CN109612152A - Thermoelectric cooling, heating unitary members - Google Patents
Thermoelectric cooling, heating unitary members Download PDFInfo
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- CN109612152A CN109612152A CN201811588736.XA CN201811588736A CN109612152A CN 109612152 A CN109612152 A CN 109612152A CN 201811588736 A CN201811588736 A CN 201811588736A CN 109612152 A CN109612152 A CN 109612152A
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/615—Heating or keeping warm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Thermoelectric cooling, heating unitary members, it include: semiconductor refrigerating component, intersect the array being connected in series with multiple P-type semiconductors and N-type semiconductor, these P-type semiconductors and N-type semiconductor self face together, both ends to be conductively connected by metal conductor plate；Upper heat-conducting plate, is attached in the metal conductor plate of upper end；Lower heat-conducting plate, is attached in the metal conductor plate of upper end；And be at least adhered to heat-conducting plate, in lower heat-conducting plate cold end hot type heat conductive pad, wherein, heat-conducting pad is provided between upper heat-conducting plate and metal conductor plate, it is lower that heat-conducting pad, hot type heat conductive pad are also equipped between heat-conducting plate and metal conductor plate, comprising: heat conductive pad main body, intercommunicating pore is offered in it, electric heating part passes through intercommunicating pore and is arranged in heat conductive pad main body, and electric heating part is used to connect with extraneous power supply heat and give heat transfer to heat conductive pad main body.
Description
Technical field
The present invention relates to cooling heat exchangers, and in particular to is used in the battery pack of power battery in electric car pair
Battery unit box radiated and heat thermoelectric cooling, heating unitary members.
Background technique
Using multiple power battery packs (battery pack) as drive energy in electric vehicle.In general a battery pack packet
Multiple battery modules are included, and multiple mould groups are put into shell.And mould group is an individual component comprising placing battery
Unit box (including one or more basic primary batteries, provides basic voltage, as lithium/manganese dioxide primary battery voltage is
Frame, multiple battery unit boxes and management circuit 3.6V).
Since the primary battery in battery unit box must be heating up in charge and discharge process, especially concentrate multiple
The battery unit box of primary battery heats up just particularly evident at summer, must be carried out thus by modes such as point cold or water coolings cold
But cool down.
Existing water-cooling section using cooling water carry out it is cooling there is a problem of it is following:
1, plate structure of cooling is complicated, and weight is larger, is unfavorable for lightweight；
2, additional equipment is needed to heat or cool down cooling water, cooling rate is slow；
3, in order to be cooled down, need to be arranged cooling/heating apparatus, and traditional cooling/heating apparatus, peripheral hardware are complicated, at
This is higher；
4, because cooling line must be arranged, occupied space is big, reduces the volume energy density of battery entirety.
The battery pack of electric car often designs in chassis, accommodates battery pack in order to as far as possible, needing will be electric more
The volume of Chi Bao design is small as far as possible, or in some cases, other circuit blocks, air circulation component in battery pack
Meeting is introduced so that the space outside battery unit box is very narrow, this when is forced using water cooling pipeline or additional setting blower
Air is reinforced flowing to radiate, relatively difficult in design.
In addition, in general situation, battery unit box needs cool down, but winter temperature is low or other temperature compared with
Low occasion or area, when electric vehicle plays, the too low voltage or electricity that will lead to entire battery pack of the temperature of primary battery
It flows unstable or does not reach requirement, this when is when just starting, it is necessary to heat temperature raising appropriate.
In the battery pack of actual electric car, the scheme of use is to heat in water cooling pipeline to coolant liquid, by adding
The coolant liquid of heat carries out thermally conductive heating.
The program is easier to realize, can also quickly realize in several seconds under general cryogenic conditions and heat liter
Temperature.But it is first to open in the case of electric vehicle is placed on outdoor stay overnight by extremely low temperature such as the Northeast or winter
It just cannot rapidly heat up and work normally.
In addition, being arranged since coolant liquid aims at cooling, carrying out heating is also not best, and pipeline is more multiple
It is miscellaneous, there is the hidden danger of leakage, usually heats and also will affect its service life.
Summary of the invention
The present invention is to carry out to solve the above-mentioned problems, and it is an object of the present invention to provide a kind of thermoelectric cooling, heating integral type
Component, while solving the problems, such as heat dissipation and heat temperature raising.
The present invention provides a kind of thermoelectric cooling, heating unitary members characterized by comprising
Semiconductor refrigerating component intersects the array being connected in series with multiple P-type semiconductors and N-type semiconductor, this
A little P-type semiconductors and N-type semiconductor self face together, to be conductively connected both ends by metal conductor plate；
Upper heat-conducting plate, is attached in the metal conductor plate of upper end；
Lower heat-conducting plate, is attached in the metal conductor plate of upper end；And
At least be adhered to heat-conducting plate, in lower heat-conducting plate cold end hot type heat conductive pad,
Wherein, it is provided with heat-conducting pad between upper heat-conducting plate and metal conductor plate, it is lower between heat-conducting plate and metal conductor plate
Heat-conducting pad is also equipped with,
Hot type heat conductive pad, comprising:
Heat conductive pad main body, inside offers intercommunicating pore,
Electric heating part passes through intercommunicating pore and is arranged in heat conductive pad main body,
Electric heating part is used to connect with extraneous power supply heat and give heat transfer to heat conductive pad main body.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, P-type semiconductor and N-type semiconductor are arranged in determinant, and mutual gap is greater than or equal to p-type and partly leads
The volume of body, N-type semiconductor.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, wherein the sum of number of P-type semiconductor and N-type semiconductor is odd number,
The lower end of first P-type semiconductor and metal conductor plate electrical connection, as the contact of the anode connection with power supply,
The lower end of the last one P-type semiconductor and metal conductor plate electrical connection, as the contact that the cathode with power supply connects,
And pass through setting between the adjacent semiconductor between first P-type semiconductor and the last one P-type semiconductor
It is connected in the metal conductor plate of upper and lower, upper heat-conducting plate is the cold end of refrigerator at this time, and lower heat-conducting plate is the hot end of refrigerator.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, P-type semiconductor and N-type semiconductor are the consistent cuboid of size shape,
It is arranged vertically in length and breadth, and the gap of adjacent P-type semiconductor and N-type semiconductor in the longitudinal direction is greater than or equal to
The length of 1.2 times of the cuboid, the gap of adjacent P-type semiconductor and N-type semiconductor in the direction of the width are greater than or equal to
The length of 1.5 times of the cuboid.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, be adhered to heat-conducting plate, heat conductive pad on lower heat-conducting plate with a thickness of 0.2-0.5mm.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, between heat-conducting pad, lower heat-conducting plate and the metal conductor plate being arranged between upper heat-conducting plate and metal conductor plate
The heat-conducting pad of setting, be adhered to heat-conducting plate, the heat conductive pad on lower heat-conducting plate is isolation material.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, upper heat-conducting plate, lower heat-conducting plate are metal plate,
Gap between upper heat-conducting plate, lower heat-conducting plate is 0.5-1.5cm.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, strip groove is carved in the bottom surface of lower heat-conducting plate, for reinforcing air-cooled effect,
The S-shaped distribution of intercommunicating pore.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, upper heat-conducting plate, lower heat-conducting plate are aluminum alloy material,
Metal conductor plate is red metal material.
Thermoelectric cooling provided by the invention, heating unitary members, can also have the following features:
Wherein, electric heating part is the flexible knitting body of PCT heating plate or electric heating wire.
The effect and effect of invention
The thermoelectric cooling that there is provided according to the present invention, heating unitary members, because directly using semiconductor refrigerating component
Freeze, rapidly conducted heat by the cooling assembly, while cooling assembly being integrated between heat-conducting plate up and down,
Size, shape can be designed as consistent with cooling component and be almost attached on component to be cooled, convenient for design, and not
It occupies additional space (only thickness being increased).
In addition, not using circulating cooling medium, cooling velocity is fast, and weight is also mitigated, and exempts from due to being directly to freeze
In addition to the risk of leakage.
Further, electric heating part is provided in heat conductive pad, direct-electrifying fever adds the peripheral wall of battery unit box
Heat, heating is fast, and heating is rapid.Moreover, no longer additionally occupying battery pack because being that electric heating part is arranged inside heat conductive pad
Space facilitates design.
Detailed description of the invention
Fig. 1 is thermoelectric cooling in the embodiment of the present invention, the structural schematic diagram for heating unitary members；
Fig. 2 is the structural schematic diagram of thermoelectric cooler coldplate in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of semiconductor refrigerating component in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of hot type heat conductive pad in the embodiment of the present invention；And
Fig. 5 is the diagrammatic cross-section of Fig. 4.
Specific embodiment
It is real below in order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention
Example combination attached drawing is applied to be specifically addressed thermoelectric cooling of the present invention, heating unitary members.
Fig. 1 is thermoelectric cooling in the embodiment of the present invention, the structural schematic diagram for heating unitary members.
Fig. 2 is the structural schematic diagram of thermoelectric cooler coldplate in the embodiment of the present invention.
Fig. 3 is the structural schematic diagram of semiconductor refrigerating component in the embodiment of the present invention.
Fig. 4 is the structural schematic diagram of hot type heat conductive pad in the embodiment of the present invention.
Fig. 5 is the diagrammatic cross-section of Fig. 4.
Embodiment 1
As shown in Figure 1, 2, 3, thermoelectric cooling, heating unitary members include that thermoelectric cooler coldplate and hot type are led
Heat pad.
Thermoelectric cooler coldplate includes semiconductor refrigerating component 10, upper heat-conducting plate 20, lower heat-conducting plate 30.
Semiconductor refrigerating component 10, the battle array being formed by connecting including multiple P-type semiconductors 11 and 12 interleaved series of N-type semiconductor
Column, these P-type semiconductors and N-type semiconductor self face together, to be conductively connected both ends by metal conductor plate B.
Upper heat-conducting plate 20, is attached in the metal conductor plate of upper end.
Lower heat-conducting plate 30, is attached in the metal conductor plate of upper end.
Wherein, it is provided with heat-conducting pad D between upper heat-conducting plate and metal conductor plate, it is lower between heat-conducting plate and metal conductor plate
It is also equipped with heat-conducting pad D,
It is adhered to the hot type heat conductive pad of cold end in heat-conducting plate or/and lower heat-conducting plate.
Hot type heat conductive pad, including heat conductive pad main body 40 and electric heating part 50.
Heat conductive pad main body 40 inside offers intercommunicating pore 41, uses silica gel heat-conducting.
Electric heating part 50 passes through intercommunicating pore and is arranged in heat conductive pad main body.
Wherein, electric heating part is used to connect with extraneous power supply heat and give heat transfer to heat conductive pad main body.
Embodiment 2
As a kind of specific embodiment, as shown in Figure 2, wherein the sum of P-type semiconductor and the number of N-type semiconductor are
Odd number,
The upper end of first P-type semiconductor and metal conductor plate electrical connection, as the contact of the anode connection with power supply,
The lower end of the last one P-type semiconductor and metal conductor plate electrical connection, as the contact that the cathode with power supply connects,
And pass through setting between the adjacent semiconductor between first P-type semiconductor and the last one P-type semiconductor
Connected in the metal conductor plate of upper and lower, upper heat-conducting plate is the cold end of refrigerator at this time, under thermally conductive version be refrigerator hot end.
Embodiment 3
As another situation, as shown in figure 3, the sum of number of P-type semiconductor and N-type semiconductor is even number,
The lower end of first P-type semiconductor and metal conductor plate electrical connection, as the contact of the anode connection with power supply,
The lower end of the last one P-type semiconductor and metal conductor plate electrical connection, as the contact that the cathode with power supply connects,
And pass through setting between the adjacent semiconductor between first P-type semiconductor and the last one P-type semiconductor
Connected in the metal conductor plate of upper and lower, upper heat-conducting plate is the cold end of refrigerator at this time, under thermally conductive version be refrigerator hot end.
Embodiment 4
On the basis of embodiment 1-3, as shown in Figure 1, 2, 3, P-type semiconductor and N-type semiconductor are size shape one
The cuboid of cause, is arranged vertically in length and breadth, the gap of adjacent P-type semiconductor and N-type semiconductor in the longitudinal direction be greater than or
The length of the cuboid equal to 1.2 times, the gap of adjacent P-type semiconductor and N-type semiconductor in the direction of the width be greater than or
The length of the cuboid equal to 1.5 times.
Embodiment 5
On the basis of above-described embodiment 1-4, as a kind of optimization, in order to preferably conduct heat, thermal resistance, the present embodiment are reduced
The thermoelectric cooler coldplate of offer further include:
It is adhered to heat-conducting plate, the heat conductive pad 40 on lower heat-conducting plate, thickness is preferably 0.2-0.5mm.
Embodiment 6
As a kind of optimization, particularly, the heat-conducting pad that is arranged between upper heat-conducting plate and metal conductor plate, lower heat-conducting plate and
The heat-conducting pad that is arranged between metal conductor plate, be adhered to heat-conducting plate, the heat conductive pad on lower heat-conducting plate is isolation material, excellent
It is selected as silica gel.
Embodiment 7
On the basis of above-described embodiment 1-6, in order to enable thermoelectric cooler coldplate have preferable mechanical strength with
And preferable heat-conducting effect, preferably:
Upper heat-conducting plate, lower heat-conducting plate be metal plate and between gap be 0.5-1.5cm, the height of corresponding semiconductor
Also between 3.5-13.5mm, further, preferably between 3.5-5.5mm.
In terms of material, upper heat-conducting plate, lower heat-conducting plate select aluminium alloy, and metal conductor plate is that red metal material or aluminium close
Gold.
Embodiment 8
Due to being to fully rely on air to flow the air-cooled of heat dissipation in the hot end of thermoelectric cooler coldplate, so in order to enhance
Air cooling effect: it is carved with a plurality of strip groove in the bottom surface of lower heat-conducting plate, for reinforcing air-cooled effect.
Embodiment 9
In order to further increase the heat transfer area of intercommunicating pore, the preferably S-shaped distribution of intercommunicating pore.
Embodiment 10
It damages heat conductive pad in order to guarantee that the temperature of heating is unlikely to excessively high and then jeopardizes the safety of battery pack, electric heating part
Select PTC (Positive Temperature Coefficient) calandria, the further temperature control temperature selected lower than 100 DEG C
Degree.
Embodiment 11
As a preference, fixing in order to facilitate the installation of with setting, heating member is the flexible knitting body of electric heating wire, in this way
Heat conductive pad can have certain flexibility and toughness, can deform in assembly, so that assembly is easy.
Embodiment 12
Accelerate cooling heat conductive pad for thermally conductive below the battery modules of battery pack as electric car, it is preferred that lead
Heat pad main body with a thickness of 0.5-1.5mm, the section of intercommunicating pore is rectangle, the rectangle with a thickness of 0.10-0.25mm.
Such size has lower thermal resistance, can conduct heat faster.
The action and effect of embodiment
According to the thermoelectric cooling of embodiment offer, heating unitary members, because directly being come using semiconductor refrigerating component
Freeze, rapidly conducted heat by the cooling assembly, while cooling assembly being integrated between heat-conducting plate up and down,
Size, shape can be designed as consistent with cooling component and be almost attached on component to be cooled, convenient for design, and not
It occupies additional space (only thickness being increased).
In addition, not using circulating cooling medium, cooling velocity is fast, and weight is also mitigated, and exempts from due to being directly to freeze
In addition to the risk of leakage.
Further, electric heating part is provided in heat conductive pad, direct-electrifying fever adds the peripheral wall of battery unit box
Heat, heating is fast, and heating is rapid.Moreover, no longer additionally occupying battery pack because being that electric heating part is arranged inside heat conductive pad
Space facilitates design.
Further, because coldplate weight is reduced, increase battery energy density, promote the market competitiveness.
And since structure is simple, installation is easy, and the devices such as no peripheral hardware pump housing reduce additional accessory, convenient for supply of material pipe
Reason.
Above embodiment is preferred case of the invention, the protection scope being not intended to limit the invention.
Claims (10)
1. a kind of thermoelectric cooling, heating unitary members characterized by comprising
Semiconductor refrigerating component intersects the array being connected in series, these p-types with multiple P-type semiconductors and N-type semiconductor
Semiconductor and N-type semiconductor self face together, to be conductively connected both ends by metal conductor plate；
Upper heat-conducting plate is attached in the metal conductor plate of upper end；
Lower heat-conducting plate, is attached in the metal conductor plate of upper end；And
At least be adhered to the upper heat-conducting plate, in lower heat-conducting plate cold end hot type heat conductive pad,
Wherein, heat-conducting pad, the lower heat-conducting plate and the gold are provided between the upper heat-conducting plate and the metal conductor plate
Belong to and be also equipped with heat-conducting pad between conductor plate,
The hot type heat conductive pad, comprising:
Heat conductive pad main body, inside offers intercommunicating pore,
Electric heating part passes through the intercommunicating pore and is arranged in the heat conductive pad main body,
The electric heating part is used to connect with extraneous power supply to carry out heating and by heat transfer to the heat conductive pad main body.
2. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, the P-type semiconductor and the N-type semiconductor are arranged in determinant, and mutual gap is greater than or equal to institute
State the volume of P-type semiconductor, the N-type semiconductor.
3. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, wherein the sum of number of the P-type semiconductor and N-type semiconductor is odd number,
The lower end of first P-type semiconductor and metal conductor plate electrical connection, as with power supply anode connection contact,
The lower end of the last one P-type semiconductor and metal conductor plate electrical connection, as the contact that the cathode with power supply connects,
And between adjacent semiconductor between first P-type semiconductor and the last one P-type semiconductor by setting it is upper,
The metal conductor plate of lower section connects, and the upper heat-conducting plate described at this time is the cold end of refrigerator, and the lower heat-conducting plate is the heat of refrigerator
End.
4. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, the P-type semiconductor and N-type semiconductor are the consistent cuboid of size shape, are arranged vertically in length and breadth, adjacent
The cuboid of the P-type semiconductor and the N-type semiconductor gap in the longitudinal direction more than or equal to 1.2 times length,
The length of the cuboid of the gap of the adjacent P-type semiconductor and N-type semiconductor in the direction of the width more than or equal to 1.5 times
Degree.
5. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, be adhered to the upper heat-conducting plate, the heat conductive pad on lower heat-conducting plate with a thickness of 0.2-0.5mm.
6. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, heat-conducting pad, the lower heat-conducting plate and the gold being arranged between the upper heat-conducting plate and the metal conductor plate
Belong to the heat-conducting pad being arranged between conductor plate, be adhered to the upper heat-conducting plate, the heat conductive pad on lower heat-conducting plate is isolation material.
7. thermoelectric cooling according to claim 6, heating unitary members, it is characterised in that:
Wherein, the upper heat-conducting plate, the lower heat-conducting plate are metal plate,
Gap between the upper heat-conducting plate, the lower heat-conducting plate is 0.5-1.5cm.
8. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, strip groove is carved in the bottom surface of the lower heat-conducting plate, for reinforcing air-cooled effect,
The S-shaped distribution of intercommunicating pore.
9. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, the upper heat-conducting plate, lower heat-conducting plate are aluminum alloy material,
The metal conductor plate is red metal material.
10. thermoelectric cooling according to claim 1, heating unitary members, it is characterised in that:
Wherein, the electric heating part is the flexible knitting body of PCT heating plate or electric heating wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811588736.XA CN109612152A (en) | 2018-12-25 | 2018-12-25 | Thermoelectric cooling, heating unitary members |
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| CN201811588736.XA CN109612152A (en) | 2018-12-25 | 2018-12-25 | Thermoelectric cooling, heating unitary members |
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| CN110260556A (en) * | 2019-05-06 | 2019-09-20 | 武汉理工大学 | Thermoelectric cooling device and preparation method thereof |
| CN111702969A (en) * | 2020-06-15 | 2020-09-25 | 惠安洛强装修设计中心 | Efficient cutting device for thin stone machining |
| CN113381111A (en) * | 2021-05-21 | 2021-09-10 | 深圳市国威科创新能源科技有限公司 | Semiconductor electric motorcycle battery cabin thermal management system |
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| CN111702969A (en) * | 2020-06-15 | 2020-09-25 | 惠安洛强装修设计中心 | Efficient cutting device for thin stone machining |
| CN113381111A (en) * | 2021-05-21 | 2021-09-10 | 深圳市国威科创新能源科技有限公司 | Semiconductor electric motorcycle battery cabin thermal management system |
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Application publication date: 20190412 |
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| RJ01 | Rejection of invention patent application after publication |