CN108682658B - Microelectronic heat radiator - Google Patents
Microelectronic heat radiator Download PDFInfo
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- CN108682658B CN108682658B CN201810261313.0A CN201810261313A CN108682658B CN 108682658 B CN108682658 B CN 108682658B CN 201810261313 A CN201810261313 A CN 201810261313A CN 108682658 B CN108682658 B CN 108682658B
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- fin
- induced draft
- cooling
- base
- piece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses a microelectronic heat dissipation device, which relates to the technical field of microelectronics and comprises a base, wherein the base is provided with an inner cavity, liquid with the boiling point of 45-60 ℃ is stored in the inner cavity, the top of the base is also provided with a fin cooling device and an air cooling device, the fin cooling device is used for increasing the heat dissipation area of gas, and the air cooling device is used for accelerating the heat dissipation speed of the whole device. The invention realizes the heat dissipation function of the device through the evaporation heat absorption and the condensation heat dissipation of the liquid, and simultaneously improves the heat dissipation effect of the heat dissipation device through the design of the fin cooling device and the air cooling device.
Description
Technical Field
The invention relates to the technical field of microelectronics, in particular to a microelectronic heat dissipation device.
Background
Microelectronics is a new technology developed with integrated circuits, especially very large scale integrated circuits. The theoretical basis of the development is modern physics established from the end of the 19 th century to the 30 th century, the microelectronic technology comprises a series of special technologies such as system circuit design, device physics, process technology, material preparation, automatic test, packaging and assembly, the microelectronic technology is the sum of all process technologies in microelectronics, and due to the fact that microelectronic equipment is small in size and high in power operation, very high heat is generated, the operation efficiency of the microelectronic equipment such as chips is easily reduced due to overhigh heat, and the equipment is easily burnt, so that the heat dissipation of the microelectronic equipment is vital, most of the existing stages adopt heat dissipation fins for heat dissipation, and the heat dissipation effect is poor.
Disclosure of Invention
The present invention is directed to a microelectronic heat dissipation device to solve the above-mentioned drawbacks of the prior art.
The utility model provides a microelectronic heat dissipation device, includes the base, the base is equipped with the inner chamber, deposit the liquid that the boiling point is 45-60 degrees centigrade in the inner chamber, the top of base still is equipped with fin cooling device and wind cooling device, fin cooling device is used for increasing gaseous heat radiating area, wind cooling device is used for accelerating the radiating rate of whole device.
Preferably, the fin cooling device comprises a first cooling fin, a second cooling fin and a third cooling fin which are symmetrically arranged respectively, the surfaces of the first cooling fin, the second cooling fin and the third cooling fin are connected with a first induced draft fin, a second induced draft fin and a third induced draft fin respectively, the first cooling fin, the second cooling fin, the third cooling fin, the first induced draft fin, the second induced draft fin and the third induced draft fin are of hollow structures, the first cooling fin, the second cooling fin and the third cooling fin are fixedly connected to the top of the base and communicated with the inner cavity of the base, the inner spaces of the first cooling fin, the second cooling fin and the third cooling fin are communicated with the inner spaces of the first induced draft fin, the second induced draft fin and the third induced draft fin respectively, the first cooling fin, the second cooling fin and the third cooling fin are provided with a first ventilation opening, the first ventilation openings are respectively positioned above the first induced draft fin, the second induced draft fin and the third induced draft fin, the first induced draft fin, the second induction, the included angles between the first radiating fin, the second radiating fin and the third radiating fin and the horizontal direction of the top of the base are 65-75 degrees.
Preferably, the air cooling device comprises an arc-shaped piece, a motor and fan blades, wherein the arc-shaped piece is of a hollow structure, the length and the width of the arc-shaped piece are equal to those of the base, the arc-shaped piece is fixedly connected to the top of the base, the motor is installed at the top of an inner ring of the arc-shaped piece, and the fan blades are installed on a rotating shaft of the motor.
Preferably, the inner part of the arc-shaped piece is also provided with a first baffle piece and a second baffle piece, the first baffle piece and the second baffle piece are arranged in a staggered manner, and the first baffle piece and the second baffle piece are fixedly connected with the inner wall of the arc-shaped piece through a connecting piece.
Preferably, the third heat sink is further connected with a fourth air inducing piece, the fourth air inducing piece is of a hollow structure, the inner space of the fourth air inducing piece is communicated with the inner space of the third heat sink, the third heat sink is further provided with a second air vent, the second air vent is located above the fourth air inducing piece, the fourth air inducing piece is located below the third air inducing piece, the lower end of the second heat sink is further provided with a third air vent, and the third air vent is located below the second air inducing piece.
Preferably, the first cooling fin, the second cooling fin, the third cooling fin, the first induced draft fin, the second induced draft fin, the third induced draft fin and the fourth induced draft fin are made of copper or aluminum.
Preferably, the bottom of the base is also provided with a groove.
The invention has the beneficial effects that: the invention realizes the heat dissipation function of the device through the evaporation heat absorption and the condensation heat dissipation of the liquid, and simultaneously improves the heat dissipation effect of the heat dissipation device through the design of the fin cooling device and the air cooling device.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a three-side view of the heat sink of the present invention;
FIG. 3 is a diagram showing the connection relationship between the first and second baffle plates and the arc-shaped plate;
fig. 4 is a schematic diagram of a position relationship between the first blocking piece and the second blocking piece of the present invention.
The fan comprises a base 1, a base 2, an induced draft sheet IV, a vent opening II, a vent opening III, a vent opening I, a vent opening III, a vent sheet I, a heat radiating fin II, a vent sheet III, a motor 11, a fan blade 12, an arc sheet 13, a vent opening I, a connecting piece 15, a baffle sheet I, a baffle sheet II 17 and a groove 18.
Detailed Description
The following embodiments are provided to describe the embodiments of the present invention, and to further describe the detailed description of the embodiments of the present invention, such as the shapes, configurations, mutual positions and connection relationships of the components, the functions and operation principles of the components, the manufacturing processes and operation methods, etc., so as to help those skilled in the art to more fully, accurately and deeply understand the inventive concept and technical solutions of the present invention.
As shown in fig. 1 to 4, a microelectronic heat dissipation device includes a base 1, the base 1 is provided with an inner cavity, liquid with a boiling point of 45-60 ℃ is stored in the inner cavity, the top of the base 1 is further provided with a fin cooling device and an air cooling device, the fin cooling device is used for increasing the heat dissipation area of gas, and the air cooling device is used for accelerating the heat dissipation speed of the whole device.
In this embodiment, the fin cooling device includes a first cooling fin 6, a second cooling fin 7, and a third cooling fin 9, which are symmetrically arranged, the surfaces of the first cooling fin 6, the second cooling fin 7, and the third cooling fin 9 are respectively connected with a first air-inducing piece 5, a second air-inducing piece 8, and a third air-inducing piece 10, the first cooling fin 6, the second cooling fin 7, the first air-inducing piece 5, the second air-inducing piece 8, and the third air-inducing piece 10 are hollow structures, the first cooling fin 6, the second cooling fin 7, and the third cooling fin 9 are fixedly connected to the top of the base 1 and communicated with the inner cavity of the base 1, the inner spaces of the first cooling fin 6, the second cooling fin 7, and the third cooling fin 9 are respectively communicated with the inner spaces of the first air-inducing piece 5, the second air-inducing piece 8, and the third air-inducing piece 10, the first cooling fin 6, the second cooling fin 7, and the third cooling fin 9 are, And the upper parts of the second induced draft piece 8 and the third induced draft piece 10, the first induced draft piece 5, the second induced draft piece 8 and the third induced draft piece 10 are sequentially heightened relative to the top of the base 1, and the included angles between the first radiating fin 6, the second radiating fin 7 and the third radiating fin 9 and the top of the base 1 in the horizontal direction are 65-75 degrees.
The bottom of the base 1 is connected with the microelectronic chip through the heat conducting silica gel, heat generated when the microelectronic chip works is transmitted to the bottom of the base 1 through the heat conducting silica gel, liquid in the base 1 absorbs heat and begins to generate steam to evaporate, the steam evaporates to the inner top of the base 1, the steam is condensed into liquid to release heat due to the fact that the temperature of the inner top is low, the condensed liquid flows back to the inner bottom of the base 1, the heat dissipation function of the microelectronic chip is achieved in a circulating and reciprocating mode, the first cooling fin 6, the second cooling fin 7, the third cooling fin 9, the first air induction fin 5, the second air induction fin 8 and the third air induction fin 10 are of hollow structures, the area of steam condensation is increased, and therefore the condensation speed of the steam is increased.
In this embodiment, the air cooling device includes arc piece 13, motor 11 and flabellum 12, and arc piece 13 is hollow structure, and the length and the width of arc piece 13 are equal with the length and the width of base 1, and arc piece 13 fixed connection is at the top of base 1, and motor 11 installs at the top of arc piece 13 inner circle, and flabellum 12 is installed in the axis of rotation of motor 11.
Since the inner space of the base 1 is limited and the vapor is condensed at a slower speed, the design of the arc-shaped piece 13 facilitates the condensed liquid to flow back into the base by increasing the condensation speed of the vapor through the addition of the arc-shaped piece 13, the first cooling fin 6, the second cooling fin 7 and the third cooling fin 9.
The motor 11 works to drive the fan blade 12 to rotate to generate wind power, so that the bottom of the base 1 and the first radiating fin 6, the second radiating fin 7 and the third radiating fin 9 are excellent in radiating effect, meanwhile, included angles between the first radiating fin 6, the second radiating fin 7, the third radiating fin 9 and the top of the base 1 in the horizontal direction are 65-75 degrees, the wind power can rebound to accelerate the radiating speed of the arc-shaped sheet 13, the first wind fin 5, the second air inducing sheet 8 and the third air inducing sheet 10 are designed to enable the fan blade 12 to be small, the wind power can be induced to all places on the top of the base 1, and the fan blade 12 is small, so that the whole device is more stable in working.
In this embodiment, a first blocking piece 16 and a second blocking piece 17 are further disposed inside the arc-shaped piece 13, the first blocking piece 16 and the second blocking piece 17 are arranged in a staggered manner, and the first blocking piece 16 and the second blocking piece 17 are fixedly connected with the inner wall of the arc-shaped piece 13 through a connecting piece 15. Thus further improving the heat dissipation effect of the arc-shaped pieces 13.
In this embodiment, the heat sink three 9 is further connected with an air inducing piece four 2, the air inducing piece four 2 is of a hollow structure, an inner space of the air inducing piece four 2 is communicated with an inner space of the heat sink three 9, the heat sink three 9 is further provided with a vent opening two 3, the vent opening two 3 is located above the air inducing piece four 2, the air inducing piece four 2 is located below the air inducing piece three 10, the lower end of the heat sink two 7 is further provided with a vent opening three 4, and the vent opening three 4 is located below the air inducing piece two 8. So make wind-force dispersion more even, improved the radiating effect of device.
In this embodiment, the first heat sink 6, the second heat sink 7, the third heat sink 9, the first air-guiding plate 5, the second air-guiding plate 8, the third air-guiding plate 10, and the fourth air-guiding plate 2 are made of copper or aluminum.
In addition, the bottom of the base 1 is also provided with a groove 18. The attachment of the microelectronic chip at the recess 18 makes the device mounting more stable.
The present invention has been described in connection with the embodiments, and it is obvious that the specific implementation of the present invention is not limited by the above-mentioned manner, and it is within the protection scope of the present invention as long as various insubstantial modifications are made by using the method concept and technical scheme of the present invention, or the concept and technical scheme of the present invention are directly applied to other occasions without modification. The protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (5)
1. A microelectronic heat dissipation device is characterized by comprising a base (1), wherein the base (1) is provided with an inner cavity, liquid with a boiling point of 45-60 ℃ is stored in the inner cavity, the top of the base (1) is also provided with a fin cooling device and an air cooling device, the fin cooling device is used for increasing the heat dissipation area of gas, and the air cooling device is used for accelerating the heat dissipation speed of the whole device;
the fin cooling device comprises a first cooling fin (6), a second cooling fin (7) and a third cooling fin (9) which are symmetrically arranged respectively, the surfaces of the first cooling fin (6), the second cooling fin (7) and the third cooling fin (9) are respectively connected with a first induced draft fin (5), a second induced draft fin (8) and a third induced draft fin (10), the first cooling fin (6), the second cooling fin (7), the third cooling fin (9), the first induced draft fin (5), the second induced draft fin (8) and the third induced draft fin (10) are of hollow structures, the first cooling fin (6), the second cooling fin (7) and the third cooling fin (9) are fixedly connected to the top of the base (1) and communicated with the inner cavity of the base (1), the inner spaces of the first cooling fin (6), the second cooling fin (7) and the third cooling fin (9) are respectively communicated with the inner spaces of the first induced draft fin (5), the second induced draft fin (8) and the third induced draft fin (10), the first air guide sheet (5), the second air guide sheet (8) and the third air guide sheet (10) are sequentially heightened relative to the top of the base (1), and included angles between the first heat radiation sheet (6), the second heat radiation sheet (7) and the third heat radiation sheet (9) and the top of the base (1) in the horizontal direction are 65-75 degrees;
the air cooling device comprises an arc-shaped sheet (13), a motor (11) and fan blades (12), wherein the arc-shaped sheet (13) is of a hollow structure, the length and the width of the arc-shaped sheet (13) are equal to those of a base (1), the arc-shaped sheet (13) is fixedly connected to the top of the base (1), the motor (11) is installed at the top of the inner ring of the arc-shaped sheet (13), and the fan blades (12) are installed on the rotating shaft of the motor (11).
2. The heat dissipating device of claim 1, wherein: the inner part of the arc-shaped piece (13) is also provided with a first baffle piece (16) and a second baffle piece (17), the first baffle piece (16) and the second baffle piece (17) are arranged in a staggered mode, and the first baffle piece (16) and the second baffle piece (17) are fixedly connected with the inner wall of the arc-shaped piece (13) through a connecting piece (15).
3. The heat dissipating device of claim 1, wherein: the radiating fin III (9) is further connected with an induced draft fin IV (2), the induced draft fin IV (2) is of a hollow structure, the inner space of the induced draft fin IV (2) is communicated with the inner space of the radiating fin III (9), the radiating fin III (9) is further provided with a vent II (3), the vent II (3) is located above the induced draft fin IV (2), the induced draft fin IV (2) is located below the induced draft fin III (10), the lower end of the radiating fin II (7) is further provided with a vent III (4), and the vent III (4) is located below the induced draft fin II (8).
4. The heat dissipating device of claim 3, wherein: the first radiating fin (6), the second radiating fin (7), the third radiating fin (9), the first induced draft fin (5), the second induced draft fin (8), the third induced draft fin (10) and the fourth induced draft fin (2) are made of copper or aluminum.
5. The heat dissipating device of claim 1, wherein: the bottom of the base (1) is also provided with a groove (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261313.0A CN108682658B (en) | 2018-03-28 | 2018-03-28 | Microelectronic heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261313.0A CN108682658B (en) | 2018-03-28 | 2018-03-28 | Microelectronic heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108682658A CN108682658A (en) | 2018-10-19 |
| CN108682658B true CN108682658B (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810261313.0A Active CN108682658B (en) | 2018-03-28 | 2018-03-28 | Microelectronic heat radiator |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US11876036B2 (en) | 2020-06-18 | 2024-01-16 | The Research Foundation For The State University Of New York | Fluid cooling system including embedded channels and cold plates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW584269U (en) * | 2003-01-30 | 2004-04-11 | Shie Shin Mau | Heat dissipation fin device having internal disturbance liquid |
| CN2720632Y (en) * | 2003-11-25 | 2005-08-24 | 陈德荣 | Special-section heat-tube radiator |
| CN104600188A (en) * | 2014-12-30 | 2015-05-06 | 东莞市高能磁电技术有限公司 | Combined effective cooling device |
| CN206742225U (en) * | 2017-04-20 | 2017-12-12 | 东莞永腾电子制品有限公司 | A kind of radiator for increasing heat pipe and copper bottom contact area |
| CN107507811B (en) * | 2017-07-24 | 2023-06-20 | 华南理工大学 | Chip heat dissipation cooling device for cooling and coupling flat plate heat tube bundle with semiconductor |
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Effective date of registration: 20200519 Address after: 242199 No.9, Jiaoyu Road, Shizi Town, Langxi County, Xuancheng City, Anhui Province Applicant after: Langxi Wanpeng Technology Intermediary Service Co., Ltd Address before: Room 1305, Floor 13, Building 4, Service Outsourcing Industrial Park, 717 Zhongshan South Road, Wuhu High-tech Industrial Development Zone, Anhui Province, 241000 Applicant before: ANHUI NIGULA ELECTRONIC TECHNOLOGY Co.,Ltd. |
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