CN209726452U - Air conditioner - Google Patents
Air conditioner Download PDFInfo
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- CN209726452U CN209726452U CN201920419918.8U CN201920419918U CN209726452U CN 209726452 U CN209726452 U CN 209726452U CN 201920419918 U CN201920419918 U CN 201920419918U CN 209726452 U CN209726452 U CN 209726452U
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- heat pipe
- substrate
- heat
- radiator structure
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Abstract
The utility model provides a kind of air conditioner, comprising: electric cabinet, electric cabinet include shell and be arranged in the intracorporal electrical component of shell；Radiator, radiator include heat pipe and radiator structure, and heat pipe is connected with radiator structure, and radiator structure is connected with shell or electrical component, and radiator structure can absorb the heat generated when electrical component work and be distributed heat by heat pipe.Air conditioner provided by the utility model, radiator structure can absorb the heat generated when electrical component work, and then the heat pipe by being connected with radiator structure distributes heat, improves the heat dissipation effect of electric cabinet, and then temperature when electrical component work is reduced, promote the performance of air conditioner.
Description
Technical field
The utility model relates to fields of home appliance technology, in particular to a kind of air conditioner.
Background technique
Currently, heat pump air conditioning system in the related technology, with the increase of power termination, the fever of automatically controlled core component
Amount increases therewith, and the heating element Relatively centralized that air conditioner is automatically controlled, such as the compressor horsepower mould as main heater element
The calorific value of block can increase with the increase of compressor frequency.At higher ambient temperatures, in the related technology it is air-cooled dissipate
Heat is often not enough to take away this partial heat well, and the temperature of the automatically controlled component of air conditioner is caused constantly to rise, and is more than normal
Range of operation will be unfavorable for the efficient operation of component, or even will cause component damage.
Utility model content
The utility model aims to solve at least one of technical problems existing in the prior art or related technologies.
For this purpose, on the one hand the utility model provides a kind of air conditioner.
In view of this, on the one hand the utility model proposes a kind of air conditioner, comprising: electric cabinet, electric cabinet include shell
With setting in the intracorporal electrical component of shell；Radiator, radiator include heat pipe and radiator structure, heat pipe and radiator structure phase
Connection, radiator structure are connected with shell or electrical component, and radiator structure can absorb the heat generated when electrical component work
And heat is distributed by heat pipe.
Air conditioner provided by the utility model, including electric cabinet and radiator, radiator are used for in electric cabinet
Electrical component radiates, and radiator includes heat pipe and radiator structure, and heat pipe is connected with radiator structure, radiator structure and electricity
The shell or electrical component for controlling case are connected, and radiator structure can absorb the heat generated when electrical component work, and then pass through
The heat pipe being connected with radiator structure distributes heat, improves the heat dissipation effect of electric cabinet, and then reduce electrical component work
Temperature when making promotes the performance of air conditioner.Wherein, radiator structure can be attached on shell, and specifically, radiator structure depends on
On the higher surface of case temperature, certainly, radiator structure also be can be set on electrical component, that is, radiator structure can
It absorbs the heat generated when electrical component work and is distributed by heat pipe.
According to above-mentioned air conditioner provided by the utility model, there can also be following additional technical feature:
In the above-mentioned technical solutions, it is preferable that radiator structure includes: substrate, and heat pipe is connected with substrate.
In the technical scheme, radiator structure includes substrate, and heat pipe is connected with substrate, and substrate absorbs electrical component work
When the heat that generates, and the heat pipe by being connected with substrate distributes heat, so that electrical component when air conditioner is run
The heat distributed quickly conducts.
In any of the above-described technical solution, it is preferable that radiator structure further include: fin plate is connected with substrate, heat pipe with
Fin plate is connected；Wherein, fin is provided on fin plate, heat pipe is between fin plate and substrate.
In the technical scheme, radiator structure further includes fin plate, and fin plate is connected with substrate, and heat pipe is located at fin plate
Between substrate namely the joint of fin plate and substrate is arranged in heat pipe, and substrate absorbs the heat that electrical component generates, and utilizes
The quick conductive of heat pipe, equal temperature function, the heat that will focus on substrate certain point quickly diffuse to entire substrate, by heat pipe with
The contact of substrate, fin plate transfers heat on fin plate, then is dissipated heat by the fin on fin plate and fin plate
It sends out.
Further, there are the slots being embedded in for heat pipe for fin plate one side, use fin or other equivalent sides on one side
Formula expands heat dissipation area, strengthens wind-cooling heat dissipating effect.
In any of the above-described technical solution, it is preferable that substrate is connected with fin plate by connector.
In the technical scheme, substrate is connected with fin plate by connector, and then increases the flexibility of radiator structure,
Substrate and fin plate can be fitted together according to actual needs to improve the heat dissipation effect of radiator structure, it can also be in practical application
Substrate and fin plate are dismantled when narrow space, to reduce overall volume, are easily installed.
Specifically, heat pipe is arranged between substrate and fin plate, and the connection type of substrate and fin plate pressing heat pipe can be with
But it is not limited to connect using screw, can also be and be bolted.
In any of the above-described technical solution, it is preferable that substrate and fin plate are welded as a whole formula structure.
In the technical scheme, substrate and fin plate are welded as a whole formula structure, and then improve substrate and fin plate
Bonding strength, meanwhile, substrate and fin plate are an integral structure, so that the thermal conduction effect between substrate and fin plate is more preferable.
In any of the above-described technical solution, it is preferable that substrate is connect with fin plate gluing.
In the technical scheme, substrate and fin plate are sticked together by gluing, are improved and are connected between substrate and fin plate
The reliability connect.
In any of the above-described technical solution, it is preferable that radiator structure is fin heat sink, and heat pipe is connected with fin heat sink
It connects.
In the technical scheme, radiator structure is fin heat sink namely fin heat sink and shell or electrical component phase
Connection, for absorbing the heat generated when electrical component work, heat pipe is connected with fin heat sink, and further, fin dissipates
Hot plate is arranged on shell on the higher surface of temperature or fin heat sink is directly connected with electrical component, and heat pipe is embedded in wing
In piece heat sink, the heat that fin heat sink absorbs is diffused rapidly to entire fin heat sink, and then increase heat dissipation area
To improve heat dissipation effect.
Further, heat pipe is arranged in the edge of fin heat sink, heat pipe and fin heat sink simultaneously with it is warm on shell
Spend that higher surface is in contact or heat pipe and fin heat sink are in contact with the electrical component to generate heat when work simultaneously.
In any of the above-described technical solution, it is preferable that radiator structure corresponds to electrical component setting, and heat pipe is embedded in heat dissipation
In structure；Wherein, the quantity of heat pipe is at least one, and the quantity of radiator is at least one.
In the technical scheme, radiator structure corresponds to electrical component setting, and heat pipe is embedded in radiator structure, Ye Jire
Pipe is completely embedded in radiator structure, and then improves heat pipe to the distributing of heat, diffusion effect.Wherein, the quantity of heat pipe is at least
Be one, can it is big in calorific value, heat pipe is arranged to multiple heat are arranged on a multiple namely radiator structure when radiating requirements are big
Pipe, and then the radiating rate of radiator is improved, the quantity of radiator is at least one, when the quantity of radiator is multiple
When, multiple radiators correspond to electrical component setting, and then rapidly can transfer out the heat that electrical component generates to come, drop
Temperature when low electrical component works, and then improve the service life of electrical component and the overall performance of air conditioner.Specifically, one
A radiator includes a radiator structure and at least one heat pipe.
In any of the above-described technical solution, it is preferable that the quantity at least two of radiator structure, at least two radiator structures
In one be correspondingly arranged with electrical component, another is arranged far from electrical component, the evaporator section of heat pipe and corresponding electrical component
Radiator structure be connected, the condensation segment of heat pipe is connected with far from the radiator structure of electrical component；Wherein, corresponding electrical component
Radiator structure be connected with shell or electrical component, be connected with the shell far from the radiator structure of electrical component.
In the technical scheme, the quantity at least two of radiator structure, one at least two radiator structures with electricity
Gas element is correspondingly arranged, and to absorb the heat generated when electrical component work, another is arranged far from electrical component, the steaming of heat pipe
Hair section is connected with the radiator structure of corresponding electrical component, to absorb the heat of radiator structure and conduct to the condensation segment with heat pipe
In another radiator structure being connected, heat is distributed by the radiator structure being connected with condensation segment, increases heat dissipation
Area improves the heat dissipation effect of radiator.
Further, the position without automatically controlled mainboard arrangement or close air inlet is arranged in the radiator structure far from electrical component
The small position of equal calorific values.
Specifically, one end of heat pipe is embedded in the radiator structure that any of the above-described technical solution proposes, the other end of heat pipe
It is embedded in the radiator structure that another any of the above-described technical solution proposes, radiator can be set at least one and correspond to electrically
At least one radiator structure far from electrical component setting also can be set in the radiator structure of element setting.
In any of the above-described technical solution, it is preferable that be provided with mounting portion on radiator structure, heat pipe is arranged in mounting portion
It is interior；Wherein, mounting portion is mounting groove or mounting hole.
In the technical scheme, be provided with mounting portion on radiator structure, heat pipe is arranged in mounting portion, with improve heat pipe and
The bonding strength of radiator structure, further, mounting portion be mounting groove or mounting hole, further, mounting portion be groove or
Circular hole.
Further, mounting portion is separately positioned on substrate and fin plate namely mounting portion is arranged in substrate and fin plate
Junction, and then heat pipe is mounted between substrate and fin plate by mounting portion.
In any of the above-described technical solution, it is preferable that the inner wall of mounting portion and/or the outer wall of heat pipe are provided with heat-conducting layer.
In the technical scheme, it is provided with heat-conducting layer on the inner wall of mounting portion and/or the outer wall of heat pipe, to improve heat dissipation knot
The heat transfer effect of structure and heat pipe.
Specifically, heat-conducting layer is heat-conducting silicone grease.
In any of the above-described technical solution, it is preferable that substrate is aluminum substrate or copper substrate.
In the technical scheme, aluminium and copper have good thermal conductivity, set aluminum substrate or copper substrate for substrate,
The thermal conductivity of substrate is improved, and then improves the heat dissipation effect of substrate.
In any of the above-described technical solution, it is preferable that substrate is soaking plate.
In the technical scheme, soaking plate has good thermal uniformity and thermal conductivity, and then can be absorbed into electricity in substrate
After the heat generated when gas element manipulation, entire substrate is rapidly diffused to, to increase heat dissipation area, and then improves heat dissipation speed
Degree.
In any of the above-described technical solution, it is preferable that fin plate is aluminous fin plate or copper fin plate.
In the technical scheme, aluminium and copper have good thermal conductivity, and aluminous fin plate or copper wing is arranged in fin plate
Sheet, improves the thermal conductivity of fin plate, and then improves the heat dissipation effect of fin plate.
In any of the above-described technical solution, it is preferable that the axis of heat pipe and the plane parallel where substrate.
In the technical scheme, heat pipe is Straight, and the axis where heat pipe is parallel with substrate namely heat pipe being capable of water
It is flat to be embedded in substrate.
In any of the above-described technical solution, it is preferable that the axis of heat pipe and the plane where the substrate are perpendicular.
In the technical scheme, heat pipe is Straight, and the axis of heat pipe and substrate are perpendicular namely heat pipe can be vertical embedding
Enter in substrate.
In any of the above-described technical solution, it is preferable that the shape of heat pipe is U-shaped or L-type.
In the technical scheme, in order to adapt to different electric control structures, heat pipe can be made L-type or U-shaped or other are special-shaped
Structure is embedded in radiator structure.
The additional aspect and advantage of the utility model will become obviously in following description section, or practical new by this
The practice of type is recognized.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
The structural schematic diagram on electric cabinet is arranged in the radiator that Fig. 1 shows the utility model one embodiment；
Another structural representation on electric cabinet is set Fig. 2 shows the radiator of the utility model one embodiment
Figure；
Fig. 3 shows the structural schematic diagram of the radiator of the utility model one embodiment；
Fig. 4 shows another structural schematic diagram of the radiator of the utility model one embodiment；
Fig. 5 shows the another structural schematic diagram of the radiator of the utility model one embodiment；
Fig. 6 shows the another structural schematic diagram of the radiator of the utility model one embodiment；
Fig. 7 shows the another structural schematic diagram of the radiator of the utility model one embodiment；
The another structural representation on electric cabinet is arranged in the radiator that Fig. 8 shows the utility model one embodiment
Figure；
The another structural representation on electric cabinet is arranged in the radiator that Fig. 9 shows the utility model one embodiment
Figure.
Wherein, corresponding relationship of the Fig. 1 into Fig. 9 between appended drawing reference and component names are as follows:
1 electric cabinet, 2 heat pipes, 3 radiator structures, 30 substrates, 32 fin plates, 34 fin heat sinks, 4 screws.
Specific embodiment
In order to be more clearly understood that the above objects, features, and advantages of the utility model, with reference to the accompanying drawing and have
The utility model is further described in detail in body embodiment.It should be noted that in the absence of conflict, this Shen
The feature in embodiment and embodiment please can be combined with each other.
Many details are explained in the following description in order to fully understand the utility model, still, this is practical
Novel to be implemented using other than the one described here other modes, therefore, the protection scope of the utility model is simultaneously
It is not limited by the specific embodiments disclosed below.
The air conditioner according to the utility model some embodiments is described referring to Fig. 1 to Fig. 9.
One embodiment of first aspect according to the present utility model, the utility model proposes a kind of air conditioners, comprising:
Electric cabinet 1, electric cabinet 1 include shell and are arranged in the intracorporal electrical component of shell；Radiator, radiator include 2 He of heat pipe
Radiator structure 3, heat pipe 2 are connected with radiator structure 3, and radiator structure 3 is connected with shell or electrical component, 3 energy of radiator structure
It enough absorbs the heat generated when electrical component work and is distributed heat by heat pipe 2.
As depicted in figs. 1 and 2, air conditioner provided by the utility model, including electric cabinet 1 and radiator, radiator
For radiating to the electrical component in electric cabinet 1, radiator includes heat pipe 2 and radiator structure 3, and heat pipe 2 and heat dissipation are tied
Structure 3 is connected, and radiator structure 3 is connected with the shell of electric cabinet 1 or electrical component, and radiator structure 3 can absorb electrical component
The heat generated when work, and then the heat pipe 2 by being connected with radiator structure 3 distributes heat, improves electric cabinet 1
Heat dissipation effect, and then temperature when electrical component work is reduced, promote the performance of air conditioner.Wherein, radiator structure 3 can depend on
On shell, specifically, radiator structure 3 is attached on the higher surface of case temperature, that is, radiator structure 3 can absorb electricity
The heat that generates when gas element manipulation is simultaneously distributed by heat pipe 2.
In the above embodiment, it is preferable that radiator structure 3 includes: substrate 30, heat pipe 2 is connected with substrate 30.
In this embodiment, radiator structure 3 includes substrate 30, and heat pipe 2 is connected with substrate 30, and substrate 30 absorbs electrical member
The heat that part generates when working, and the heat pipe 2 by being connected with substrate 30 distributes heat, when so that air conditioner being run
The heat that electrical component distributes quickly conducts.
In any of the above-described embodiment, it is preferable that radiator structure 3 further include: fin plate 32 is connected with substrate 30, heat
Pipe 2 is connected with fin plate 32；Wherein, fin is provided on fin plate 32, heat pipe 2 is between fin plate 32 and substrate 30.
As shown in Figure 3 and Figure 4, in this embodiment, radiator structure 3 further includes fin plate 32, fin plate 32 and substrate 30
It is connected, heat pipe 2 is between fin plate 32 and substrate 30 namely the joint of fin plate 32 and substrate 30 is arranged in heat pipe 2,
Substrate 30 absorbs the heat that electrical component generates, and it is a certain to will focus on substrate 30 using the quick conductive of heat pipe 2, equal temperature function
The heat of point quickly diffuses to entire substrate 30, transfers heat to fin with the contact of substrate 30, fin plate 32 by heat pipe 2
On plate 32, then by the fin on fin plate 32 and fin plate 32 heat is distributed.
Further, there are the slots being embedded in for heat pipe 2 for 32 one side of fin plate, on one side using fin or other are equivalent
Mode expands heat dissipation area, strengthens wind-cooling heat dissipating effect.
Specifically, as shown in Figure 3 and Figure 4, heat pipe 2 can be horizontally or vertically embedded in substrate 30,30 surface of substrate with
Fin plate 32 is connected.Heat pipe 2 can be one or more, and specifically depending on automatically controlled radiating requirements, heat dissipation capacity demand is big
Then 2 quantity of heat pipe increases, and small 2 quantity of then heat pipe of radiating requirements is few.In addition heat pipe 2 as shown in Figure 3 and Figure 4 is vertical or water
Plug flat enters between substrate 30 and fin plate 32, and heat pipe 2 is straight pipe type, but simultaneously in order to adapt to different electric control structures, heat pipe 2
It can be made L-type, between U-shaped or other abnormally-structured insertion substrates 30 and fin plate 32.Fin plate 32 and substrate 30 press
The connection type of heat pipe 2 can be, but not limited to connect using screw 4, as shown in figure 5, reserving between fin plate 32 and substrate 30
Then good 4 hole location of screw is pressed together from drivescrew 4 below substrate 30 by substrate 30 and fin plate 32.Wherein 2 institute of heat pipe
Place position, which can also increase, applies the thermal conductive contact that the substances such as heat-conducting silicone grease strengthen heat pipe 2 and substrate 30, fin plate 32, and the embodiment is same
When can be convenient the replacement of heat pipe 2.Other connection types in addition can also be 32 gluing of substrate 30 and fin plate, weldering
It connects in succession.
In any of the above-described embodiment, it is preferable that substrate 30 is connected with fin plate 32 by connector.
In this embodiment, substrate 30 is connected with fin plate 32 by connector, and then increases the flexible of radiator structure 3
Property, can according to actual needs fit together substrate 30 and fin plate 32 to improve the heat dissipation effect of radiator structure 3, can also be
Substrate 30 and fin plate 32 are dismantled when practical application narrow space, to reduce overall volume, are easily installed.
In any of the above-described embodiment, it is preferable that substrate 30 and fin plate 32 are welded as a whole formula structure.
In this embodiment, substrate 30 and fin plate 32 are welded as a whole formula structure, and then improve substrate 30 and fin
The bonding strength of plate 32, meanwhile, substrate 30 and fin plate 32 are an integral structure, so that the heat between substrate 30 and fin plate 32
Conducting effect is more preferable.
In any of the above-described embodiment, it is preferable that substrate 30 is connect with 32 gluing of fin plate.
In this embodiment, substrate 30 is sticked together with fin plate 32 by gluing, improves substrate 30 and fin plate 32
Between the reliability that connects.
Specifically, as shown in figure 5, having reserved the hole location of screw 4 between fin plate 32 and substrate 30, then from substrate 30
Drivescrew 4 presses together substrate 30 and fin heat sink 34 below, the setting of heat pipe 2 substrate 30 and fin plate 32 it
Between, convenient for the replacement of heat pipe 2.Wherein, the connection type that substrate 30 and fin plate 32 press heat pipe 2 can be, but not limited to using spiral shell
4 connection of nail can also be substrate 30 and fin plate 32 are glued, are welded to connect etc..
In any of the above-described embodiment, it is preferable that radiator structure 3 is fin heat sink 34, heat pipe 2 and fin heat sink 34
It is connected.
As shown in Figure 6 and Figure 7, in this embodiment, radiator structure 3 is fin heat sink 34 namely fin heat sink 34
It is connected with shell or electrical component, for absorbing the heat generated when electrical component work, heat pipe 2 and 34 phase of fin heat sink
Connection, further, fin heat sink 34 be arranged on shell on the higher surface of temperature or fin heat sink 34 directly with electricity
Gas element is connected, and heat pipe 2 is embedded in fin heat sink 34, the heat that fin heat sink 34 absorbs is diffused rapidly to whole
A fin heat sink 34, and then increase heat dissipation area to improve heat dissipation effect.
Further, the edge of fin heat sink 34, heat pipe 2 and fin heat sink 34 while and shell is arranged in heat pipe 2
The higher surface of temperature is in contact on body or heat pipe 2 and fin heat sink 34 connect with the electrical component to generate heat when work simultaneously
Touching.
In any of the above-described embodiment, it is preferable that the corresponding electrical component setting of radiator structure 3, heat pipe 2 are embedded in heat dissipation
In structure 3；Wherein, the quantity of heat pipe 2 is at least one, and the quantity of radiator is at least one.
As shown in Figures 1 to 7, in this embodiment, the corresponding electrical component setting of radiator structure 3, heat pipe 2 is embedded in scattered
In heat structure 3 namely heat pipe 2 is embedded in completely in radiator structure 3, and then improves heat pipe 2 to the distributing of heat, diffusion effect.
Wherein, the quantity of heat pipe 2 is at least one, can it is big in calorific value, heat pipe 2 is arranged to multiple, Ye Jiyi when radiating requirements are big
Multiple heat pipes 2 are set on a radiator structure 3, as shown in Figure 2 and Figure 4, three heat pipes 2, Jin Erti are set on a radiator structure 3
The radiating rate of high radiator.Further, the quantity of radiator is at least one, when the quantity of radiator is multiple
When, multiple radiators correspond to electrical component setting, and then rapidly can transfer out the heat that electrical component generates to come, drop
Temperature when low electrical component works, and then improve the service life of electrical component and the overall performance of air conditioner.Specifically, In
In the embodiment, a radiator includes a radiator structure 3 and at least one heat pipe 2.
In any of the above-described embodiment, it is preferable that the quantity at least two of radiator structure 3, at least two radiator structures 3
In one be correspondingly arranged with electrical component, another is arranged far from electrical component, the evaporator section of heat pipe 2 and corresponding electrical component
Radiator structure 3 be connected, the condensation segment of heat pipe 2 is connected with far from the radiator structure 3 of electrical component；Wherein, corresponding electrical
The radiator structure 3 of element is connected with shell or electrical component, and the radiator structure 3 far from electrical component is connected with the shell.
As shown in Figure 8 and Figure 9, in this embodiment, the quantity at least two of radiator structure 3, at least two heat dissipation knots
One in structure 3 is correspondingly arranged with electrical component, and to absorb the heat generated when electrical component work, another is far from electrical member
Part setting, the evaporator section of heat pipe 2 is connected with the radiator structure 3 of corresponding electrical component, to absorb the heat and biography of radiator structure 3
It is directed in another radiator structure 3 being connected with the condensation segment of heat pipe 2, it will be hot by the radiator structure 3 being connected with condensation segment
Amount distributes, and increases heat dissipation area, improves the heat dissipation effect of radiator.
Further, the position without automatically controlled mainboard arrangement or close air inlet is arranged in the radiator structure 3 far from electrical component
The small positions of calorific values such as mouth.
Specifically, one end of heat pipe 2 is embedded in the radiator structure 3 that any of the above-described embodiment proposes, the other end of heat pipe 2
It is embedded in the radiator structure 3 that another any of the above-described embodiment proposes, for example, one end of heat pipe 2 is embedded in the composition of substrate 30
Any in the radiator structure 3 of radiator structure 3, the composition of fin heat sink 34 that radiator structure 3, substrate 30 and fin plate 32 are constituted
In a, the other end of heat pipe 2 is embedded in the radiator structure that the radiator structure 3, substrate 30 and fin plate 32 of the composition of substrate 30 are constituted
3, in any of radiator structure 3 that fin heat sink 34 is constituted.Radiator can be set at least one and correspond to electrically
At least one radiator structure 3 far from electrical component setting also can be set in the radiator structure 3 of element setting.Such as Fig. 8 institute
Show, radiator includes a heat pipe 2, two radiator structures 3, and the evaporator section of heat pipe 2 is embedded in corresponding electrical component setting
In radiator structure 3, the condensation segment of heat pipe 2 is embedded in another radiator structure 3 far from electrical component, is increased at heat source
Heat dissipation area improves the heat dissipation effect of electrical component.As shown in figure 9, radiator includes three radiator structures 3, two heat
Pipe 2, wherein the evaporator section of two heat pipes 2 is embedded in the radiator structure 3 of the same corresponding electrical component setting, two heat
The condensation segment of pipe 2 is respectively embedded into two radiator structures 3 far from electrical component setting, increases the heat dissipation area at heat source,
Improve the heat dissipation effect of electrical component.Wherein, substrate 30 is soaking plate.
Further, the evaporator section of heat pipe 2 and condensation segment are in the same wind field, and then are concentrated convenient for air conditioner
Heat dissipation.
In any of the above-described embodiment, it is preferable that be provided with mounting portion on radiator structure 3, heat pipe 2 is arranged in mounting portion
It is interior；Wherein, mounting portion is mounting groove or mounting hole.
As shown in Figure 3 and Figure 4, in this embodiment, mounting portion is provided on radiator structure 3, heat pipe 2 is arranged in mounting portion
It is interior, to improve the bonding strength of heat pipe 2 and radiator structure 3, further, mounting portion be mounting groove or mounting hole, further
Ground, mounting portion are groove or circular hole.
Further, mounting portion is separately positioned on substrate 30 and fin plate 32 namely mounting portion is arranged in 30 He of substrate
The junction of fin plate 32, and then heat pipe 2 is mounted between substrate 30 and fin plate 32 by mounting portion.
In any of the above-described embodiment, it is preferable that the inner wall of mounting portion and/or the outer wall of heat pipe 2 are provided with heat-conducting layer.
In this embodiment, it is provided with heat-conducting layer on the outer wall of the inner wall of mounting portion and/or heat pipe 2, to improve heat dissipation knot
The heat transfer effect of structure 3 and heat pipe 2.
Specifically, heat-conducting layer is heat-conducting silicone grease.
In any of the above-described embodiment, it is preferable that substrate 30 is aluminum substrate or copper substrate.
In this embodiment, aluminium and copper have good thermal conductivity, set aluminum substrate or copper substrate for substrate 30,
The thermal conductivity of substrate 30 is improved, and then improves the heat dissipation effect of substrate 30.
In any of the above-described embodiment, it is preferable that substrate 30 is soaking plate.
In this embodiment, soaking plate has good thermal uniformity and thermal conductivity, and then can be absorbed into electricity in substrate 30
After the heat generated when gas element manipulation, entire substrate 30 is rapidly diffused to, to increase heat dissipation area, and then improves heat dissipation speed
Degree.
In any of the above-described embodiment, it is preferable that fin plate 32 is aluminous fin plate or copper fin plate.
In this embodiment, aluminium and copper have good thermal conductivity, and aluminous fin plate or copper wing is arranged in fin plate 32
Sheet, improves the thermal conductivity of fin plate 32, and then improves the heat dissipation effect of fin plate 32.
In any of the above-described embodiment, it is preferable that the axis of heat pipe 2 and the plane parallel where substrate 30.
As shown in figures 1 and 3, in this embodiment, heat pipe 2 is Straight, and the axis where heat pipe 2 is equal with substrate 30
Capable namely heat pipe 2 can level be embedded in substrate 30.
In any of the above-described embodiment, it is preferable that the axis of heat pipe 2 and the plane where the substrate 30 are perpendicular.
As shown in Figure 2 and Figure 4, in this embodiment, heat pipe 2 is Straight, and the axis and substrate 30 of heat pipe 2 are perpendicular,
Namely heat pipe 2 can be vertically embedded into substrate 30.
In any of the above-described embodiment, it is preferable that the shape of heat pipe 2 is U-shaped or L-type.
In this embodiment, in order to adapt to different electric control structures, heat pipe 2 can be made L-type or U-shaped or other special-shaped knots
Structure is embedded in radiator structure 3.
In the present invention, term " multiple " then refers to two or more, unless otherwise restricted clearly.Term
" installation ", " connected ", " connection ", " fixation " etc. shall be understood in a broad sense, can also be with for example, " connection " may be a fixed connection
It is to be detachably connected, or be integrally connected；" connected " can be directly connected, can also be indirectly connected through an intermediary.It is right
For those skilled in the art, can understand as the case may be above-mentioned term in the present invention specifically contain
Justice.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least the one of the utility model
In a embodiment or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment
Or example.Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more embodiment or examples
In can be combined in any suitable manner.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of air conditioner characterized by comprising
Electric cabinet, the electric cabinet include shell and are arranged in the intracorporal electrical component of the shell；
Radiator, the radiator include heat pipe and radiator structure, and the heat pipe is connected with the radiator structure, described
Radiator structure is connected with the shell or the electrical component, when the radiator structure can absorb electrical component work
The heat of generation is simultaneously distributed heat by the heat pipe.
2. air conditioner according to claim 1, which is characterized in that the radiator structure includes:
Substrate, the heat pipe are connected with the substrate.
3. air conditioner according to claim 2, which is characterized in that the radiator structure further include:
Fin plate is connected with the substrate, and the heat pipe is connected with the fin plate；
Wherein, fin is provided on the fin plate, the heat pipe is between the fin plate and the substrate.
4. air conditioner according to claim 3, which is characterized in that
The substrate is connected with the fin plate by connector or the substrate and the fin plate are welded as a whole formula knot
Structure or the substrate are connect with the fin plate gluing.
5. air conditioner according to claim 1, which is characterized in that
The radiator structure is fin heat sink, and the heat pipe is connected with the fin heat sink.
6. air conditioner according to any one of claim 1 to 5, which is characterized in that
The radiator structure corresponds to the electrical component setting, and the heat pipe is embedded in the radiator structure；
Wherein, the quantity of the heat pipe is at least one, and the quantity of the radiator is at least one.
7. air conditioner according to any one of claim 1 to 5, which is characterized in that
The quantity at least two of the radiator structure, one at least two radiator structures with the electrical component pair
It should be arranged, another is arranged far from the electrical component, and the evaporator section of the heat pipe is dissipated with the described of the corresponding electrical component
Heat structure is connected, and the condensation segment of the heat pipe is connected with the radiator structure far from the electrical component；
Wherein, the radiator structure of the corresponding electrical component is connected with the shell or the electrical component, far from institute
The radiator structure for stating electrical component is connected with the shell.
8. air conditioner according to any one of claim 1 to 5, which is characterized in that
Mounting portion is provided on the radiator structure, the heat pipe is arranged in the mounting portion；
Wherein, the mounting portion is mounting groove or mounting hole.
9. air conditioner according to claim 8, which is characterized in that
The outer wall of the inner wall of the mounting portion and/or the heat pipe is provided with heat-conducting layer.
10. air conditioner according to claim 3 or 4, which is characterized in that
The substrate is aluminum substrate or copper substrate or the substrate is soaking plate；And/or
The fin plate is aluminous fin plate or copper fin plate；And/or
Plane parallel where the axis of the heat pipe and the substrate；Or
The axis of the heat pipe and the plane where the substrate are perpendicular；Or
The shape of the heat pipe is U-shaped or L-type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920419918.8U CN209726452U (en) | 2019-03-29 | 2019-03-29 | Air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920419918.8U CN209726452U (en) | 2019-03-29 | 2019-03-29 | Air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209726452U true CN209726452U (en) | 2019-12-03 |
Family
ID=68689479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920419918.8U Active CN209726452U (en) | 2019-03-29 | 2019-03-29 | Air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209726452U (en) |
-
2019
- 2019-03-29 CN CN201920419918.8U patent/CN209726452U/en active Active
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