CN2720632Y - Special-section heat-tube radiator - Google Patents
Special-section heat-tube radiator Download PDFInfo
- Publication number
- CN2720632Y CN2720632Y CN 200320118440 CN200320118440U CN2720632Y CN 2720632 Y CN2720632 Y CN 2720632Y CN 200320118440 CN200320118440 CN 200320118440 CN 200320118440 U CN200320118440 U CN 200320118440U CN 2720632 Y CN2720632 Y CN 2720632Y
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- heat
- pedestal
- base
- pipe
- radiating fin
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- Expired - Fee Related
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Abstract
A special-section heat-tube radiator of the utility model is to improve the radiation effect of the traditional heat tubular radiator through greatly increasing the gross area of the heat radiating fin. A base is equipped with a plurality of flat heat tube bodies, and both sides of each flat heat tube are equipped with heat radiating fins. This description has an applied explanation on the computer CPU, electronic electrical equipment circuit board, heat radiation of other solid heat sources, heat collection-radiation of the convection cell, and chilling aspect of the semiconductor.
Description
Technical field
The utility model relates to a kind of heat-pipe radiator.
Background technology
The current heat-pipe radiator that occurs all is that the radiating fin cover is welded on the heat pipe body, and problems of welded quality can have influence on radiating effect; Many heat pipes are united when using, be that every heat pipe is fixed on the pedestal, again evaporation section contacted or place thermal source with thermal source, mass industrialized production is very difficult like this, while is because the quantity of thermal source placement heat pipe is often limited, thereby it is also limited further to improve radiating effect.
Summary of the invention
The purpose of this utility model be to provide a kind of radiating effect better, at the heat-pipe type radiator that is suitable for aspect production cost and the production technology in marketing.
The purpose of this utility model realizes by following technical solution: heat-pipe radiator is designed to a profiled-cross-section heat-pipe radiator, pedestal (2) is connected with thermal source (1), it is provided with chamber, the end (3), chamber, the end (3) is provided with column-type heat tube body (8) or a plurality of flat hot pipe body (5), the both sides of each flat hot pipe body (5) are provided with radiating fin (4), pedestal, chamber, the end and the heat pipe body vacuum die cavity that forms a whole, the agent structure of whole profiled-cross-section heat-pipe radiator contain all radiating fins can be by manufacturing technique method one-shot formings such as extruding or die casting.
The beneficial effects of the utility model are, the shape and size in chamber, the end (3) can design neatly, a plurality of flat hot pipe bodies (5) can be set on it, flat hot pipe body (5) can design its shape and size again as required neatly, each heat pipe body is provided with radiating fin in the two sides again simultaneously, thereby the total quantity of its radiating fin and total area of dissipation increase greatly than conventional heat pipe radiator, and radiating effect also just improves greatly; The agent structure of all heat pipe bodies and all radiating fins are by process one-shot formings such as extruding or die casting, can satisfy the requirement of large-scale production, can reduce production costs greatly, can avoid influencing because of problems of welded quality is issuable between heat pipe body and the fin problem of radiating effect.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1, Fig. 2, Fig. 3 use a kind of embodiment schematic diagram of the present utility model on horizontally-mounted computer cpu, electronic and electrical equipment wiring board and other solid thermal sources, wherein Fig. 1 is the front view of embodiment, and Fig. 2 is a vertical view, and Fig. 3 is an end view.
Among the figure, 1. thermal source, 2. pedestal, 3. base, 4. radiating fin.
Fig. 4, Fig. 5, Fig. 6 use another kind of embodiment schematic diagram of the present utility model on horizontally-mounted computer cpu, electronic and electrical equipment wiring board and other solid thermal sources, wherein Fig. 4 is the front view of embodiment, and Fig. 5 is a vertical view, and Fig. 6 is an end view.
Among the figure, 1. thermal source, 2. pedestal, 3. base, 4. radiating fin, 5. flat hot pipe body.
Fig. 7, Fig. 8 use a kind of embodiment schematic diagram of the present utility model on computer cpu, electronic and electrical equipment wiring board and other solid thermal sources in vertical installation, wherein Fig. 7 is the front view of embodiment, and Fig. 8 is a vertical view.
Among the figure, 1. thermal source, 2. pedestal, 3. base, 4. radiating fin, 5. flat hot pipe body, 6. water conservancy diversion frame, 7. wick (or liquid sucting core structure).
Fig. 9, Figure 10 be horizontally-mounted computer cpu, electronic and electrical equipment wiring board and other solid thermal sources again on use a kind of embodiment schematic diagram of the utility model, wherein Fig. 9 is the front view of embodiment, Figure 10 is a vertical view.
Among the figure, 1. thermal source, 2. pedestal, 4. radiating fin, 5. flat hot pipe body, 6. water conservancy diversion frame, 8. column-type heat tube body.
Figure 11, Figure 12 are a kind of embodiment signals that the utility model is applied to fluid (gas or liquid) heat radiation (or thermal-arrest-heat radiation), and wherein Figure 11 is the front view of embodiment, and Figure 12 is a vertical view.
Among the figure, 4. radiating fin, 5. flat hot pipe body, 6. water conservancy diversion frame, 8. column-type heat tube body.
Figure 13, Figure 14 are a kind of embodiment schematic diagrames that the utility model is applied to conductor refrigeration, and wherein Figure 11 is the front view of embodiment, and Figure 12 is a vertical view.
Among the figure, 2. pedestal, 4. radiating fin, 5. flat hot pipe body, 6. water conservancy diversion frame, 8. column-type heat tube body, 9. conductor refrigeration sheet.
Embodiment
Fig. 1, Fig. 2, Fig. 3 use a kind of embodiment schematic diagram of the present utility model on horizontally-mounted computer cpu, electronic and electrical equipment wiring board and other solid thermal sources, among the figure, pedestal (2) be for realize and concrete thermal source (such as with computer cpu) joining structure, because the area of pedestal (2) is little, be provided with base (3) as the connector between pedestal (2) and the radiating fin (4), base (3) and pedestal (2) form a profiled-cross-section heat pipe die cavity.Base (3) can enlarge the area of plane as required, so that more radiating fin (4) to be set; The increase of radiating fin quantity causes the increase of total area of dissipation and the raising of radiating effect.The main body of base (3) and pedestal (2) and all radiating fins (4) can pass through the hot extrusion technique one-shot forming, can reduce production costs and avoid the radiating fin problems of welded quality.
Fig. 4, Fig. 5, Fig. 6 use another kind of embodiment schematic diagram of the present utility model on horizontally-mounted computer cpu, electronic and electrical equipment wiring board and other solid thermal sources, among the figure, base (3) is arranged on the pedestal (2), base (3) is provided with one or several flat hot pipe bodies (5), the both sides of each flat hot pipe body (5) are provided with radiating fin (4), form profiled-cross-section gravity assisted heat pipe radiator.Pedestal (2), base (3) and all flat hot pipe bodies (5) form a profiled-cross-section gravity assisted heat pipe die cavity, and the heat that pedestal (2) is drawn from thermal source (1) can reach whole heat pipe die cavity rapidly and propagate to radiating fin (4).
Because the influence of hot-fluid effect, radiating fin (4) exists temperature gradient along direction of heat flow in the heat radiation process, just reduce gradually to head temperature from the fin root, the height of fin just can not be De Taigao, by flat hot pipe body (5) being set and radiating fin (4) being set, can reach the purpose that increases total area of dissipation and improve radiating effect on its two sides.
Fig. 7, Fig. 8 use a kind of embodiment schematic diagram of the present utility model on computer cpu, electronic and electrical equipment wiring board and other solid thermal sources in vertical installation, among the figure, outer periphery at all radiating fins (4) is equipped with water conservancy diversion frame (6), wherein has two faces to utilize radiating fin as baffler; In the heat pipe die cavity, be provided with wick (7), also can in the heat pipe die cavity, produce liquid sucting core structure.
Fig. 9, Figure 10 use another embodiment schematic diagram of the present utility model on horizontally-mounted computer cpu, electronic and electrical equipment wiring board and other solid thermal sources, among the figure, base (3) is provided with a column-type heat tube body (8), around column-type heat tube body (8), be provided with four flat hot pipe bodies (5) again, be characterized in to make radiating fin (4) to leave thermal source (1) certain distance.The cross section of column-type heat tube body (8) can be rectangle shape, polygon, circle or special-shaped, the visual concrete condition setting of quantity of flat hot pipe body (5) all around.
Figure 11, Figure 12 are a kind of embodiment schematic diagrames that the utility model is applied to gas or liquid heat radiation (or thermal-arrest-heat radiation).Among the figure, two profiled-cross-section heat-pipe radiators are fused, form a profiled-cross-section heat collector tube-radiator, be actually a heat pipe by a column-type heat tube body (8).If the B frame is used as the frame that is cooled, the A frame frame that dispels the heat exactly then; In UTILIZATION OF VESIDUAL HEAT IN, the A frame is heated frame exactly.Fan is for selecting for use.
Figure 13, Figure 14 are a kind of embodiment schematic diagrames that the utility model is applied to conductor refrigeration.Among the figure, the B frame is the frame that is cooled, and the profiled-cross-section heat-pipe radiator in the B frame is worked as heat collector, and its pedestal (2) connects the huyashi-chuuka (cold chinese-style noodles) of conductor refrigeration sheet (9); The A frame is the heat radiation frame, and the pedestal of profiled-cross-section heat-pipe radiator (2) connects the hot side of conductor refrigeration sheet (9) in the A frame.
Claims (4)
1. heat-pipe radiator, by pedestal, heat pipe and radiating fin are formed, it is characterized in that: base (3) is arranged on the pedestal (2), base (3) is provided with one or several flat hot pipe bodies (5), the both sides of each flat hot pipe body (5) are provided with radiating fin (4), form profiled-cross-section gravity assisted heat pipe radiator, pedestal (2), base (3) and all flat hot pipe bodies (5) form a whole profiled-cross-section gravity assisted heat pipe die cavity, and heat-conducting liquid can be flowed to the die cavity and the contacted position of thermal source (1) of pedestal (2) from each position of profiled-cross-section vacuum die cavity with gravity.
2. the described a kind of heat-pipe radiator of claim 1, it is characterized in that: base (3) is arranged on the pedestal (2), and base (3) is provided with a column-type heat tube body (8), is provided with several flat hot pipe bodies (5) around column-type heat tube body (8) again; The cross section of column-type heat tube body (8) can be rectangle shape, polygon, circle or special-shaped, the visual concrete condition setting of the quantity of flat hot pipe body (5) all around.
3. the described a kind of heat-pipe radiator of claim 1 is characterized in that: when cooperating fan to dispel the heat, be provided with a water conservancy diversion frame (6) in the outer most edge of radiating fin (4), two faces of water conservancy diversion frame (6) utilize radiating fin (4) directly as baffler.
4. the described a kind of heat-pipe radiator of claim 1, it is characterized in that: base (3) is arranged on the pedestal (2), pedestal (2) and base (3) form profiled-cross-section gravity assisted heat pipe die cavity, go up at base (3) and directly make radiating fin (4), form profiled-cross-section gravity assisted heat pipe radiator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200320118440 CN2720632Y (en) | 2003-11-25 | 2003-11-25 | Special-section heat-tube radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200320118440 CN2720632Y (en) | 2003-11-25 | 2003-11-25 | Special-section heat-tube radiator |
Publications (1)
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CN2720632Y true CN2720632Y (en) | 2005-08-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200320118440 Expired - Fee Related CN2720632Y (en) | 2003-11-25 | 2003-11-25 | Special-section heat-tube radiator |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101943392A (en) * | 2010-09-21 | 2011-01-12 | 常熟琦光光电科技有限公司 | Heat dissipation device |
CN103066631A (en) * | 2012-06-08 | 2013-04-24 | 合肥海奥电气科技有限公司 | Electric bus on-board charger |
CN104812215A (en) * | 2015-04-01 | 2015-07-29 | 太仓陶氏电气有限公司 | Radiator for welding machine |
CN108332454A (en) * | 2018-03-21 | 2018-07-27 | 天津商业大学 | A kind of carbon dioxide gravity assisted heat pipe subcooler |
CN108447835A (en) * | 2018-05-19 | 2018-08-24 | 芜湖中淇节能科技有限公司 | A kind of combined type microelectronics radiator |
CN108682658A (en) * | 2018-03-28 | 2018-10-19 | 安徽尼古拉电子科技有限公司 | A kind of microelectronics radiator |
WO2021012984A1 (en) * | 2019-07-19 | 2021-01-28 | 深圳市英维克科技股份有限公司 | Gravity heat pipe radiator and electronic device |
-
2003
- 2003-11-25 CN CN 200320118440 patent/CN2720632Y/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101943392A (en) * | 2010-09-21 | 2011-01-12 | 常熟琦光光电科技有限公司 | Heat dissipation device |
CN103066631A (en) * | 2012-06-08 | 2013-04-24 | 合肥海奥电气科技有限公司 | Electric bus on-board charger |
CN103066631B (en) * | 2012-06-08 | 2014-10-29 | 合肥海奥电气科技有限公司 | Electric bus on-board charger |
CN104812215A (en) * | 2015-04-01 | 2015-07-29 | 太仓陶氏电气有限公司 | Radiator for welding machine |
CN108332454A (en) * | 2018-03-21 | 2018-07-27 | 天津商业大学 | A kind of carbon dioxide gravity assisted heat pipe subcooler |
CN108682658A (en) * | 2018-03-28 | 2018-10-19 | 安徽尼古拉电子科技有限公司 | A kind of microelectronics radiator |
CN108447835A (en) * | 2018-05-19 | 2018-08-24 | 芜湖中淇节能科技有限公司 | A kind of combined type microelectronics radiator |
WO2021012984A1 (en) * | 2019-07-19 | 2021-01-28 | 深圳市英维克科技股份有限公司 | Gravity heat pipe radiator and electronic device |
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Legal Events
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |