushion (4).

7. A VC heat sink for use on integrated boards according to claim 6, wherein said insulating and heat insulating cushions (4) are ceramic fiber cushions.

8. A VC heat sink for use on integration boards according to claim 2 wherein the contact plate (12) is rectangular parallelepiped shaped, the a surface of the contact plate (12) is mounted on the back of the connection board (11), and the B surface parallel to the a surface contacts the heat source element, the area of the B surface is greater than or equal to the vertical projection area of the heat source element on the connection board (11).

9. The VC heat sink used on integrated boards of claim 8, further comprising a filled vapor chamber, wherein the B side of the contact board (12) is contacted with the heat source piece through the filled vapor chamber.