CN216673674U - Automatically controlled board heat radiation structure and heat pump water heater - Google Patents
Automatically controlled board heat radiation structure and heat pump water heater Download PDFInfo
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- CN216673674U CN216673674U CN202123300381.XU CN202123300381U CN216673674U CN 216673674 U CN216673674 U CN 216673674U CN 202123300381 U CN202123300381 U CN 202123300381U CN 216673674 U CN216673674 U CN 216673674U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses an electric control board heat dissipation structure and a heat pump water heater, and relates to the technical field of heat pump water heaters, wherein the electric control board heat dissipation structure comprises an electric control board and a radiator arranged on the electric control board, and the radiator comprises: the heat dissipation base is provided with a first mounting groove; the radiating fin is arranged on the radiating base and provided with a second mounting groove, the shape of the second mounting groove is the same as that of the first mounting groove, and the first mounting groove and the second mounting groove are oppositely arranged and form a mounting cavity; the radiating pipe is used for communicating cooling water, is arranged in the mounting cavity and is provided with a water inlet and a water outlet; the electric control board comprises a PCB and a heating element arranged on the PCB, and the heating element is attached to the outer side surface of the heat dissipation base. The electric control board heat dissipation structure has the characteristics of simple structure and good heat dissipation effect.
Description
Technical Field
The utility model relates to the technical field of heat pump water heaters, in particular to an electric control plate heat dissipation structure and a heat pump water heater applying the same.
Background
The heat pump water heater is a high-efficiency heat energy lifting and transferring device working based on reverse Carnot cycle, and uses a small amount of electric energy as power, uses a refrigerant as a carrier, continuously absorbs low-grade heat energy in air, and converts the low-grade heat energy into usable high-grade heat energy.
The electric control board is used for controlling the start and stop of the heat pump water heater and heat exchange work, multiple heating devices such as IPM and PFC are arranged on the electric control board, and when the electric control board works, the voltage is high, the passing current is large, so that large heat can be generated, and if heat is not conducted in time, the temperature rise can be caused to be too high, and then elements are damaged.
The heat dissipation mode that adopts at present installs the fin additional to reach the heat conduction effect, nevertheless when service environment is more abominable and ambient temperature is higher, the heat conduction effect of fin is relatively poor, can't in time carry out the heat conduction, causes the device that generates heat and intensifies excessively, leads to the unable normal work of heat pump water heater.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an electric control board heat dissipation structure, and aims to provide an electric control board heat dissipation structure which is simple in structure and good in heat dissipation effect.
In order to achieve the above object, the present invention provides an electronic control board heat dissipation structure for dissipating heat of a heating element, the electronic control board heat dissipation structure includes an electronic control board and a heat sink disposed on the electronic control board, the heat sink includes:
the heat dissipation base is provided with a first mounting groove;
the radiating fin is arranged on the radiating base and provided with a second mounting groove, the shape of the second mounting groove is the same as that of the first mounting groove, and the first mounting groove and the second mounting groove are oppositely arranged and form a mounting cavity;
the radiating pipe is used for communicating cooling water, is arranged in the mounting cavity and is provided with a water inlet and a water outlet;
the electric control board comprises a PCB and a heating element arranged on the PCB, and the heating element is attached to the outer side surface of the heat dissipation base.
Optionally, the radiating pipe is in a U-shaped loop and surrounds, and the two ends of the radiating pipe are respectively the water inlet and the water outlet.
Optionally, both ends of the radiating pipe extend out from the same side of the radiator.
Optionally, the cooling tube is formed by pipe bending, first mounting groove with the second mounting groove is circular-arc recess, and with the surface laminating of cooling tube.
Optionally, the first mounting groove with realize the laminating through heat-conducting glue between the cooling tube, the second mounting groove with realize the laminating through heat-conducting glue between the cooling tube.
Optionally, the heating element and the heat dissipation base are attached to each other through a heat conducting adhesive.
Optionally, the opposite sides of the heating element are provided with connecting holes, the heat dissipation base is provided with threaded holes corresponding to the connecting holes, and the heating element is arranged on the heat dissipation base through a threaded fastener.
Optionally, the heat sink is provided to the PCB board by a threaded fastener.
Optionally, the heat dissipation base and the heat dissipation fins are made of aluminum alloy, and the heat dissipation tube is made of copper.
The utility model also provides a heat pump water heater, which is used for heat exchange of a swimming pool and comprises:
a housing;
according to the electric control board heat dissipation structure, the electric control board heat dissipation structure is arranged on the shell;
the condenser is arranged on the shell and provided with a water inlet pipe and a water outlet pipe, the water inlet pipe is communicated with the water inlet, and the water outlet pipe is communicated with the water outlet;
the compressor is arranged on the shell;
the evaporator is arranged on the shell;
the condenser, the compressor with the evaporimeter passes through the pipeline and communicates in proper order the condenser with still be equipped with throttling arrangement on the communicating pipeline of evaporimeter.
According to the technical scheme, the electric control board is provided with the radiator for heat dissipation, the radiator comprises a heat dissipation base, a heat dissipation sheet and a heat dissipation pipe, the heat dissipation pipe is communicated with external cooling water and is arranged between the heat dissipation base and the heat dissipation sheet, a heating element of the electric control board is attached to the heat dissipation base, heat generated during operation of the electric control board is taken away through the heat dissipation pipe and the heat dissipation sheet, heat dissipation is achieved through air, and the technical means that the heat dissipation effect is improved through the cooperation of air heat dissipation and water cooling heat dissipation is adopted, so that the technical problem that a heat pump water heater cannot normally work due to poor heat conduction effect of the heat dissipation sheet in the prior art is effectively solved, and the technical effects that the structure is simple and the heat dissipation effect is good are achieved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a heat dissipation structure of an electronic control board according to the present invention;
FIG. 2 is a schematic front view of the heat dissipation structure of the electric control board according to the present invention;
FIG. 3 is a schematic diagram of a disassembled structure of the heat dissipation structure of the electric control board according to the present invention;
FIG. 4 is a schematic view of the heat sink of the present invention;
the reference numbers indicate:
an electronic control board heat dissipation structure 100; an electric control board 10; a PCB board 11; a heating element 12; a heat sink 20; a heat dissipation base 21; a first mounting groove 211; a heat sink 22; a second mounting groove 221; a radiating pipe 23; a water inlet 231; and a water outlet 232.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides an electric control board heat dissipation structure 100 for heat dissipation of a heating element 12.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
In an embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the electrical control board heat dissipation structure 100 includes an electrical control board 10 and a heat sink 20 disposed on the electrical control board 10, the heat sink 20 includes a heat dissipation base 21, a heat dissipation fin 22 and a heat dissipation pipe 23, wherein the heat dissipation base 21 is provided with a first mounting groove 211; the radiating fin 22 is arranged on the radiating base 21, the radiating fin 22 is provided with a second mounting groove 221, the shape of the second mounting groove 221 is the same as that of the first mounting groove 211, and the first mounting groove 211 and the second mounting groove 221 are oppositely arranged and form a mounting cavity; the radiating pipe 23 is used for communicating cooling water, the radiating pipe 23 is arranged in the installation cavity, and the radiating pipe 23 is provided with a water inlet 231 and a water outlet 232; the electric control board 10 comprises a PCB 11 and a heating element 12 arranged on the PCB 11, wherein the heating element 12 is attached to the outer side surface of the heat dissipation base 21.
It can be understood that, the installation cavity formed by the first installation groove 211 and the second installation groove 221 is adapted to the external shape of the heat dissipation tube 23, the heat dissipation tube 23 is located between the heat dissipation base 21 and the heat dissipation fin 22, on the one hand, the heat of the heat generation element 12 can be taken away, on the other hand, the heat conduction of the heat dissipation fin 22 can be also assisted, the heat dissipation effect is improved, the heat dissipation tube 23 is communicated with cooling water, heat dissipation is performed in a water cooling mode, the heat dissipation fin 22 is provided with a plurality of fins at intervals, the contact area between the heat dissipation fin and air is increased to realize the heat dissipation effect, the two cooperate together, and the heat generated by the heat generation element 12 is taken away at any time. The heat pump water heater is used for heating swimming pool water, and the cooling water that cooling tube 23 communicates can be swimming pool water, and swimming pool water also heats itself when carrying out the heat dissipation to heating element 12 through cooling tube 23 promptly, can improve the heating efficiency of swimming pool water.
According to the technical scheme, the radiator 20 for radiating heat is arranged on the electric control board 10, the radiator 20 comprises a radiating base 21, a radiating fin 22 and a radiating pipe 23, the radiating pipe 23 is communicated with external cooling water and is arranged between the radiating base 21 and the radiating fin 22, the heating element 12 of the electric control board 10 is attached to the radiating base 21, heat generated during operation of the electric control board 10 is taken away through the radiating pipe 23 and the radiating fin 22, and not only is the heat radiated through air, but also the technical means that the radiating effect is improved by the cooperation of air radiating and water cooling radiating is adopted, so that the technical problem that the heat pump water heater cannot normally operate due to poor heat conduction effect of the radiating fin 22 in the prior art is effectively solved, and the technical effects of simple structure and good radiating effect are further achieved.
In the embodiment of the present invention, as shown in fig. 3 and 4, the heat dissipation pipe 23 is disposed around the heat dissipation pipe 23 in a U-shape, and the two ends of the heat dissipation pipe 23 are respectively provided with the water inlet 231 and the water outlet 232. The length of the heat pipe 23 is increased by the loop, so that the contact area between the heat pipe 23 and the heat dissipation base 21 or the heat dissipation fins 22 is increased, and the heat dissipation effect is improved.
In the embodiment of the present invention, as shown in fig. 3 and 4, both ends of the radiating pipe 23 protrude from the same side of the radiator 20. The heat dissipation base 21 and the heat dissipation fins 22 are connected through threaded fasteners, the outer side face of the heat dissipation base 21 is flush with the outer side face of the heat dissipation fins 22, and two ends of the heat dissipation pipe 23 extend out of the same side face to conveniently communicate with external cooling water.
In the embodiment of the present invention, as shown in fig. 3 and 4, the heat pipe 23 is formed by bending a circular pipe, and the first mounting groove 211 and the second mounting groove 221 are both arc-shaped grooves and are attached to the outer surface of the heat pipe 23. The assembly sequence of the heat sink 20 may be that the heat pipe 23 is first placed on the first mounting groove 211 of the heat dissipation base 21, and the second mounting groove 221 of the heat sink 22 faces the heat pipe 23 and is aligned with the heat pipe 23, or the heat pipe 23 is first placed on the second mounting groove 221 of the heat sink 22, and the first mounting groove 211 of the heat dissipation base 21 faces the heat pipe 23 and is aligned with the heat pipe 23, and the heat sink 22 is connected with the heat dissipation base 21 through a threaded fastener, so that the heat pipe 23 is fixed in the mounting cavity formed by the first mounting groove 211 and the second mounting groove 221, thereby realizing the assembly of the heat sink 20.
In the embodiment of the present invention, the first mounting groove 211 is attached to the heat dissipating pipe 23 by a heat conductive adhesive, and the second mounting groove 221 is attached to the heat dissipating pipe 23 by a heat conductive adhesive. The heat-conducting glue has the functions of bonding and increasing the heat-conducting effect.
In the embodiment of the present invention, the heat generating component 12 and the heat dissipating base 21 are bonded by a heat conductive adhesive. The heat-conducting glue has the functions of bonding and increasing the heat-conducting effect.
In the embodiment of the present invention, the opposite sides of the heating element 12 are provided with connection holes, the heat dissipation base 21 is provided with threaded holes corresponding to the connection holes, and the heating element 12 is disposed on the heat dissipation base 21 through threaded fasteners. The structural stability is improved through the connection of the threaded fasteners, the heating element 12 is prevented from falling off from the heat dissipation base 21, and the heat dissipation effect is guaranteed.
In the embodiment of the present invention, the heat sink 20 is provided to the PCB board 11 by a screw fastener. During assembly, the heating element 12 is bonded on the heat dissipation base 21 through the heat conducting glue, and is further fixed through the threaded fastener, the radiator 20 is arranged on the PCB 11 through the threaded fastener, and finally the pin of the heating element 12 is welded on the PCB 11, so that the assembly of the electric control board 10 and the radiator 20 is completed.
In the embodiment of the present invention, the material of the heat dissipation base 21 and the heat dissipation fins 22 is aluminum alloy, and the material of the heat dissipation pipe 23 is copper. The aluminum alloy is used as the material of the heat dissipation base 21 and the heat dissipation fins 22, which has the characteristics of light weight and good heat dissipation performance, and the copper pipe is used as the heat dissipation pipe 23, which also has good heat conduction effect.
The present invention further provides a heat pump water heater (not shown in the figures), which includes a housing, an electric control board heat dissipation structure 100, a condenser, a compressor and an evaporator, wherein the specific structure of the electric control board heat dissipation structure 100 refers to the above embodiments, and the heat pump water heater adopts all the technical solutions of all the above embodiments, so that the heat pump water heater at least has all the beneficial effects brought by the technical solutions of the above embodiments, and further description is omitted here. Wherein, the heat dissipation structure 100 of the electric control board is arranged on the shell; the condenser is arranged on the shell and is provided with a water inlet pipe and a water outlet pipe, the water inlet pipe is communicated with the water inlet 231, and the water outlet pipe is communicated with the water outlet 232; the compressor is arranged on the shell; the evaporator is arranged in the shell; the condenser, the compressor and the evaporator are sequentially communicated through a pipeline, and a throttling device is further arranged on a communicating pipeline of the condenser and the evaporator.
In the present invention, the radiator 20 is connected to the condenser, so that the heat exchange of the water in the swimming pool is realized, and the heat dissipation of the heating element 12 of the electric control board 10 can be performed, so as to ensure the normal operation of the heat pump water heater in a high environment, and at the same time, the water flowing out from the heat dissipation pipe 23 returns to the swimming pool again, so as to improve the heat exchange efficiency of the swimming pool.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides an automatically controlled board heat radiation structure for heating element's heat dissipation, its characterized in that, automatically controlled board heat radiation structure includes automatically controlled board and locates the radiator of automatically controlled board, the radiator includes:
the heat dissipation base is provided with a first mounting groove;
the radiating fin is arranged on the radiating base and provided with a second mounting groove, the shape of the second mounting groove is the same as that of the first mounting groove, and the first mounting groove and the second mounting groove are oppositely arranged and form a mounting cavity;
the radiating pipe is used for communicating cooling water, is arranged in the mounting cavity and is provided with a water inlet and a water outlet;
the electric control board comprises a PCB and a heating element arranged on the PCB, and the heating element is attached to the outer side surface of the heat dissipation base.
2. The heat dissipating structure of claim 1, wherein said heat dissipating pipe is looped in a U shape, and said water inlet and said water outlet are respectively formed at two ends of said heat dissipating pipe.
3. The heat dissipating structure of an electronic control board as claimed in claim 2, wherein both ends of said heat dissipating pipe protrude from the same side of said heat sink.
4. The heat dissipating structure of an electronic control board as claimed in claim 2, wherein the heat dissipating pipe is formed by bending a circular pipe, and the first mounting groove and the second mounting groove are both arc-shaped grooves and are attached to the outer surface of the heat dissipating pipe.
5. The heat dissipating structure of an electronic control board as claimed in claim 4, wherein the first mounting groove is attached to the heat dissipating pipe by a heat conductive adhesive, and the second mounting groove is attached to the heat dissipating pipe by a heat conductive adhesive.
6. The heat dissipation structure of claim 1, wherein the heat generating element is attached to the heat dissipation base by a thermally conductive adhesive.
7. The electronic control board heat dissipation structure of claim 6, wherein the heat dissipation base has connection holes at opposite sides thereof, the heat dissipation base has screw holes corresponding to the connection holes, and the heat dissipation element is mounted on the heat dissipation base by means of screw fasteners.
8. An electronic control board heat dissipation structure as defined in claim 1, wherein the heat sink is attached to the PCB board by a threaded fastener.
9. The electronic control board heat dissipating structure of claim 1, wherein the heat dissipating base and the heat dissipating fins are made of aluminum alloy, and the heat dissipating pipe is made of copper.
10. A heat pump water heater for heat exchange of a swimming pool is characterized by comprising:
a housing;
an electronic control board heat dissipation structure as defined in any one of claims 1 to 9, the electronic control board heat dissipation structure being provided in the housing;
the condenser is arranged on the shell and provided with a water inlet pipe and a water outlet pipe, the water inlet pipe is communicated with the water inlet, and the water outlet pipe is communicated with the water outlet;
the compressor is arranged on the shell;
the evaporator is arranged on the shell;
the condenser, the compressor with the evaporimeter passes through the pipeline and communicates in proper order the condenser with still be equipped with throttling arrangement on the communicating pipeline of evaporimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123300381.XU CN216673674U (en) | 2021-12-23 | 2021-12-23 | Automatically controlled board heat radiation structure and heat pump water heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123300381.XU CN216673674U (en) | 2021-12-23 | 2021-12-23 | Automatically controlled board heat radiation structure and heat pump water heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216673674U true CN216673674U (en) | 2022-06-03 |
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ID=81799117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123300381.XU Active CN216673674U (en) | 2021-12-23 | 2021-12-23 | Automatically controlled board heat radiation structure and heat pump water heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216673674U (en) |
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2021
- 2021-12-23 CN CN202123300381.XU patent/CN216673674U/en active Active
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