CN201041437Y - Semi-conductor refrigerating assembly with heat radiation device - Google Patents
Semi-conductor refrigerating assembly with heat radiation device Download PDFInfo
- Publication number
- CN201041437Y CN201041437Y CNU2007201013396U CN200720101339U CN201041437Y CN 201041437 Y CN201041437 Y CN 201041437Y CN U2007201013396 U CNU2007201013396 U CN U2007201013396U CN 200720101339 U CN200720101339 U CN 200720101339U CN 201041437 Y CN201041437 Y CN 201041437Y
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- CN
- China
- Prior art keywords
- heat
- semiconductor refrigerating
- refrigerating assembly
- evaporation cavity
- radiating tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the semiconductor device technical field, and discloses a semiconductor refrigerating component with a heat radiating device. The utility model is technically characterized in that a couple arm at the both ends of which a cold base plate and a heat base plate are arranged is included, the heat base plate is provided with an evaporation cavity, the heat base plate is connected with a heat radiating pipe with a plurality of fins or fin heat radiators through a heat conducting pipe. The heat base plate of the semiconductor refrigerating component with the heat radiating device of the utility model is provided with the evaporation cavity, and is communicated with the heat radiating pipe through the heat conducting pipe, the formed heat resistance between the semiconductor refrigerating component and the heat radiating device when being applied is eliminated, and the heat conducting efficiency is greatly improved.
Description
Technical field
The utility model belongs to technical field of semiconductor device, relates in particular to a kind of semiconductor refrigerating assembly that has heat abstractor.
Background technology
The semiconductor refrigerating assembly that utilizes galvanic couple arm (also being peltier-element) formation is as refrigeration source, because it has pollution-free, noiselessness, nothing wearing and tearing and the fast advantage of freezing, and has been widely used in each technical fields such as metering, environmental monitoring, analytical test, refrigeration.Cold substrate, hot substrate that semiconductor refrigerating assembly mainly comprises galvanic couple arm, deflector and is welded on the deflector both sides are formed, cold substrate, hot substrate again with pass cold, heat abstractor is fitted, fixing.The semiconductor refrigerating assembly of this structure, its cold substrate, hot substrate and biography is cold, can there be flatness error in the binding face of heat abstractor, to form big thermal resistance during work, this thermal resistance can reduce greatly that cold substrate, hot substrate and biography are cold, the heat conduction efficiency of heat abstractor, and the performance of semiconductor refrigerating assembly is descended.
The utility model content
Problem to be solved in the utility model just provides a kind of elimination rigging error, reduces the semiconductor refrigerating assembly that has heat abstractor of thermal-conduction resistance, raising refrigerating efficiency.
The technical solution adopted in the utility model is: comprise that both sides are provided with the galvanic couple arm of cold substrate, hot substrate, described hot substrate is provided with evaporation cavity, and hot substrate is connected with the radiating tube that has some bundle fins or finned radiator by heat pipe.
Its additional technical feature is: described evaporation cavity, heat pipe, radiating tube are interconnected and constitute the sealing tube chamber; Described evaporation cavity, heat pipe, radiating tube are circular, oval or square tube chamber; Be filled with working medium in the sealing tube chamber that described evaporation cavity, heat pipe and radiating tube constitute; Be filled with the working medium of having one's bosom filled with in the sealing tube chamber that described evaporation cavity, heat pipe and radiating tube constitute; The heat-transfer device that described evaporation cavity, heat pipe, radiating tube and working medium constitute is a heat pipe; Described radiating tube is connected for rise riveting or soldering with fin; Described finned radiator is needle-like, sheet or column.
A kind of semiconductor refrigerating assembly that has a heat abstractor provided by the utility model compared with prior art, have the following advantages: one, the hot substrate of semiconductor refrigerating assembly is provided with evaporation cavity, and be connected with radiating tube by heat pipe, eliminate formed thermal resistance when fitting between semiconductor refrigerating assembly and the heat abstractor, improved heat conduction efficiency; Its two, be provided with working medium in the closed cavity that evaporation cavity, heat pipe and radiating tube form, the working medium heat radiation that circulates in cavity can improve the cold and hot conduction operating efficiency of this semiconductor refrigerating assembly greatly; Its three, overall structure is simple and direct, compact, volume is less relatively, area of dissipation is relatively large, can adapt to the supporting use of miniature and miniaturization conductor refrigeration product etc.
Description of drawings
Fig. 1 is a kind of a kind of structural representation that has the semiconductor refrigerating assembly of heat abstractor of the utility model;
Fig. 2 is a kind of another kind of structural representation that has the semiconductor refrigerating assembly of heat abstractor.
The specific embodiment
Below in conjunction with accompanying drawing a kind of structure and operation principle that has the semiconductor refrigerating assembly of heat abstractor that the utility model provides is described in further detail.
As shown in Figure 1, a kind of semiconductor refrigerating assembly that has heat abstractor of the utility model, comprise that both sides are provided with the galvanic couple arm 3 of cold substrate 1, hot substrate 2, hot substrate 2 is provided with evaporation cavity 4, hot substrate 2 is connected with the radiating tube 7 that has some bundle fins 6 by heat pipe 5, radiating tube 7 is connected for rise riveting or soldering with fin 6, and evaporation cavity 4, heat pipe 5, radiating tube 7 are interconnected and form the inner sealing tube chamber that is filled with working medium 8.
As shown in Figure 2, a kind of semiconductor refrigerating assembly that has heat abstractor of the utility model, comprise that both sides are provided with the galvanic couple arm 3 of cold substrate 1, hot substrate 2, hot substrate 2 is provided with evaporation cavity 4, hot substrate 2 is connected with the radiating tube 7 that has finned radiator 9 by heat pipe 5, finned radiator 9 is needle-like, sheet or column, and evaporation cavity 4, heat pipe 5, radiating tube 7 are interconnected and form the inner sealing tube chamber that is filled with working medium 8.
During use, working medium 8 circulates in evaporation cavity 4, heat pipe 5, radiating tube 7 are interconnected the sealing tube chamber that forms.Working medium 8 at first at heat absorption back, evaporation cavity 4 places evaporative phase-change, passes to radiating tube 7 with heat rapidly by heat pipe 5, and carries out the large tracts of land heat exchange by fin 6 or finned radiator 9 with environment.This structure has been eliminated formed thermal resistance when fitting between semiconductor refrigerating assembly and the heat abstractor, can improve the cold and hot conduction operating efficiency of this semiconductor refrigerating assembly greatly.
The utility model is not limited only to said structure, so long as by tube connector the structure that semiconductor refrigerating assembly is connected with heat abstractor is all fallen into protection domain of the present utility model.
Claims (8)
1. semiconductor refrigerating assembly that has heat abstractor, comprise that both sides are provided with the galvanic couple arm of cold substrate, hot substrate, it is characterized in that: described hot substrate is provided with evaporation cavity, and hot substrate is connected with the radiating tube that has some bundle fins or finned radiator by heat pipe.
2. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 1 is characterized in that: described evaporation cavity, heat pipe, radiating tube are interconnected and constitute the sealing tube chamber.
3. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 1 is characterized in that: described evaporation cavity, heat pipe, radiating tube are circular, oval or square tube chamber.
4. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 2 is characterized in that: be filled with working medium in the sealing tube chamber that described evaporation cavity, heat pipe and radiating tube constitute.
5. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 4 is characterized in that: be filled with the working medium of having one's bosom filled with in the sealing tube chamber that described evaporation cavity, heat pipe and radiating tube constitute.
6. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 5 is characterized in that: the heat-transfer device that described evaporation cavity, heat pipe, radiating tube and working medium constitute is a heat pipe.
7. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 1 is characterized in that: described radiating tube is connected for rise riveting or soldering with fin.
8. a kind of semiconductor refrigerating assembly that has heat abstractor according to claim 1 is characterized in that: described finned radiator is needle-like, sheet or column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201013396U CN201041437Y (en) | 2007-05-15 | 2007-05-15 | Semi-conductor refrigerating assembly with heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201013396U CN201041437Y (en) | 2007-05-15 | 2007-05-15 | Semi-conductor refrigerating assembly with heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201041437Y true CN201041437Y (en) | 2008-03-26 |
Family
ID=39253146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201013396U Expired - Fee Related CN201041437Y (en) | 2007-05-15 | 2007-05-15 | Semi-conductor refrigerating assembly with heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201041437Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102410658A (en) * | 2011-11-18 | 2012-04-11 | 苏州雪林电器科技有限公司 | Semiconductor refrigerating chip heat dissipation assembly for refrigerator |
| CN104344630B (en) * | 2014-08-29 | 2017-06-06 | 青岛海尔股份有限公司 | Semiconductor freezer and its manufacture method |
| CN107008206A (en) * | 2017-06-12 | 2017-08-04 | 上海理工大学 | A kind of heat pipe-type gas hydrate quickly generates device |
| CN110933901A (en) * | 2019-11-01 | 2020-03-27 | 苏州永腾电子制品有限公司 | Aluminum heat conduction liquid cooling radiator |
-
2007
- 2007-05-15 CN CNU2007201013396U patent/CN201041437Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102410658A (en) * | 2011-11-18 | 2012-04-11 | 苏州雪林电器科技有限公司 | Semiconductor refrigerating chip heat dissipation assembly for refrigerator |
| CN104344630B (en) * | 2014-08-29 | 2017-06-06 | 青岛海尔股份有限公司 | Semiconductor freezer and its manufacture method |
| CN107008206A (en) * | 2017-06-12 | 2017-08-04 | 上海理工大学 | A kind of heat pipe-type gas hydrate quickly generates device |
| CN110933901A (en) * | 2019-11-01 | 2020-03-27 | 苏州永腾电子制品有限公司 | Aluminum heat conduction liquid cooling radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080326 Termination date: 20110515 |