CN212936539U

CN212936539U - Miniature electronic component radiator

Info

Publication number: CN212936539U
Application number: CN202022354584.6U
Authority: CN
Inventors: 杨顺成
Original assignee: Shenzhen Guangzhimei Technology Co ltd
Current assignee: Shenzhen Guangzhimei Technology Co ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-04-09
Anticipated expiration: 2030-10-21

Abstract

The utility model discloses a miniature electronic component radiator relates to the radiator field, including the heat dissipation main part, the inside top of heat dissipation main part is provided with electronic component, electronic component's bottom is provided with the heat-conducting plate, the bottom of heat-conducting plate is provided with first heating panel, the inside of heat dissipation main part is located first heating panel below and is provided with the second heating panel. The utility model discloses a heat-conducting plate that sets up, first heating panel, the second heating panel, the heat conduction post, miniature fan, the guide duct, the exhaust vent, at first heating panel, the surface of second heating panel all scribbles the aluminium lamination, and first heating panel, the second heating panel all is the copper, the heat-conducting plate can give first heating panel with heat transfer, the heat conduction post gives the second heating panel with heat transfer, the wind that miniature fan blew off simultaneously passes through the guide duct, inside the exhaust vent is even gives off the heat dissipation main part, make the cold wind volume in the heat dissipation main part almost the same, thereby can avoid the uneven condition of heat dissipation.

Description

Miniature electronic component radiator

Technical Field

The utility model relates to a radiator field specifically is a miniature electronic component radiator.

Background

The electronic radiator is usually a radiating fin for radiating high-power electronic components, has no external power supply, is naturally cooled, is mostly made into aluminum alloy sections, and is cut into required sizes according to the sizes of the components, such as radiating fins of high-power switch tubes or triodes, of course, the ultrahigh-power electronic components under special conditions also have radiating fans, and for example, the switch tubes of the switch power supply must be additionally provided with the radiating fans.

When the existing electronic element radiator is used, most electronic element radiators can not enable all positions of radiating fins on the radiator to uniformly radiate heat and can influence the radiating effect of the electronic element radiator, so that the electronic element radiator is improved, and a miniature electronic element radiator is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the problem that the existing electronic element radiator can not uniformly radiate heat, a miniature electronic element radiator is provided.

In order to achieve the above object, the utility model provides a following technical scheme: a miniature electronic component radiator comprises a radiating main body, wherein an electronic component is arranged at the top end inside the radiating main body, a heat conducting plate is arranged at the bottom of the electronic component, a first heat radiating plate is arranged at the bottom of the heat conducting plate, a second heat radiating plate is arranged inside the radiating main body and below the first heat radiating plate, a plurality of groups of heat conducting columns extending into the heat conducting plate and the first heat radiating plate are arranged at the top of the second heat radiating plate, a plurality of groups of supporting plates are arranged at the bottom end inside the radiating main body and below the second heat radiating plate, air outlets and air inlets are respectively arranged inside two sides of the radiating main body, a miniature fan is arranged inside the air inlets, an air guide hopper is arranged at one side of the air inlets inside the radiating main body, an air guide pipe is arranged at one side of the air guide hopper inside the radiating main body, the outer wall of the air guide pipe is uniformly provided with a plurality of groups of air outlet holes.

Preferably, the number of the heat conduction columns is ten, and the heat conduction columns are fixedly connected with the heat conduction plate, the first heat dissipation plate and the second heat dissipation plate.

Preferably, the surfaces of the first heat dissipation plate and the second heat dissipation plate are coated with aluminum layers, and the first heat dissipation plate and the second heat dissipation plate are copper plates.

Preferably, the number of the mounting racks is four, and the mounting racks are fixedly connected with the heat dissipation main body.

Preferably, the number of the supporting plates is two, and the supporting plates are fixedly connected with the second heat dissipation plate and the heat dissipation main body.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a heat-conducting plate that sets up, first heating panel, the second heating panel, the heat conduction post, miniature fan, the guide duct, the exhaust vent, at first heating panel, the surface of second heating panel all scribbles the aluminium lamination, and first heating panel, the second heating panel all is the copper, the heat-conducting plate can give first heating panel with heat transfer, the heat conduction post gives the second heating panel with heat transfer, the wind that miniature fan blew off simultaneously passes through the guide duct, inside the exhaust vent is even gives off the heat dissipation main part, make the cold wind volume in the heat dissipation main part almost the same, thereby can avoid the uneven condition of heat dissipation, cold wind in the last heat dissipation main part passes through the air outlet and takes away the heat, thereby can play good radiating effect.

Drawings

Fig. 1 is a schematic view of the internal structure of the present invention;

fig. 2 is a side sectional view of the present invention;

fig. 3 is a top view of the present invention.

In the figure: 1. a heat dissipating body; 2. an electronic component; 3. a heat conducting plate; 4. a first heat dissipation plate; 5. a heat-conducting column; 6. an air outlet; 7. an air guide pipe; 8. an air outlet; 9. a mounting frame; 10. a second heat dissipation plate; 11. A support plate; 12. a wind guide hopper; 13. a micro fan; 14. and an air inlet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention according to its overall structure.

Referring to fig. 1-3, a micro electronic component heat sink includes a heat dissipating body 1, an electronic component 2 is disposed on the top end of the interior of the heat dissipating body 1, a heat conducting plate 3 is disposed on the bottom of the electronic component 2, a first heat dissipating plate 4 is disposed on the bottom of the heat conducting plate 3, a second heat dissipating plate 10 is disposed on the interior of the heat dissipating body 1 below the first heat dissipating plate 4, a plurality of sets of heat conducting columns 5 extending to the interior of the heat conducting plate 3 and the first heat dissipating plate 4 are disposed on the top of the second heat dissipating plate 10, a plurality of sets of supporting plates 11 are disposed on the bottom end of the interior of the heat dissipating body 1 at the bottom of the second heat dissipating plate 10, an air outlet 6 and an air inlet 14 are respectively disposed on the interior of the heat dissipating body 1, a micro fan 13 is disposed on the interior of the air inlet 14, an air guiding hopper 12 is, the outside of guide duct 7 is provided with multiunit mounting bracket 9, and the outer wall of guide duct 7 evenly is provided with multiunit exhaust vent 8.

Please refer to fig. 1, the surfaces of the first heat sink 4 and the second heat sink 10 are coated with aluminum layers, the first heat sink 4 and the second heat sink 10 are copper plates, ten sets of heat-conducting pillars 5 are provided, the heat-conducting pillars 5 are fixedly connected with the heat-conducting plate 3, the first heat sink 4 and the second heat sink 10, and the first heat sink 4, the second heat sink 10 and the heat-conducting pillars 5 are provided to achieve a good heat dissipation effect.

Please refer to fig. 1, four sets of mounting brackets 9 are provided, the mounting brackets 9 are fixedly connected with the heat dissipating main body 1, and the mounting brackets 9 can be used for mounting and fixing the air guide pipe 7.

Please refer to fig. 1, the number of the supporting plates 11 is two, the supporting plates 11 are fixedly connected with the second heat dissipating plate 10 and the heat dissipating body 1, and the space is formed between the second heat dissipating plate 10 and the heat dissipating body 1 through the supporting plates 11, so as to increase the heat dissipating effect and support the heat dissipating body.

The working principle is as follows: during the use, because first heating panel 4, the surface of second heating panel 10 all scribbles the aluminium lamination, and first heating panel 4, second heating panel 10 all is the copper, thereby be convenient for heat-conducting plate 3 gives first heating panel 4 with heat transfer, heat conduction post 5 gives second heating panel 10 with heat transfer, and meanwhile, the wind that miniature fan 13 blew off can pass through guide duct 7, inside exhaust vent 8 is even gives off heat dissipation main part 1, make the cold wind volume in the heat dissipation main part 1 almost the same, thereby can avoid the uneven condition of heat dissipation, cold wind in the main part 1 of finally dispelling the heat takes away the heat through air outlet 6, thereby can play good radiating effect.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A miniature electronic component radiator, includes radiating main part (1), its characterized in that: the heat dissipation device is characterized in that an electronic element (2) is arranged at the top end inside the heat dissipation main body (1), a heat conduction plate (3) is arranged at the bottom of the electronic element (2), a first heat dissipation plate (4) is arranged at the bottom of the heat conduction plate (3), a second heat dissipation plate (10) is arranged inside the heat dissipation main body (1) and below the first heat dissipation plate (4), multiple groups of heat conduction columns (5) extending to the heat conduction plate (3) and the first heat dissipation plate (4) are arranged at the top of the second heat dissipation plate (10), multiple groups of support plates (11) are arranged at the bottom of the heat dissipation main body (1) and at the bottom of the second heat dissipation plate (10), an air outlet (6) and an air inlet (14) are respectively arranged inside two sides of the heat dissipation main body (1), a micro fan (13) is installed inside the air inlet (14), and an air guide hopper (12), an air guide pipe (7) is arranged on one side, located on an air guide hopper (12), of the interior of the heat dissipation main body (1), a plurality of groups of mounting frames (9) are arranged on the outer side of the air guide pipe (7), and a plurality of groups of air outlet holes (8) are uniformly formed in the outer wall of the air guide pipe (7).

2. The heat sink for miniature electronic components as recited in claim 1, wherein: the number of the heat conduction columns (5) is ten, and the heat conduction columns (5) are fixedly connected with the heat conduction plate (3), the first heat dissipation plate (4) and the second heat dissipation plate (10).

3. The heat sink for miniature electronic components as recited in claim 1, wherein: the surface of the first heat dissipation plate (4) and the surface of the second heat dissipation plate (10) are coated with aluminum layers, and the first heat dissipation plate (4) and the second heat dissipation plate (10) are copper plates.

4. The heat sink for miniature electronic components as recited in claim 1, wherein: the number of mounting bracket (9) is provided with four groups, mounting bracket (9) and heat dissipation main part (1) fixed connection.

5. The heat sink for miniature electronic components as recited in claim 1, wherein: the number of the supporting plates (11) is two, and the supporting plates (11) are fixedly connected with the second heat dissipation plate (10) and the heat dissipation main body (1).