CN206774522U - A kind of chip heat radiator - Google Patents
A kind of chip heat radiator Download PDFInfo
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- CN206774522U CN206774522U CN201720342931.9U CN201720342931U CN206774522U CN 206774522 U CN206774522 U CN 206774522U CN 201720342931 U CN201720342931 U CN 201720342931U CN 206774522 U CN206774522 U CN 206774522U
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Abstract
Description
技术领域technical field
本实用新型涉及芯片散热技术领域,具体为一种芯片散热装置。The utility model relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation device.
背景技术Background technique
不管是个人计算机还是中、大型计算机,各芯片产生大量热量,尤其是CPU产生的热量最大,随着运算速度的提高,各芯片产生的热量会更大,但是各芯片尤其是CPU在温度较高的情况下,会影响使用寿命,如果温度太高,则会烧坏芯片。目前,对于芯片的散热,采用风扇散热,对于运算速度大的芯片,则采用空调吹冷风的方式。这样就会造成能源的浪费,而且由于风机的寿命有限,在使用过程中,风机损坏后,导致芯片的温度迅速升高,降低使用寿命,造成计算机死机,影响工作,对于在战争、高危作业时会造成更大损失。严重时还会烧坏芯片甚至还会烧坏主板。Regardless of whether it is a personal computer or a medium and large computer, each chip generates a large amount of heat, especially the CPU generates the most heat. With the increase of computing speed, the heat generated by each chip will be greater, but each chip, especially the CPU, has a higher temperature. Under the circumstances, it will affect the service life, if the temperature is too high, it will burn the chip. At present, fans are used to dissipate heat for chips, and for chips with high computing speed, air conditioners are used to blow cold air. This will cause a waste of energy, and because the life of the fan is limited, in the process of use, after the fan is damaged, the temperature of the chip will rise rapidly, which will reduce the service life, cause the computer to crash, and affect the work. will cause greater losses. In severe cases, the chip will be burned out and even the motherboard will be burned out.
实用新型内容Utility model content
本实用新型的目的在于提供一种芯片散热装置,以解决上述背景技术中提出的问题。The purpose of this utility model is to provide a chip cooling device to solve the problems raised in the above-mentioned background technology.
为实现上述目的,本实用新型提供如下技术方案:一种芯片散热装置,包括芯片、散热架和风扇,所述芯片的上端面上贴合有水冷管,所述水冷管的上端覆盖有导热片,所述芯片的边缘安装有散热架,所述散热架的底端设置有安装板,所述散热架的端面上设置有安装架,所述散热架上嵌套有循环管,所述循环管与水冷管相互连通,所述散热架的顶端固定安装有循环泵,所述循环泵通过导管与循环管连通,所述风扇安装在散热架的一侧,所述风扇的内腔设置有马达和扇叶,所述风扇的两侧均设置有连接件,所述连接件的外壁上设置有定位螺栓。In order to achieve the above object, the utility model provides the following technical solutions: a chip heat dissipation device, including a chip, a heat dissipation frame and a fan, a water-cooled tube is attached to the upper end of the chip, and the upper end of the water-cooled tube is covered with a heat-conducting sheet , the edge of the chip is equipped with a heat dissipation frame, the bottom of the heat dissipation frame is provided with a mounting plate, the end face of the heat dissipation frame is provided with a mounting frame, and a circulation pipe is nested on the heat dissipation frame, and the circulation pipe It communicates with the water-cooling pipe, and the top of the cooling frame is fixedly installed with a circulating pump, which communicates with the circulating pipe through a conduit. The fan is installed on one side of the cooling frame, and the inner cavity of the fan is provided with a motor and As for the fan blade, connecting pieces are arranged on both sides of the fan, and positioning bolts are arranged on the outer wall of the connecting piece.
优选的,所述安装板的表面设置有螺栓孔,所述安装板设置有四组。Preferably, the surface of the mounting plate is provided with bolt holes, and the mounting plate is provided with four groups.
优选的,所述导热片为软性硅胶导热片,所述水冷管和循环管中均设置有水冷液。Preferably, the heat conduction sheet is a soft silicone heat conduction sheet, and water cooling liquid is provided in the water cooling pipe and the circulation pipe.
优选的,所述连接件上设置有滑槽,所述散热架上与风扇连接处的安装架设置有与滑槽匹配的凸块。Preferably, the connecting piece is provided with a sliding slot, and the mounting frame at the connection between the cooling frame and the fan is provided with a protrusion matching the sliding slot.
与现有技术相比,本实用新型的有益效果是:该芯片散热装置结构简单,方便实用,巧妙地将风冷与水冷相互结合,并且通过散热架的设置延长了传统的循环管,使散热效果更好,效率更高,同时,结构比较紧凑,占用空间小,安装更加方便,通过安装板的设置可直接通过螺钉在固定位置进行安装,该装置,还可以利用连接件和定位螺栓来改变风扇的位置,提高了它的灵活性和功能性。Compared with the prior art, the utility model has the beneficial effects that: the chip cooling device has a simple structure, is convenient and practical, cleverly combines air cooling and water cooling, and extends the traditional circulation pipe through the setting of the cooling frame to make the heat dissipation The effect is better, the efficiency is higher, and at the same time, the structure is relatively compact, the space occupied is small, and the installation is more convenient. Through the setting of the mounting plate, it can be directly installed at a fixed position through screws. The device can also be changed by using connectors and positioning bolts. The location of the fan improves its flexibility and functionality.
附图说明Description of drawings
图1为本实用新型整体结构示意图;Fig. 1 is a schematic diagram of the overall structure of the utility model;
图2为本实用新型主要部件位置结构示意图;Fig. 2 is a schematic diagram of the position and structure of the main components of the utility model;
图3为本实用新型风扇结构示意图;Fig. 3 is a schematic diagram of the fan structure of the utility model;
图4为本实用新型连接件结构示意图;Fig. 4 is a structural schematic diagram of the utility model connector;
图5为本实用新型安装架结构示意图;Fig. 5 is a structural schematic diagram of the utility model mounting frame;
图6为本实用新型水冷管结构示意图。Fig. 6 is a schematic structural diagram of the water cooling tube of the present invention.
图中:1风扇、2安装板、3螺栓孔、4散热架、5安装架、6循环管、7导管、8循环泵、9马达、10扇叶、11连接件、12芯片、13水冷管、14导热片、15滑槽、16凸块、17定位螺栓。In the figure: 1 fan, 2 mounting plate, 3 bolt hole, 4 heat sink, 5 mounting frame, 6 circulation pipe, 7 conduit, 8 circulation pump, 9 motor, 10 fan blade, 11 connector, 12 chip, 13 water cooling pipe , 14 heat conducting sheet, 15 chute, 16 bump, 17 positioning bolt.
具体实施方式detailed description
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
请参阅图1-6,本实用新型提供一种技术方案:一种芯片散热装置,包括芯片12、散热架4和风扇1,所述芯片12的上端面上贴合有水冷管13,所述水冷管13的上端覆盖有导热片14,用于辅助散热,所述芯片12的边缘安装有散热架4,所述散热架4的底端设置有安装板2,用于固定安装,所述安装板2的表面设置有螺栓孔3,所述安装板2设置有四组,使结构更为稳定,所述散热架4的端面上设置有安装架5,所述散热架5上嵌套有循环管6,用于循环散热,所述循环管6与水冷管13相互连通,所述导热片14为软性硅胶导热片,所述水冷管13和循环管6中均设置有水冷液,用于水冷散热,所述散热架4的顶端固定安装有循环泵8,实现水冷循环,所述循环泵8通过导管7与循环管6连通,所述风扇1安装在散热架4的一侧,所述风扇1的内腔设置有马达9和扇叶10,所述风扇1的两侧均设置有连接件11,所述连接件11上设置有滑槽15,所述散热架4上与风扇1连接处的安装架5设置有与滑槽15匹配的凸块16,用于安装风扇1,所述连接件11的外壁上设置有定位螺栓17,用于改变风扇1位置。Please refer to Figures 1-6, the utility model provides a technical solution: a chip heat dissipation device, including a chip 12, a heat dissipation frame 4 and a fan 1, and a water cooling tube 13 is attached to the upper end surface of the chip 12. The upper end of the water-cooled pipe 13 is covered with a heat conduction sheet 14 for auxiliary heat dissipation. The edge of the chip 12 is equipped with a heat dissipation frame 4, and the bottom end of the heat dissipation frame 4 is provided with a mounting plate 2 for fixed installation. The surface of the plate 2 is provided with bolt holes 3, and the mounting plate 2 is provided with four groups to make the structure more stable. The end surface of the heat dissipation frame 4 is provided with a mounting frame 5, and a loop is nested on the heat dissipation frame 5. The pipe 6 is used for circulation and heat dissipation. The circulation pipe 6 communicates with the water cooling pipe 13. The heat conducting sheet 14 is a soft silicone heat conducting sheet. Both the water cooling pipe 13 and the circulation pipe 6 are provided with water cooling liquid for For water cooling and heat dissipation, a circulation pump 8 is fixedly installed on the top of the heat dissipation frame 4 to realize water cooling circulation. The circulation pump 8 communicates with the circulation pipe 6 through a conduit 7, and the fan 1 is installed on one side of the heat dissipation frame 4. The inner cavity of the fan 1 is provided with a motor 9 and a fan blade 10, and both sides of the fan 1 are provided with a connecting piece 11, and the connecting piece 11 is provided with a chute 15, and the cooling frame 4 is connected with the fan 1 The mounting frame 5 at the position is provided with a protrusion 16 matching the sliding groove 15 for installing the fan 1 , and a positioning bolt 17 is provided on the outer wall of the connecting piece 11 for changing the position of the fan 1 .
工作原理:使用时,首先将散热架4放置在适当的位置,使芯片12处于散热架4的中心位置,将水冷管13贴合在芯片12的上表面,然后把导热片14覆盖上去,接着使用螺钉通过安装板2将散热架4固定安装好,并利用连接件11和定位螺栓17将风扇1调整到适合的位置,工作时,导热片14能高效地将芯片12内的温度传递出来,被水冷管13中的水冷液吸收,并通过循环泵8的作用下,在循环管6中实现循环散热,尤其在风扇1启动的条件下。Working principle: When in use, first place the heat sink 4 in an appropriate position so that the chip 12 is in the center of the heat sink 4, attach the water cooling tube 13 to the upper surface of the chip 12, and then cover the heat conduction sheet 14, and then Use screws to fix the heat sink 4 through the mounting plate 2, and use the connector 11 and the positioning bolt 17 to adjust the fan 1 to a suitable position. When working, the heat conduction sheet 14 can efficiently transfer the temperature inside the chip 12. It is absorbed by the water-cooling liquid in the water-cooling pipe 13, and under the action of the circulation pump 8, it realizes circulation and heat dissipation in the circulation pipe 6, especially under the condition that the fan 1 is started.
尽管已经示出和描述了本实用新型的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本实用新型的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720342931.9U CN206774522U (en) | 2017-04-02 | 2017-04-02 | A kind of chip heat radiator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720342931.9U CN206774522U (en) | 2017-04-02 | 2017-04-02 | A kind of chip heat radiator |
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| CN206774522U true CN206774522U (en) | 2017-12-19 |
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| CN201720342931.9U Expired - Fee Related CN206774522U (en) | 2017-04-02 | 2017-04-02 | A kind of chip heat radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111365940A (en) * | 2020-03-10 | 2020-07-03 | 淮北市华明工业变频设备有限公司 | A fixing device for a water-cooled radiator and a method of using the same |
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2017
- 2017-04-02 CN CN201720342931.9U patent/CN206774522U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111365940A (en) * | 2020-03-10 | 2020-07-03 | 淮北市华明工业变频设备有限公司 | A fixing device for a water-cooled radiator and a method of using the same |
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