CN115793804A - Computer heat sink - Google Patents
Computer heat sink Download PDFInfo
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- CN115793804A CN115793804A CN202211160207.6A CN202211160207A CN115793804A CN 115793804 A CN115793804 A CN 115793804A CN 202211160207 A CN202211160207 A CN 202211160207A CN 115793804 A CN115793804 A CN 115793804A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The invention relates to a computer heat dissipation device, which comprises a chip radiator and a heat dissipation controller, wherein a chip heat dissipation sheet of the chip radiator is in heat conduction connection with an auxiliary heat dissipation block through a plurality of heat conduction strips, the auxiliary heat dissipation block comprises a plurality of mouth-shaped heat dissipation strips which are aligned side by side and in heat conduction connection, heat conduction strip inner circulation pipelines are arranged in the heat conduction strips, a heat dissipation sheet inner circulation pipeline is arranged in the chip heat dissipation sheet, a heat dissipation block circulation pipeline is arranged in the auxiliary heat dissipation block, the heat dissipation sheet inner circulation pipeline is communicated with the heat dissipation block circulation pipeline through the heat conduction strip inner circulation pipeline, and the heat dissipation block circulation pipeline is communicated with a circulation driver. The heat dissipation controller comprises a control unit, a temperature sensor and a circulation driver control circuit, wherein the control unit starts or closes the circulation driver through the circulation driver control circuit according to information fed back by the temperature sensor. The invention forms a graded heat dissipation scheme by intelligently controlling the temperature of the chip radiating fins, the auxiliary heat dissipation cluster block and the circulating water cooling, and has the characteristics of low noise, low heat dissipation energy consumption and the like.
Description
Technical Field
The invention relates to a computer heat dissipation device, in particular to an improved computer chip heat dissipation device, and belongs to the field of computer heat dissipation.
Background
The electronic computer can emit a large amount of heat in the work engineering, wherein the calorific capacity of computer chips and other calculation elements is particularly outstanding, the higher the computing capability of the chips is, the larger the load is, the higher the calorific capacity is, the higher the heat accumulation can generate high temperature, the overhigh temperature can influence the normal operation of the computer, the running speed is slowed down, the blue screen, the crash can occur, and other faults can be caused, and the serious person can burn out the chips or the matching circuits thereof. Therefore, heat dissipation for computers is particularly important.
At present, the most typical heat dissipation scheme to computer chip now is to utilize substances such as similar heat-conducting glue to glue the heat dissipation part on the chip, and the heat that the chip work produced distributes through the heat dissipation part, and wherein, the most common heat dissipation part is fin, radiator fan, and the normal operating condition of heat dissipation part is along with the chip gets into operating condition, and radiator fan lasts work, and is lost power until the chip. Because the radiating effect of this kind of heat dissipation scheme is limited, must adopt great powerful fan to dispel the heat, consequently must bring the problem of noise pollution, the power of fan is big more, and the fan noise is big more, and simultaneously, the fan is in normally open state, and the energy consumption is big, and the fan life-span also receives the influence, if the fan is maintained untimely, will take place the hardware damage. Moreover, in some specific application occasions, for example, under the condition that the space design requirements are high, such as a notebook computer, an all-in-one computer and the like, the high-power fan cannot meet the space design requirements.
Disclosure of Invention
The invention discloses a computer heat dissipation device, which adopts a new scheme that a chip heat radiator with improved heat dissipation efficiency is combined with a heat dissipation controller, and a chip heat dissipation sheet, an auxiliary heat dissipation cluster block and circulating water cooling form a graded heat dissipation scheme through intelligent temperature control, thereby solving the problems of high equipment noise, high fan energy consumption, short service life and occupation of dimensional space in a case, which are caused by the fact that a normally-open high-power fan is used for providing air-cooled heat dissipation in the existing scheme.
The invention discloses a computer heat dissipation device, which comprises a chip heat radiator and a heat dissipation controller, wherein the chip heat radiator comprises a chip heat dissipation sheet in heat conduction connection with a chip, the chip heat dissipation sheet is in heat conduction connection with one end of a plurality of heat conduction strips, the other end of each heat conduction strip is in heat conduction connection with an auxiliary heat dissipation collection block, each auxiliary heat dissipation collection block comprises a plurality of mouth-shaped heat dissipation strips, the mouth-shaped heat dissipation strips are aligned side by side and in heat conduction connection, heat conduction strip internal circulation pipelines are arranged in the heat conduction strips, heat dissipation strip internal circulation pipelines are arranged in the chip heat dissipation sheet, heat dissipation collection block circulation pipelines are arranged in the auxiliary heat dissipation collection block, the heat dissipation strip internal circulation pipelines are communicated with the heat dissipation collection block circulation pipelines through the heat conduction strip internal circulation pipelines, and the heat dissipation collection block circulation pipelines are communicated with a circulation driver.
The heat dissipation controller comprises a control unit, a temperature sensor and a circulating driver control circuit, wherein the temperature sensor is in heat conduction connection with a chip, the control unit judges whether the temperature of the chip exceeds a low-temperature threshold value according to information fed back by the temperature sensor, the control unit starts a circulating driver through the circulating driver control circuit according to the result that the temperature of the chip exceeds the low-temperature threshold value, and the control unit closes the circulating driver through the circulating driver control circuit according to the result that the temperature of the chip is returned to the low-temperature threshold value.
Further, the heat conduction strip inner circulation pipeline of this scheme includes inner circulation pipe A, inner circulation pipe B, heat dissipation glomeration circulation pipeline includes circulation pipe A, circulation pipe B, the cycle driver includes water tank A, water tank B, circulating water pump, water tank A passes through circulating water pump and water tank B intercommunication, water tank A communicates with the one end of circulation pipe A, the other end of circulation pipe A passes through inner circulation pipe A and communicates with the one end of the interior circulating line of fin, water tank B communicates with the one end of circulation pipe B, the other end of circulation pipe B passes through inner circulation pipe B and communicates with the other end of the interior circulating line of fin.
Furthermore, the internal circulation pipeline of the radiating fin and/or the circulation pipeline A and the circulation pipeline B are in a square-shaped pipeline structure, and the water tank A and the water tank B are sheet-shaped water storage containers with radiating side surfaces.
Furthermore, the auxiliary heat dissipation assembly is connected with the auxiliary heat dissipation fan in an air cooling mode, the heat dissipation controller further comprises an auxiliary heat dissipation fan control circuit, the control unit judges whether the chip temperature exceeds an auxiliary air cooling threshold value according to information fed back by the temperature sensor, the control unit starts the auxiliary heat dissipation fan through the auxiliary heat dissipation fan control circuit according to a result that the chip temperature exceeds the auxiliary air cooling threshold value, and the control unit returns a result that the chip temperature is within the auxiliary air cooling threshold value to close the auxiliary heat dissipation fan through the auxiliary heat dissipation fan control circuit.
Furthermore, the auxiliary heat radiation fan comprises a fan body and a fan ventilation base, wherein the fan body is in ventilation connection with the fan ventilation base, and the fan ventilation base is in ventilation connection with one end opening of the plurality of mouth-shaped heat radiation strips or is in air cooling connection with the top of the auxiliary heat radiation assembly.
Still further, a plurality of louvres have been seted up on at least one side radiating surface of the mouth type heat dissipation strip of this scheme, and the length direction equidistance interval arrangement of louvre edge mouth type heat dissipation strip.
Furthermore, the chip cooling fin is provided with a chip air cooler which comprises a chip cooling fan, the chip cooling fan is in electric control connection with the control unit through a chip cooling fan control circuit, the control unit starts the chip cooling fan through the chip cooling fan control circuit according to a result that the temperature of the chip exceeds the chip air cooling threshold, and the control unit closes the chip cooling fan through the chip cooling fan control circuit according to a result that the temperature of the chip returns to the chip air cooling threshold.
Still further, the chip air cooler of the scheme further comprises a plurality of rows of radiating fins arranged between the chip radiating fins and the chip radiating fan, and the radiating fins are in air-cooling connection with the chip radiating fan.
Still further, the chip radiator of this scheme still includes the quick-witted case radiator fan who establishes on computer machine case, and quick-witted case radiator fan passes through quick-witted case radiator fan control circuit and chip radiator fan control circuit automatically controlled connection, and quick-witted case radiator fan and chip radiator fan synchronous start or close.
Still further, the temperature sensor of this scheme includes mercury thermodetector, trigger circuit, and mercury thermodetector includes the mercury chamber that contains full mercury, and mercury chamber and survey buret intercommunication, trigger circuit include low temperature threshold trigger circuit, supplementary air-cooled threshold trigger circuit, chip air-cooled threshold trigger circuit.
The low-temperature threshold trigger circuit comprises a low-temperature threshold trigger pin A, a low-temperature threshold trigger and a low-temperature threshold trigger pin B which are sequentially and electrically connected, the low-temperature threshold trigger is electrically connected with the control unit, and the low-temperature threshold trigger pin A and the low-temperature threshold trigger pin B are arranged on two sides in the pipe wall of the measuring pipe at the near end of the stroke of the mercury expansion caused by heating.
The auxiliary air-cooling threshold triggering circuit comprises an auxiliary air-cooling threshold triggering pin A, an auxiliary air-cooling threshold trigger and an auxiliary air-cooling threshold triggering pin B which are sequentially and electrically connected, the auxiliary air-cooling threshold trigger is electrically connected with the control unit, and the auxiliary air-cooling threshold triggering pin A and the auxiliary air-cooling threshold triggering pin B are arranged on two sides in the pipe wall of the measuring pipe at the middle end of the stroke of mercury thermal expansion.
The chip air-cooling threshold trigger circuit comprises a chip air-cooling threshold trigger pin A, a chip air-cooling threshold trigger and a chip air-cooling threshold trigger pin B which are sequentially and electrically connected, the chip air-cooling threshold trigger is electrically connected with the control unit, and the chip air-cooling threshold trigger pin A and the chip air-cooling threshold trigger pin B are arranged on two sides in the far-end pipe wall of the measuring pipe along the stroke of mercury thermal expansion.
The computer heat dissipation device adopts the combination of the chip heat radiator with improved heat dissipation efficiency and the heat dissipation controller, and forms a graded heat dissipation scheme by intelligently controlling the temperature of the chip heat dissipation fins, the auxiliary heat dissipation collection block and the circulating water cooling.
Drawings
Fig. 1 is a schematic front view of a first example of a chip heat spreader.
Fig. 2 is a schematic front view of the assembly of the chip heat sink, the heat conducting bar and the auxiliary heat dissipation block.
Fig. 3 is a left side view of the assembly of the chip heat sink, heat conducting strip, and auxiliary heat sink block.
Fig. 4 is a schematic bottom view of the assembly of the chip heat sink, the heat conducting strip and the auxiliary heat sink block.
Fig. 5 is a schematic diagram of a temperature sensor.
Fig. 6 is a schematic front view of a second example of a chip heat spreader.
Wherein the content of the first and second substances,
100 is a chip heat sink, 101 is a heat sink inner circulation pipe, 110 is a heat sink fin,
200 is a heat conducting strip, 201 is an internal circulation tube A, 202 is an internal circulation tube B,
300 is an auxiliary heat dissipation block, 301 is a circulation pipe A, 302 is a circulation pipe B, 310 is a mouth-shaped heat dissipation strip, 311 is a heat dissipation hole, 320 is an auxiliary heat dissipation fan, 321 is a fan body, 322 is a fan ventilation base,
400 is a circulation driver, 410 is a water tank a, 420 is a water tank b, 430 is a circulation water pump,
500 is a temperature sensor, 501 is a mercury cavity, 502 is a measuring tube, 510 is a low-temperature threshold trigger circuit, 511 is a low-temperature threshold trigger pin a, 512 is a low-temperature threshold trigger, 513 is a low-temperature threshold trigger pin b, 520 is an auxiliary air-cooling threshold trigger circuit, 521 is an auxiliary air-cooling threshold trigger pin a, 522 is an auxiliary air-cooling threshold trigger, 523 is an auxiliary air-cooling threshold trigger pin b, 530 is a chip air-cooling threshold trigger circuit, 531 is a chip air-cooling threshold trigger pin a, 532 is a chip air-cooling threshold trigger, 533 is a chip air-cooling threshold trigger pin b.
Detailed Description
The following detailed description refers to the accompanying drawings.
As shown in fig. 1, 2 and 6, the heat dissipation device of the computer of the present invention includes a chip heat sink and a heat dissipation controller, wherein the chip heat sink includes a chip heat sink 100 in heat-conducting connection with a chip, the chip heat sink 100 is in heat-conducting connection with one end of a plurality of heat-conducting strips 200, the other end of the heat-conducting strips 200 is in heat-conducting connection with an auxiliary heat dissipation block 300, the auxiliary heat dissipation block 300 includes a plurality of mouth-shaped heat dissipation strips 310, the mouth-shaped heat dissipation strips 310 are aligned side by side and in heat-conducting connection, heat-conducting strip inner circulation pipelines are disposed in the heat-conducting strips 200, heat dissipation piece inner circulation pipelines 101 are disposed in the chip heat sink 100, heat dissipation block circulation pipelines are disposed in the auxiliary heat dissipation block 300, the heat dissipation piece inner circulation pipelines 101 are communicated with the heat dissipation block circulation pipelines through the heat-conducting strip inner circulation pipelines, and the heat dissipation block circulation pipelines are communicated with a circulation driver 400. The heat dissipation controller comprises a control unit, a temperature sensor 500 and a circulation driver control circuit, wherein the temperature sensor 500 is in heat conduction connection with the chip, the control unit judges whether the temperature of the chip exceeds a low-temperature threshold value according to information fed back by the temperature sensor 500, the control unit starts the circulation driver 400 through the circulation driver control circuit according to a result that the temperature of the chip exceeds the low-temperature threshold value, and the control unit closes the circulation driver 400 through the circulation driver control circuit according to a result that the temperature of the chip returns to the low-temperature threshold value.
According to the scheme, the chip radiator with improved radiating efficiency is combined with the radiating controller, and the chip radiating fins 100, the auxiliary radiating block 300 and the circulating water cooling form a grading radiating scheme through intelligent temperature control. When a chip, such as a cpu or a GPU, is in a low-load operating state, the heat dissipation requirement of the chip can be satisfied only by a heat dissipation scheme combining the improved chip heat sink 100 and the auxiliary heat dissipation block 300, specifically, by increasing the heat dissipation area of the chip heat sink 100 and additionally providing the auxiliary heat dissipation block 300, and connecting the two through the heat conduction strip 200, the heat dissipation area is greatly enlarged, the auxiliary heat dissipation block 300 is composed of a plurality of mouth-shaped heat dissipation strips 310, the hollow ventilation structure of the mouth-shaped heat dissipation strips 310 improves the heat dissipation efficiency, that is, the heat dissipation requirement of the chip in a low-power consumption state can be completely satisfied by the combination scheme of the chip heat sink 100 and the auxiliary heat dissipation block 300. When the chip enters a working state, the operation load of the chip is increased, the heat productivity is increased, at the moment, the temperature sensor 500 feeds the temperature measurement value back to the control unit, the control unit judges whether the received temperature value exceeds a preset low-temperature threshold value, if the temperature value exceeds the low-temperature threshold value, the circulating driver 400 is started through the circulating driver control circuit, circulating cooling liquid is enabled to flow among the chip cooling fins 100, the heat conduction strips 200 and the auxiliary heat dissipation collection blocks 300 in a circulating mode, the heat dissipation efficiency is improved, and the heat dissipation of the chip is accelerated. When the control unit detects that the temperature value returns to the low temperature threshold, the circulation driver 400 is closed through the circulation driver control circuit, so that energy consumption is saved, and the overall noise of the equipment is reduced. Therefore, this scheme is compared current scheme that adopts the radiating of normally opening high-power fan, has increased the cooling surface, has improved the radiating efficiency, utilizes the heat dissipation controller to open or close according to the change intelligent control circulation water-cooling of chip temperature simultaneously, has the noise low, and the heat dissipation power consumption reduces, saves quick-witted incasement dimension space's characteristics.
In order to realize circulating cooling, the heat conducting strip internal circulation pipeline comprises an internal circulation pipe A201 and an internal circulation pipe B202, the heat dissipation block circulation pipeline comprises a circulation pipe A301 and a circulation pipe B302, the circulation driver 400 comprises a water tank A410, a water tank B420 and a circulation water pump 430, the water tank A410 is communicated with the water tank B420 through the circulation water pump 430, the water tank A410 is communicated with one end of the circulation pipe A301, the other end of the circulation pipe A301 is communicated with one end of the heat dissipation sheet internal circulation pipeline 101 through the internal circulation pipe A201, the water tank B420 is communicated with one end of the circulation pipe B302, and the other end of the circulation pipe B302 is communicated with the other end of the heat dissipation sheet internal circulation pipeline 101 through the internal circulation pipe B202. And the circulating water pump 430 is started, and circulating cooling water sequentially circulates through the water tank A410, the circulating pipe A301, the internal circulating pipe A201, the internal circulating pipeline 101 of the radiating fin, the internal circulating pipe B202, the circulating pipe B302 and the water tank B420, so that the aim of circulating cooling is fulfilled. As shown in fig. 2, 3 and 4, the present solution uses three heat conduction bars 200, and thus has three sets of the above-mentioned circulating cooling pipelines, but the present solution is not limited to three sets, and may be other quantities meeting the design requirements. Based on the scheme, in order to improve the heat exchange efficiency and improve the heat exchange quantity of circulating cooling water and a chip, the heat exchange quantity of the circulating cooling water and the auxiliary heat dissipation assembly 300 and the heat exchange quantity of the circulating cooling water passing through the water tank and the outside, the inner circulating pipeline 101 of the heat dissipation plate and/or the circulating pipe A301 and the circulating pipe B302 are in a shape of a square-wave pipeline structure, and the water tank A410 and the water tank B420 are sheet-shaped water storage containers with heat dissipation side surfaces.
On the basis of the scheme of enhancing heat dissipation and water-cooling heat dissipation, in order to meet the requirement of better controlling the high temperature caused by heat release and avoid the damage caused by the fact that the chip exceeds a preset temperature threshold value under the heavy load running state, the scheme also introduces an auxiliary air-cooling scheme. As shown in fig. 1 and 6, the auxiliary heat dissipation block 300 is connected to the auxiliary heat dissipation fan 320 through air cooling, the heat dissipation controller further includes an auxiliary heat dissipation fan control circuit, the control unit determines whether the chip temperature exceeds the auxiliary air cooling threshold according to the information fed back by the temperature sensor 500, the control unit turns on the auxiliary heat dissipation fan 320 through the auxiliary heat dissipation fan control circuit according to the result that the chip temperature exceeds the auxiliary air cooling threshold, and the control unit turns off the auxiliary heat dissipation fan 320 through the auxiliary heat dissipation fan control circuit according to the result that the chip temperature returns to the auxiliary air cooling threshold. Specifically, when the chip enters a heavy load working state, the operational load of the chip is significantly increased, the heat productivity is increased in a surging manner, and at this time, the temperature value received by the control unit further exceeds the preset auxiliary air cooling threshold value on the basis that the temperature value exceeds the low temperature threshold value, and then the auxiliary cooling fan 320 is started through the auxiliary cooling fan control circuit, so that the cooling efficiency is improved. When the control unit detects that the temperature value returns to the auxiliary air-cooling threshold value, the auxiliary cooling fan 320 is turned off by the auxiliary cooling fan control circuit, so that the noise generated by the fan is reduced, the energy consumption is saved, and the service life of the fan is prolonged. The introduction of the auxiliary cooling fan 320 effectively improves the cooling problem of the chip under heavy load operation by additionally arranging air cooling under the condition of low requirement on the installed space, and meanwhile, when the chip is separated from the heavy load operation state or the temperature of the chip is effectively controlled, the fan can be randomly turned off to reduce noise and save energy.
Based on the above scheme, the requirement of improving the heat dissipation effect or improving the utilization of the dimensional space can be met through the reasonable arrangement of the auxiliary heat dissipation fan 320. The auxiliary heat dissipation fan 320 includes a fan body 321 and a fan ventilation base 322, the fan body 321 is connected to the fan ventilation base 322 in a ventilation manner, and the fan ventilation base 322 is connected to one end opening of the plurality of heat dissipation strips 310 in a ventilation manner or connected to the top of the auxiliary heat dissipation block 300 in an air cooling manner. As shown in fig. 1, the auxiliary heat dissipation fan 320 is disposed at the top of the auxiliary heat dissipation block 300, and the fan is opposite to the heat dissipation surface, so that the heat dissipation efficiency is high, as shown in fig. 6, the auxiliary heat dissipation fan 320 is disposed at an opening at one end of the heat dissipation strip 310, so as to draw out air in the heat dissipation strip 310, thereby facilitating heat removal, reducing the assembly height of the component, and saving the dimensional space. On the basis, on the premise of introducing the auxiliary heat dissipation fan 320, in order to improve the ventilation effect of the auxiliary heat dissipation assembly 300 and improve the heat dissipation efficiency, as shown in fig. 2, a plurality of heat dissipation holes 311 are formed on at least one side of the heat dissipation surface of the mouth-shaped heat dissipation strip 310, and the heat dissipation holes 311 are arranged at equal intervals along the length direction of the mouth-shaped heat dissipation strip 310. Whether the auxiliary heat dissipation fan 320 is disposed on the top or one side of the auxiliary heat dissipation block 300, the heat of the auxiliary heat dissipation block 300 can be promoted to be taken away by the surrounding air, and the heat dissipation effect is remarkably improved.
On the basis of the scheme of enhancing heat dissipation, water-cooling heat dissipation and assisting air cooling, in order to better control the high temperature caused by heat release and avoid damage caused by the fact that the chip exceeds a preset temperature threshold value in an overload running state, the scheme also introduces an air cooling scheme aiming at the chip. The chip cooling fin 100 is provided with a chip air cooler, the chip air cooler comprises a chip cooling fan, the chip cooling fan is electrically controlled and connected with the control unit through a chip cooling fan control circuit, the control unit starts the chip cooling fan through the chip cooling fan control circuit according to a result that the chip temperature exceeds the chip air cooling threshold value, and the control unit returns a result that the chip temperature is within the chip air cooling threshold value to close the chip cooling fan through the chip cooling fan control circuit. Specifically, when the chip enters an overload working state, the operation load of the chip is increased to the limit, the heat productivity is increased violently, at the moment, the temperature value received by the control unit further exceeds the preset chip air cooling threshold value on the basis that the temperature value exceeds the auxiliary air cooling threshold value, and then the chip cooling fan is started through the chip cooling fan control circuit, so that the cooling efficiency is improved. When the control unit detects that the temperature value returns to the air cooling threshold value of the chip, the chip cooling fan is turned off through the chip cooling fan control circuit, so that the noise generated by the fan is reduced, the energy consumption is saved, and the service life of the fan is prolonged. The introduction of the chip cooling fan effectively improves the cooling problem of the chip under overload operation by additionally arranging air cooling under the condition of low requirement on the installation space, and meanwhile, when the chip is separated from the overload operation state or the temperature of the chip is effectively controlled, the fan can be randomly turned off to reduce noise and save energy. On the basis, in order to improve the heat dissipation efficiency of the chip cooling fan, as shown in fig. 2, 3 and 4, the chip air cooler further includes a plurality of rows of cooling fins 110 disposed between the chip cooling fin 100 and the chip cooling fan, and the cooling fins 110 are connected to the chip cooling fan in an air-cooling manner. The heat dissipation fins 110 increase the heat dissipation area of the chip heat dissipation plate 100, and at the same time, an air passage is formed between the chip heat dissipation plate 100 and the chip heat dissipation fan, thereby improving the fluidity of air and enhancing the heat dissipation effect. On the basis, in order to enhance the heat convection between the air in the case and the outside air, the chip radiator further comprises a case cooling fan arranged on the computer case, the case cooling fan is electrically connected with the chip cooling fan control circuit through a case cooling fan control circuit, and the case cooling fan and the chip cooling fan are synchronously started or closed.
The scheme also discloses a temperature sensor matched with the grading heat dissipation purpose, as shown in fig. 5, the temperature sensor 500 comprises a mercury thermometer and a trigger circuit, the mercury thermometer comprises a mercury cavity 501 filled with mercury, the mercury cavity 501 is communicated with a measuring pipe 502, and the trigger circuit comprises a low-temperature threshold trigger circuit 510, an auxiliary air-cooling threshold trigger circuit 520 and a chip air-cooling threshold trigger circuit 530. The low-temperature threshold trigger circuit 510 comprises a first low-temperature threshold trigger pin 511, a second low-temperature threshold trigger pin 512 and a second low-temperature threshold trigger pin 513 which are electrically connected in sequence, the first low-temperature threshold trigger pin 511 and the second low-temperature threshold trigger pin 513 are electrically connected with the control unit, and the first low-temperature threshold trigger pin 511 and the second low-temperature threshold trigger pin 513 are arranged on two sides of the inner wall of the near end of the measuring tube 502 along the stroke of mercury thermal expansion. The auxiliary air-cooling threshold trigger circuit 520 comprises an auxiliary air-cooling threshold trigger pin A521, an auxiliary air-cooling threshold trigger 522 and an auxiliary air-cooling threshold trigger pin B523 which are sequentially and electrically connected, the auxiliary air-cooling threshold trigger 522 is electrically connected with the control unit, and the auxiliary air-cooling threshold trigger pin A521 and the auxiliary air-cooling threshold trigger pin B523 are arranged on two sides in the pipe wall of the measuring pipe 502 along the middle end of the mercury heating expansion stroke. The chip air-cooling threshold trigger circuit 530 comprises a chip air-cooling threshold trigger pin A531, a chip air-cooling threshold trigger 532 and a chip air-cooling threshold trigger pin B533 which are electrically connected in sequence, the chip air-cooling threshold trigger 532 is electrically connected with the control unit, and the chip air-cooling threshold trigger pin A531 and the chip air-cooling threshold trigger pin B533 are arranged on two sides in the pipe wall of the measuring pipe 502 along the far end of the mercury heated and expanded stroke.
The mercury absorbs the heat emitted by the chip and expands, when the temperature of the chip exceeds a low-temperature threshold, the mercury liquid level advances along the measuring tube 502, so that the low-temperature threshold trigger pin A511 and the low-temperature threshold trigger pin B513 are firstly connected, and the low-temperature threshold trigger 512 is triggered, at the moment, the control unit starts the circulating driver 400 through the circulating driver control circuit and enters a circulating water cooling mode, if the temperature of the chip returns to the low-temperature threshold, the mercury shrinks, so that the low-temperature threshold trigger pin A511 and the low-temperature threshold trigger pin B513 are disconnected, if the temperature of the chip continuously rises until the temperature of the chip exceeds an auxiliary air cooling threshold, the mercury liquid level continues advancing along the measuring tube 502, so that the auxiliary air cooling threshold trigger pin A521 and the auxiliary air cooling threshold trigger pin B523 are connected, so that the auxiliary air cooling threshold trigger is triggered, 522 is triggered, at the moment, the control unit starts the auxiliary cooling fan 320 through the auxiliary cooling fan control circuit, entering a circulating water cooling and auxiliary air cooling mode, if the chip temperature returns to the auxiliary air cooling threshold value, the mercury shrinks, so that an auxiliary air cooling threshold value trigger pin A521 and an auxiliary air cooling threshold value trigger pin B523 are disconnected, if the chip temperature continuously rises until the chip temperature exceeds the chip air cooling threshold value, the mercury liquid level continuously advances along the measuring pipe 502, so that a chip air cooling threshold value trigger pin A531 and a chip air cooling threshold value trigger pin B533 are connected, so that a chip air cooling threshold value trigger 532 is triggered, at the moment, the control unit starts a chip radiating fan and a chassis radiating fan through a chip radiating fan control circuit, entering a circulating water cooling, auxiliary air cooling, chip air cooling and chassis air cooling mode, and if the chip temperature returns to the chip air cooling threshold value, the mercury shrinks, so that the chip threshold value trigger pin A531, the chip air cooling threshold value trigger pin B531 are disconnected, the chip air-cooled threshold triggers pin b 533. Therefore, the temperature sensor disclosed by the scheme has the characteristics of simple and reliable structure, long service life, low manufacturing cost and the like.
The structures, components, and the like disclosed in the present embodiment can be implemented by general and customary means known in the art, unless otherwise specified. The computer heat dissipation device of the present invention is not limited to the disclosure of the specific embodiments, the technical solutions presented in the embodiments can be extended based on the understanding of those skilled in the art, and the simple alternatives made by those skilled in the art according to the present invention in combination with the common general knowledge also belong to the scope of the present invention.
Claims (10)
1. A computer heat dissipation device is characterized by comprising a chip heat dissipation device and a heat dissipation controller, wherein the chip heat dissipation device comprises a chip heat dissipation sheet in heat conduction connection with a chip, the chip heat dissipation sheet is in heat conduction connection with one end of a plurality of heat conduction strips, the other end of each heat conduction strip is in heat conduction connection with an auxiliary heat dissipation block, each auxiliary heat dissipation block comprises a plurality of mouth-shaped heat dissipation strips, the mouth-shaped heat dissipation strips are aligned side by side and in heat conduction connection, heat conduction strip inner circulation pipelines are arranged in the heat conduction strips, heat dissipation sheet inner circulation pipelines are arranged in the chip heat dissipation sheet, heat dissipation block circulation pipelines are arranged in the auxiliary heat dissipation block, the heat dissipation sheet inner circulation pipelines are communicated with the heat dissipation block circulation pipelines through the heat conduction strip inner circulation pipelines, and the heat dissipation block circulation pipelines are communicated with a circulation driver,
the heat dissipation controller comprises a control unit, a temperature sensor and a circulating driver control circuit, wherein the temperature sensor is in heat conduction connection with a chip, the control unit judges whether the chip temperature exceeds a low-temperature threshold value according to information fed back by the temperature sensor, the control unit starts the circulating driver through the circulating driver control circuit according to a result that the chip temperature exceeds the low-temperature threshold value, and the control unit returns a result that the chip temperature is within the low-temperature threshold value to close the circulating driver through the circulating driver control circuit according to the chip temperature.
2. The computer heat dissipation device according to claim 1, wherein the heat conduction strip internal circulation pipeline comprises an internal circulation pipe A and an internal circulation pipe B, the heat dissipation cluster circulation pipeline comprises a circulation pipe A and a circulation pipe B, the circulation driver comprises a water tank A, a water tank B and a circulation water pump, the water tank A is communicated with the water tank B through the circulation water pump, the water tank A is communicated with one end of the circulation pipe A, the other end of the circulation pipe A is communicated with one end of the internal circulation pipeline of the heat dissipation sheet through the internal circulation pipe A, the water tank B is communicated with one end of the circulation pipe B, and the other end of the circulation pipe B is communicated with the other end of the internal circulation pipeline of the heat dissipation sheet through the internal circulation pipe B.
3. The heat dissipating device for computers according to claim 2, wherein the heat dissipating inner circulation pipe and/or the first circulation pipe and the second circulation pipe are a rectangular pipe structure, and the first water tank and the second water tank are thin-plate water storage containers having heat dissipating sides.
4. The computer heat dissipation device of claim 1, wherein the auxiliary heat dissipation assembly is connected to an auxiliary heat dissipation fan in an air-cooled manner, the heat dissipation controller further comprises an auxiliary heat dissipation fan control circuit, the control unit determines whether the chip temperature exceeds an auxiliary air-cooled threshold according to information fed back by the temperature sensor, the control unit turns on the auxiliary heat dissipation fan through the auxiliary heat dissipation fan control circuit according to a result that the chip temperature exceeds the auxiliary air-cooled threshold, and the control unit turns off the auxiliary heat dissipation fan through the auxiliary heat dissipation fan control circuit according to a result that the chip temperature returns to within the auxiliary air-cooled threshold.
5. The heat dissipating device of claim 4, wherein the auxiliary heat dissipating fan comprises a fan body and a fan ventilation base, the fan body is connected to the fan ventilation base in a ventilation manner, and the fan ventilation base is connected to one end of the plurality of heat dissipating strips in a ventilation manner or connected to the top of the auxiliary heat dissipating block in an air cooling manner.
6. The heat dissipating device of claim 5, wherein at least one side of the heat dissipating surface of the heat dissipating strip has a plurality of heat dissipating holes, and the heat dissipating holes are arranged along the length direction of the heat dissipating strip at equal intervals.
7. The computer heat sink according to claim 4, wherein the chip heat sink is provided with a chip air cooler, the chip air cooler comprises a chip heat dissipation fan, the chip heat dissipation fan is electrically connected to the control unit through a chip heat dissipation fan control circuit, the control unit turns on the chip heat dissipation fan through the chip heat dissipation fan control circuit according to a result that the chip temperature exceeds the chip air-cooling threshold, and the control unit turns off the chip heat dissipation fan through the chip heat dissipation fan control circuit according to a result that the chip temperature returns to the chip air-cooling threshold.
8. The heat dissipating device of claim 7, wherein said chip air cooler further comprises a plurality of rows of cooling fins disposed between said chip cooling fins and said chip cooling fan, said cooling fins being in air-cooled communication with said chip cooling fan.
9. The computer heat sink of claim 7, wherein the chip heat sink further comprises a chassis heat sink fan disposed on the computer chassis, the chassis heat sink fan is electrically connected to the chip heat sink fan control circuit through a chassis heat sink fan control circuit, and the chassis heat sink fan and the chip heat sink fan are synchronously turned on or off.
10. The computer heat sink according to claim 7 or 9, wherein the temperature sensor comprises a mercury thermometer comprising a mercury chamber filled with mercury, the mercury chamber being in communication with the measurement tube, a trigger circuit comprising a low temperature threshold trigger circuit, an auxiliary air-cooled threshold trigger circuit, a chip air-cooled threshold trigger circuit,
the low-temperature threshold trigger circuit comprises a low-temperature threshold trigger pin A, a low-temperature threshold trigger and a low-temperature threshold trigger pin B which are electrically connected in sequence, the low-temperature threshold trigger is electrically connected with the control unit, the low-temperature threshold trigger pin A and the low-temperature threshold trigger pin B are arranged on two sides in the pipe wall of the measuring pipe at the near end of the stroke of mercury thermal expansion,
the auxiliary air-cooling threshold trigger circuit comprises an auxiliary air-cooling threshold trigger pin A, an auxiliary air-cooling threshold trigger and an auxiliary air-cooling threshold trigger pin B which are electrically connected in sequence, the auxiliary air-cooling threshold trigger is electrically connected with the control unit, the auxiliary air-cooling threshold trigger pin A and the auxiliary air-cooling threshold trigger pin B are arranged on two sides in the pipe wall of the measuring pipe at the middle end of the stroke of mercury thermal expansion,
the chip air-cooling threshold trigger circuit comprises a chip air-cooling threshold trigger pin A, a chip air-cooling threshold trigger and a chip air-cooling threshold trigger pin B which are electrically connected in sequence, the chip air-cooling threshold trigger is electrically connected with the control unit, and the chip air-cooling threshold trigger pin A and the chip air-cooling threshold trigger pin B are arranged on two sides in the pipe wall of the far end of the measuring pipe along the stroke of mercury thermal expansion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211160207.6A CN115793804A (en) | 2022-09-22 | 2022-09-22 | Computer heat sink |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211160207.6A CN115793804A (en) | 2022-09-22 | 2022-09-22 | Computer heat sink |
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| CN115793804A true CN115793804A (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211160207.6A Pending CN115793804A (en) | 2022-09-22 | 2022-09-22 | Computer heat sink |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116979664A (en) * | 2023-09-22 | 2023-10-31 | 深圳市乌托邦创意科技有限公司 | Heat abstractor of portable power source group |
| CN117457602A (en) * | 2023-12-22 | 2024-01-26 | 湘潭大学 | High-heat-flow chip packaging structure and service temperature real-time regulation and control method thereof |
-
2022
- 2022-09-22 CN CN202211160207.6A patent/CN115793804A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116979664A (en) * | 2023-09-22 | 2023-10-31 | 深圳市乌托邦创意科技有限公司 | Heat abstractor of portable power source group |
| CN116979664B (en) * | 2023-09-22 | 2023-12-19 | 深圳市乌托邦创意科技有限公司 | Heat abstractor of portable power source group |
| CN117457602A (en) * | 2023-12-22 | 2024-01-26 | 湘潭大学 | High-heat-flow chip packaging structure and service temperature real-time regulation and control method thereof |
| CN117457602B (en) * | 2023-12-22 | 2024-04-02 | 湘潭大学 | High-heat-flow chip packaging structure and service temperature real-time regulation and control method thereof |
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