CN107567239B - Heat dissipation assembly and refrigeration equipment - Google Patents
Heat dissipation assembly and refrigeration equipment Download PDFInfo
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- CN107567239B CN107567239B CN201710607291.4A CN201710607291A CN107567239B CN 107567239 B CN107567239 B CN 107567239B CN 201710607291 A CN201710607291 A CN 201710607291A CN 107567239 B CN107567239 B CN 107567239B
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Abstract
The invention provides a heat dissipation assembly, which is provided with a first heat dissipation plate and a second heat dissipation plate, wherein one end of the first heat dissipation plate is connected with a driving chip, the second heat dissipation plate is connected with the other end of the first heat dissipation plate, the second heat dissipation plate is of a hollow structure, the end part of the second heat dissipation plate is respectively provided with a refrigerant inlet and a refrigerant outlet, a refrigerant flows into the second heat dissipation plate through the refrigerant inlet, the refrigerant transfers low temperature to the first heat dissipation plate through the second heat dissipation plate, the first heat dissipation plate transfers the low temperature to the driving chip to cool the driving chip, and meanwhile, the traditional arrangement of a copper pipe and a fixed aluminum plate for refrigerant circulation is abandoned, meanwhile, the cooling requirements of various chips are met through the transformation of the second heat dissipation piece structure.
Description
Technical Field
The invention relates to the technical field of refrigeration equipment, in particular to a heat dissipation assembly and refrigeration equipment.
Background
At present, in an electric control box of an air conditioner in the market, due to the existence of heating components in the electric control box, a certain structural design is required to dissipate heat generated by the heating components, the purpose of heat dissipation is achieved by opening the electric control box or forming an air duct in the electric control box, and the heat dissipation effect is difficult to achieve under the condition that the electric control box needs to be closed or semi-closed.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, an aspect of the present invention provides a heat dissipation assembly.
Another aspect of the present invention is to provide a refrigeration apparatus.
In view of the above, according to an object of the present invention, there is provided a heat dissipation assembly for a refrigeration device, the refrigeration device includes a compressor and a refrigerant pipe, the compressor includes a driving chip, the heat dissipation assembly includes: the first heat dissipation plate is connected with the driving chip at one end face; and the second heat dissipation part is connected with the other end surface of the first heat dissipation plate, is of a hollow structure, and is provided with a refrigerant inlet and a refrigerant outlet at the end part respectively.
The heat radiation component provided by the invention is provided with a first heat radiation plate and a second heat radiation member, wherein one end surface of the first heat radiation plate is connected with a driving chip, the second heat radiation member is connected with the other end surface of the first heat radiation plate, the second heat radiation member is of a hollow structure, the end part of the second heat radiation member is respectively provided with a refrigerant inlet and a refrigerant outlet, a refrigerant flows into the second heat radiation member through the refrigerant inlet and flows through a hollow cavity of the whole second heat radiation member, in the process, the refrigerant transmits low temperature to the first heat radiation plate through the second heat radiation member, the first heat radiation plate transmits the low temperature to the driving chip which is in contact with the first heat radiation plate, the driving chip is cooled, namely, the heat of the driving chip is sequentially dissipated through a heat radiation plate component and the refrigerant, meanwhile, only two parts of the first heat radiation plate and the second heat radiation member are arranged, the copper tube is fixed by the two aluminum plates, so that the number of parts of the heat dissipation assembly is small, the thermal contact resistance between the parts is reduced, the heat dissipation efficiency is improved, and the temperature of the chip is effectively reduced. And the requirements of specifications and layout of various chips are met through the conversion of the second heat dissipation piece structure.
In addition, according to the heat dissipation assembly in the above technical solution provided by the present invention, the following additional technical features may also be provided:
in the above technical solution, preferably, the outlet of the refrigerant pipe is inserted into the refrigerant inlet, and the inlet of the refrigerant pipe is inserted into the refrigerant outlet.
In this technical scheme, the export of refrigerant pipe is inserted and is established in the refrigerant inlet, and the import of refrigerant pipe is inserted and is established in the refrigerant outlet, is convenient for carry the refrigerant in the second radiating piece, flows through to whole second radiating piece when the refrigerant, flows out from the refrigerant outlet again, guarantees that the refrigerant is difficult for taking place to leak, and can the circulation operation.
In any of the above technical solutions, preferably, the refrigerant inlet and the refrigerant outlet are respectively adapted to the refrigerant pipe.
In this technical scheme, refrigerant import, refrigerant export respectively with refrigerant pipe looks adaptation, further place the refrigerant and expose from the kneck of second heat sink with the refrigerant pipe, influence the cooling to drive chip, prevent simultaneously that the refrigerant from dripping on drive chip.
In any of the above technical solutions, preferably, an end of the refrigerant pipe contacting the second heat sink is connected by welding.
In this technical scheme, the coolant pipe is connected through the welding with the tip that the second radiating piece contacted, further guarantees the stability of both connections, prevents that the coolant from leaking, and welding operation is simple, and the cost is lower.
In any one of the above technical solutions, preferably, the first heat dissipation plate is provided with an installation groove, and the second heat dissipation member is placed in the installation groove.
In this technical scheme, the mounting groove has been seted up on the first heating panel, and the second radiating piece is placed in the mounting groove, and the mounting groove plays the restriction effect to the second radiating piece for the second radiating piece is connected with first heating panel more stably.
In any of the above technical solutions, preferably, the second heat sink is connected to the first heat sink by welding.
In this technical scheme, the second radiating piece is connected through the welding with first heating panel, firmly connects the second radiating piece on first heating panel, prevents effectively that the second radiating piece from droing from first heating panel, guarantees the radiating effect of refrigerant to driver chip.
In any one of the above technical solutions, preferably, the end surface of the first heat dissipation plate facing the second heat dissipation member is provided with a buckle, the buckle can be opened or closed, and when the second heat dissipation member is placed on the first heat dissipation plate, the buckle is clamped on the second heat dissipation member.
In this technical scheme, first heating panel is provided with the buckle towards the terminal surface of second heat dissipation spare on, and the buckle can open or close, and when the second heat dissipation spare was placed on first heating panel, the buckle joint was on the second heat dissipation spare, effectively prevented that the second heat dissipation spare from dropping from first heating panel, and easy operation is convenient simultaneously.
In any one of the above technical solutions, preferably, the second heat dissipating member includes at least one branch member, and when the number of the branch members is plural, the plural branch members are connected in sequence.
In this technical scheme, the second radiating piece contains at least one branch piece, and when the quantity of branch piece was a plurality of, a plurality of branch pieces head and the tail were connected in order, formed longer refrigerant circulation pipeline, increased heat radiating area, improved the radiating efficiency.
In any of the above technical solutions, preferably, the first heat dissipation plate is an aluminum heat dissipation plate; the second heat sink is an aluminum heat sink.
In the technical scheme, the first heat dissipation plate is an aluminum heat dissipation plate; the second heat dissipation part is an aluminum heat dissipation part, the heat conduction effect of an aluminum product is better, the lower temperature of a refrigerant can be rapidly transmitted to the driving chip, the temperature of the driving chip is effectively reduced, the service life of the driving chip is prolonged, and the problem that the thermal resistance is easily increased due to the fact that a copper pipe is adopted as a circulation channel of the refrigerant in the past is solved.
In summary, the refrigerant heat dissipation assembly provided by the invention comprises a first heat dissipation plate and a second heat dissipation plate connected with one end face of the first heat dissipation plate, the cross section shape of the second heat dissipation plate and the bending direction on the first heat dissipation plate can be changed according to actual requirements so as to meet different driving chip layouts, different heat dissipation requirements and the like, because the aluminum heat dissipation plate is directly contacted with the driving chip, the aluminum heat dissipation plate is connected with the aluminum heat dissipation plate, and the refrigerant is directly contacted with the aluminum heat dissipation plate, a copper pipe is omitted, so that thermal contact resistance between the copper pipe and the aluminum plate is avoided, and the heat dissipation efficiency is improved.
According to another object of the present invention, there is provided a refrigerating apparatus including: the heat dissipation assembly according to any of the above technical solutions.
The refrigeration equipment provided by the invention comprises the heat dissipation assembly in any technical scheme, so that the refrigeration equipment has all the beneficial effects of the heat dissipation assembly, and is not repeated herein.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of a heat sink assembly separated from a coolant tube according to an embodiment of the present invention;
FIG. 2 is a front view of an embodiment of the heat sink assembly assembled with a coolant tube;
FIG. 3 is a top view of an embodiment of the heat sink assembly assembled with a coolant tube;
fig. 4 is a side view of the heat sink assembly assembled with the coolant tube in an embodiment of the invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 4 is:
12 a first heat dissipation plate, 14 a second heat dissipation plate, 142 a refrigerant inlet, 144 a refrigerant outlet, 146 a welding area, 20 a refrigerant pipe, 22 a refrigerant pipe outlet and 24 a refrigerant pipe inlet.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
The heat dissipation assembly according to some embodiments of the present invention is described below with reference to fig. 1 to 4.
As shown in fig. 1, fig. 2 and fig. 4, an embodiment of the present invention provides a heat dissipation assembly for a refrigeration apparatus, the refrigeration apparatus includes a compressor and a refrigerant pipe 20, the compressor includes a driving chip, and the heat dissipation assembly includes: the driving circuit comprises a first heat dissipation plate 12, wherein one end face of the first heat dissipation plate 12 is connected with a driving chip, the end face of the first heat dissipation plate 12 is polished to be smooth and coated with silica gel, and the first heat dissipation plate is fixed with the driving chip through screws; the second heat dissipating member 14 is U-shaped, the second heat dissipating member 14 is connected to the other end surface of the first heat dissipating plate 12, the second heat dissipating member 14 is hollow, and a refrigerant inlet 142 and a refrigerant outlet 144 are respectively formed at an end of the second heat dissipating member 14.
The heat dissipation assembly provided by the invention is provided with a first heat dissipation plate 12 and a second heat dissipation plate 14, wherein one end surface of the first heat dissipation plate 12 is connected with a driving chip, the second heat dissipation plate 14 is connected with the other end surface of the first heat dissipation plate 12, the second heat dissipation plate 14 is of a hollow structure, the end part of the second heat dissipation plate 14 is respectively provided with a refrigerant inlet 142 and a refrigerant outlet 144, a refrigerant flows into the second heat dissipation plate 14 through the refrigerant inlet 142 and flows through the hollow cavity of the whole second heat dissipation plate 14, in the process, the refrigerant transmits low temperature to the first heat dissipation plate 12 through the second heat dissipation plate 14, the first heat dissipation plate 12 transmits the low temperature to the driving chip contacted with the first heat dissipation plate 12, the driving chip is cooled, namely, the heat of the driving chip is dissipated through the heat dissipation plate assembly and the refrigerant in sequence, and meanwhile, only two parts of the first, the copper pipe specially arranged for refrigerant circulation in the prior art is abandoned, two aluminum plates are needed for fixing the copper pipe, the number of components of the heat dissipation assembly is small, so that the thermal contact resistance between the components is reduced, the heat dissipation efficiency is improved, the temperature of a chip is effectively reduced, meanwhile, one end of the first heat dissipation plate 12 is connected with the driving chip, the connection between the first heat dissipation plate and the driving chip is more stable due to the plate-shaped structure, the heat dissipation efficiency is improved, the direct contact between the copper pipe and the chip is avoided, once the heat dissipation ester outside the copper pipe is unevenly and slightly bent, the contact between the pipeline and the chip is poor, and the heat dissipation efficiency is obviously. Through the structural change of the second heat dissipation part 14, the requirements of specifications and layouts of various chips are met. In this embodiment, the second heat dissipating member 14 is U-shaped, so that a sharp corner is avoided, and the circulation of a refrigerant can be accelerated, and the sectional area of the second heat dissipating member 14 and the direction of the second heat dissipating member 14 on the first heat dissipating plate 12 can be diversified according to actual needs, so as to meet the layout of different driving chips and different heat dissipating requirements.
As shown in fig. 1 and 2, in one embodiment of the present invention, the refrigerant pipe outlet 22 is preferably inserted into the refrigerant inlet 142, and the refrigerant pipe inlet 24 is preferably inserted into the refrigerant outlet 144.
In this embodiment, the refrigerant pipe outlet 22 is inserted into the refrigerant inlet 142, and the refrigerant pipe inlet 24 is inserted into the refrigerant outlet 144, so as to facilitate the refrigerant to be conveyed into the second heat dissipating member 14, and after the refrigerant flows through the entire second heat dissipating member 14, the refrigerant flows out from the refrigerant outlet 144, thereby ensuring that the refrigerant is not easy to leak and can be circulated.
In an embodiment of the present invention, the refrigerant inlet 142 and the refrigerant outlet 144 are preferably respectively matched with the refrigerant pipe 20.
In this embodiment, the refrigerant inlet 142 and the refrigerant outlet 144 are respectively matched with the refrigerant pipe 20, and the refrigerant is further exposed from the interface between the second heat sink 14 and the refrigerant pipe 20, so as to affect the cooling of the driving chip and prevent the refrigerant from dripping on the driving chip.
In one embodiment of the present invention, the ends of the refrigerant pipes 20 contacting the second heat sink 14 are preferably connected by welding.
In this embodiment, the ends of the refrigerant pipe 20 contacting the second heat sink 14 are connected by welding, so as to further ensure the connection stability of the two, prevent the refrigerant from leaking, and have simple welding operation and low cost.
In one embodiment of the present invention, it is preferable that the first heat dissipation plate 12 is formed with a mounting groove, and the second heat dissipation member 14 is placed in the mounting groove.
In this embodiment, the first heat dissipation plate 12 is provided with an installation groove, the second heat dissipation member 14 is placed in the installation groove, and the installation groove limits the second heat dissipation member 14, so that the connection between the second heat dissipation member 14 and the first heat dissipation plate 12 is more stable.
As shown in fig. 1 and 3, in one embodiment of the present invention, preferably, the second heat dissipation element 14 is connected to the first heat dissipation plate 12 by welding, and a welding region 146 is formed around the outside of the second heat dissipation element 14 along an outside line of the second heat dissipation element 14.
In this embodiment, the second heat dissipation element 14 is connected to the first heat dissipation plate 12 by welding, and the welding region 146 surrounds the outer edge of the second heat dissipation element 14, so that the second heat dissipation element 14 can be firmly connected to the first heat dissipation plate 12, the second heat dissipation element 14 is effectively prevented from falling off from the first heat dissipation plate 12, and the heat dissipation effect of the refrigerant on the driver chip is ensured.
In one embodiment of the present invention, it is preferable that the end surface of the first heat dissipation plate 12 facing the second heat dissipation member 14 is provided with a clip, which can be opened or closed, and which is clipped to the second heat dissipation member 14 when the second heat dissipation member 14 is placed on the first heat dissipation plate 12.
In this embodiment, a buckle is disposed on an end surface of the first heat dissipation plate 12 facing the second heat dissipation member 14, the buckle can be opened or closed, and when the second heat dissipation member 14 is placed on the first heat dissipation plate 12, the buckle is clamped on the second heat dissipation member 14, so as to effectively prevent the second heat dissipation member 14 from falling off from the first heat dissipation plate 12, and the operation is simple and convenient.
As shown in fig. 1 and 2, in one embodiment of the present invention, the second heat dissipation element 14 preferably includes at least one leg.
In this embodiment, the second heat dissipating element 14 includes a plurality of branch members, which can also ensure cooling and heat dissipation of the driving chips, and in other embodiments, the number of the branch members may be multiple, and when the number of the branch members is multiple, the plurality of branch members are sequentially connected end to form a longer refrigerant circulating pipeline, thereby increasing the heat dissipating area, improving the heat dissipating efficiency, and determining the trend and the shape of the bracket according to actual needs to meet the cooling needs of different driving chips.
In one embodiment of the present invention, preferably, the first heat dissipation plate 12 is an aluminum heat dissipation plate; the second heat sink 14 is an aluminum heat sink.
In this embodiment, the first heat dissipation plate 12 is an aluminum heat dissipation plate; the second heat dissipation part 14 is an aluminum heat dissipation part, the heat conduction effect of an aluminum product is better, the lower temperature of a refrigerant can be rapidly transmitted to the driving chip, the temperature of the driving chip is effectively reduced, the service life of the driving chip is prolonged, and the problem that the thermal resistance is easily increased due to the fact that a copper pipe is adopted as a circulation channel of the refrigerant in the past is solved.
In summary, the refrigerant heat dissipation assembly provided by the invention comprises a first heat dissipation plate 12 and a second heat dissipation plate 14 connected with one end face of the first heat dissipation plate, the cross-sectional shape of the second heat dissipation plate 14 and the bending direction on the first heat dissipation plate 12 can be changed according to actual requirements so as to meet different driving chip layouts, different heat dissipation requirements and the like, because the aluminum heat dissipation plate is directly contacted with the driving chip, the aluminum heat dissipation plate is connected with the aluminum heat dissipation plate, the refrigerant is directly contacted with the aluminum heat dissipation plate, a copper pipe is omitted, and therefore, thermal contact resistance between the copper pipe and the aluminum plate is avoided, and the heat dissipation efficiency is improved.
An embodiment of the second aspect of the present invention proposes a refrigeration apparatus comprising: the heat dissipation assembly of any of the above embodiments.
The refrigeration equipment provided by the invention comprises the heat dissipation assembly in any embodiment, so that all the beneficial effects of the heat dissipation assembly are achieved, and the details are not repeated.
In the present invention, the term "plurality" means two or more unless explicitly defined otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a heat dissipation assembly for refrigeration plant, refrigeration plant includes compressor and refrigerant pipe, the compressor includes driver chip, its characterized in that, heat dissipation assembly includes:
the end face of the first heat dissipation plate is connected with the driving chip;
the second heat dissipation part is connected with the other end face of the first heat dissipation plate, the second heat dissipation part is of a hollow structure, and a refrigerant inlet and a refrigerant outlet are respectively formed in the end part of the second heat dissipation part;
the outlet of the refrigerant pipe is inserted into the refrigerant inlet, and the inlet of the refrigerant pipe is inserted into the refrigerant outlet;
the end part of the refrigerant pipe, which is contacted with the second heat dissipation part, is connected by welding;
the second heat dissipation part is connected with the first heat dissipation plate through welding; or
A buckle is arranged on the end face, facing the second heat dissipation part, of the first heat dissipation plate, the buckle can be opened or closed, and when the second heat dissipation part is placed on the first heat dissipation plate, the buckle is clamped on the second heat dissipation part; or
The first heat dissipation plate is provided with a mounting groove, and the second heat dissipation part is placed in the mounting groove.
2. The heat dissipation assembly of claim 1,
the refrigerant inlet and the refrigerant outlet are respectively matched with the refrigerant pipe.
3. The heat dissipation assembly of claim 1 or 2,
the second heat dissipation member comprises at least one branch member, and when the number of the branch members is multiple, the branch members are sequentially connected.
4. The heat dissipation assembly of claim 1 or 2,
the first heat dissipation plate is an aluminum heat dissipation plate;
the second heat dissipation member is an aluminum heat dissipation member.
5. A refrigeration apparatus, comprising:
the heat dissipation assembly of any one of claims 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710607291.4A CN107567239B (en) | 2017-07-24 | 2017-07-24 | Heat dissipation assembly and refrigeration equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710607291.4A CN107567239B (en) | 2017-07-24 | 2017-07-24 | Heat dissipation assembly and refrigeration equipment |
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| CN107567239A CN107567239A (en) | 2018-01-09 |
| CN107567239B true CN107567239B (en) | 2020-03-27 |
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| CN201710607291.4A Active CN107567239B (en) | 2017-07-24 | 2017-07-24 | Heat dissipation assembly and refrigeration equipment |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110366351B (en) * | 2019-06-18 | 2020-05-12 | 南京埃斯顿自动化股份有限公司 | Manufacturing method of conduction heat dissipation structure of servo driver |
| CN116642224A (en) * | 2021-10-20 | 2023-08-25 | 美的集团武汉暖通设备有限公司 | Automatically controlled heat radiation structure, air condensing units and air conditioner |
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