CN213178893U

CN213178893U - Efficient miniature refrigerator

Info

Publication number: CN213178893U
Application number: CN202021905980.7U
Authority: CN
Inventors: 张旭强; 华祖民
Original assignee: Suzhou Xinyuji Precision Machinery Co ltd
Current assignee: Suzhou Xinyuji Precision Machinery Co ltd
Priority date: 2020-09-04
Filing date: 2020-09-04
Publication date: 2021-05-11
Anticipated expiration: 2030-09-04

Abstract

The utility model belongs to the field of refrigerators, and particularly discloses a high-efficiency micro refrigerator, which comprises a radiator, a fan (1), a radiating fin (2), a first water cooling head (3), a second water cooling head (4), a refrigerating semiconductor (5), a multilayer box-type heat exchanger (6), a temperature control display (7), a case (8) and a cooling pump (9); the radiator and the fan (1) are embedded on the side surface of the case (8); the first water cooling head (3) and the second water cooling head (4) are fixed in the case (8) in parallel; the radiating fins (2) are fixedly connected to the side faces of the first water cooling head (3) and the second water cooling head (4); the refrigeration semiconductor (5) is clamped between the two water cooling heads; a cooling pump (9) is vertically arranged beside the second water cooling head (4) and is connected with the water cooling head through a conduit; the refrigerator improves the refrigeration effect through the modes of fan heat dissipation, water cooling, semiconductor cooling and hot water circulation.

Description

Efficient miniature refrigerator

Technical Field

The utility model belongs to the refrigerator field, in particular to miniature refrigerator of efficient.

Background

The semiconductor refrigerator uses the Peltier effect to connect two different metals with direct current to form an N-type semiconductor and a P-type semiconductor, and the temperature of one joint is gradually reduced and the temperature of the other joint is increased, so that heat transfer is realized, the temperature of the required low-temperature part is reduced, and the refrigeration effect is realized.

The semiconductor refrigerator has the characteristics of no noise, no vibration, no need of a refrigerator, small volume and light weight, but the utilization of absorbed heat is usually insufficient, the waste of energy is easily caused, the use efficiency of electric energy is not high, and the industrial manufacturing is not facilitated, so that the cost is reduced.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the application provides a high-efficiency micro refrigerator, and a commonly used pure metal conductor is replaced by an N-type semiconductor and a P-type semiconductor through the Peltier effect, so that the refrigerating effect is improved; on the other hand, the cooling liquid enters the multilayer box type heat exchanger after temperature rise, sufficient time is ensured for temperature reduction, the effect of the refrigerant is improved, heat can be considered for reuse, the reutilization of energy is embodied, and unnecessary heat release is reduced.

The technical scheme of the utility model as follows:

an efficient micro refrigerator, characterized in that: the device comprises a radiator, a fan, a radiating fin, a first water cooling head, a second water cooling head, a refrigeration semiconductor, a multi-layer box type heat exchanger, a temperature control display, a case, a switch, a power socket and a cooling pump; the radiator and the fan are embedded in the side face of the case; the first water-cooling head and the second water-cooling head are fixed inside the case in parallel; the radiating fins are fixedly connected to the side faces of the first water-cooling head and the second water-cooling head; the refrigeration semiconductor is clamped between the two water cooling heads; a cooling pump is vertically arranged beside the second water cooling head; the cooling pump is connected with the first water cooling head and the second water cooling head through a conduit; one side of the multilayer box type heat exchanger is in flexible connection with the second water cooling head through a guide pipe, and the other side of the multilayer box type heat exchanger is fixedly connected with the case; the temperature control display is fixed in the case; the display area of the temperature control display is flush with the side surface of the case; the switch and the power socket are arranged outside the side wall of the case.

Furthermore, a plurality of radiating fins are arranged outside the side wall of the case, heat on the temperature rise side of the semiconductor can be rapidly radiated by the radiating fins along with the fan, and the heat is prevented from being retained in the refrigerator to influence the refrigeration effect.

Furthermore, the refrigeration semiconductor does not contain a sliding component, the refrigeration side of the refrigeration semiconductor is tightly attached to the second water-cooling head, the heating side of the refrigeration semiconductor is tightly attached to the first water-cooling head, the second water-cooling head connected with the temperature reduction side of the semiconductor provides cooling liquid, heat is fully absorbed, and after the cooling liquid flows through the temperature rise side, the hot cooling liquid flows to the multilayer box-type heat exchanger to realize drainage.

Furthermore, the multilayer box type heat exchanger is connected with the cooling pump and the second water cooling head through the guide pipes respectively, heat continuously flows from the high-temperature side to the low-temperature side due to heat transfer in the multilayer box type heat exchanger, the cooling liquid is kept in a low-temperature state, and the refrigeration effect is improved.

Further, the surface roughness of the case is required to be 3.2, and the smoothness of the surface of the case is guaranteed.

Furthermore, the power socket is a three-core power socket, wherein brown is a live wire, blue is a zero wire, and yellow-green is a ground wire, so that continuous grounding in work is ensured, and the power socket is a common safety protection means for high-power electrical appliances.

Furthermore, the multilayer box-type heat exchanger and the case are fixed through the hexagonal studs, so that the connection stability is improved, and the problem of hot melting caused by temperature rise can be avoided compared with soldering tin.

Drawings

FIG. 1 is a schematic view of a high efficiency micro refrigerator according to embodiments 1 and 2 of the present invention;

fig. 2 is a schematic diagram of the refrigeration principle of the micro refrigerator according to embodiments 1 and 2 of the present invention.

In the figure: 1. the heat exchanger comprises a radiator, a fan, a cooling fin, a first water cooling head, a second water cooling head, a refrigerating semiconductor, a multilayer box type heat exchanger, a temperature control display, a case, a switch, a power socket, a switch and a cooling pump, wherein the cooling fin is 2, the first water cooling head is 3, the second water cooling head is 4, the refrigerating semiconductor is 5, the multilayer box type heat exchanger is 6, the temperature control display is 7, the case is 8.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Example 1

A high-efficiency micro refrigerator shown in fig. 1, which comprises a radiator and fan 1, a radiating fin 2, a first water cooling head 3, a second water cooling head 4, a refrigerating semiconductor 5, a multi-layer box type heat exchanger 6, a temperature control display 7, a case 8, a switch 81, a power socket 82 and a cooling pump 9; the radiator and the fan 1 are embedded on the side surface of the case 8; the first water-cooling head 3 and the second water-cooling head 4 are fixed inside the case 8 in parallel; the radiating fin 2 is fixedly connected to the side surfaces of the first water-cooling head 3 and the second water-cooling head 4; the refrigeration semiconductor 5 is clamped between the two water cooling heads; a cooling pump 9 is vertically arranged beside the second water cooling head 4; the cooling pump 9 is connected with the first water cooling head 3 and the second water cooling head 4 through a conduit; one side of the multilayer box type heat exchanger 6 is in flexible connection with the second water cooling head 4 through a guide pipe, and the other side of the multilayer box type heat exchanger is fixedly connected with the case 8; the temperature control display 7 is fixed inside the case 8; the display area of the temperature control display 7 is flush with the side surface of the case 8; the switch 81 and the power socket 82 are both disposed outside the side wall of the housing 8.

When the heat exchanger is used, the power socket 82 is connected, the switch 81 is started, the radiator and the fan 1 are driven to work by electric energy, when cooling liquid flows in through the cooling pump 9, the second water-cooling head 4 is cooled under the action of a semiconductor, high-temperature liquid heat flows to the second water-cooling head 4 due to heat transfer, the temperature of the liquid in the water-cooling head rises and flows to the multi-layer box-type heat exchanger 6 through the first water-cooling head 3, the liquid is gradually cooled under the action of the heat exchanger, and the liquid flows back to the cooling pump 9 again.

Example 2

Preferably, a plurality of cooling fins are arranged outside the side wall of the case 8.

Preferably, the refrigeration semiconductor 5 does not include a sliding component, and the refrigeration side of the refrigeration semiconductor is tightly attached to the second water cooling head 4, and the heating side of the refrigeration semiconductor is tightly attached to the first water cooling head 3.

Preferably, the multi-layer box type heat exchanger 6 is connected with the cooling pump 9 and the second water cooling head 4 through pipes respectively.

Preferably, the surface roughness of the chassis 8 requires 3.2.

Preferably, the power outlet 82 is a three-wire power outlet.

Preferably, the multi-layer box type heat exchanger 6 and the chassis 8 are fixed through hexagonal studs.

When the temperature control display 7 is used, the temperature to be adjusted at a certain time point can be adjusted by the temperature control display 7, namely, the refrigeration degree is controlled by adjusting the cooling degree of the semiconductor and the time of the cooling effect of the refrigerating fluid beside the semiconductor; the air flow can be accelerated, the heat transfer is promoted and the refrigeration effect is enhanced by ventilating the radiator and the fan 1; the heat of the multilayer box type heat exchanger 6 can be recycled, and the energy utilization rate of the high-efficiency micro refrigerator is improved.

The above is only a preferred embodiment of the present invention, and the protection scope of the present invention can not be limited thereby, and the simple equivalent changes and modifications made according to the claims and the utility model also belong to the protection scope of the present invention.

Claims

1. An efficient micro refrigerator, characterized in that: the device comprises a radiator, a fan (1), a radiating fin (2), a first water cooling head (3), a second water cooling head (4), a refrigeration semiconductor (5), a multi-layer box-type heat exchanger (6), a temperature control display (7), a case (8), a switch (81), a power socket (82) and a cooling pump (9); the radiator and the fan (1) are embedded on the side surface of the case (8); the first water cooling head (3) and the second water cooling head (4) are fixed in the case (8) in parallel; the radiating fins (2) are fixedly connected to the side faces of the first water cooling head (3) and the second water cooling head (4); the refrigeration semiconductor (5) is clamped between the two water cooling heads; a cooling pump (9) is vertically arranged beside the second water cooling head (4), and the cooling pump (9) is connected with the first water cooling head (3) and the second water cooling head (4) through a conduit; one side of the multilayer box type heat exchanger (6) is in flexible connection with the second water cooling head (4) through a guide pipe, and the other side of the multilayer box type heat exchanger is fixedly connected with the case (8); the temperature control display (7) is fixed in the case (8); the display area of the temperature control display (7) is flush with the side surface of the case (8); the switch (81) and the power socket (82) are arranged outside the side wall of the case (8).

2. A high efficiency micro refrigerator as claimed in claim 1, wherein: and a plurality of radiating fins are arranged outside the side wall of the case (8).

3. A high efficiency micro refrigerator as claimed in claim 1, wherein: the refrigeration semiconductor (5) does not contain a sliding part, the refrigeration side of the refrigeration semiconductor is tightly attached to the second water-cooling head (4), and the heating side of the refrigeration semiconductor is tightly attached to the first water-cooling head (3).

4. A high efficiency micro refrigerator as claimed in claim 1, wherein: the multilayer box type heat exchanger (6) is connected with the cooling pump (9) and the second water cooling head (4) through guide pipes respectively.

5. A high efficiency micro refrigerator as claimed in claim 1, wherein: the surface roughness of the case (8) is required to be 3.2.

6. A high efficiency micro refrigerator as claimed in claim 1, wherein: the power socket (82) is a three-core power socket.

7. A high efficiency micro refrigerator as claimed in claim 1, wherein: the multilayer box type heat exchanger (6) and the case (8) are fixed through a hexagonal stud.