CN210463746U - Semiconductor refrigeration constant temperature water tank - Google Patents

Semiconductor refrigeration constant temperature water tank Download PDF

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Publication number
CN210463746U
CN210463746U CN201920553560.8U CN201920553560U CN210463746U CN 210463746 U CN210463746 U CN 210463746U CN 201920553560 U CN201920553560 U CN 201920553560U CN 210463746 U CN210463746 U CN 210463746U
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China
Prior art keywords
water tank
semiconductor refrigeration
heat
semiconductor
heat radiation
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CN201920553560.8U
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Chinese (zh)
Inventor
江再宽
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Suzhou Aode high end equipment Co.,Ltd.
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Suzhou Aode Machinery Co ltd
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Abstract

The utility model discloses a semiconductor refrigeration constant temperature water tank, it includes the water tank box that is formed by the preparation of metal material, encircles attached a plurality of semiconductor refrigeration pieces on the water tank box outer wall surface, set up semiconductor refrigeration piece generate heat a side first heat radiation structure on the surface, set up cooling fan, setting on the first heat radiation structure are in water tank box inner wall second heat radiation structure on the surface, right water in the water tank box stirs the circulating pump of inner loop. The utility model discloses simple structure, the reliability is high, and refrigeration effect is good, and the noise is low.

Description

Semiconductor refrigeration constant temperature water tank
Technical Field
The utility model belongs to the technical field of the temperature control, especially, relate to a semiconductor refrigeration constant temperature water tank.
Background
Constant temperature water tank is generally used in life or technology needs occasion, and the technique generally adopts vapor compression formula refrigeration principle to control the water tank temperature at present, can obtain the water tank temperature that is lower than ambient temperature. The technology has the characteristics of more parts, relatively complex system, relatively inconvenient operation and maintenance and the like; and the constant temperature can be realized only by consuming more electric energy.
Therefore, it is necessary to provide a new semiconductor refrigeration thermostatic water tank to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a semiconductor refrigeration constant temperature water tank, simple structure, the reliability is high, and refrigeration effect is good, and the noise is low.
The utility model discloses a following technical scheme realizes above-mentioned purpose: the utility model provides a semiconductor refrigeration constant temperature water tank, its include by the water tank box that the metal material preparation formed, encircle attached a plurality of semiconductor refrigeration pieces on the water tank box outer wall surface, set up semiconductor refrigeration piece generate heat a side on the surface first heat radiation structure, set up last cooling fan, the setting of first heat radiation structure are in water tank box inner wall on the surface second heat radiation structure, right water in the water tank box stirs the circulating pump of inner loop.
Furthermore, the heat absorption surface of the semiconductor refrigeration sheet is attached to the outer surface of the water tank body, heat conduction is carried out by utilizing the metal outer wall of the water tank, and refrigeration and temperature control are carried out on water in the water tank.
Further, the semiconductor refrigeration chip adopts a DC12V power supply to realize direct current input.
Furthermore, the first heat dissipation structure comprises a bonding connection part bonded with the surface of the semiconductor refrigeration sheet, and a plurality of heat dissipation fins which extend outwards from the bonding connection part and are distributed in a stacked mode at intervals from top to bottom.
Further, the heat radiation fan is arranged on the heat radiation fin.
Furthermore, the second heat dissipation structure comprises a plurality of heat dissipation fins which are vertically distributed in a stacked manner at intervals.
Furthermore, one end of the circulating pump is communicated with the bottom of the water tank body through a first pipeline, and the other end of the circulating pump is communicated with the upper part of the water tank body through a second pipeline to form a circulating loop.
Furthermore, the semiconductor refrigeration piece forms a semiconductor refrigeration piece array on the outer surface of the water tank body, and heat-conducting silicone grease is coated between the array and the outer wall surface of the water tank body.
Compared with the prior art, the utility model relates to a semiconductor refrigeration constant temperature water tank's beneficial effect lies in: the semiconductor refrigerating chip array is adopted for refrigerating, the structure is simple, and the reliability is high; the cost is low, and the production and the processing are easy; the fluids on the cold side and the hot side adopt the measures of heat exchange enhancement, so that the refrigeration effect is good; the small fan array is adopted in the refrigeration operation, so that the noise is very low; the direct current power supply is input, is easy to combine with a solar power generation device or an energy storage battery, and is environment-friendly, energy-saving, flexible and convenient to use.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
the figures in the drawings represent:
1, a water tank body; 2, semiconductor refrigerating sheets; 3 a first heat dissipation structure, 31 a joint part and 32 heat dissipation fins; 4, a heat radiation fan; 5 a second heat dissipation structure; 6 circulation pump, 61 first conduit, 62 second conduit.
Detailed Description
Example (b):
referring to fig. 1, the present embodiment is a semiconductor refrigeration thermostatic water tank, which includes a water tank body 1 made of a metal material, a plurality of semiconductor refrigeration sheets 2 attached to the outer wall surface of the water tank body 1 in a surrounding manner, a first heat dissipation structure 3 disposed on the heating side surface of the semiconductor refrigeration sheets 2, a heat dissipation fan 4 disposed on the first heat dissipation structure 3, a second heat dissipation structure 5 disposed on the inner wall surface of the water tank body 1, and a circulation pump 6 for stirring the water in the water tank body 1 and performing internal circulation.
The heat absorption surface of the semiconductor refrigeration sheet 2 is attached to the outer surface of the water tank body 1, heat conduction is carried out by utilizing the metal outer wall of the water tank, and refrigeration and temperature control are carried out on water in the water tank. The semiconductor refrigerating plate 2 utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the aim of refrigeration can be achieved. The semiconductor refrigerating plate 2 adopts a DC12V power supply to realize direct current input, and is convenient to be communicated with a solar power generation device or an energy storage battery for use.
The first heat dissipation structure 3 includes a joint connection portion 31 jointed with the surface of the semiconductor chilling plate 2, and a plurality of heat dissipation fins 32 extending outwards from the joint connection portion and distributed in a stacked manner at intervals. The heat dissipation fan 4 is arranged on the heat dissipation fins 32, so that convection heat transfer at the air side is enhanced, and the refrigeration effect is enhanced.
The second heat dissipation structure 5 comprises a plurality of heat dissipation fins which are vertically distributed in a stacked mode at intervals, so that the heat exchange area of the water side is increased, and the refrigeration efficiency and the refrigeration effect are improved.
One end of the circulating pump 6 is communicated with the bottom of the water tank body 1 through the first pipeline 61, the other end is communicated with the upper part of the water tank body 1 through the second pipeline 62, a circulating loop is formed, water in the water tank body 1 is stirred and circulated, convection heat transfer in the water tank is increased, and the temperature uniformity of the water in the water tank is improved.
The semiconductor refrigerating sheet 2 forms a semiconductor refrigerating sheet array on the outer surface of the water tank body 1, and heat-conducting silicone grease is coated between the array and the outer wall surface of the water tank body 1, so that heat transfer resistance is reduced, and the heat exchange effect is enhanced.
The embodiment is applicable to vehicle-mounted use.
In the embodiment, the semiconductor refrigeration constant-temperature water tank adopts the semiconductor refrigeration sheet array for refrigeration, and has simple structure and high reliability; the cost is low, and the production and the processing are easy; the fluids on the cold side and the hot side adopt the measures of heat exchange enhancement, so that the refrigeration effect is good; the small fan array is adopted in the refrigeration operation, so that the noise is very low; the direct current power supply is input, is easy to combine with a solar power generation device or an energy storage battery, and is environment-friendly, energy-saving, flexible and convenient to use.
What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.

Claims (8)

1. A semiconductor refrigeration thermostatic water tank is characterized in that: it includes by the water tank box that the metal material preparation formed, encircle attached a plurality of semiconductor refrigeration pieces on the water tank box outer wall surface, set up semiconductor refrigeration piece generate heat a side on the surface first heat radiation structure, set up and be in last cooling fan, the setting of first heat radiation structure is in water tank box inner wall on the surface second heat radiation structure, right water in the water tank box stirs the circulating pump of inner loop.
2. A semiconductor refrigeration thermostatic water tank as set forth in claim 1, wherein: the heat absorption surface of the semiconductor refrigeration sheet is attached to the outer surface of the water tank body, heat conduction is carried out by utilizing the metal outer wall of the water tank, and refrigeration and temperature control are carried out on water in the water tank.
3. A semiconductor refrigeration thermostatic water tank as set forth in claim 1, wherein: the semiconductor refrigerating chip adopts a DC12V power supply to realize direct current input.
4. A semiconductor refrigeration thermostatic water tank as set forth in claim 1, wherein: the first heat dissipation structure comprises a bonding connection part bonded with the surface of the semiconductor refrigeration piece, and a plurality of heat dissipation fins which extend outwards from the bonding connection part and are distributed in a stacked mode at intervals from top to bottom.
5. The semiconductor refrigeration thermostatic water tank of claim 4, characterized in that: the heat radiation fan is arranged on the heat radiation fin.
6. A semiconductor refrigeration thermostatic water tank as set forth in claim 1, wherein: the second heat dissipation structure comprises a plurality of heat dissipation fins which are vertically distributed at intervals in a laminated mode.
7. A semiconductor refrigeration thermostatic water tank as set forth in claim 1, wherein: one end of the circulating pump is communicated with the bottom of the water tank body through a first pipeline, and the other end of the circulating pump is communicated with the upper part of the water tank body through a second pipeline to form a circulating loop.
8. A semiconductor refrigeration thermostatic water tank as set forth in claim 1, wherein: the semiconductor refrigerating sheet is arranged on the outer surface of the water tank body to form a semiconductor refrigerating sheet array, and heat-conducting silicone grease is coated between the array and the outer wall surface of the water tank body.
CN201920553560.8U 2019-04-22 2019-04-22 Semiconductor refrigeration constant temperature water tank Active CN210463746U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920553560.8U CN210463746U (en) 2019-04-22 2019-04-22 Semiconductor refrigeration constant temperature water tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920553560.8U CN210463746U (en) 2019-04-22 2019-04-22 Semiconductor refrigeration constant temperature water tank

Publications (1)

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CN210463746U true CN210463746U (en) 2020-05-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109916134A (en) * 2019-04-22 2019-06-21 苏州奥德机械有限公司 A kind of semiconductor refrigerating constant temperature water tank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109916134A (en) * 2019-04-22 2019-06-21 苏州奥德机械有限公司 A kind of semiconductor refrigerating constant temperature water tank

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Address after: Room 3 and 4, 228 Wulian Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Aode high end equipment Co.,Ltd.

Address before: 215300 rooms 3 and 4, 228 Wulian Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: SUZHOU AODE MACHINERY Co.,Ltd.