CN219372911U - Air conditioner and computer board radiator thereof - Google Patents
Air conditioner and computer board radiator thereof Download PDFInfo
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- CN219372911U CN219372911U CN202222788549.4U CN202222788549U CN219372911U CN 219372911 U CN219372911 U CN 219372911U CN 202222788549 U CN202222788549 U CN 202222788549U CN 219372911 U CN219372911 U CN 219372911U
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- computer board
- heat dissipation
- semiconductor
- air conditioner
- radiator
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an air conditioner and a computer board radiator thereof, wherein the computer board radiator of the air conditioner comprises a radiating module and a semiconductor radiating assembly, the radiating module comprises a radiating base and a fin assembly connected with the radiating base, and the radiating base is provided with an installation position for installing a computer board. The semiconductor heat dissipation assembly comprises a semiconductor heat dissipation sheet for dissipating heat of the computer board and a switch for controlling the work of the semiconductor heat dissipation sheet connected with the semiconductor heat dissipation sheet, and the semiconductor heat dissipation sheet is connected with the heat dissipation module. In the computer board radiator of air conditioner that this application provided, be equipped with the heat dissipation base who is connected with the computer board on the heat dissipation module, set up the semiconductor fin, work through the semiconductor fin, conduct the cold volume to the computer board through the heat dissipation base, and then in time dispel the heat to the computer board, the heat dissipation capacity of computer board increases, and the radiating effect of computer board improves.
Description
Technical Field
The utility model relates to the technical field of heat dissipation structures, in particular to a computer board radiator of an air conditioner. The utility model also relates to an air conditioner comprising the computer board radiator.
Background
The heat dissipation of the power element of the current air-conditioning computer board is generally assisted by aluminum fins.
However, because the heat dissipation speed of the aluminum fin is slightly slower than that of the power element on the computer board, the external temperature is too high, the local temperature contacted with the power element cannot dissipate heat rapidly, and the air conditioner starts to perform protective frequency reduction or stop so as to reduce the heat dissipation capacity of the power element, so that the refrigerating effect of the air conditioner is poor and the use is affected.
Therefore, how to improve the heat dissipation effect of the computer board is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The utility model aims to provide a computer board radiator of an air conditioner, so as to improve the radiating effect of a computer board. Another object of the present utility model is to provide an air conditioner including the above-mentioned computer board radiator.
In order to achieve the above object, the present utility model provides a computer board radiator of an air conditioner, comprising:
the heat dissipation module comprises a heat dissipation base and a fin assembly connected with the heat dissipation base, and the heat dissipation base is provided with a mounting position for mounting a computer board;
the semiconductor heat dissipation assembly comprises a semiconductor heat dissipation fin for dissipating heat of a computer board and a switch connected with the semiconductor heat dissipation fin for controlling the semiconductor heat dissipation fin to work, and the semiconductor heat dissipation fin is connected with the heat dissipation module.
Optionally, in the computer board radiator of the air conditioner, the heat dissipation base is provided with a first clamping groove for accommodating the semiconductor heat dissipation fin, and the hot end of the semiconductor heat dissipation fin is attached to the fin assembly.
Optionally, in the computer board radiator of the air conditioner, a cold end of the semiconductor is attached to the heat dissipation base, and a hot end of the semiconductor is attached to the fin assembly.
Optionally, in the computer board radiator of the air conditioner, the fin assembly is provided with a second clamping groove for accommodating the semiconductor cooling fin, and the cold end of the semiconductor cooling fin is attached to the cooling base.
Optionally, in the computer board radiator of the air conditioner, a heat-conducting adhesive is disposed on a bonding surface of the semiconductor heat sink.
Optionally, in the computer board radiator of the air conditioner, the switch is connected with an outdoor temperature sensor of the air conditioner, and the semiconductor radiating fin works when the switch is closed when the outdoor temperature sensor senses that the outdoor temperature exceeds a temperature preset value.
Optionally, in the computer board radiator of the air conditioner, the switch is a relay, and when the relay is attracted, the semiconductor radiating fin works.
Optionally, in the computer board radiator of the air conditioner, the semiconductor radiating fin is electrically connected with the computer board for supplying power.
Optionally, in the computer board radiator of the air conditioner, the fin assembly includes a mounting plate and a stacked aluminum fin mounted on the mounting plate, and the mounting plate is connected with the heat dissipation base.
The air conditioner comprises a computer board radiator and a computer board arranged on the computer board radiator, wherein the computer board radiator is any one of the computer board radiator.
In the above technical scheme, the computer board radiator of the air conditioner provided by the utility model comprises a radiating module and a semiconductor radiating assembly, wherein the radiating module comprises a radiating base and a fin assembly connected with the radiating base, and the radiating base is provided with an installation position for installing a computer board. The semiconductor heat dissipation assembly comprises a semiconductor heat dissipation sheet for dissipating heat of the computer board and a switch for controlling the work of the semiconductor heat dissipation sheet connected with the semiconductor heat dissipation sheet, and the semiconductor heat dissipation sheet is connected with the heat dissipation module.
According to the above description, in the computer board radiator of the air conditioner provided by the application, the radiating module is provided with the radiating base connected with the computer board, the semiconductor radiating fins are arranged, the semiconductor radiating fins work, the cooling capacity is conducted to the computer board through the radiating base, then the computer board is radiated in time, the radiating capacity of the computer board is increased, and the radiating effect of the computer board is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat sink for a computer board according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a heat sink for a computer board with another view angle according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a fin assembly according to an embodiment of the present utility model;
FIG. 4 is a schematic view of another view of a fin assembly according to an embodiment of the present utility model;
FIG. 5 is a side view of a fin assembly provided by an embodiment of the present utility model;
fig. 6 is a schematic structural diagram of a heat dissipation base according to an embodiment of the present utility model;
fig. 7 is a schematic structural diagram of another view-angle heat dissipation base according to an embodiment of the present utility model;
fig. 8 is a side view of a heat dissipation base according to an embodiment of the present utility model.
Wherein in fig. 1-8:
1. a fin assembly; 1-1, mounting plates; 1-2, stacked aluminum fins; 1-3, a second clamping groove; 1-4, baffle plates;
2. a heat dissipation base; 2-1, mounting position; 2-2, mounting holes;
3. a semiconductor heat sink.
Detailed Description
The core of the utility model is to provide a computer board radiator of an air conditioner so as to improve the radiating effect of a computer board. Another core of the present utility model is to provide an air conditioner including the above-mentioned computer board radiator.
The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not limiting of the application. The described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It should be noted that, for convenience of description, only a portion related to the related application is shown in the drawings. Embodiments and features of embodiments in this application may be combined with each other without conflict.
It should be appreciated that "system," "apparatus," "unit" and/or "module" as used in this application is one method for distinguishing between different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the word can be replaced by other expressions.
As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not specific to the singular, but may include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.
Wherein, in the description of the embodiments of the present application, "/" means or is meant unless otherwise indicated, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present application, "plurality" means two or more than two.
The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
Flowcharts are used in this application to describe the operations performed by systems according to embodiments of the present application. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.
Please refer to fig. 1 to 8.
In a specific embodiment, the computer board radiator of the air conditioner provided by the embodiment of the utility model comprises a radiating module and a semiconductor radiating assembly, wherein the radiating module comprises a radiating base 2 and a fin assembly 1 connected with the radiating base 2. In order to improve the heat dissipation effect, the heat dissipation base 2 is preferably an aluminum base.
The heat dissipation base 2 is provided with a mounting position 2-1 for mounting a computer board. Specifically, according to the distribution of the power elements on the computer board, the mounting holes 2-2 are arranged on the heat dissipation base 2, the computer board and the radiator of the computer board are fixed together by using fasteners, specifically, the fasteners can be threaded fasteners or buckles, and further, the threaded fasteners can be screws or bolts, and the like.
In order to improve the heat dissipation effect, it is preferable to apply a heat-conducting adhesive to the contact position between the power element and the heat dissipation base 2, so that the contact between the power element and the heat dissipation base is better.
The semiconductor heat dissipation assembly comprises a semiconductor heat dissipation sheet 3 for dissipating heat of a computer board, a switch for controlling the operation of the semiconductor heat dissipation sheet 3 connected with the semiconductor heat dissipation sheet 3, and a heat dissipation module connected with the semiconductor heat dissipation sheet 3. Specifically, a groove for mounting the semiconductor heat sink 3 is formed between the heat dissipation base 2 and the fin assembly 1. The heat dissipation base 2 may have a hole structure for mounting the semiconductor heat sink 3 at one end thereof close to the fin assembly 1. The semiconductor heat sink 3 is inserted into the cavity structure.
The semiconductor heat sink 3 may be one or at least two, and its specific mounting position depends on the position of the power device of the computer board, preferably, is close to the power device.
In order to improve the heat dissipation effect, it is preferable that the bonding surface of the semiconductor heat sink 3 is provided with a heat conductive adhesive, that is, a heat dissipation adhesive is provided between the semiconductor heat sink 3 and the heat dissipation base 2, and a heat dissipation adhesive is provided between the semiconductor heat sink 3 and the fin assembly 1.
As can be seen from the above description, in the computer board radiator of the air conditioner provided in the embodiments of the present application, the heat dissipation module is provided with the heat dissipation base 2 connected with the computer board, the semiconductor heat dissipation fins 3 are provided, the heat dissipation base 2 is used to conduct the cooling capacity to the computer board through the work of the semiconductor heat dissipation fins 3, so as to timely dissipate the heat of the computer board, the heat dissipation capacity of the computer board is increased, and the refrigerating effect of the air conditioner is improved. The heat dissipation capacity of the electric control power element on the computer board is improved, and the high-temperature refrigeration effect is further improved.
In a specific embodiment, the heat dissipation base 2 is provided with a first clamping groove for accommodating the semiconductor heat dissipation plate 3, and the hot end of the semiconductor heat dissipation plate 3 is attached to the fin assembly 1. In another heat dissipation mode, the fin assembly 1 is provided with a second clamping groove 1-3 for accommodating the semiconductor heat sink 3, and the cold end of the semiconductor heat sink 3 is attached to the heat dissipation base 2. Preferably, the cold end of the semiconductor is attached to the heat dissipation base 2, and the hot end of the semiconductor is attached to the fin assembly 1.
During specific assembly, holes or grooves are formed in the heat dissipation base 2 or the fin component 1, the surfaces of the semiconductor heat dissipation fins 3 are coated with heat conducting glue and then are filled into the holes or grooves, the holes or grooves are sealed after being filled, and the fin component 1 is mounted on the heat dissipation base 2; the position of the semiconductor radiating fin 3 is between the fin assembly 1 and the radiating base 2, and the specific installation position 2-1 is determined by referring to the position of a high-power element of an air conditioner computer board matched with the semiconductor radiating fin.
Specifically, the switch may be manually controlled by a user. Preferably, the switch is connected to an outdoor temperature sensor of the air conditioner, and the semiconductor fin 3 operates when the switch is turned off when the outdoor temperature sensor senses that the outdoor temperature exceeds a temperature preset value.
More preferably, the switch is a relay and the semiconductor heat sink 3 operates when the relay is attracted.
In a specific embodiment, a wire of the semiconductor radiating fin 3 is connected to a computer board of an air conditioner, when an outdoor environment temperature sensor of the air conditioner detects that the outdoor temperature is lower than T1 (a temporary 43 ℃), the semiconductor radiating fin 3 does not work, and a radiator of the computer board radiates heat by air cooling only through an outdoor fan of the air conditioner; when the outdoor environment temperature sensor of the air conditioner detects that the outdoor temperature is higher than T1 (the temperature is temporarily 43 ℃), the computer board supplies power to the semiconductor radiating fins 3 while cooling by the air, the semiconductor radiating fins 3 start to cool and radiate the power element, the radiating efficiency of the power element at high temperature is improved, the refrigerating effect of the air conditioner is not reduced, and the refrigerating effect of the air conditioner in the outdoor high-temperature environment is improved.
Based on the above aspects, it is preferable that the fin assembly 1 includes a mounting plate 1-1 and a stacked aluminum fin 1-2 mounted on the mounting plate 1-1, the mounting plate 1-1 being connected with the heat dissipation base 2. Specifically, the size and the spacing of the stacked aluminum fins 1-2 are determined according to actual needs, wherein one end of the stacked aluminum fins 1-2 away from the mounting plate 1-1 can be fixed by the baffle plate 1-4, and an air channel is formed between the baffle plate 1-4, the stacked aluminum fins 1-2 and the mounting plate 1-1.
The air conditioner comprises a computer board radiator and a computer board arranged on the computer board radiator, wherein the computer board radiator is any one of the computer board radiators. The foregoing describes a specific structure of a computer board radiator, and the application includes the computer board radiator, which also has the technical effects described above.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. Computer board radiator of air conditioner, its characterized in that includes:
the heat dissipation module comprises a heat dissipation base (2) and a fin assembly (1) connected with the heat dissipation base (2), wherein the heat dissipation base (2) is provided with a mounting position (2-1) for mounting a computer board;
the semiconductor heat dissipation assembly comprises a semiconductor heat dissipation sheet (3) for dissipating heat of a computer board and a switch for controlling the semiconductor heat dissipation sheet (3) to work, wherein the semiconductor heat dissipation sheet (3) is connected with the heat dissipation module.
2. The computer board radiator of the air conditioner according to claim 1, wherein the heat dissipation base (2) is provided with a first clamping groove for accommodating the semiconductor heat dissipation sheet (3), and the hot end of the semiconductor heat dissipation sheet (3) is attached to the fin assembly (1).
3. The computer board radiator of an air conditioner according to claim 1, wherein the cold end of the semiconductor is attached to the heat dissipation base (2), and the hot end of the semiconductor is attached to the fin assembly (1).
4. The computer board radiator of the air conditioner according to claim 1, wherein the fin assembly (1) is provided with a second clamping groove (1-3) for accommodating the semiconductor cooling fin (3), and the cold end of the semiconductor cooling fin (3) is attached to the cooling base (2).
5. The computer board radiator of the air conditioner according to claim 1, wherein the bonding surface of the semiconductor radiating fin (3) is provided with heat conducting glue.
6. The computer board radiator of an air conditioner according to claim 1, wherein the switch is connected with an outdoor temperature sensor of the air conditioner, and the semiconductor heat sink (3) operates when the switch is turned off when the outdoor temperature sensor senses that the outdoor temperature exceeds a temperature preset value.
7. The computer board radiator of an air conditioner according to claim 1, characterized in that the switch is a relay, and the semiconductor heat sink (3) operates when the relay is suctioned.
8. The computer board radiator of an air conditioner according to claim 1, characterized in that the semiconductor heat sink (3) is electrically connected to the computer board for supplying power.
9. The computer board radiator of an air conditioner according to any one of claims 1 to 8, wherein the fin assembly (1) includes a mounting plate (1-1) and a stacked aluminum fin (1-2) mounted on the mounting plate (1-1), the mounting plate (1-1) being connected with the heat dissipation base (2).
10. An air conditioner comprising a computer board radiator and a computer board mounted on the computer board radiator, wherein the computer board radiator is the computer board radiator according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222788549.4U CN219372911U (en) | 2022-10-21 | 2022-10-21 | Air conditioner and computer board radiator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222788549.4U CN219372911U (en) | 2022-10-21 | 2022-10-21 | Air conditioner and computer board radiator thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219372911U true CN219372911U (en) | 2023-07-18 |
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ID=87151461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222788549.4U Active CN219372911U (en) | 2022-10-21 | 2022-10-21 | Air conditioner and computer board radiator thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219372911U (en) |
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2022
- 2022-10-21 CN CN202222788549.4U patent/CN219372911U/en active Active
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