CN103199316B - Battery pack and radiator structure thereof - Google Patents

Battery pack and radiator structure thereof Download PDF

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Publication number
CN103199316B
CN103199316B CN201310138441.3A CN201310138441A CN103199316B CN 103199316 B CN103199316 B CN 103199316B CN 201310138441 A CN201310138441 A CN 201310138441A CN 103199316 B CN103199316 B CN 103199316B
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Prior art keywords
heat
temperature
battery pack
radiator structure
plate
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CN201310138441.3A
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CN103199316A (en
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程文
黄卜夫
龚灼
钟翔宇
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Shenzhen Zhongzhi Weian Robot Technology Co., Ltd
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China Security and Surveillance Technology PRC Inc
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infra-red detectors

Abstract

The invention discloses a kind of battery pack and radiator structure thereof, described radiator structure is used for the temperature of the inner some battery units of regulating cell group, comprise: semiconductor heat-exchanger rig, there is the first side and the second side, heat exchange is carried out by neither endothermic nor exothermic and described internal battery pack in described first side, and heat exchange is carried out by neither endothermic nor exothermic and described battery pack outside in described second side; Radiating subassembly, a part of and described battery unit thermo-contact, another part and described first side thermo-contact, to transmit the heat between described semiconductor heat-exchanger rig and battery unit.Relative to air convection transferring heat, radiating subassembly can heat between transmission battery unit more rapidly and efficiently and semiconductor heat-exchanger rig, improves the heat exchange efficiency of battery pack and external environment condition, and then the performance of raising battery pack.

Description

Battery pack and radiator structure thereof
Technical field
The present invention relates to cell art, especially relate to a kind of battery pack and radiator structure thereof.
Background technology
Battery pack is formed by some battery cells in series or parallel combination, battery unit, in charge and discharge process, can produce large calorimetric, if heat can not effectively dissipate, make battery generation electrical property change by making the temperature of battery pack rise rapidly, and then affect the performance of battery pack.
Current battery pack is dispelled the heat in air-cooled mode mainly through arranging fan, but this radiating mode efficiency is lower.Chinese patent CN2884544 proposes a kind of semiconductor air conditioner that adopts and dispels the heat to battery pack, this semiconductor air conditioner comprises one to be had the semiconductor chilling plate of the first side and the second side and is positioned at two fans of these semiconductor chilling plate two sides, wherein heat exchange is carried out by neither endothermic nor exothermic and internal battery pack in the first side, heat exchange is carried out by neither endothermic nor exothermic and battery pack outside in second side, cross-ventilation speed accelerated by the fan of two sides, to increase radiating efficiency, thus realize the heat exchange of internal battery pack and external environment condition.The program not only can be dispelled the heat to battery pack, can also heat battery pack, to ensure that battery pack works in desirable operating temperature range.But such scheme is carry out heat exchange by cross-ventilated mode with external environment equally, and heat exchange efficiency is not high.
Summary of the invention
Main purpose of the present invention is to provide a kind of battery pack and radiator structure thereof, is intended to the heat exchange efficiency improving battery pack and external environment condition, and then improves the performance of battery pack, the useful life of prolongation battery pack.
To achieve these objectives, the present invention proposes a kind of radiator structure of battery pack, for the temperature of the inner some battery units of regulating cell group, comprising:
Semiconductor heat-exchanger rig, has the first side and the second side, and heat exchange is carried out by neither endothermic nor exothermic and described internal battery pack in described first side, and heat exchange is carried out by neither endothermic nor exothermic and described battery pack outside in described second side;
Radiating subassembly, a part of and described battery unit thermo-contact, another part and described first side thermo-contact, to transmit the heat between described semiconductor heat-exchanger rig and battery unit.
Preferably, described radiating subassembly comprises and the temperature-uniforming plate of described battery unit thermo-contact and the heat-conducting plate of described first side thermo-contact and the heat pipe that is connected between described temperature-uniforming plate and heat-conducting plate.
Preferably, described temperature-uniforming plate and heat-conducting plate are provided with through hole, and described heat pipe one section inserts in the through hole of described temperature-uniforming plate, and another section inserts in the through hole of described heat-conducting plate.
Preferably, described temperature-uniforming plate is formed by two pieces of panel combinations, and wherein at least one piece of panel is provided with the groove of accommodating described heat pipe, to be clamped and fastened on by described heat pipe between described two pieces of panels.
Preferably, described heat-conducting plate is formed by two pieces of panel combinations, and wherein at least one piece of panel is provided with the groove of accommodating described heat pipe, to be clamped and fastened on by described heat pipe between described two pieces of panels.
Preferably, described some battery units are arranged into multirow, and head and the tail two row battery units be adjacent a line respectively battery unit between be interspersed with described temperature-uniforming plate.
Preferably, heat-conducting resin is filled with between described temperature-uniforming plate and battery unit.
Preferably, described semiconductor heat-exchanger rig comprises semiconductor chilling plate, fin and the control circuit that is electrically connected with described semiconductor chilling plate with described first side and the second side, and described fin is close to described second side.
Preferably, described semiconductor heat-exchanger rig also comprises the air-blast device being positioned at described battery pack outside, and described control circuit and described air-blast device are electrically connected.
The present invention proposes a kind of battery pack simultaneously, and comprise radiator structure and some battery units, described radiator structure comprises:
Semiconductor heat-exchanger rig, has the first side and the second side, and heat exchange is carried out by neither endothermic nor exothermic and described internal battery pack in described first side, and heat exchange is carried out by neither endothermic nor exothermic and described battery pack outside in described second side;
Radiating subassembly, a part of and described battery unit thermo-contact, another part and described first side thermo-contact, to transmit the heat between described semiconductor heat-exchanger rig and battery unit.
A kind of radiator structure provided by the present invention, by a part of and battery unit thermo-contact by radiating subassembly, first side thermo-contact of another part and semiconductor heat-exchanger rig, to transmit the heat between described semiconductor heat-exchanger rig and battery unit, relative to air convection transferring heat, radiating subassembly can heat between transmission battery unit more rapidly and efficiently and semiconductor heat-exchanger rig, improves the heat exchange efficiency of battery pack and external environment condition, and then the performance of raising battery pack; The temperature of each battery unit of adjustment that radiating subassembly can be balanced, reduces the temperature difference between each battery unit, extends the useful life of battery pack simultaneously.
Have employed the heat pipe with excellent heat conductivity performance in radiating subassembly, make battery pack can more rapidly and efficiently with external environment condition heat-shift, battery performance is able to further raising.
Accompanying drawing explanation
Fig. 1 is the structural representation of radiator structure one embodiment of the present invention;
Fig. 2 is the structural representation of the semiconductor heat-exchanger rig in Fig. 1;
Fig. 3 is the structural representation of the semiconductor chilling plate in Fig. 2;
Fig. 4 is the connection diagram of temperature-uniforming plate in Fig. 1 and heat pipe;
Fig. 5 is the connection diagram of heat-conducting plate in Fig. 1 and heat pipe;
Fig. 6 is the partial sectional view of the heat pipe in Fig. 1;
Fig. 7 is the structural representation of battery pack one embodiment of the present invention;
Fig. 8 is the internal structure schematic diagram of battery pack in Fig. 7.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
See Fig. 1-Fig. 6, propose radiator structure one embodiment of the present invention, described radiator structure is applied to battery pack, for the temperature of the inner some battery units 200 of regulating cell group, comprises semiconductor heat-exchanger rig 300 and radiating subassembly 400.Described semiconductor heat-exchanger rig 300 is fixed on the shell 100 of battery pack, comprise the semiconductor chilling plate 310 with the first side 311 and the second side 312, the fin 320 being close to described second side 312 and the control circuit (scheming not shown) be electrically connected with described semiconductor chilling plate 310, heat exchange is carried out by neither endothermic nor exothermic and internal battery pack in described first side 311, heat exchange is carried out by neither endothermic nor exothermic and battery pack outside in described second side 312, described fin 320 comprises base plate 321 and is connected to this base plate 321 and extends to some support plates 322 of battery pack outside, described base plate 321 is close to the second side 312 of described semiconductor chilling plate 310.Described control circuit provides power supply for described semiconductor chilling plate 310, and change current direction as required: when control circuit detects that the temperature of described battery pack is greater than ideal working temperature scope, then pass to forward current to described semiconductor chilling plate 310, to make, absorb heat in described first side 311, the second side 312 heat release; When control circuit detects that the temperature of described battery pack is less than ideal working temperature scope, then pass to reverse current to described semiconductor chilling plate 310, to make, absorb heat in described second side 312, the first side 311 heat release.Described ideal working temperature scope is different and difference to some extent according to the performance of battery, the present embodiment preferably 0 DEG C ~ 40 DEG C, leads to forward current, leads to reverse current when being less than 0 DEG C when namely the temperature of battery pack is greater than 40 DEG C.In order to strengthen the exchange capability of heat of semiconductor heat-exchanger rig 300, described semiconductor heat-exchanger rig 300 also comprises the air-blast device 330 being positioned at battery pack outside, it comprises the support 331 being fixed on battery housing 200 and the fan 332 be installed on this support 331, control circuit and air-blast device 330 are electrically connected, and drive fan 332 rotates.
The principle that semiconductor heat-exchanger rig 300 freezes is based on paltie effect: when electric current flows through the node that two different conductors are formed, Nodes can produce heat release and endothermic thermal event, and the size of heat release or heat absorption is decided by the size of electric current.The structural representation of semiconductor chilling plate 310 as shown in Figure 3, it is made up of two panels potsherd 313 and the some bismuth tellurium semiconductors between two potsherds 313, namely the outer surface of described two potsherds 313 is respectively the first side 311 and the second side 312, and described bismuth tellurium semiconductor comprises the N type semiconductor and P type semiconductor that are connected in series.One piece of N type semiconductor and one piece of P type semiconductor connect into galvanic couple pair, after connecting direct current, and the just energy-producing transfer of energy, the joint that electric current flows to P type element by N-type element absorbs heat, becomes cold junction; Electric current flows to the joint release heat of N-type element by P type element, becomes hot junction; When current direction is reverse, hot junction and cold junction reciprocity.The right logarithm of the galvanic couple that the power of heat absorption and release ability is made up of the size of electrical current and N-type and P type semiconductor decides, and electrical current is larger, galvanic couple is more to logarithm, and heat absorption and release ability is stronger.
As shown in Figure 1, a part for described radiating subassembly 400 and battery unit 200 thermo-contact, another part and the first side 311 thermo-contact, for transmitting the heat between semiconductor heat-exchanger rig 300 and battery unit 200.Described radiating subassembly 400 comprises temperature-uniforming plate 410, heat-conducting plate 430 and heat pipe 420, in battery pack, some battery units 200 are arranged into multirow, and head and the tail two row battery units 200 be adjacent a line respectively battery unit 200 between be interspersed with described temperature-uniforming plate 410, to make described temperature-uniforming plate 410 and battery unit 200 thermo-contact, the battery unit 200 making to be positioned at middle part also can transferring heat uniform with temperature-uniforming plate 410, thus the temperature between each battery unit 200 can be regulated uniformly, the effective temperature difference reduced between each battery unit 200.Specifically as shown in fig. 1, battery unit 200 totally 16, is arranged into 4 row 4 in internal battery pack and arranges, temperature-uniforming plate 410 two, be interspersed in respectively between the first row and the second row battery unit 200 and between the third line and fourth line battery unit 200.Because battery unit 200 exists effect of expanding with heat and contract with cold, leave the gap of 1 ~ 1.5mm between battery unit 200 and temperature-uniforming plate 410, and fill heat-conducting resin 500 as epoxy resin, to improve heat transfer efficiency; Temperature-uniforming plate 410 need be made with the metal material that thermal conductivity is high, the preferred aluminum alloy materials of the present embodiment, and does the process of anodic oxidation black, to take into account cost and thermal conductivity.As shown in Figure 2, described heat-conducting plate 430 is fixedly connected on the fin 320 of semiconductor heat-exchanger rig 300 or the housing 100 of battery pack, and with the first side 311 thermo-contact of semiconductor chilling plate 310, polytene heat-insulation cotton 340 is fixed with, to improve heat transfer efficiency between fin 320 and heat-conducting plate 430; Because heat-conducting plate 430 directly contacts with semiconductor heat-exchanger rig 300, the brass that therefore preferably heat conductivility is excellent makes.Described heat pipe 420 is connected between temperature-uniforming plate 410 and heat-conducting plate 430, and in order to strengthen the exchange capability of heat of radiator structure, can use many heat pipes 420, the present embodiment is 4 heat pipes 420 preferably simultaneously.
The through hole of horizontal expansion can be set on temperature-uniforming plate 410 and heat-conducting plate 430, heat pipe 420 1 sections is inserted in the through hole of temperature-uniforming plate 410, another section inserts in the through hole of heat-conducting plate 430, to make heat pipe 420 fully contact with heat-conducting plate 430 with temperature-uniforming plate 410, improves heat transfer efficiency.For the ease of processing, cut down finished cost, the temperature-uniforming plate 410 of the present embodiment and heat-conducting plate 430 form by two pieces of panel combinations, wherein at least one piece of panel is provided with the groove of horizontal expansion, heat pipe 420 is placed in this groove, recycling screw fastening two panels, to be fixed on heat pipe 420 between two pieces of panels.
As shown in Figure 4, the panel 411 of temperature-uniforming plate and panel 412 are equipped with groove 413, the large section of heat pipe 420 1 is placed in the groove 413 of panel 411, and panel 412 is again by screw and panel 411 is fastening is combined into temperature-uniforming plate 410, and heat pipe 420 is clamped and fastened in temperature-uniforming plate 410.In order to convenient for installation and maintenance, heat pipe 420 and temperature-uniforming plate 410 can be connected to one by welding manner.
As shown in Figure 5, the panel 431 of heat-conducting plate and panel 432 are equipped with groove 433, heat pipe 420 1 sections is placed in the groove 433 of panel 431, screw is utilized to pass panel 432 and panel 431 and be fixed on semiconductor heat-exchanger rig 300 or housing 100, so that semiconductor chilling plate 310 is clamped and fastened between heat-conducting plate 430 and fin 320, heat pipe 420 is clamped and fastened in heat-conducting plate 430 simultaneously.
Figure 6 shows that the structural representation of heat pipe 420 in the present embodiment, described heat pipe 420 utilizes phase-change material transferring heat, has thermal conduction characteristic fast and efficiently.It comprises shell 421 and tube core 422, and tube core 422 inside has a vapor chamber 423, and heat pipe 420 inside is pumped into negative pressure state and is filled with working solution 424 between shell 421 and tube core 422, and described working solution 424 boiling point is low, is easy to volatilization.The tube wall of tube core 422 has liquid-sucking core, and it is made up of capillary-porous material, has some capillaries.Heat pipe 420 1 sections is evaporation ends, other one section is condensation end, when heat pipe 420 one end is heated, working solution in capillary is evaporated to steam rapidly by liquid, and steam flows to other one end under small pressure differential, and releases heat, regelation becomes liquid, liquid flows back to evaporation section by capillary force again, and so circulation is more than, and heat is reached other one end by heat pipe 420 one end.This circulation is carried out fast, and heat can be come by conduction continuously, and therefore heat pipe 420 has excellent heat conductivility and isothermal performance.
Certainly, radiating subassembly 400 also only can comprise temperature-uniforming plate 410 and heat-conducting plate 430, and temperature-uniforming plate 410 is fixedly connected with heat-conducting plate 430 or is wholely set, to transmit the heat between battery unit 200 and semiconductor heat-exchanger rig 300.
The radiator structure course of work of the present embodiment is as follows:
When battery pack causes battery unit 200 adstante febre due to the discharge and recharge of big current, first heat is delivered on temperature-uniforming plate 410, the control circuit of semiconductor heat-exchanger rig 300 detects that the temperature of battery pack is greater than ideal working temperature scope, then pass to forward current to semiconductor chilling plate 310, first side 311 of semiconductor chilling plate 310 starts heat absorption, heat-conducting plate 430 is constantly freezed, heat-conducting plate 430 temperature is caused to reduce, heat pipe 420 due to the one section of temperature inserted in temperature-uniforming plate 430 high, the one section of temperature inserted in heat-conducting plate 430 is low, therefore heat is delivered to heat-conducting plate 430 from temperature-uniforming plate 410 by heat pipe 420 endlessly, the second side 312 heat release again via semiconductor chilling plate 310 passes to fin 320, finally by air-blast device 330 by heat Quick diffusing in external environment condition, whole process is exactly constantly to battery pack radiating and cooling.
When control circuit detects that the temperature of battery pack is less than ideal working temperature scope, then pass to reverse current to semiconductor chilling plate 310, second side 312 of semiconductor chilling plate 310 starts the heat absorbing external environment condition, and transfer heat to heat-conducting plate 430 via its first side 311 heat release, heat-conducting plate 430 is constantly heated, heat-conducting plate 430 temperature is caused to raise, heat pipe 420 due to the one section of temperature inserted in temperature-uniforming plate 410 low, the one section of temperature inserted in heat-conducting plate 430 is high, therefore heat is delivered to temperature-uniforming plate 410 from heat-conducting plate 430 by heat pipe 420 endlessly, again via temperature-uniforming plate 410 by heat distribution to each battery unit 200, whole process is exactly constantly to battery pack heat temperature raising.
Accordingly, the radiator structure of the present embodiment is relative to air convection transferring heat, higher by the efficiency of radiating subassembly 400 transferring heat between battery unit 200 and semiconductor heat-exchanger rig 300, improve the heat exchange efficiency of battery pack and external environment condition, and then improve the performance of battery pack.Particularly between temperature-uniforming plate 410 and heat-conducting plate 430, connect heat pipe 420, can heat between transmission temperature-uniforming plate 410 more rapidly and efficiently and heat-conducting plate 430, and via the semiconductor heat-exchanger rig 300 be connected with heat-conducting plate 430 with external environment condition heat-shift, and then achieve rapidly and efficiently to battery pack radiating and cooling or heat temperature raising, further increase heat exchange efficiency, improve the performance of battery pack.
In conjunction with see Fig. 7, Fig. 8, battery pack one embodiment of the present invention is proposed, described battery pack comprises shell 100, is placed in the some battery units 200 in shell 100 and is fixed on the radiator structure of shell 100, described radiator structure is the radiator structure described in above-described embodiment, does not repeat them here.Some battery units 200 in shell are arranged into multirow, and head and the tail two row battery units 200 be adjacent a line respectively battery unit 200 between be interspersed with described temperature-uniforming plate 410, to make described temperature-uniforming plate 410 and battery unit 200 thermo-contact, the battery unit 200 making to be positioned at middle part also can transferring heat uniform with temperature-uniforming plate 410, thus the temperature between each battery unit 200 can be regulated uniformly, the effective temperature difference reduced between each battery unit 200.Specifically as shown in Figure 8, battery unit 200 totally 16, is arranged into 4 row 4 and arranges, temperature-uniforming plate 410 two, be interspersed in respectively between the first row and the second row battery unit 200 and between the third line and fourth line battery unit 200.Battery unit 200 end has pressed solidly pressing plate 600, loosens to prevent battery unit 200; The semiconductor heat-exchanger rig 300 of radiator structure is fixed on shell 100, and its one end with air-blast device 330 is placed in outside shell 100.
The battery pack of the present embodiment, owing to have employed the radiator structure of above-described embodiment, by temperature-uniforming plate 410 and battery unit 200 thermo-contact, and each battery unit 200 is equal with the contact area of temperature-uniforming plate 410, with the temperature of each battery unit 200 of the adjustment of equilibrium, reduce the temperature difference between each battery unit 200, extend the useful life of battery pack; Relative to air convection transferring heat, higher by the efficiency of radiating subassembly 400 transferring heat between battery unit 200 and semiconductor heat-exchanger rig 300, improve the heat exchange efficiency of battery pack and external environment condition, and then improve the performance of battery pack.
Particularly between temperature-uniforming plate 410 and heat-conducting plate 430, connect heat pipe 420, can heat between transmission temperature-uniforming plate 410 more rapidly and efficiently and heat-conducting plate 430, and via the semiconductor heat-exchanger rig 300 be connected with heat-conducting plate 430 with external environment condition heat-shift, and then achieve rapidly and efficiently to battery pack radiating and cooling or heat temperature raising, further increase heat exchange efficiency, improve the performance of battery pack.
Should be understood that; these are only the preferred embodiments of the present invention; can not therefore limit the scope of the claims of the present invention; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (9)

1. a radiator structure for battery pack, for the temperature of the inner some battery units of regulating cell group, is characterized in that, comprising:
Semiconductor heat-exchanger rig, comprise the semiconductor chilling plate with the first side and the second side and the fin being close to described second side, heat exchange is carried out by neither endothermic nor exothermic and described internal battery pack in described first side, and heat exchange is carried out by neither endothermic nor exothermic and described battery pack outside in described second side;
Radiating subassembly, a part of and described battery unit thermo-contact, another part and described first side thermo-contact, to transmit the heat between described semiconductor heat-exchanger rig and battery unit;
Described radiating subassembly comprises and the temperature-uniforming plate of described battery unit thermo-contact and the heat-conducting plate of described first side thermo-contact and the heat pipe that is connected between described temperature-uniforming plate and heat-conducting plate, described heat pipe one section inserts in described temperature-uniforming plate, and another section is inserted in described heat-conducting plate.
2. radiator structure according to claim 1, is characterized in that, described temperature-uniforming plate and heat-conducting plate are provided with through hole, and described heat pipe one section inserts in the through hole of described temperature-uniforming plate, and another section inserts in the through hole of described heat-conducting plate.
3. radiator structure according to claim 1, is characterized in that, described temperature-uniforming plate is formed by two pieces of panel combinations, and wherein at least one piece of panel is provided with the groove of accommodating described heat pipe, to be clamped and fastened on by described heat pipe between described two pieces of panels.
4. radiator structure according to claim 1, is characterized in that, described heat-conducting plate is formed by two pieces of panel combinations, and wherein at least one piece of panel is provided with the groove of accommodating described heat pipe, to be clamped and fastened on by described heat pipe between described two pieces of panels.
5. the radiator structure according to any one of claim 1-4, is characterized in that, described some battery units are arranged into multirow, and head and the tail two row battery units be adjacent a line respectively battery unit between be interspersed with described temperature-uniforming plate.
6. radiator structure according to claim 5, is characterized in that, is filled with heat-conducting resin between described temperature-uniforming plate and battery unit.
7. the radiator structure according to any one of claim 1-4, is characterized in that, described semiconductor heat-exchanger rig also comprises the control circuit be electrically connected with described semiconductor chilling plate.
8. radiator structure according to claim 7, is characterized in that, described semiconductor heat-exchanger rig also comprises the air-blast device being positioned at described battery pack outside, and described control circuit and described air-blast device are electrically connected.
9. a battery pack, comprises radiator structure and some battery units, it is characterized in that, described radiator structure is the radiator structure as described in any one of claim 1-8.
CN201310138441.3A 2013-04-19 2013-04-19 Battery pack and radiator structure thereof Active CN103199316B (en)

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CN201859928U (en) * 2010-08-19 2011-06-08 北京有色金属研究总院 Novel cooling system for battery packs
CN201781012U (en) * 2010-09-16 2011-03-30 南京双登科技发展研究院有限公司 High-heat-dissipation power battery pack

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TWI610487B (en) * 2016-09-06 2018-01-01 達方電子股份有限公司 Battery module

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