CN108682658A - A kind of microelectronics radiator - Google Patents
A kind of microelectronics radiator Download PDFInfo
- Publication number
- CN108682658A CN108682658A CN201810261313.0A CN201810261313A CN108682658A CN 108682658 A CN108682658 A CN 108682658A CN 201810261313 A CN201810261313 A CN 201810261313A CN 108682658 A CN108682658 A CN 108682658A
- Authority
- CN
- China
- Prior art keywords
- induced
- cooling fin
- draft plate
- pedestal
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004377 microelectronic Methods 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 123
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000009835 boiling Methods 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 claims abstract description 4
- 238000009423 ventilation Methods 0.000 claims description 20
- 241000883990 Flabellum Species 0.000 claims description 10
- 230000001965 increasing effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009833 condensation Methods 0.000 abstract description 6
- 230000005494 condensation Effects 0.000 abstract description 6
- 238000001704 evaporation Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of microelectronics radiator, it is related to microelectronics technology, including pedestal, the pedestal is equipped with inner cavity, it is 45 60 degrees Celsius of liquid that storage, which has boiling point, in the inner cavity, fin cooling device and air-cooling device are additionally provided at the top of the pedestal, the fin cooling device is used to increase the heat dissipation area of gas, and the air-cooling device is used to accelerate the radiating rate of whole device.The present invention realizes the heat sinking function of the device by the evaporation endothermic and condensation heat dissipation of liquid, while the heat dissipation effect of radiator is improved by the design of fin cooling device and air-cooling device.
Description
Technical field
The present invention relates to microelectronics technology, more particularly to a kind of microelectronics radiator.
Background technology
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Its theoretical foundation developed is at the end of the 19th century to the modern physics set up during the 1930s, microelectronics
Technology includes that system circuit design, device physics, technology, material preparation, automatically test and encapsulation, assembling etc. are a series of
Special technology, microelectric technique are the summations of every technology in microelectronics, due to the small size of microelectronic device,
High-power running, so that very high heat is generated, and the excessively high operational efficiency for being easily reduced the microelectronic devices such as chip of heat,
It is easy burning apparatus simultaneously, thus it is most important to the heat dissipation of microelectronic device, mostly use cooling fin heat dissipation greatly at this stage, but dissipate
Thermal effect is poor.
Invention content
The purpose of the present invention is to provide a kind of microelectronics radiators, caused by the prior art above-mentioned multinomial to solve
Defect.
A kind of microelectronics radiator, including pedestal, the pedestal are equipped with inner cavity, in the inner cavity storage there is the boiling point to be
45-60 degrees Celsius of liquid is additionally provided with fin cooling device and air-cooling device, the fin cooling dress at the top of the pedestal
The heat dissipation area for increasing gas is set, the air-cooling device is used to accelerate the radiating rate of whole device.
Preferably, the fin cooling device includes the cooling fin one, cooling fin two and cooling fin three being symmetrically arranged,
The surface of cooling fin one, cooling fin two and cooling fin three is connected separately with induced-draft plate one, induced-draft plate two and induced-draft plate three, cooling fin
One, cooling fin two, cooling fin three, induced-draft plate one, induced-draft plate two and induced-draft plate three are hollow structure, cooling fin one, cooling fin two
It is fixedly connected on the top of pedestal with cooling fin three and connects with the inner cavity of pedestal, cooling fin one, cooling fin two and cooling fin
Inner space of three inner space respectively with induced-draft plate one, induced-draft plate two and induced-draft plate three connects, cooling fin one, cooling fin
Two and cooling fin three on be equipped with ventilation opening one, ventilation opening one is located at the upper of induced-draft plate one, induced-draft plate two and induced-draft plate three
Side, induced-draft plate one, the opposite top with pedestal of induced-draft plate two and induced-draft plate three are increased successively, cooling fin one, cooling fin two and are dissipated
Backing three and the angle of base top horizontal direction are 65-75 degree.
Preferably, the air-cooling device includes arc-like sheet, motor and flabellum, and arc-like sheet is hollow structure, arc-like sheet
Length and width is equal with the length and width of pedestal, and arc-like sheet is fixedly connected on the top of pedestal, and motor is mounted on arc-like sheet
The top of inner ring, flabellum are mounted in the rotation axis of motor.
Preferably, the inside of the arc-like sheet is additionally provided with washer one and washer two, washer one and the dislocation arrangement of washer two, shelves
Piece one and washer two are fixedly connected by connector with the inner wall of arc-like sheet.
Preferably, the cooling fin three is also associated with induced-draft plate four, and induced-draft plate four is hollow structure, the inside of induced-draft plate four
Space and the inner space of cooling fin three connect, and ventilation opening two is additionally provided on cooling fin three, and ventilation opening two is located at induced-draft plate four
Top, induced-draft plate four is located at the lower section of induced-draft plate three, and the lower end of cooling fin two is additionally provided with ventilation opening three, and ventilation opening three is located at and draws
The lower section of wind piece two.
Preferably, the cooling fin one, cooling fin two, cooling fin three, induced-draft plate one, induced-draft plate two, induced-draft plate three and draw
The material of wind piece four is copper or aluminium.
Preferably, the bottom of the pedestal is additionally provided with groove.
The beneficial effects of the invention are as follows：The present invention realizes dissipating for the device by the evaporation endothermic and condensation heat dissipation of liquid
Hot function, while improving by the design of fin cooling device and air-cooling device the heat dissipation effect of radiator.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is three side view of cooling fin of the present invention；
Fig. 3 is the annexation figure of the catch one and catch two and arc-like sheet of the present invention；
Fig. 4 is the position relationship schematic diagram of the catch one and catch two of the present invention.
Wherein, 1- pedestals, 2- induced-draft plates four, 3- ventilation openings two, 4- ventilation openings three, 5- induced-draft plates one, 6- cooling fins one, 7-
Cooling fin two, 8- induced-draft plates two, 9- cooling fins three, 10- induced-draft plates three, 11- motors, 12- flabellums, 13- arc-like sheets, 14- ventilations
Mouth one, 15- connectors, 16- washers one, 17- washers two, 18- grooves.
Specific implementation mode
Below by the description to embodiment, the shape of for example involved each component of specific implementation mode of the invention, structure
It makes, the mutual alignment between each section and connection relation, the effect of each section and operation principle, manufacturing process and the side of operating with
Method etc., is described in further detail, completeer to help those skilled in the art to have the inventive concept of the present invention, technical solution
Whole, accurate and deep understanding.
As shown in Figures 1 to 4, a kind of microelectronics radiator, including pedestal 1, the pedestal 1 is equipped with inner cavity, described interior
It is 45-60 degrees Celsius of liquid that storage, which has boiling point, in chamber, and the top of the pedestal 1 is additionally provided with fin cooling device and air cooling dress
It sets, the fin cooling device is used to increase the heat dissipation area of gas, and the air-cooling device is used to accelerate dissipating for whole device
Thermal velocity.
In the present embodiment, the fin cooling device includes the cooling fin 1 being symmetrically arranged, 27 and of cooling fin
The surface of cooling fin 39, cooling fin 1, cooling fin 27 and cooling fin 39 is connected separately with induced-draft plate 1,28 and of induced-draft plate
Induced-draft plate 3 10, during cooling fin 1, cooling fin 27, cooling fin 39, induced-draft plate 1, induced-draft plate 28 and induced-draft plate 3 10 are
Hollow structure, cooling fin 1, cooling fin 27 and cooling fin 39 are fixedly connected on the top of pedestal 1 and are mutually passed through with the inner cavity of pedestal 1
It is logical, the inner space of cooling fin 1, cooling fin 27 and cooling fin 39 respectively with induced-draft plate 1, induced-draft plate 28 and induced-draft plate
3 10 inner space connects, and ventilation opening 1, ventilation opening are equipped on cooling fin 1, cooling fin 27 and cooling fin 39
One 14 are located at the top of induced-draft plate 1, induced-draft plate 28 and induced-draft plate 3 10, induced-draft plate 1, induced-draft plate 28 and induced-draft plate
The 3 10 opposite tops with pedestal 1 are increased successively, cooling fin 1, cooling fin 27 and cooling fin 39 and 1 top water square of pedestal
To angle be 65-75 degree.
The bottom of pedestal 1 is linked together by heat conductive silica gel and microelectronic chip, microelectronic chip generates when working
Heat the bottom of pedestal 1 is transmitted to by heat conductive silica gel, the liquid heat absorption in pedestal 1 starts to generate evaporation of vapours, and steam steams
It is dealt into the inner top of pedestal 1, since the temperature of inner top is low, steam is condensed into liquid and releases heat, and the liquid being condensed into is again
Flow back into the interior bottom of pedestal 1, so move in circles realize microelectronic chip heat sinking function, cooling fin 1, cooling fin 27,
Cooling fin 39, induced-draft plate 1, induced-draft plate 28 and induced-draft plate 3 10 are the design of hollow structure, increase the face of steam condensation
Product, to increase the condensation rate of steam.
In the present embodiment, the air-cooling device includes arc-like sheet 13, motor 11 and flabellum 12, and arc-like sheet 13 is hollow
The length and width of structure, arc-like sheet 13 is equal with the length and width of pedestal 1, and arc-like sheet 13 is fixedly connected on the top of pedestal 1
Portion, motor 11 are mounted on the top of 13 inner ring of arc-like sheet, and flabellum 12 is mounted in the rotation axis of motor 11.
Since the inner space of pedestal 1 is limited, the speed of steam condensation is slower, so by increasing arc-like sheet 13, heat dissipation
Piece 1, cooling fin 27 and cooling fin 39 come increase steam condensation speed, arc-like sheet 13 design convenient for condensation liquid flow
It returns in pedestal.
The work of motor 11 drives the wind-force that the rotation of flabellum 12 generates so that the bottom of pedestal 1 and cooling fin 1, cooling fin
27 and cooling fin 39 heat dissipation effect it is outstanding, while cooling fin 1, cooling fin 27 and cooling fin 39 and pedestal 1 push up
The angle of portion's horizontal direction is 65-75 degree so that wind-force, which can rebound, accelerates the radiating rate of arc-like sheet 13, wind piece 1, air inducing
The design of piece 28 and induced-draft plate 3 10 so that wind-force can also be introduced to each place at 1 top of pedestal when flabellum 12 is smaller,
Flabellum 12 is small so that more stablizing when whole device works.
In the present embodiment, the inside of the arc-like sheet 13 is additionally provided with washer 1 and washer 2 17, washer 1 and shelves
The dislocation arrangement of piece 2 17, washer 1 and washer 2 17 are fixedly connected by connector 15 with the inner wall of arc-like sheet 13.So into
One step improves the heat dissipation effect of arc-like sheet 13.
In the present embodiment, the cooling fin 39 is also associated with induced-draft plate 42, and induced-draft plate 42 is hollow structure, air inducing
The inner space of piece 42 and the inner space of cooling fin 39 connect, and ventilation opening 23, ventilation opening are additionally provided on cooling fin 39
23 are located at the top of induced-draft plate 42, and induced-draft plate 42 is located at the lower section of induced-draft plate 3 10, and the lower end of cooling fin 27 is additionally provided with logical
Air port 34, ventilation opening 34 are located at the lower section of induced-draft plate 28.So that wind-force dispersion is more uniform, device is improved
Heat dissipation effect.
In the present embodiment, the cooling fin 1, cooling fin 27, cooling fin 39, induced-draft plate 1, induced-draft plate 28, draw
The material of wind piece 3 10 and induced-draft plate 42 is copper or aluminium.
In addition, the bottom of the pedestal 1 is additionally provided with groove 18.Microelectronic chip is connected at groove 18 so that device
Installation is more stablized.
The present invention is exemplarily described above in conjunction with embodiment, it is clear that the present invention implements not by above-mentioned side
The limitation of formula, if the improvement of the various unsubstantialities of inventive concept and technical scheme of the present invention progress is used, or without
It improves and the design of the present invention and technical solution is directly applied into other occasions, within protection scope of the present invention.This
The protection domain of invention should be determined by the scope of protection defined in the claims.
Claims (7)
1. a kind of microelectronics radiator, which is characterized in that including pedestal (1), the pedestal (1) is equipped with inner cavity, the inner cavity
It is 45-60 degrees Celsius of liquid that middle storage, which has boiling point, and fin cooling device and air cooling dress are additionally provided at the top of the pedestal (1)
It sets, the fin cooling device is used to increase the heat dissipation area of gas, and the air-cooling device is used to accelerate dissipating for whole device
Thermal velocity.
2. radiator according to claim 1, it is characterised in that：The fin cooling device includes being symmetrically arranged
Cooling fin one (6), cooling fin two (7) and cooling fin three (9), cooling fin one (6), cooling fin two (7) and cooling fin three (9)
Surface is connected separately with induced-draft plate one (5), induced-draft plate two (8) and induced-draft plate three (10), cooling fin one (6), cooling fin two (7),
Cooling fin three (9), induced-draft plate one (5), induced-draft plate two (8) and induced-draft plate three (10) are hollow structure, cooling fin one (6), heat dissipation
Piece two (7) and cooling fin three (9) are fixedly connected on the top of pedestal (1) and connect with the inner cavity of pedestal (1), cooling fin one
(6), the inner space of cooling fin two (7) and cooling fin three (9) respectively with induced-draft plate one (5), induced-draft plate two (8) and induced-draft plate three
(10) inner space connects, and ventilation opening one is equipped on cooling fin one (6), cooling fin two (7) and cooling fin three (9)
(14), ventilation opening one (14) is located at the top of induced-draft plate one (5), induced-draft plate two (8) and induced-draft plate three (10), induced-draft plate one
(5), induced-draft plate two (8) and the opposite top with pedestal (1) of induced-draft plate three (10) are increased successively, cooling fin one (6), cooling fin two
(7) and the angle in cooling fin three (9) and pedestal (1) top horizontal direction is 65-75 degree.
3. radiator according to claim 1, it is characterised in that：The air-cooling device includes arc-like sheet (13), horse
Up to (11) and flabellum (12), arc-like sheet (13) is hollow structure, the length and width of arc-like sheet (13) and the length of pedestal (1) and
Width is equal, and arc-like sheet (13) is fixedly connected on the top of pedestal (1), and motor (11) is mounted on the top of arc-like sheet (13) inner ring
Portion, flabellum (12) are mounted in the rotation axis of motor (11).
4. radiator according to claim 3, it is characterised in that：The inside of the arc-like sheet (13) is additionally provided with washer one
(16) and washer two (17), washer one (16) and washer two (17) dislocation arrange that washer one (16) and washer two (17) pass through company
Fitting (15) is fixedly connected with the inner wall of arc-like sheet (13).
5. radiator according to claim 2, it is characterised in that：The cooling fin three (9) is also associated with induced-draft plate four
(2), induced-draft plate four (2) is hollow structure, and the inner space and the inner space of cooling fin three (9) of induced-draft plate four (2) connect,
Ventilation opening two (3) is additionally provided on cooling fin three (9), ventilation opening two (3) is located at the top of induced-draft plate four (2), induced-draft plate four (2) position
In the lower section of induced-draft plate three (10), the lower end of cooling fin two (7) is additionally provided with ventilation opening three (4), and ventilation opening three (4) is located at induced-draft plate
Two (8)
Lower section.
6. radiator according to claim 5, it is characterised in that：The cooling fin one (6), cooling fin two (7), heat dissipation
Piece three (9), induced-draft plate one (5), induced-draft plate two (8), induced-draft plate three (10) and induced-draft plate four (2) material be copper or aluminium.
7. radiator according to claim 1, it is characterised in that：The bottom of the pedestal (1) is additionally provided with groove (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261313.0A CN108682658B (en) | 2018-03-28 | 2018-03-28 | Microelectronic heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261313.0A CN108682658B (en) | 2018-03-28 | 2018-03-28 | Microelectronic heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108682658A true CN108682658A (en) | 2018-10-19 |
| CN108682658B CN108682658B (en) | 2020-06-26 |
Family
ID=63799616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810261313.0A Active CN108682658B (en) | 2018-03-28 | 2018-03-28 | Microelectronic heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108682658B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11876036B2 (en) | 2020-06-18 | 2024-01-16 | The Research Foundation For The State University Of New York | Fluid cooling system including embedded channels and cold plates |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW584269U (en) * | 2003-01-30 | 2004-04-11 | Shie Shin Mau | Heat dissipation fin device having internal disturbance liquid |
| CN2720632Y (en) * | 2003-11-25 | 2005-08-24 | 陈德荣 | Special-section heat-tube radiator |
| CN104600188A (en) * | 2014-12-30 | 2015-05-06 | 东莞市高能磁电技术有限公司 | Combined effective cooling device |
| CN206742225U (en) * | 2017-04-20 | 2017-12-12 | 东莞永腾电子制品有限公司 | A kind of radiator for increasing heat pipe and copper bottom contact area |
| CN107507811A (en) * | 2017-07-24 | 2017-12-22 | 华南理工大学 | The chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating |
-
2018
- 2018-03-28 CN CN201810261313.0A patent/CN108682658B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW584269U (en) * | 2003-01-30 | 2004-04-11 | Shie Shin Mau | Heat dissipation fin device having internal disturbance liquid |
| CN2720632Y (en) * | 2003-11-25 | 2005-08-24 | 陈德荣 | Special-section heat-tube radiator |
| CN104600188A (en) * | 2014-12-30 | 2015-05-06 | 东莞市高能磁电技术有限公司 | Combined effective cooling device |
| CN206742225U (en) * | 2017-04-20 | 2017-12-12 | 东莞永腾电子制品有限公司 | A kind of radiator for increasing heat pipe and copper bottom contact area |
| CN107507811A (en) * | 2017-07-24 | 2017-12-22 | 华南理工大学 | The chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11876036B2 (en) | 2020-06-18 | 2024-01-16 | The Research Foundation For The State University Of New York | Fluid cooling system including embedded channels and cold plates |
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| Publication number | Publication date |
|---|---|
| CN108682658B (en) | 2020-06-26 |
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Effective date of registration: 20200519 Address after: 242199 No.9, Jiaoyu Road, Shizi Town, Langxi County, Xuancheng City, Anhui Province Applicant after: Langxi Wanpeng Technology Intermediary Service Co.,Ltd. Address before: Room 1305, Floor 13, Building 4, Service Outsourcing Industrial Park, 717 Zhongshan South Road, Wuhu High-tech Industrial Development Zone, Anhui Province, 241000 Applicant before: ANHUI NIGULA ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20240703 Address after: No. 30, Road Group, Shizi Village, Shizi Town, Langxi County, Xuancheng City, Anhui Province, 242131 Patentee after: Jin Ji Country or region after: China Address before: No. 9, Education Road, Shizi Town, Langxi County, Xuancheng City, Anhui Province, 242199 Patentee before: Langxi Wanpeng Technology Intermediary Service Co.,Ltd. Country or region before: China |