CN209949720U

CN209949720U - UPS main control panel cooling system

Info

Publication number: CN209949720U
Application number: CN201822027850.7U
Authority: CN
Inventors: 苏世通
Original assignee: Foshan Russelda Technology Co Ltd
Current assignee: Foshan Russelda Technology Co Ltd
Priority date: 2018-12-04
Filing date: 2018-12-04
Publication date: 2020-01-14
Anticipated expiration: 2028-12-04

Abstract

The utility model relates to a UPS main control panel cooling system, including the main control panel, be equipped with the controller in the main control panel, its left side edge is equipped with radiator fan, and the right side edge is equipped with main radiating fin, and the upper surface of main radiating fin is equipped with a plurality of "T" font spouts and the temperature sensor who is used for imbedding the field effect transistor, is equipped with the radiating groove that runs through in the spout, and the lower surface of main radiating fin is equipped with the semiconductor refrigeration piece, and the hot junction surface of semiconductor refrigeration piece is equipped with vice fin. The utility model discloses can enough shorten field effect transistor installation time, can reach promptly often and reduce field effect temperature again, prevent the reverse transmission of heat that semiconductor refrigeration piece hot junction distributed out.

Description

UPS main control panel cooling system

Technical Field

The utility model relates to a heat abstractor technical field, concretely relates to UPS main control panel cooling system.

Background

Ups (uninterruptible Power supply), i.e., an uninterruptible Power supply, is a system device that connects a storage battery (mostly a lead-acid maintenance-free storage battery) with a host, and converts direct current into commercial Power through module circuits such as a host inverter. The power supply device is mainly used for providing stable and uninterrupted power supply for a single computer, a computer network system or other power electronic equipment such as an electromagnetic valve, a pressure transmitter and the like. When the commercial power input is normal, the UPS supplies the commercial power to the load for use after stabilizing the voltage, and the UPS is an alternating current type voltage stabilizer and also charges the battery in the machine; when the commercial power is interrupted (power failure in accident), the UPS immediately supplies the direct current electric energy of the battery to the load by a method of switching and converting the inverter to continuously supply 220V alternating current to the load, so that the load keeps normal work and the software and hardware of the load are protected from being damaged.

In a UPS host inverter, one or more fets of different power are typically used on the control board. The fet generates a large amount of heat during operation, and the accumulation of this heat can cause the performance of the fet and other electronic components in the UPS to deteriorate, or even burn out the fet. Therefore, in order to ensure the normal operation of the UPS, the heat therein must be dissipated. The aluminum radiator has the advantages of light weight, good radiating effect and the like, can well radiate heat of heating devices in electronic equipment, and is widely applied to inverter power supplies. The inverter heat radiator is usually in a block U shape and a single-side sawtooth shape, and the surface of the inverter heat radiator is smooth. When the screw is used for fixing the field effect tube, the field effect tube can rotate along with the screw, so that the field effect tube is easily not matched in the middle, time and labor are wasted in the installation process, and the production efficiency is low.

In order to solve the above problems, the chinese utility model patent with the publication number of CN207854363U discloses a field effect tube embedded aluminum profile heat sink. The radiator comprises two radiating fins, wherein each radiating fin comprises a first column, a second column, a connecting groove, a first groove, a second groove and radiating teeth which are mutually symmetrical, and the sizes of the first groove and the second groove are consistent with the size of a field effect tube. By embedding the field effect transistor into the groove, the field effect transistor cannot rotate along with the screw when being fixed. Therefore, the installation time of the field effect transistor can be shortened, and the working efficiency is further improved.

Although the heat sink can shorten the time for mounting the fet, the performance of the heat sink is improved by increasing the heat dissipation area with the heat dissipation teeth, and the heat dissipated by the fet cannot be quickly absorbed, and the heat dissipation performance of the heat sink needs to be further improved. Especially when the UPS load is increased or the UPS is in a full load state, the operating temperature of the fet increases rapidly, and if the heat dissipated by the fet cannot be removed promptly and rapidly, the performance of the fet will be significantly reduced, and even possibly burned out.

Another chinese utility model with an authorization publication number CN204990158U discloses a UPS heat dissipation device. The heat dissipation device comprises a radiator, a semiconductor refrigeration sheet, a fan and a controller, wherein a temperature sensor is arranged in the controller. The temperature sensor is used for monitoring the temperature of the radiator in real time, and then the controller gives a proper current to the semiconductor refrigerating sheet, so that the heat generated by the UPS working element can be timely and rapidly dissipated through the semiconductor refrigerating sheet.

However, in the UPS heat dissipation device, the semiconductor cooling fins are disposed between the heat dissipation fins of the heat dissipation device, and the heat dissipated from the hot end of the semiconductor cooling fins is easy to be reversely transferred back to the heat dissipation device, so the heat dissipation efficiency of the UPS heat dissipation device needs to be further improved.

SUMMERY OF THE UTILITY MODEL

One of the purposes of the utility model is to overcome the not enough of above-mentioned prior art, provide one kind and can enough shorten field effect transistor installation time, can reach promptly often and reduce field effect temperature again, prevent the UPS main control panel cooling system of the reverse transmission of heat that semiconductor refrigeration piece hot junction distributed out.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:

UPS main control panel cooling system, including the main control panel, be equipped with the controller in the main control panel, its left side edge is equipped with radiator fan, and the right side edge is equipped with main radiating fin, and the upper surface of main radiating fin is equipped with a plurality of "T" font spouts and the temperature sensor that are used for imbedding the field effect transistor, is equipped with the radiating groove that runs through in the spout, and the lower surface of main radiating fin is equipped with the semiconductor refrigeration piece, and the hot junction surface of semiconductor refrigeration piece is equipped with vice fin.

Preferably, the heat sink is located below the level of the main control board.

Preferably, a cooling water pipe is provided above the sub-fin.

Preferably, the sliding groove is internally provided with a mounting hole.

Preferably, heat-conducting silicone grease is arranged between the sliding groove and the field effect tube, between the main radiating fin and the semiconductor refrigerating fin and between the semiconductor refrigerating fin and the auxiliary radiating fin.

Due to the adoption of the technical scheme, compare with prior art, the utility model discloses following beneficial effect has:

1. the temperature sensor is used for detecting the temperature of the main radiating fin in real time, and when the temperature of the main radiating fin reaches a preset value, the controller gives a proper current value to the semiconductor refrigerating fin, so that the heat on the main radiating fin can be radiated through the semiconductor refrigerating fin in a short time. And the semiconductor refrigeration piece is also provided with an auxiliary radiating fin, the radiating fan is arranged on the other side of the main control panel, and when the radiating fan is started, heat accumulated at the hot end of the semiconductor refrigeration piece can be quickly dissipated through the auxiliary radiating fin, so that heat backflow is avoided.

2. The high-power elements such as field effect transistors on the main control board are intensively arranged in the sliding groove, so that the installation time of the field effect transistors can be greatly shortened, the UPS main control board can be subjected to uniform heat dissipation and cooling, and the normal operation of other working elements is ensured.

3. Therefore, the heat dissipation system not only can shorten the installation time of the field effect transistor, but also can timely and rapidly reduce the temperature of high-power elements such as the field effect transistor on the main control panel, and prevent the heat emitted by the hot end of the semiconductor refrigeration sheet from reversely transferring.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a partially enlarged view of a portion a in fig. 1.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiment of the present invention, all other embodiments that a person skilled in the art can obtain without creative work all belong to the protection scope of the present invention.

As shown in fig. 1 and 2, the UPS main control panel heat dissipation system includes a main control panel 1, a controller 2 is disposed in the main control panel 1, a heat dissipation fan 3 is disposed at a left side edge of the main control panel, a main heat dissipation plate 4 is disposed at a right side edge of the main control panel, a plurality of T-shaped chutes 5 for embedding field effect transistors and a temperature sensor 6 are disposed on an upper surface of the main heat dissipation plate 4, heat dissipation grooves 7 penetrating through the chutes 5 are disposed in the chutes 5, semiconductor cooling plates 8 are disposed on a lower surface of the main heat dissipation plate 4, and auxiliary cooling fins 9 are disposed on a surface of the semiconductor cooling plates 8. The controller 2 is electrically connected with the cooling fan 3, the temperature sensor 6 and the semiconductor refrigeration sheet 8, the cold end of the semiconductor refrigeration sheet 8 is connected with the lower surface of the main cooling sheet 4, and the hot end of the semiconductor refrigeration sheet is connected with the auxiliary cooling sheet 9.

High-power elements such as field effect transistors in the UPS system are all arranged in T-shaped chutes 5 on the main radiating fins 4. A mounting hole can be formed in the sliding groove 5, and the field effect tube substrate is fixed to the mounting hole through screws, so that the field effect tube is firmer in position.

When the heat dissipation system is installed, the main heat dissipation plate 4 is fixed to one side edge of the main control board 1. The field effect transistor is limited in the sliding groove 5, and the connecting pin of the field effect transistor is connected with the main control board 1. The heat dissipation grooves 7 on the main heat dissipation fins 4 penetrate through the left and right side walls thereof and are located below the plane of the main control board 1. Therefore, when the temperature of the whole UPS main control panel is normal, the heat dissipation fan 3 can be used for effectively dissipating heat and reducing the temperature of the main heat dissipation sheet 4.

When the UPS load increases or is in a full-load operation state, the temperature of high-power components such as fets in the UPS system increases rapidly. The temperature sensor 6 detects that the temperature of the primary heat sink 4 exceeds a predetermined threshold and sends an electrical signal to the controller 2. The controller 2 calculates according to the electric signal and then gives a proper current to the semiconductor refrigerating sheet 8, so that the heat on the main radiating sheet 4 is rapidly dissipated through the semiconductor refrigerating sheet 8. When the temperature of the main radiating fin 4 is reduced to the normal range, the controller 2 reduces the current value transmitted to the semiconductor chilling fin 8, or turns off the semiconductor chilling fin 8. The heat dissipation fan 3 and the main heat dissipation plate 4 are used for heat dissipation and temperature reduction of high-power elements such as field effect transistors in the UPS system. Therefore, the service life of the semiconductor refrigerating sheet 8 can be prolonged, and the energy consumption of the UPS system can be saved.

The fins on the sub-fin 9 form a gap passage perpendicular to the working surface of the cooling fan 3. When the heat dissipation fan 3 is started to operate, the airflow will flow through the gap channels between the heat dissipation fins on the secondary heat dissipation plate 9, so as to accelerate the heat dissipation speed of the secondary heat dissipation plate 9.

Furthermore, a cooling water pipe is arranged on the heat dissipation fins of the auxiliary heat dissipation fins 9. The cooling water pipe is used for cooling the auxiliary radiating fins, so that the radiating efficiency of the radiating system can be improved.

In the above embodiment, the heat-conducting silicone grease is coated between the chute 5 and the fet, between the main heat sink 4 and the semiconductor cooling plate 8, and between the semiconductor cooling plate 8 and the sub heat sink 9.

The above all be the utility model discloses a preferred embodiment, the utility model discloses a protection scope does not confine above-mentioned embodiment to, the all belong to the utility model discloses other technical scheme under the thinking all belong to the utility model discloses a protection scope.

Claims

UPS master control board cooling system, including the master control board, its characterized in that: the improved field effect transistor heat dissipation device is characterized in that a controller is arranged in the main control panel, a heat dissipation fan is arranged on the edge of the left side of the main control panel, a main heat dissipation piece is arranged on the edge of the right side of the main control panel, a plurality of T-shaped sliding grooves used for being embedded into a field effect transistor and a temperature sensor are arranged on the upper surface of the main heat dissipation piece, a through heat dissipation groove is formed in each sliding groove, a semiconductor refrigeration piece is arranged on the lower surface of the main heat dissipation piece, and an auxiliary heat dissipation piece.
2. The UPS main control panel heat dissipation system of claim 1, wherein: the heat dissipation groove is positioned below the horizontal plane of the main control board.
3. The UPS main control panel heat dissipation system of claim 2, wherein: and a cooling water pipe is arranged on the auxiliary radiating fin.
4. The UPS main control panel heat dissipation system of claim 3, wherein: and a mounting hole is arranged in the sliding groove.
5. The UPS main control panel heat dissipation system of any of claims 1-4, wherein: and heat-conducting silicone grease is arranged between the sliding groove and the field effect tube, between the main heat dissipation plate and the semiconductor refrigeration plate and between the semiconductor refrigeration plate and the auxiliary heat dissipation plate.