CN110366351B - Manufacturing method of conduction heat dissipation structure of servo driver - Google Patents

Manufacturing method of conduction heat dissipation structure of servo driver Download PDF

Info

Publication number
CN110366351B
CN110366351B CN201910527557.3A CN201910527557A CN110366351B CN 110366351 B CN110366351 B CN 110366351B CN 201910527557 A CN201910527557 A CN 201910527557A CN 110366351 B CN110366351 B CN 110366351B
Authority
CN
China
Prior art keywords
heat dissipation
heat
servo driver
mounting substrate
evaporation section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910527557.3A
Other languages
Chinese (zh)
Other versions
CN110366351A (en
Inventor
刘冬
钱巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Estun Automation Co Ltd
Original Assignee
Nanjing Estun Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Estun Automation Co Ltd filed Critical Nanjing Estun Automation Co Ltd
Priority to CN201910527557.3A priority Critical patent/CN110366351B/en
Publication of CN110366351A publication Critical patent/CN110366351A/en
Priority to PCT/CN2019/112856 priority patent/WO2020253008A1/en
Application granted granted Critical
Publication of CN110366351B publication Critical patent/CN110366351B/en
Priority to PCT/CN2020/090115 priority patent/WO2020253423A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a servo driver conduction heat dissipation structure and a manufacturing method thereof, wherein the servo driver conduction heat dissipation structure comprises more than one heat pipe, the heat pipe comprises an evaporation section and a condensation section, the evaporation section is connected with a power module installed in a servo driver and used for conducting heat generated by the power module to the condensation section, and the condensation section is connected with a heat dissipation terminal positioned outside the servo driver and used for taking away heat conducted from the evaporation section on the condensation section. The invention has the beneficial effects that: the heat pipe is connected with the power module in the servo driver, heat generated by the work of the power module is conducted to the heat dissipation terminal outside the servo driver to be connected, the heat is dissipated to the atmosphere environment through the heat dissipation terminal, the heat dissipation terminal is located at the position, which is not contacted with the servo driver, so that the influence of the heat dissipated by the heat dissipation terminal on the servo driver is avoided, the size of the servo driver in the invention can be reduced due to the simplification of a heat dissipation structure, and the miniaturization and modularization of the servo driver are realized.

Description

Manufacturing method of conduction heat dissipation structure of servo driver
Technical Field
The invention relates to a conduction heat dissipation structure of a servo driver and a manufacturing method thereof.
Background
In the field of existing heat dissipation technologies, heat pipe heat dissipation technologies are mature and widespread, and the mainstream of the heat dissipation technology is high in heat dissipation power, so that the heat pipe heat dissipation technology is not applicable to IT industries, industrial power generation, pipeline transportation and air conditioners.
Nowadays, with the rapid development of the industrial servo industry, the requirements for servo motors and servo drivers are increasing. The servo driver is required to be continuously developed and optimized in the directions of modularization, miniaturization, high-power intensive type and the like, so that higher technical requirements are provided for the servo driver, under the condition, a die-casting aluminum radiator of the traditional servo driver can not meet new technical requirements gradually, and new challenges are provided for high heat flow density generated by a high heat device, reliability of a module after bearing high electric pulse impact in a short time and the like when the driver works normally. In order to solve the heat dissipation problem of the servo driver:
accessory 1 discloses a servo driver heat radiation structure, it is installed on the posterior lateral plate of driver shell, this servo driver heat radiation structure includes heat-conducting plate and heating panel, the heat-conducting plate can be dismantled with the heating panel and be connected, absorb the heat that the servo driver produced with the heat-conducting plate, and adopt the area to be greater than the heating panel of heat-conducting plate and absorb the heat of heat-conducting plate and with the heat effluvium, this kind of heat radiation structure sets up the outside at the shell of servo driver, it is great with the inside power module's that produces heat of servo driver distance, can not be timely with the produced heat conduction of power module derive the shell, and this heat radiation structure itself temperature rise when the heat dissipation influences the temperature in the shell again through the shell.
Accessory 2 discloses a heat abstractor of servo driver, and it includes heat dissipation box, motor, a plurality of fan blades of a plurality of gears and a plurality of pivot, and it rotates through motor drive pivot, and epaxial fan blade rotates along with the pivot is synchronous, carries out the heat dissipation treatment to servo driver, and this kind of heat radiation structure is complicated, is unfavorable for servo driver's miniaturized design to the fan blade setting of this structure is in the box, and its radiating effect is not particularly ideal because of the restriction that receives the box.
The accessory 3 discloses a known energy servo driver system heat dissipation device, which comprises a servo driver, a heat dissipation door and a heat dissipation device, wherein the heat dissipation device is arranged at the bottom of the servo driver, and the heat dissipation door is arranged on the front wall of the servo driver; and the structure of the attachment 3 is more complicated and is positioned in the servo driver, so that the attachment 2 is not beneficial to the miniaturization design of the servo driver, and the heat dissipation effect is also limited.
Attachment 1: chinese utility model patent document No. CN 204425890U.
An accessory 2: chinese utility model patent document No. CN 207691717U.
An accessory 3: the Chinese patent publication with application publication number CN 106793693A.
Disclosure of Invention
The invention aims to provide a conduction heat dissipation structure of a servo driver, which is beneficial to the heat dissipation requirement of the driver under the goals of small volume, modularization and high power density.
In order to solve the problems, the technical scheme adopted by the invention is as follows: servo driver conduction heat radiation structure, including more than one heat pipe, the heat pipe includes evaporation zone and condensation segment, and the evaporation zone is connected with the power module of installing on servo driver and is used for leading to the condensation segment with the heat transfer that power module produced, and the condensation segment is connected with the heat dissipation terminal outside being located servo driver and is used for taking away the heat that self evaporation zone conduction was come on the condensation segment. The heat pipe is adopted, so that a heat dissipation terminal connected with the heat pipe can not be in contact with the servo driver, the influence of the heat dissipated by the heat dissipation terminal on the servo driver is avoided, the heat can be conducted out by adopting one heat pipe, the structure of the servo driver is simplified, the small-size and modularized design requirements of the servo driver can be realized, and the heat dissipation requirement under the high power density target of the servo driver can be met due to the strong heat conduction capability and the high heat dissipation speed of the heat pipe.
As a further improvement of the present invention, the present invention further comprises a heat dissipation mounting substrate, the heat dissipation mounting substrate is used for being mounted on the servo driver, the power module of the servo driver is mounted on the heat dissipation mounting substrate and is used for conducting the heat generated by the power module to the heat dissipation mounting substrate, and the evaporation section of the heat pipe is connected with the heat dissipation mounting substrate and is used for conducting the heat on the heat dissipation mounting substrate to the condensation section. The heat dissipation mounting substrate is arranged, so that the power module is conveniently connected with the heat pipe, and the power module can be intensively mounted on the heat dissipation mounting substrate, and the modularized design requirement of the servo driver is further met.
As a further improvement of the invention, the power module and the evaporation section are respectively positioned at two sides of the heat dissipation mounting substrate, wherein the power module and the heat dissipation mounting substrate are detachably mounted, and the evaporation section and the heat dissipation mounting substrate are fixed. The power module and the heat pipe are respectively positioned on different sides of the heat dissipation mounting substrate, so that the power module is more compactly mounted on the heat dissipation mounting substrate, and the servo driver can be more miniaturized.
As a further improvement of the invention, one side of the heat dissipation mounting substrate for mounting the evaporation section is provided with a fixing groove, and the evaporation section is fixed in the fixing groove. The heat pipe is fixedly connected with the heat dissipation mounting substrate through the fixing groove.
As a further improvement of the invention, the heat dissipation terminal comprises a plurality of fins, fixing holes matched with the heat dissipation end of the heat pipe in size are formed in the fins, and the condensation end of the heat pipe is fixed with the fixing holes in the fins in a cold pressing or welding mode. The plurality of fins are arranged, so that the contact area between the heat dissipation terminal and the air penetrating is increased, and the heat dissipation of the heat dissipation terminal is more convenient.
As a further improvement of the invention, one end of the fixing hole is provided with a flanging. The invention is provided with the flanging, so that the contact surface between the heat pipe and the fin is increased, and the fin and the heat pipe are conveniently fixed.
Another objective of the present invention is to provide a method for manufacturing a conductive heat dissipation structure of a servo driver, comprising
Step 1, manufacturing a heat dissipation mounting substrate and fins, wherein a fixing groove is formed in the surface of one side of the heat dissipation mounting substrate, a mounting hole for mounting a power module is formed in the surface of the other side of the heat dissipation mounting substrate, fixing holes are formed in the fins, and a flange is formed at one end edge of each fixing hole.
And 2, mounting the fins on the condensation section of the heat pipe, extending the evaporation section of the heat pipe into the servo driver and pressing and embedding the evaporation section into the fixing groove.
And 3, mounting the power module on one side of the heat dissipation mounting substrate far away from the evaporation section.
And 4, mounting the heat dissipation mounting substrate as a component on the servo driver.
As a further improvement of the invention, step 2 comprises
And 2.1, taking a heat pipe and a fin, inserting the condensation section of the heat pipe into the fixing hole on the fin, and cold-pressing the flanging or welding the flanging on the condensation section.
And 2.2, repeating the step 2.1, and installing a plurality of fins on the heat pipe in the step 2.1 to finish the installation of one heat pipe and the heat dissipation terminal.
And 2.3, placing the evaporation section of the heat pipe in the step 2.2 on a fixing groove, and pressing the evaporation section into the fixing groove to fix the evaporation section in the fixing groove.
And 2.4, repeating the step 2.1 to the step 2.3, and finishing the installation of the rest heat pipes and the heat dissipation terminal.
In conclusion, the beneficial effects of the invention are as follows: the heat pipe is connected with the power module in the servo driver, heat generated by the work of the power module is conducted to the heat dissipation terminal outside the servo driver to be connected, the heat is dissipated to the atmosphere environment through the heat dissipation terminal, the heat dissipation terminal is located at the position, which is not contacted with the servo driver, so that the influence of the heat dissipated by the heat dissipation terminal on the servo driver is avoided, the size of the servo driver in the invention can be reduced due to the simplification of a heat dissipation structure, and the miniaturization and modularization of the servo driver are realized.
Drawings
Fig. 1 is a front view of a conductive heat dissipation structure of a servo driver in the present invention.
FIG. 2 is a top view of the conductive heat dissipation structure of the servo driver of the present invention.
Wherein: 1. a heat pipe; 2. an evaporation section; 3. a condensing section; 4. a servo driver; 5. a power module; 6. a heat dissipation terminal; 7. a heat-dissipating mounting substrate; 8. fixing grooves; 10. and a fin.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
Example 1
The conductive heat dissipation structure of the servo driver shown in fig. 1 and fig. 2 includes more than one heat pipe 1, and the present embodiment is described by taking three heat pipes 1 as an example. The heat pipe 1 in this embodiment includes an evaporation section 2 and a condensation section 3, the evaporation section 2 is connected with the condensation section 3, wherein: the evaporation section 2 and the condensation section 3 are two parts of the heat pipe 1, and the two parts are actually an integrated structure and jointly form the heat pipe 1, the heat pipe 1 belongs to the prior art, and is not an improvement point of the invention, the invention distinguishes the two parts of the heat pipe for convenience of description, the evaporation section 2 is connected with a power module 5 arranged in a servo driver 4 and used for conducting heat generated by the power module 5 to the condensation section 3, and the condensation section 3 is connected with a heat dissipation terminal 6 which is positioned outside the servo driver and is at a certain distance from the servo driver and used for taking away heat conducted from the evaporation section 2 on the condensation section 3.
The invention realizes the connection between the evaporation section 2 and the power module 5, and the concrete structure is as follows: the heat dissipation mounting substrate 7 is arranged in the servo driver, the heat dissipation mounting substrate 7 is detachably mounted on the servo driver 4 in a bolt mode, and the power module 5 of the servo driver 4 is detachably mounted on the heat dissipation mounting substrate 7 and used for conducting heat generated by the power module 5 to the heat dissipation mounting substrate 7.
In the present embodiment, the power module 5 and the evaporation section 2 are preferably respectively mounted on two sides of the heat dissipation mounting substrate 7, wherein the evaporation section 2 is fixed to the heat dissipation mounting substrate 7, and wherein the power module 5 is mounted on the surface of the same side of the heat dissipation mounting substrate 7, so that the power module 5 is more compactly mounted, and the volume of the servo driver can be further reduced. The specific way of fixing the evaporation section 2 and the heat dissipation mounting substrate 7 is as follows: one side of the heat dissipation mounting substrate 7, which is used for mounting the evaporation section 2, is provided with a fixing groove 8, and the evaporation section 2 is pressed into the fixing groove 8, so that the evaporation section 2 is embedded into the fixing groove 8 or the evaporation section 2 is fixed in the fixing groove by adopting a welding mode. According to the invention, the thickness of the heat-dissipation mounting substrate 7 is larger than the diameter of the heat pipe 1, after the evaporation section 2 is embedded into the fixing groove 8, the groove wall of the fixing groove 8 is attached to the outer surface of the evaporation section 2, and the contact surface between the evaporation section 2 and the heat-dissipation mounting substrate 7 is increased to the maximum extent, so that the efficiency of the heat pipe 1 for conducting heat out of the heat-dissipation mounting substrate 7 is improved.
The heat dissipation terminal 6 of the present invention comprises a plurality of fins 10, wherein the fins 10 are provided with fixing holes with sizes matched with the heat dissipation ends of the heat pipes 1, and the condensation ends of the heat pipes 1 are fixed with the fixing holes (not shown in the figure) on the fins 10 in a cold pressing or welding manner. In the invention, a flange (not shown) is preferably arranged at one end of the fixing hole, and the flange can be pressed on the condensation section 3 after the condensation section 3 passes through the fixing hole, so that the heat pipe 1 and the fins 10 are connected more firmly, the contact area between the condensation section 3 and the heat pipe 1 is increased, and the heat dissipation of the condensation section 3 is facilitated.
When the heat pipe is used, the heat dissipation terminal 6 can be cooled by means of forced air cooling, water cooling, natural convection cooling and the like, so that heat on the heat dissipation terminal 6 is quickly dissipated to the atmospheric environment, and the temperature difference between the heat dissipation terminal 6 and the power module 5 always exists, so that the heat conduction of the heat pipe 1 is not influenced.
When the servo driver 4 works normally, the power module 5 generates high heat in a small area, the high heat generated by the power module 5 is quickly transmitted to the heat-radiating mounting substrate 7, the heat-radiating mounting substrate 7 transmits the received heat to the evaporation section 2 of the heat pipe 1, the evaporation section 2 of the heat pipe 1 quickly transmits the received heat to the condensation section 3 of the heat pipe 1, and the heat of the condensation section 3 of the heat pipe 1 is taken away by using the heat-radiating terminal 6 arranged at the condensation section 3 of the heat pipe 1. The heat dissipation terminal 6 exchanges heat to the atmospheric environment by means of forced air cooling or natural air convection cooling, or the like. The heat pipe 1 continuously conducts heat by itself, and achieves and realizes the purpose of cooling the power module 5.
The invention has the following advantages: 1. the high-power-density high-heat-conduction heat dissipation device can realize the rapid heat conduction and heat dissipation of the high heat in the driver under high power density; 2. the heat dissipation terminal is separated from the driver body, so that the aims of modularization and miniaturization of the driver are fulfilled; 3. the working reliability of the high-heat component when generating overhigh heat in a short time is improved; 4. the heat dissipation terminal can adopt various terminal heat dissipation modes without being influenced by the servo driver body, and is flexible, simple and convenient; 5. the heat pipe 1 can be arranged in a plurality of directions after extending out of the servo driver, so that the heat inside the driver can be conducted and dissipated to different directions of the driver.
Example 2
The technical scheme of the embodiment is a method for manufacturing the conduction heat dissipation structure of the servo driver in embodiment 1, and the method specifically comprises the following steps:
step 1, manufacturing a heat dissipation mounting substrate 7 and fins 10, wherein a fixing groove 8 is formed in the surface of one side of the heat dissipation mounting substrate 7, a mounting hole for mounting a power module 5 is formed in the surface of the other side of the heat dissipation mounting substrate 7, a fixing hole is formed in the fin 10, and a flange is formed at one end edge of the fixing hole.
Step 2, install fin 10 on the condensation segment 3 of heat pipe 1, stretch into servo driver inside with the evaporation zone 2 of heat pipe 1 and press and put into fixed slot 8, the width of the fixed slot 8 of seting up in step 1 slightly is lighter than the diameter of evaporation zone 2, because the width of fixed slot 8 slightly is lighter than the diameter of evaporation zone 2, impress evaporation zone 2 hard in the fixed slot can make evaporation zone 2 unable activity in fixed slot 8, realize the fixed of evaporation zone 2 and fixed slot 8. In this embodiment, the width of the fixing groove 8 may also be set to be slightly larger than the diameter of the evaporation section 2 in step 1, and the evaporation section 2 is placed in the fixing groove 8 and fixed in the fixing groove 8 by welding.
And 3, mounting the power module 5 on one side, far away from the evaporation section 2, of the heat dissipation mounting substrate 7 by using screws and the like.
And 4, detachably (such as in a bolt connection mode) mounting the heat dissipation mounting substrate 7 on the servo driver 4 at one side for connecting the evaporation section 2, so as to finish the mounting of the conduction heat dissipation structure of the servo driver.
Wherein, step 2 in the invention specifically comprises:
and 2.1, taking a heat pipe 1 and a fin 10, inserting the condensation section 3 of the heat pipe 1 into a fixing hole on the fin 10, and cold-pressing and flanging or welding and fixing the flanging on the condensation section 3.
And 2.2, repeating the step 2.1, and installing a plurality of fins 10 on the condensation section 3 of the heat pipe 1 in the step 2.1 to complete the installation of one heat pipe 1 and the heat dissipation terminal 6.
And 2.3, placing the evaporation section 2 of the heat pipe 1 in the step 2.2 above the fixing groove 8, and pressing the evaporation section 2 into the fixing groove 8 to enable the evaporation section 2 to be placed into the fixing groove 8, so that the evaporation section and the fixing groove 8 are fixed or the evaporation section and the fixing groove 8 are fixed by welding.
And 2.4, repeating the step 2.1 to the step 2.3, and finishing the installation of the rest heat pipes 1 and the heat dissipation terminal 6.
The parts not specifically described in the above description are the prior art, or can be realized by the prior art, such as the opening of the fixing groove 8 and the opening of the fixing hole. The specific embodiments of the present invention are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention. That is, all equivalent changes and modifications made according to the contents of the claims of the present invention should be regarded as the technical scope of the present invention.

Claims (2)

1. The manufacturing method of the conduction heat dissipation structure of the servo driver is characterized in that: the servo driver conduction heat dissipation structure comprises a heat dissipation mounting substrate (7) and more than one heat pipe (1);
the heat pipe (1) comprises an evaporation section (2) and a condensation section (3), the evaporation section (2) is used for conducting heat generated by the power module (5) to the condensation section (3), and the condensation section (3) is connected with a heat dissipation terminal (6) positioned outside the servo driver and used for taking away heat conducted from the evaporation section (2) on the condensation section (3);
the heat dissipation mounting substrate (7) is used for being mounted on the servo driver (4), the power module (5) of the servo driver (4) is mounted on the heat dissipation mounting substrate (7) and used for conducting heat generated by the power module (5) to the heat dissipation mounting substrate (7), and the evaporation section (2) of the heat pipe (1) is connected with the heat dissipation mounting substrate (7) and used for conducting heat on the heat dissipation mounting substrate (7) to the condensation section (3);
the power module (5) and the evaporation section (2) are respectively positioned at two sides of the heat dissipation mounting substrate (7), wherein the power module (5) and the heat dissipation mounting substrate (7) are detachably mounted, and the evaporation section (2) is fixed with the heat dissipation mounting substrate (7);
one side of the heat dissipation mounting substrate (7) for mounting the evaporation section (2) is provided with a fixing groove (8), and the evaporation section (2) is fixed in the fixing groove (8);
the heat dissipation terminal (6) comprises a plurality of fins (10), fixing holes matched with the heat dissipation end of the heat pipe (1) in size are formed in the fins (10), the condensation end of the heat pipe (1) is fixed with the fixing holes in the fins (10) in a cold pressing or welding mode, and a flanging is arranged at one end of each fixing hole;
the manufacturing method comprises
Step 1, manufacturing a heat dissipation mounting substrate (7) and fins (10), wherein a fixing groove (8) is formed in the surface of one side of the heat dissipation mounting substrate (7), a mounting hole for mounting a power module (5) is formed in the surface of the other side of the heat dissipation mounting substrate (7), a fixing hole is formed in each fin (10), and a flange is formed at one end edge of each fixing hole;
step 2, installing the fins (10) on the condensation section (3) of the heat pipe (1), extending the evaporation section (2) of the heat pipe (1) into the servo driver and pressing and embedding the evaporation section into the fixed groove (8);
step 3, mounting the power module (5) on one side of the heat dissipation mounting substrate (7) far away from the evaporation section (2);
and step 4, mounting the heat dissipation mounting substrate (7) as a component on the servo driver (4).
2. The method of claim 1, wherein: step 2 comprises
Step 2.1, taking a heat pipe (1) and a fin (10), inserting a condensation section (3) of the heat pipe (1) into a fixing hole on the fin (10), and cold-pressing and flanging or welding the flanging on the condensation section (3);
step 2.2, repeating the step 2.1, and installing a plurality of fins (10) on the heat pipe (1) in the step 2.1 to complete the installation of one heat pipe (1) and the heat dissipation terminal (6);
2.3, placing the evaporation section (2) of the heat pipe (1) in the step 2.2 on the fixing groove (8), and pressing the evaporation section (2) into the fixing groove (8) to fix the evaporation section (2) in the fixing groove (8);
and 2.4, repeating the step 2.1 to the step 2.3, and finishing the installation of the rest heat pipes (1) and the heat dissipation terminal (6).
CN201910527557.3A 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver Active CN110366351B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201910527557.3A CN110366351B (en) 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver
PCT/CN2019/112856 WO2020253008A1 (en) 2019-06-18 2019-10-23 Conductive heat dissipating structure for servo drive, and manufacturing method for same
PCT/CN2020/090115 WO2020253423A1 (en) 2019-06-18 2020-05-14 Manufacturing method for conductive heat dissipation structure of servo driver

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910527557.3A CN110366351B (en) 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver

Publications (2)

Publication Number Publication Date
CN110366351A CN110366351A (en) 2019-10-22
CN110366351B true CN110366351B (en) 2020-05-12

Family

ID=68216327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910527557.3A Active CN110366351B (en) 2019-06-18 2019-06-18 Manufacturing method of conduction heat dissipation structure of servo driver

Country Status (2)

Country Link
CN (1) CN110366351B (en)
WO (2) WO2020253008A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110366351B (en) * 2019-06-18 2020-05-12 南京埃斯顿自动化股份有限公司 Manufacturing method of conduction heat dissipation structure of servo driver

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2269639Y (en) * 1995-05-09 1997-12-03 郭明 Cooling device for high power semiconductor device
CN101917835A (en) * 2010-08-23 2010-12-15 上海中科深江电动车辆有限公司 Large-power module cooling structure of electric vehicle controller
JP2011165713A (en) * 2010-02-04 2011-08-25 Fuji Electric Co Ltd Heat sink of semiconductor device
CN102331832A (en) * 2011-09-06 2012-01-25 宁波菲仕电机技术有限公司 Forced air-cooled heat pipe radiating system for servo driver
CN103167780A (en) * 2011-12-16 2013-06-19 台达电子企业管理（上海）有限公司 Combined type radiator for power module and combined type radiator assembly
CN204425890U (en) * 2015-03-31 2015-06-24 广东技术师范学院 A kind of servo-driver radiator structure
CN106793693A (en) * 2016-12-22 2017-05-31 广东技术师范学院 A kind of Intelligent servo drive system heat abstractor
KR20170127327A (en) * 2016-05-11 2017-11-21 주식회사 다원시스 Heat Sink
CN207691717U (en) * 2017-12-28 2018-08-03 上海华江企业管理股份有限公司 A kind of radiator of servo-driver
CN109729701A (en) * 2019-01-25 2019-05-07 岩熔之光智能科技(上海)有限公司 A kind of dedicated pulsating heat pipe radiator of high power density servo-driver

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100338767C (en) * 2004-05-26 2007-09-19 鸿富锦精密工业（深圳）有限公司 Heat pipe radiating unit and manufacturing method thereof
CN100573416C (en) * 2005-07-15 2009-12-23 富准精密工业(深圳)有限公司 Computer system and heat radiation module thereof
US20090109620A1 (en) * 2007-10-31 2009-04-30 Wang Cheng-Tu Heat-dissipating device of portable electronic apparatus
CN101776941B (en) * 2009-01-08 2013-03-13 富准精密工业(深圳)有限公司 Radiating device
US8004842B2 (en) * 2009-05-22 2011-08-23 Asia Vital Components Co., Ltd. Heat dissipation device for communication chassis
TW201144994A (en) * 2010-06-15 2011-12-16 Hon Hai Prec Ind Co Ltd Server and server system
CN103036394A (en) * 2011-09-29 2013-04-10 台达电子企业管理（上海）有限公司 Heat dissipation device applied to middle and high voltage inverter
CN203289822U (en) * 2013-06-25 2013-11-13 斯恩威（中国）自控系统工程有限公司 Radiator for vehicle-mounted industrial personal computer
CN104848079A (en) * 2014-02-13 2015-08-19 昆山东大智汇技术咨询有限公司 Large power LED street lamp dissipating heat by heat pipe
CN107567239B (en) * 2017-07-24 2020-03-27 广东美的暖通设备有限公司 Heat dissipation assembly and refrigeration equipment
CN210519277U (en) * 2019-06-18 2020-05-12 南京埃斯顿自动化股份有限公司 Conduction heat dissipation structure of servo driver
CN110366351B (en) * 2019-06-18 2020-05-12 南京埃斯顿自动化股份有限公司 Manufacturing method of conduction heat dissipation structure of servo driver

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2269639Y (en) * 1995-05-09 1997-12-03 郭明 Cooling device for high power semiconductor device
JP2011165713A (en) * 2010-02-04 2011-08-25 Fuji Electric Co Ltd Heat sink of semiconductor device
CN101917835A (en) * 2010-08-23 2010-12-15 上海中科深江电动车辆有限公司 Large-power module cooling structure of electric vehicle controller
CN102331832A (en) * 2011-09-06 2012-01-25 宁波菲仕电机技术有限公司 Forced air-cooled heat pipe radiating system for servo driver
CN103167780A (en) * 2011-12-16 2013-06-19 台达电子企业管理（上海）有限公司 Combined type radiator for power module and combined type radiator assembly
CN204425890U (en) * 2015-03-31 2015-06-24 广东技术师范学院 A kind of servo-driver radiator structure
KR20170127327A (en) * 2016-05-11 2017-11-21 주식회사 다원시스 Heat Sink
CN106793693A (en) * 2016-12-22 2017-05-31 广东技术师范学院 A kind of Intelligent servo drive system heat abstractor
CN207691717U (en) * 2017-12-28 2018-08-03 上海华江企业管理股份有限公司 A kind of radiator of servo-driver
CN109729701A (en) * 2019-01-25 2019-05-07 岩熔之光智能科技(上海)有限公司 A kind of dedicated pulsating heat pipe radiator of high power density servo-driver

Also Published As

Publication number Publication date
CN110366351A (en) 2019-10-22
WO2020253423A1 (en) 2020-12-24
WO2020253008A1 (en) 2020-12-24

Similar Documents

Publication Publication Date Title
CN210519277U (en) Conduction heat dissipation structure of servo driver
CN101001514A (en) Liquid-cooled radiating device and radiating unit
CN110366351B (en) Manufacturing method of conduction heat dissipation structure of servo driver
CN209016918U (en) A kind of high-power frequency conversion radiator and cooling system
CN220457275U (en) Natural heat dissipation frequency converter
CN209217888U (en) Permanent-magnet servo motor radiator structure
CN212108752U (en) Outdoor machine of air conditioner
CN209486605U (en) A kind of high power consumption server temperature-uniforming plate module group radiator
CN108682658B (en) Microelectronic heat radiator
CN211827170U (en) A waterborne graphite alkene heat radiation plate structure for CPU
CN220210863U (en) Servo controller with good heat dissipation effect
CN220491284U (en) CPU (Central processing Unit) radiating hot air fan module
CN212781932U (en) Computer host radiator
CN211648325U (en) Forced air cooling diesel engine box
CN216851640U (en) Efficient aluminum plate radiator
CN112186953B (en) Variable frequency motor and frequency converter composite set
CN220691362U (en) Air blowing and sucking type CPU radiator
CN216820456U (en) Graphene heat transfer radiator
CN220473946U (en) Expansion type server radiator structure
CN213126914U (en) High-strength shock-absorbing radiating fin
CN214046435U (en) Heat dissipation structure and device
CN220955936U (en) Become oar driver and wind motor group
CN218298952U (en) BIM component generation device
CN221178287U (en) Servo driver heat abstractor and servo driver
CN220984521U (en) Chip assembly, heat dissipation module group and electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant