CN210745850U

CN210745850U - Heat sink device

Info

Publication number: CN210745850U
Application number: CN201921904641.4U
Authority: CN
Inventors: 封文丽
Original assignee: Shenzhen Changhongyu Technology Co Ltd
Current assignee: Shenzhen Changhongyu Technology Co Ltd
Priority date: 2019-11-06
Filing date: 2019-11-06
Publication date: 2020-06-12
Anticipated expiration: 2029-11-06

Abstract

The utility model discloses a heat abstractor, including low thermal resistance component and radiator unit, low thermal resistance component and heat source direct contact, radiator unit includes evaporimeter, steam pipe, radiator and back flow, steam pipe one end with the output of evaporimeter is connected, the other end with the input of radiator is connected, back flow one end with the output of radiator is connected, the other end with the input of evaporimeter is connected with evaporimeter, steam pipe, radiator and back flow constitute a closed loop, low thermal resistance component with the evaporimeter is connected fixedly. The evaporator is driven by the low-thermal-resistance element in a heating mode, the heat dissipation area of the radiator is expanded by utilizing a long-distance space, the heat dissipation effect is improved, specifically, steam generated by heating of the evaporator through the low-thermal-resistance element enters the radiator through the steam pipe for heat dissipation, and meanwhile cooled liquid in the radiator supplies the evaporator through the return pipe, so that efficient heat dissipation is achieved, and overall thermal resistance is reduced.

Description

Heat sink device

Technical Field

The utility model relates to a heat dissipation field, more specifically say and indicate a heat abstractor.

Background

With the continuous development of electronic technology, the integration level of chips is higher and higher, the power is continuously increased, the corresponding heat flux density is also continuously increased, and a heat dissipation scheme meets new challenges. Especially on a server and a network exchanger device, the power of a chip exceeds 300W, the heat flow density is as high as 60W per square centimeter, but the existing heat dissipation structure has low efficiency and hidden troubles.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a heat abstractor.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a heat dissipation device comprises a low thermal resistance element and a heat dissipation assembly, wherein the low thermal resistance element is in direct contact with a heat source, the heat dissipation assembly comprises an evaporator, a steam pipe, a radiator and a return pipe, one end of the steam pipe is connected with the output end of the evaporator, the other end of the steam pipe is connected with the input end of the radiator, one end of the return pipe is connected with the output end of the radiator, the other end of the return pipe is connected with the input end of the evaporator, the steam pipe, the radiator and the return pipe form a closed loop, and the low thermal resistance element is fixedly connected with the evaporator.

The further technical scheme is as follows: fins for improving the heat dissipation effect are arranged on two sides of the low-thermal-resistance element and are fixedly connected with the low-thermal-resistance element.

The further technical scheme is as follows: the fins and the low-heat-resistance element are fixedly connected in a welding or bonding or interference fit mode.

The further technical scheme is as follows: the low heat resistance element is fixedly connected with the bottom surface of the evaporator.

The further technical scheme is as follows: the low heat resistance element and the bottom surface of the evaporator are fixedly connected in a welding or bonding or interference fit mode.

The further technical scheme is as follows: the low thermal resistance element is a heat pipe.

The further technical scheme is as follows: the low thermal resistance element is a temperature equalization plate.

Compared with the prior art, the utility model beneficial effect be: the utility model relates to a heat abstractor is connected fixedly through low thermal resistance component direct and heat source contact and with the evaporimeter, is connected with the output of evaporimeter through steam pipe one end, and the other end is connected with the input of radiator, is connected with the output of radiator through back flow one end, and the other end is connected with the input of evaporimeter and constitutes a closed loop with evaporimeter, steam pipe, radiator and back flow. The evaporator is driven by the low-thermal-resistance element in a heating mode, the heat dissipation area of the radiator is expanded by utilizing a long-distance space, the heat dissipation effect is improved, specifically, steam generated by heating of the evaporator through the low-thermal-resistance element enters the radiator through the steam pipe for heat dissipation, and meanwhile cooled liquid in the radiator supplies the evaporator through the return pipe, so that efficient heat dissipation is achieved, and overall thermal resistance is reduced.

The foregoing is a summary of the present invention, and other objects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, which is provided for the purpose of illustration and understanding of the present invention.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation device of the present invention;

fig. 2 is a schematic structural view of the heat dissipation device of the present invention.

Reference numerals

11. A low thermal resistance element; 12. a fin; 21. an evaporator; 22. a steam pipe; 23. a heat sink; 24. a return pipe.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

As shown in fig. 1 to 2, a heat dissipating device includes a low thermal resistance element 11 and a heat dissipating assembly, the low thermal resistance element 11 is in direct contact with a heat source, the heat dissipating assembly includes an evaporator 21, a steam pipe 22, a heat sink 23 and a return pipe 24, one end of the steam pipe 22 is connected to an output end of the evaporator 21, the other end is connected to an input end of the heat sink 23, one end of the return pipe 24 is connected to an output end of the heat sink 23, the other end is connected to an input end of the evaporator 21 to form a closed loop with the evaporator 21, the steam pipe 22, the heat sink 23 and the return pipe 24, and the low thermal resistance element 11 is fixedly. The evaporator 21 is driven by the low thermal resistance element 11 through heating, the radiator 23 expands the radiating area by using a long-distance space, and the radiating effect is improved, specifically, steam generated by heating the evaporator 21 through the low thermal resistance element 11 enters the radiator 23 through the steam pipe 22 for radiating, and meanwhile, cooled liquid in the radiator 23 supplies the evaporator 21 through the return pipe 24, so that efficient radiating and overall thermal resistance reduction are realized.

Specifically, as shown in fig. 2, fins 12 for improving the heat dissipation effect are disposed on two sides of the low thermal resistance element 11, and the fins 12 are connected and fixed with the low thermal resistance element 11. The fins 12 are matched with two ends of the low thermal resistance element 11, so that the space right above the heat source is fully utilized, and the heat dissipation effect is improved.

Specifically, the fin 12 and the low heat resistance element 11 are connected and fixed by welding or bonding or interference fit.

Specifically, as shown in fig. 2, the low heat-resistance element 11 is fixedly attached to the bottom surface of the evaporator 21.

Specifically, the low heat resistance element 11 is fixedly connected to the bottom surface of the evaporator 21 by welding or bonding or interference fit.

Specifically, the low heat-resistance element 11 is a heat pipe.

Specifically, the low heat-resistance element 11 is a temperature-uniforming plate.

Compared with the prior art, the utility model relates to a heat abstractor passes through low thermal resistance component and directly contacts and be connected fixedly with the heat source, is connected with the output of evaporimeter through steam pipe one end, and the other end is connected with the input of radiator, is connected with the output of radiator through back flow one end, and the other end is connected with the input of evaporimeter and constitutes a closed loop with evaporimeter, steam pipe, radiator and back flow. The evaporator is driven by the low-thermal-resistance element in a heating mode, the heat dissipation area of the radiator is expanded by utilizing a long-distance space, the heat dissipation effect is improved, specifically, steam generated by heating of the evaporator through the low-thermal-resistance element enters the radiator through the steam pipe for heat dissipation, and meanwhile cooled liquid in the radiator supplies the evaporator through the return pipe, so that efficient heat dissipation is achieved, and overall thermal resistance is reduced.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A heat dissipation device is characterized by comprising a low thermal resistance element and a heat dissipation assembly, wherein the low thermal resistance element is in direct contact with a heat source, the heat dissipation assembly comprises an evaporator, a steam pipe, a radiator and a return pipe, one end of the steam pipe is connected with the output end of the evaporator, the other end of the steam pipe is connected with the input end of the radiator, one end of the return pipe is connected with the output end of the radiator, the other end of the return pipe is connected with the input end of the evaporator to enable the evaporator, the steam pipe, the radiator and the return pipe to form a closed loop, and the low thermal resistance element is fixedly connected with the evaporator.

2. The heat dissipating device as claimed in claim 1, wherein fins for enhancing heat dissipating effect are disposed on two sides of the low thermal resistance element, and the fins are connected and fixed to the low thermal resistance element.

3. The heat dissipating device as claimed in claim 2, wherein the fins and the low thermal resistance element are fixed by welding or bonding or interference fit.

4. The heat dissipating device of claim 1, wherein the low thermal resistance element is fixedly attached to the bottom surface of the evaporator.

5. The heat dissipating device of claim 4, wherein the low thermal resistance element is fixedly connected to the bottom surface of the evaporator by welding, bonding or interference fit.

6. The heat dissipating device of claim 1, wherein the low thermal resistance element is a heat pipe.

7. The heat dissipating device of claim 1, wherein the low thermal resistance element is a vapor chamber.