CN213305850U

CN213305850U - High-end curved screen TV backlight circuit board

Info

Publication number: CN213305850U
Application number: CN202022095842.3U
Authority: CN
Inventors: 沈斌; 姚世荣; 程林海; 陈雪华
Original assignee: Kunshan Jinpeng Electron Co ltd
Current assignee: Kunshan Jinpeng Electron Co ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-05-28
Anticipated expiration: 2030-09-23

Abstract

The utility model discloses a high-end bent screen TV backlight circuit board, it includes circuit board body, heating panel, support column, a plurality of heat dissipation mechanism, two heating panels are located the top both sides of circuit board body respectively, four support columns are located the bottom four corners of circuit board body respectively, heat dissipation mechanism is located the bottom of circuit board body, heat dissipation mechanism includes cooling tube etc., the coolant liquid chamber is located between cooling tube and ventilation pipe, a plurality of inside fin are fixed on the inner wall of ventilation pipe, one end and the cooling tube of heat conduction pole are fixed, the other end and the outside fin of heat conduction pole are fixed; the circuit board body comprises a substrate and the like, wherein the heat dissipation layer is located below the substrate, the circuit layer is located above the substrate, the insulating layer is located above the circuit layer, and the heat conduction column penetrates through the substrate, the heat dissipation layer, the circuit layer and the insulating layer. The utility model discloses a heat dissipation mechanism, heat dissipation layer, heat conduction post etc. improve the radiating effect.

Description

High-end curved screen TV backlight circuit board

Technical Field

The utility model relates to a backlight circuit board especially relates to a curved screen TV backlight circuit board of high-end.

Background

In recent years, electronic technology has been rapidly advanced, electronic devices have become more precise, and particularly, in the case of miniaturization and densification of electronic components, the heat dissipation requirements of circuit boards have become higher due to the more heat generated by the electronic components, and the existing circuit board structures have not been able to meet the requirements.

Disclosure of Invention

To the above situation, in order to overcome the defect of prior art, the utility model provides a high-end bent screen TV backlight circuit board.

The utility model discloses a solve above-mentioned technical problem through following technical scheme: a high-end curved screen TV backlight circuit board is characterized by comprising a circuit board body, heat dissipation plates, support columns and a plurality of heat dissipation mechanisms, wherein two heat dissipation plates are respectively positioned at two sides of the top end of the circuit board body; the circuit board body comprises a substrate, a heat dissipation layer, a circuit layer, an insulating layer and a heat conduction column, wherein the heat dissipation layer is located below the substrate, the circuit layer is located above the substrate, the insulating layer is located above the circuit layer, and the heat conduction column penetrates through the substrate, the heat dissipation layer, the circuit layer and the insulating layer.

Preferably, the inner radiating fins and the outer radiating fins are all made of copper sheets, so that the radiating effect is improved, the structure is simple, and the cost is low.

Preferably, the heat conducting rod and the heat conducting column are made of aluminum materials, so that the heat dissipation effect is improved, the structure is simple, and the cost is low.

Preferably, a cooling liquid inlet and a cooling liquid outlet are respectively arranged on two sides of the cooling liquid cavity, so that the cooling liquid is convenient to convey and replace.

Preferably, the heat dissipation layer adopts a metal heat dissipation layer, so that the heat dissipation effect is improved, the structure is simple, and the cost is low.

Preferably, the height of the supporting column is greater than that of the heat dissipation mechanism, so that the heat dissipation mechanism is hollowed out and is not in contact with other elements, and heat dissipation is facilitated.

The utility model discloses an actively advance the effect and lie in: the support column is used for supporting the circuit board body, prevents the heat dissipation mechanism from contacting with other elements, and is not damaged. The heat at the top of the circuit board body is dissipated through the heat dissipation plate, and the heat dissipation effect is improved. A plurality of inside fin are fixed on the inner wall of ventilation pipe, and inside fin is used for increasing the heat radiating area of ventilation pipe to make the radiating effect improve. The cooling liquid is arranged in the cooling liquid cavity, so that heat on the radiating pipe and heat on the ventilating pipe can be taken away, and the radiating effect is improved. The heat conducting rod radiates the heat on the radiating pipe through the external radiating fins, so that the radiating effect is improved. The heat generated by the circuit layer can be rapidly dispersed to the heat dissipation layer through the heat conduction column and then rapidly and efficiently led out through the heat dissipation layer, so that the heat conduction efficiency and the heat conduction effect are improved; the insulating layer may protect the line layer and the like.

Drawings

Fig. 1 is a schematic diagram of a three-dimensional structure of a high-end curved-screen TV backlight circuit board according to the present invention.

Fig. 2 is a schematic side view of the high-end curved screen TV backlight circuit board of the present invention.

Fig. 3 is a schematic structural view of the middle heat dissipation mechanism of the present invention.

Fig. 4 is a schematic structural diagram of the middle circuit board body of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

As shown in fig. 1 to 4, the utility model discloses high-end curved screen TV backlight circuit board includes circuit board body 1, heating panel 2, support column 3, a plurality of heat dissipation mechanism, two heating panels 2 are located the top both sides of circuit board body 1 respectively, four support columns 3 are located the bottom four corners of circuit board body 1 respectively, heat dissipation mechanism is located the bottom of circuit board body 1, heat dissipation mechanism includes cooling tube 4, ventilation pipe 5, cooling liquid chamber 6, internal cooling fin 7, heat conduction pole 8, external cooling fin 9, cooling liquid chamber 6 is located between cooling tube 4 and ventilation pipe 5, a plurality of internal cooling fin 7 are fixed on the inner wall of ventilation pipe 5, one end and cooling tube 4 of heat conduction pole 8 are fixed, the other end and external cooling fin 9 of heat conduction pole 8 are fixed; the circuit board body 1 comprises a substrate 10, a heat dissipation layer 11, a circuit layer 12, an insulating layer 13 and a heat conduction column 14, wherein the heat dissipation layer 11 is located below the substrate 10, the circuit layer 12 is located above the substrate 10, the insulating layer 13 is located above the circuit layer 12, and the heat conduction column 14 penetrates through the substrate 10, the heat dissipation layer 11, the circuit layer 12 and the insulating layer 13.

The internal radiating fins 7 and the external radiating fins 9 are made of copper sheets, so that the radiating effect is improved, the structure is simple, and the cost is low.

The heat conducting rod 8 and the heat conducting column 14 are made of aluminum materials, so that the heat dissipation effect is improved, the structure is simple, and the cost is low.

And a cooling liquid inlet and a cooling liquid outlet are respectively arranged on two sides of the cooling liquid cavity 6, so that the cooling liquid is convenient to convey and replace.

The heat dissipation layer 11 adopts a metal heat dissipation layer, so that the heat dissipation effect is improved, the structure is simple, and the cost is low.

The height of the supporting column 3 is larger than that of the heat dissipation mechanism, so that the heat dissipation mechanism is hollowed out and is not in contact with other elements, and heat dissipation is facilitated.

The working principle of the utility model is as follows: the utility model discloses a parts such as circuit board body 1, heating panel 2, support column 3, cooling tube 4, ventilation pipe 5, coolant liquid chamber 6, inside fin 7, heat-conducting rod 8, outside fin 9, base plate 10, heat dissipation layer 11, circuit layer 12, insulating layer 13, heat-conducting post 14 are the parts that general standard spare or technical personnel in the field know, and its structure and principle all are this technical personnel all can learn through the technical manual or learn through conventional experimental method. When the heat dissipation device is used, the support columns 3 are used for supporting the circuit board body 1, so that the heat dissipation mechanism is prevented from being in contact with other elements, and the heat dissipation device is not damaged. The heat at the top of the circuit board body 1 is dissipated through the heat dissipation plate 2, and the heat dissipation effect is improved. A plurality of inner fins 7 are fixed on the inner wall of the ventilation duct 5, and the inner fins 7 are used to increase the heat radiation area of the ventilation duct 5, thereby enabling the heat radiation effect to be improved. The cooling liquid is arranged in the cooling liquid cavity 6, so that heat on the radiating pipe 4 and heat on the ventilating pipe 5 can be taken away, and the radiating effect is improved. The heat conduction rod 8 radiates the heat of the radiating pipe 4 through the external radiating fins 9, thereby enhancing the radiating effect. The heat generated by the circuit layer 12 can be rapidly dispersed to the heat dissipation layer 11 through the heat conduction column 14 and then rapidly and efficiently led out through the heat dissipation layer 11, so that the heat conduction efficiency and the heat conduction effect are improved; the insulating layer 13 may protect the wiring layer 12 and the like.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A high-end curved screen TV backlight circuit board is characterized by comprising a circuit board body (1), two heat dissipation plates (2), support columns (3) and a plurality of heat dissipation mechanisms, wherein the two heat dissipation plates (2) are respectively positioned at two sides of the top end of the circuit board body (1), the four support columns (3) are respectively positioned at four corners of the bottom end of the circuit board body (1), the heat dissipation mechanisms are positioned at the bottom end of the circuit board body (1) and comprise heat dissipation tubes (4) and ventilation tubes (5), the cooling device comprises a cooling liquid cavity (6), internal cooling fins (7), a heat conducting rod (8) and external cooling fins (9), wherein the cooling liquid cavity (6) is positioned between the radiating pipe (4) and the ventilating pipe (5), the internal cooling fins (7) are fixed on the inner wall of the ventilating pipe (5), one end of the heat conducting rod (8) is fixed with the radiating pipe (4), and the other end of the heat conducting rod (8) is fixed with the external cooling fins (9); the circuit board body (1) comprises a substrate (10), a heat dissipation layer (11), a circuit layer (12), an insulating layer (13) and a heat conduction column (14), wherein the heat dissipation layer (11) is located below the substrate (10), the circuit layer (12) is located above the substrate (10), the insulating layer (13) is located above the circuit layer (12), and the heat conduction column (14) penetrates through the substrate (10), the heat dissipation layer (11), the circuit layer (12) and the insulating layer (13).

2. A high-end curved-screen TV backlight circuit board according to claim 1, characterized in that the inner heat sink (7) and the outer heat sink (9) are both made of copper sheets.

3. The high-end curved-screen TV backlight circuit board according to claim 1, wherein the heat-conducting rod (8) and the heat-conducting post (14) are made of aluminum material.

4. A high-end curved screen TV backlight circuit board according to claim 1, wherein the cooling liquid cavity (6) is provided with a cooling liquid inlet and a cooling liquid outlet on both sides thereof, respectively.

5. A high-end curved-screen TV backlight circuit board according to claim 1, wherein the heat dissipation layer (11) is a metal heat dissipation layer.

6. A high-end curved screen TV backlight circuit board according to claim 1, characterized in that the height of the supporting columns (3) is greater than the height of the heat dissipation mechanism.