CN220491284U - CPU (Central processing Unit) radiating hot air fan module - Google Patents
CPU (Central processing Unit) radiating hot air fan module Download PDFInfo
- Publication number
- CN220491284U CN220491284U CN202321618639.7U CN202321618639U CN220491284U CN 220491284 U CN220491284 U CN 220491284U CN 202321618639 U CN202321618639 U CN 202321618639U CN 220491284 U CN220491284 U CN 220491284U
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- Prior art keywords
- heat
- mounting
- cpu
- heat conducting
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 238000001816 cooling Methods 0.000 claims 7
- 230000005855 radiation Effects 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 36
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a CPU (Central processing Unit) radiating fan module, which relates to the technical field of CPU radiation and aims at solving the technical problem that the CPU cannot be subjected to efficient radiation treatment in the prior art; the hot air fan module comprises a heat conducting bottom plate; the upper end of the heat conducting bottom plate is provided with a mounting plate, the outer side of the heat conducting bottom plate is provided with heat conducting pipes, the outer sides of the heat conducting pipes are provided with heat conducting components, the heat conducting components are provided with two groups, the outer sides of the heat conducting components are provided with first mounting components, the inner sides of the first mounting components are provided with first heat radiating components, the outer sides of the heat conducting components are provided with second mounting components, and the inner sides of the second mounting components are provided with second heat radiating components; this CPU heat dissipation fan module is through setting up of heat conduction bottom plate with heat dispersion in many groups heat pipe, through the setting increase radiating area of heat conduction subassembly, drives the air flow through first heat dissipation subassembly and takes away the heat, realizes playing high-efficient heat dissipation to the CPU.
Description
Technical Field
The utility model belongs to the technical field of CPU heat dissipation, and particularly relates to a CPU heat dissipation fan module.
Background
Nowadays, a CPU heat dissipation fan is used to help the CPU dissipate heat and ensure its normal operation, and the CPU is a core processor in a computer and is responsible for processing and executing various computing tasks, but a lot of heat is generated in the process, if the CPU is overheated, it may cause a breakdown of the computer system and even cause hardware damage.
At present, the utility model patent with the patent number of CN201320798966.5 discloses a computer CPU heat radiation module, which is characterized in that heat radiation fins are manufactured in two different specifications, after the heat radiation fins with the same specification are buckled together, the two groups of heat radiation fins are buckled into a whole in a reverse direction, and the utility model has the advantages of reasonable design, simple structure, easy implementation, convenient use, convenient assembly, good assembly strength and good heat radiation effect; the heat dissipation fin group is divided into two different specifications for heat dissipation, but the CPU heat dissipation fan module has poor heat dissipation effect on the CPU in the use process, and can not perform high-efficiency heat dissipation treatment on the CPU by only relying on the heat conduction structure for heat dissipation.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a CPU heat dissipation fan module, which aims to solve the technical problem that the CPU cannot be efficiently subjected to heat dissipation treatment in the prior art.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a CPU heat dissipation hot air fan module, which comprises a heat conduction bottom plate; the upper end of heat conduction bottom plate is provided with the mounting panel, the outside of heat conduction bottom plate is provided with the heat pipe, the heat pipe is provided with the multiunit, the outside of heat pipe is provided with heat conduction subassembly, heat conduction subassembly is provided with two sets of, heat conduction subassembly's outside is provided with first installation component, heat conduction subassembly's inboard is provided with first radiator unit, heat conduction subassembly's outside is provided with the second installation component, the inboard of second installation component is provided with the second radiator unit, the inboard of mounting panel is provided with the installation screw.
When the CPU heat dissipation fan module of the technical scheme is used, the mounting plate is mounted on the CPU through the arrangement of the mounting screws, heat is dispersed into a plurality of groups of heat conduction pipes through the arrangement of the heat conduction bottom plate, the heat dissipation area is increased through the arrangement of the heat conduction assembly, the first heat dissipation assembly is mounted and treated through the arrangement of the first mounting assembly, and the first heat dissipation assembly drives air to flow so as to take away heat, so that efficient heat dissipation treatment on the CPU is realized.
Further, the heat conduction assembly comprises radiating fins, the radiating fins are arranged on the outer sides of the heat conduction pipes, a plurality of groups of radiating fins are arranged, fixed side plates are fixedly arranged on the outer sides of the radiating fins, the plurality of groups of radiating fins are installed and treated through the arrangement of the fixed side plates, and the radiating area is increased through the arrangement of the radiating fins.
Further, the heat conduction assembly comprises a mounting groove, the mounting groove is formed in the inner side of the heat dissipation fin, a plurality of groups of mounting grooves are formed, the mounting groove is connected with the heat conduction assembly in a clamping mode, and the heat dissipation fin is mounted through the clamping connection of the mounting groove and the heat conduction pipe.
Further, the first installation component is including the installing frame, the installing frame set up in the outside of heat conduction subassembly, the outside of installing frame is provided with the connecting rod, the connecting rod is provided with the multiunit, installs the processing to built-in motor through the setting of installing frame, installs the installing frame through the setting of connecting rod.
Further, the first installation component comprises a built-in motor, the built-in motor is arranged on the inner side of the installation frame, the built-in motor is located at the center of the installation frame, and the fan disc is driven through the built-in motor.
Further, the first heat dissipation assembly comprises a fan disc, the fan disc is arranged at the output end of the built-in motor, fan blades are arranged on the outer side of the fan disc, a plurality of groups of fan blades are arranged, the fan disc drives the plurality of groups of fan blades to rotate, and air is driven to flow through the plurality of groups of fan blades to take away heat.
Further, the first heat dissipation assembly comprises an installation lining, the installation lining is arranged on the outer side of the installation frame, one end of the connecting rod is connected with the outer side of the installation lining, and the fan disc is installed through the installation of the installation lining.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the CPU heat dissipation fan module, the mounting plate is mounted on the CPU through the arrangement of the mounting screws, heat is dispersed into a plurality of groups of heat conduction pipes through the arrangement of the heat conduction bottom plate, the mounting of the heat dissipation fins is performed through the clamping connection of the mounting grooves and the heat conduction pipes, the mounting of a plurality of groups of heat dissipation fins is performed through the arrangement of the fixed side plates, the heat dissipation area is increased through the arrangement of the heat dissipation fins, and the efficient heat conduction treatment of the CPU is realized;
2. the CPU heat dissipation fan module is used for installing the built-in motor through the installation of the installation frame, installing the installation frame through the installation of the connecting rod, driving the fan disc through the built-in motor, driving the fan disc to rotate through the fan disc, driving air to flow through the fan disc to take away heat through the fan disc, and installing the fan disc through the installation of the installation lining, so that efficient heat dissipation of the CPU is achieved.
Drawings
FIG. 1 is a schematic diagram of a front perspective view of an embodiment of the present utility model;
FIG. 2 is a schematic side view of an embodiment of the present utility model;
FIG. 3 is a schematic diagram of an embodiment of the utility model in elevation and in deployment;
fig. 4 is a schematic side view of an embodiment of the present utility model.
The marks in the drawings are: 1. a thermally conductive base plate; 2. a mounting plate; 3. a heat conduction pipe; 4. a heat conducting component; 5. a first mounting assembly; 6. a first heat dissipation assembly; 7. a second mounting assembly; 8. a second heat dissipation assembly; 9. installing a screw; 10. a heat dissipating fin; 11. fixing the side plates; 12. a mounting groove; 13. a mounting frame; 14. a connecting rod; 15. a built-in motor; 16. a fanning tray; 17. a fan blade; 18. and (5) installing a lining.
Detailed Description
The specific embodiment is a heat-dissipating fan module for a CPU, the front perspective structure of which is shown in FIG. 1, the side perspective structure of which is shown in FIG. 2, and the heat-dissipating fan module comprises a heat-conducting bottom plate 1; the upper end of heat conduction bottom plate 1 is provided with mounting panel 2, the outside of heat conduction bottom plate 1 is provided with heat pipe 3, heat pipe 3 is provided with the multiunit, the outside of heat pipe 3 is provided with heat conduction subassembly 4, heat conduction subassembly 4 is provided with two sets of, the outside of heat conduction subassembly 4 is provided with first installation component 5, the inboard of first installation component 5 is provided with first radiator unit 6, the outside of heat conduction subassembly 4 is provided with second installation component 7, the inboard of second installation component 7 is provided with second radiator unit 8, the inboard of mounting panel 2 is provided with mounting screw 9.
Wherein, heat conduction subassembly 4 is including radiating fin 10, radiating fin 10 sets up in the outside of heat pipe 3, radiating fin 10's is provided with the multiunit, radiating fin 10's outside fixed mounting has fixed curb plate 11, carry out the installation to multiunit radiating fin 10 through the setting of fixed curb plate 11 and handle, set up increase radiating area through radiating fin 10, heat conduction subassembly 4 is including mounting groove 12, mounting groove 12 is seted up in radiating fin 10's inboard, the multiunit has been seted up to mounting groove 12, mounting groove 12 and heat conduction subassembly 4 block are connected, carry out the installation to radiating fin 10 through the block connection of mounting groove 12 and heat pipe 3.
This embodiment is for CPU fan module that looses fan, its front view expansion structure schematic diagram is as shown in fig. 3, its side view expansion structure schematic diagram is as shown in fig. 4, first installation component 5 is including installing frame 13, installing frame 13 sets up in the outside of heat conduction subassembly 4, the outside of installing frame 13 is provided with connecting rod 14, connecting rod 14 is provided with the multiunit, install installation processing to built-in motor 15 through the setting of installing frame 13, install installation frame 13 through the setting of connecting rod 14, first installation component 5 is including built-in motor 15, built-in motor 15 sets up in the inboard of installing frame 13, built-in motor 15 is located the central point of installing frame 13, drive processing is carried out fan dish 16 through built-in motor 15.
Meanwhile, the first heat dissipation component 6 comprises a fan disc 16, the fan disc 16 is arranged at the output end of the built-in motor 15, fan blades 17 are arranged on the outer side of the fan disc 16, a plurality of groups of fan blades 17 are arranged, the fan disc 16 drives the fan blades 17 to rotate, the fan blades 17 drive air to flow to take away heat, the first heat dissipation component 6 comprises an installation lining 18, the installation lining 18 is arranged on the outer side of the installation frame 13, one end of the connecting rod 14 is connected with the outer side of the installation lining 18, and the fan disc 16 is installed through the installation of the installation lining 18.
When the CPU heat dissipation fan module of the technical scheme is used, the mounting plate 2 is mounted on the CPU through the arrangement of the mounting screws 9, heat is dispersed into the heat conduction pipes 3 through the arrangement of the heat conduction bottom plate 1, the heat dissipation fins 10 are mounted through the clamping connection of the mounting grooves 12 and the heat conduction pipes 3, the heat dissipation fins 10 are mounted through the arrangement of the fixed side plates 11, the heat dissipation area is increased through the arrangement of the heat dissipation fins 10, the built-in motor 15 is mounted through the arrangement of the mounting frame 13, the mounting frame 13 is mounted through the arrangement of the connecting rod 14, the fan disc 16 is driven through the built-in motor 15, the fan disc 16 drives the fan blades 17 to rotate, the air is driven by the fan blades 17 to flow to take away heat, and the fan disc 16 is mounted through the arrangement of the mounting liner 18, so that the efficient heat dissipation treatment on the CPU is realized.
And all that is not described in detail in this specification is well known to those skilled in the art.
Claims (7)
1. A CPU heat dissipation fan module comprises a heat conduction base plate (1); the heat conducting device is characterized in that the upper end of the heat conducting base plate (1) is provided with a mounting plate (2), the outer side of the heat conducting base plate (1) is provided with heat conducting pipes (3), the heat conducting pipes (3) are provided with a plurality of groups, the outer side of the heat conducting pipes (3) is provided with heat conducting components (4), the heat conducting components (4) are provided with two groups, the outer side of the heat conducting components (4) is provided with a first mounting component (5), the inner side of the first mounting component (5) is provided with a first heat radiating component (6), the outer side of the heat conducting components (4) is provided with a second mounting component (7), the inner side of the second mounting component (7) is provided with a second heat radiating component (8), and the inner side of the mounting plate (2) is provided with mounting screws (9).
2. The CPU cooling fan module according to claim 1, wherein the heat conducting component (4) includes cooling fins (10), the cooling fins (10) are disposed on the outer sides of the heat conducting pipes (3), a plurality of groups of cooling fins (10) are disposed, and a fixed side plate (11) is fixedly mounted on the outer sides of the cooling fins (10).
3. The CPU heat dissipation fan module according to claim 2, wherein the heat conduction assembly (4) includes a mounting groove (12), the mounting groove (12) is formed on the inner side of the heat dissipation fin (10), the mounting groove (12) is formed with a plurality of groups, and the mounting groove (12) is connected with the heat conduction assembly (4) in a clamping manner.
4. The CPU heat dissipation fan module according to claim 1, wherein the first mounting assembly (5) includes a mounting frame (13), the mounting frame (13) is disposed on the outer side of the heat conduction assembly (4), a connecting rod (14) is disposed on the outer side of the mounting frame (13), and a plurality of groups of connecting rods (14) are disposed.
5. The CPU-powered heat dissipation fan module as defined in claim 4, wherein the first mounting assembly (5) includes a built-in motor (15), the built-in motor (15) is disposed inside the mounting frame (13), and the built-in motor (15) is located at a central position of the mounting frame (13).
6. The CPU-cooling fan module according to claim 5, wherein the first cooling component (6) includes a fan disc (16), the fan disc (16) is disposed at an output end of the built-in motor (15), fan blades (17) are disposed at an outer side of the fan disc (16), and a plurality of groups of fan blades (17) are disposed.
7. The CPU heat dissipation fan module according to claim 6, wherein the first heat dissipation component (6) includes a mounting liner (18), the mounting liner (18) is disposed on the outer side of the mounting frame (13), and one end of the connecting rod (14) is connected with the outer side of the mounting liner (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321618639.7U CN220491284U (en) | 2023-06-25 | 2023-06-25 | CPU (Central processing Unit) radiating hot air fan module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321618639.7U CN220491284U (en) | 2023-06-25 | 2023-06-25 | CPU (Central processing Unit) radiating hot air fan module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220491284U true CN220491284U (en) | 2024-02-13 |
Family
ID=89837638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321618639.7U Active CN220491284U (en) | 2023-06-25 | 2023-06-25 | CPU (Central processing Unit) radiating hot air fan module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220491284U (en) |
-
2023
- 2023-06-25 CN CN202321618639.7U patent/CN220491284U/en active Active
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