CN217903110U

CN217903110U - Photovoltaic module quick shutoff device with good heat dissipation effect

Info

Publication number: CN217903110U
Application number: CN202221339926.XU
Authority: CN
Inventors: 虞红峰; 冯成; 邓晓帆; 李宁达
Original assignee: Shanghai Shaoneng New Energy Technology Co ltd
Current assignee: Shanghai Shaoneng New Energy Technology Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-25
Anticipated expiration: 2032-05-31

Abstract

An object of the utility model is to provide a photovoltaic module that radiating effect is good closes ware fast contains the PCB board, and the MOS pipe is installed to the PCB board, still contains the metal heat-sink. The metal heat dissipation piece comprises a heat dissipation piece which is attached to the upper end face of the MOS tube, namely a main heat generation face and used for heat dissipation. The PCB board is provided with a jack, the metal heat radiating piece comprises a plug-in sheet, and the plug-in sheet comprises a plug-in block and a butt-joint block. When the inserted sheet is connected with the PCB, the inserted block is placed in the jack of the PCB, and the abutting block abuts against the upper surface of the PCB, so that the depth position of the inserted block in the jack is controlled to control the height position of the radiating fin, the radiating fin can be quickly positioned, and the radiating fin can be tightly attached to the MOS tube. The insert block is further fixed in the jack by welding, so that the radiating fin can be tightly attached to the MOS tube for a long time. In addition, after the insertion sheet is connected with the PCB, as the insertion sheet is also made of metal, part of heat of the radiating fin can be transferred to the PCB, and a better radiating effect is achieved.

Description

Photovoltaic module quick shutoff device with good heat dissipation effect

Technical Field

The utility model relates to a photovoltaic power generation technical field, concretely relates to quick shutoff of photovoltaic module that radiating effect is good.

Background

Photovoltaic power generation technology is widely applied based on the reproducibility and cleanness of solar energy. In a general photovoltaic power generation system, a plurality of photovoltaic modules are connected in series to form a string, and then an inverter is connected to convert direct current into alternating current for grid connection. The series-connected photovoltaic modules form a high dc voltage, which can lead to personal hazards and fire accidents. The photovoltaic module shutoff device is important electronic equipment connected with a photovoltaic module, and is mainly used for quickly shutting off the photovoltaic module and preventing high-voltage accidents in a photovoltaic power generation system.

The circuit board inside the photovoltaic module shutoff device can produce heat during operation, thereby untimely heat dissipation can lead to the heat too high to scrap. The MOS tube is a main heating device and also a most main working device of the shutoff device. In order to timely dissipate heat of the MOS transistor, in the prior art, the MOS transistor is heat-dissipated by using a heat sink. Chinese patent publication No. CN206314144U discloses an MOS transistor heat dissipation device, which includes an MOS transistor, a heat sink, a PCB, a pressing member, and screws. The upper end and the lower end of the MOS tube are respectively clung to the radiator and the PCB. The upper surface of radiator is equipped with the screw hole, and it has the through-hole to apply for the casting die to run through, and the screw passes in proper order and applies for casting die, PCB board, MOS pipe and radiator for the MOS pipe compresses tightly between PCB board and radiator, and the heat conduction that the MOS pipe gived off is to the radiator. However, the scheme has the following defects in practical use: radiator, PCB board, pressure member and MOS pipe all need the trompil to pass through the screw fixation, the step is many, and efficiency is slow. In addition, the pressing piece is abutted against the surface of the radiator, so that the heat dissipation of the radiator is blocked, and the heat dissipation effect of the radiator is weakened to a certain extent.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a photovoltaic module that radiating effect is good closes ware fast, simple to operate and radiating effect are good during the fin installation.

The above technical purpose of the utility model is realized through following technical scheme:

a photovoltaic module quick shutoff device with a good heat dissipation effect comprises a PCB board, wherein the PCB board is provided with an MOS (metal oxide semiconductor) tube and further comprises a metal heat dissipation piece; the metal radiating piece comprises a radiating fin attached to the upper end face of the MOS tube and an inserting piece used for being connected with the PCB; the insertion piece comprises an insertion block and an abutting block; the PCB board contain with the jack of inserted block grafting, the butt joint piece with PCB board butt, the inserted block is through welded fastening in the jack.

Therefore, after the photovoltaic module quick shutoff device is connected with the photovoltaic module, the circuit mainly plays a role in quick shutoff, wherein the MOS tube is a key component. Meanwhile, the MOS tube is a main heating device, and is easy to heat and damage, so that the shutoff device cannot work. Therefore, it is necessary to ensure the heat of the MOS transistor to be dissipated in time to prevent burning. Therefore, in this case, the metal heat sink includes a heat sink attached to the upper end surface of the MOS transistor, i.e., the main heat generating surface, for heat dissipation. The metal heat radiating member may be made of metal such as an aluminum sheet, a copper sheet, etc., and is made of aluminum based on the molding ability and good heat radiating ability of aluminum.

For the easy to assemble fin, in the present case, the jack has been seted up to the PCB board, and metal heat dissipation spare contains the inserted sheet, and the inserted sheet contains inserted block and butt joint piece. When the inserted sheet is connected with the PCB, the inserted block is placed in the jack of the PCB, and the abutting block abuts against the upper surface of the PCB, so that the depth position of the inserted block in the jack is controlled to control the height position of the radiating fin, the radiating fin can be quickly positioned, and the radiating fin can be tightly attached to the MOS tube. The insert block is further fixed in the jack by welding, so that the radiating fin can be tightly attached to the MOS tube for a long time. In addition, after the insertion piece is connected with the PCB, as the insertion piece is made of metal, part of heat of the radiating fin can be transferred to the PCB, and a better radiating effect is achieved. To sum up, in the present case, only need trompil in advance on the PCB board, make the simple grafting of inserted sheet and PCB board again, can accomplish fixed connection through the welding at last, and can keep hugging closely for a long time, need not unnecessary fitting piece and also need not many trompils, easy to assemble when guaranteeing the radiating effect.

As the utility model discloses an optimized technical scheme contains the setting and is in the fin with between the MOS pipe, with the heat conduction silicone grease of both inseparable laminatings.

Therefore, the radiating fin and the surface of the MOS tube cannot be tightly attached in a complete sense, and the radiating effect is influenced to a certain extent. In the scheme, heat-conducting silicone grease is filled between the radiating fin and the MOS tube. Because the heat-conducting performance of the heat-conducting silicone grease is excellent, the original heat-radiating effect cannot be influenced after the heat-conducting silicone grease is used between the MOS tube and the heat radiating fin. Moreover, the heat-conducting silicone grease is a flexible substance, has certain elasticity, and can be tightly attached to the MOS tube and the radiating fin, so that the heat of the MOS tube can be more comprehensively released, and a better radiating effect is achieved.

As the utility model discloses a preferred technical scheme, both ends are connected with one respectively about the fin the inserted sheet, the MOS pipe is located two between the inserted sheet.

Therefore, the metal heat dissipation piece comprises two insertion pieces which are respectively arranged at two ends of the heat dissipation piece, and the MOS tube is positioned between the two insertion pieces. The two insertion pieces are arranged to be connected with the PCB, so that the connection is firmer on one hand; on the other hand also makes both ends homoenergetic about the fin continuously receive to MOS pipe up end promptly mainly produce the power that the heat face hugs closely, and the laminating effect is better for the radiating effect is good.

As the preferred technical scheme of the utility model, two the inserted sheet laminate respectively in MOS manages about both ends face.

Therefore, the MOS tube not only generates heat on the front side, but also has certain heat on the left and right side surfaces. The insertion pieces at the left end and the right end of the radiating fin are respectively attached to the left end face and the right end face of the MOS tube, so that the radiating of two side faces of the MOS tube is facilitated, and a better radiating effect is achieved.

As the utility model discloses a preferred technical scheme, the inserted sheet respectively with be equipped with the heat conduction silicone grease that closely laminates with both between the MOS pipe.

As the preferred technical proposal of the utility model, the thickness of the heat-conducting silicone grease is 0.5mm-1.5mm.

Therefore, when the thickness of the heat-conducting silicone grease is in the interval, the heat dissipation effect is good. In the scheme, the thickness of the heat-conducting silicone grease is 1mm.

As a preferred technical solution of the present invention, the metal heat sink includes a connecting piece connected to an upper end of the heat sink; the left end and the right end of the MOS tube are respectively provided with the insertion sheet, and the insertion sheet is sequentially provided with a plurality of positioning holes in the height direction; the two ends of the connecting sheet both comprise buckle joints, and the buckle joints are detachably buckled with the positioning holes of the two inserting sheets.

From this, both ends all install a spliced piece about the MOS pipe, and the spliced piece is equipped with a plurality of locating holes in the direction of height in proper order. The upper end of the radiating fin is connected with a connecting sheet, and the fastening joints at two ends of the connecting sheet are detachably fastened with a positioning hole on one inserting sheet respectively. On one hand, the connecting sheet can be buckled in the positioning holes at different height positions by detachable buckling, so that the height position of the radiating fin can be changed according to actual needs, and the radiating fin can be better attached to the MOS tube; on the other hand, when the radiating fins or other structures are damaged and need to be replaced, the radiating fins or other structures are convenient to replace. Simple fastening, dismounting and mounting are convenient.

As the preferred technical scheme of the utility model, the connection piece passes through spring coupling the fin.

Therefore, gaps may exist between the radiating fins and the MOS tubes according to the different sizes and models of the MOS tubes or other problems. In order to solve the above problems, in the present application, the heat sink is connected to the connecting sheet through a spring. After the radiating fins are connected with the connecting pieces through the springs, the radiating fins can be tightly attached to the MOS tubes under the action of downward elastic force provided by the springs, gaps between the radiating fins and the MOS tubes are further filled, and the radiating effect is guaranteed.

As the preferred technical proposal of the utility model, heat-conducting silicone grease which is attached with the insertion piece and the MOS tube is arranged between the insertion piece and the MOS tube; and heat-conducting silicone grease which is attached to the radiating fin and the MOS tube is arranged between the radiating fin and the MOS tube.

From this, the inserted sheet is equipped with the heat conduction silicone grease with both laminating with MOS pipe, and heat conduction silicone grease can closely laminate with both through self elastic characteristic for the heat of MOS pipe left and right sides end can distribute through the inserted sheet, has strengthened the radiating effect. And heat-conducting silicone grease is also arranged between the MOS tube and the radiating fin, so that the radiating effect is enhanced.

To sum up, the utility model discloses a technical scheme compares and has following beneficial effect in prior art:

1. the PCB board is provided with a jack, and the metal heat dissipation part comprises a plug-in sheet. When the heat dissipation fin is installed, the insertion fin is inserted into the insertion hole, and then the position is further fixed through welding, so that the heat dissipation fin can be tightly attached to the MOS tube for a long time. The metal heat radiating piece is convenient to install.

2. The heat-conducting silicone grease is used between the MOS tube and the radiating fin and can be tightly attached to the MOS tube and the radiating fin, so that the heat of the MOS tube can be released more comprehensively, and a better radiating effect is achieved.

3. The metal heat dissipation piece comprises two insertion pieces which are respectively arranged at two ends of the heat dissipation piece, and the MOS tube is positioned between the two insertion pieces. The two inserting pieces are arranged to be connected with the PCB, so that the connection is firmer on one hand; on the other hand also makes both ends homoenergetic about the fin continuously receive the power of hugging closely to MOS pipe up end (mainly producing the hot side promptly), and the laminating effect is better for the radiating effect is good.

4. The insertion pieces at the left end and the right end of the radiating fin are respectively attached to the left end face and the right end face of the MOS tube, so that the radiating of two side faces of the MOS tube is facilitated, and a better radiating effect is achieved.

5. When the insertion piece is connected with the PCB, the insertion block is placed in the jack of the PCB, and the abutting block abuts against the upper surface of the PCB, so that the depth position of the insertion block in the jack is controlled to control the height position of the radiating fin, the radiating fin can be quickly positioned, and the radiating fin is tightly attached to the MOS tube.

6. The radiating fin is connected with the connecting sheet through a spring. After the radiating fins are connected with the connecting pieces through the springs, the radiating fins can be tightly attached to the MOS tubes under the action of downward elastic force provided by the springs, gaps between the radiating fins and the MOS tubes are further filled, and the radiating effect is guaranteed.

7. The inserting sheet is sequentially provided with a plurality of positioning holes in the height direction, and the fastening joints at two ends of the connecting sheet are detachably fastened with the positioning holes at a certain proper height position respectively. On one hand, the detachable buckling connection enables the height position of the connecting sheet to be changed according to actual needs, and the connecting sheet is better attached to the MOS tube; on the other hand, when the radiating fins, the springs or other structures are damaged and need to be replaced, the radiating fins, the springs or other structures are convenient to replace.

Description of the drawings:

in order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a PCB board, a metal heat sink and a MOS transistor;

fig. 2 is a schematic view of a metal heat sink in example 1;

fig. 3 is a schematic view of a metal heat sink in example 2.

In the figure:

1. PCB board, 2, MOS pipe, 3, metal heat dissipation piece, 31, fin, 32, inserted sheet, 321, inserted block, 322, butt joint piece, 323, locating hole, 33, connecting piece, 331, buckle joint, 34, spring.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Embodiment 1, as shown in fig. 1 and 2, a photovoltaic module fast turn-off device with good heat dissipation effect includes a PCB 1, a MOS transistor 2 mounted on the PCB 1, and a metal heat sink 3.

After the photovoltaic module quick shutoff device is connected with the photovoltaic module, the circuit mainly plays a role in quick shutoff, wherein the MOS tube 2 is a key component. Meanwhile, the MOS tube 2 is a main heating device, and is easy to heat and damage, so that the turn-off device cannot work. Therefore, it is necessary to ensure that the heat of the MOS transistor 2 is dissipated in time to prevent burning. In the present embodiment, the metal heat sink 3 includes a heat sink 31 attached to the upper end surface (i.e., the main heat generating surface) of the MOS transistor 2 for dissipating heat. The metal heat sink 3 may be made of metal such as an aluminum sheet or a copper sheet, and in this embodiment, the metal heat sink 3 is made of aluminum based on the molding capability and the good heat dissipation capability of aluminum.

To facilitate the installation of the heat sink 31, in the present embodiment, the PCB board 1 is provided with a jack (not shown), and the metal heat sink 3 includes a plug-in sheet 32. When the heat sink is installed, the insertion piece 32 is inserted into the insertion hole, and then the position is further fixed by welding, so that the heat sink 31 can be tightly attached to the MOS tube 2 for a long time. In addition, after the inserting sheet 32 is connected with the PCB 1, since the inserting sheet 32 is made of metal, a part of heat of the heat sink 31 can be transferred to the PCB 1, thereby achieving a better heat dissipation effect. In conclusion, in this embodiment, only need to open a hole in advance on the PCB board 1, make the simple grafting of inserted sheet 32 and PCB board 1 again, can accomplish fixed connection through the welding at last, and can keep hugging closely for a long time, need not unnecessary fitting piece, easy to assemble when guaranteeing the radiating effect.

Specifically, the inserting piece 32 includes an inserting block 321 and an abutting block 322, the inserting block 321 is located in the inserting hole, and the abutting block 322 abuts against the PCB board 1. Therefore, the inserting sheet 32 is connected with the PCB 1, the inserting block 321 is placed in the inserting hole of the PCB 1, and the abutting block 322 abuts against the upper surface of the PCB 1, so that the depth position of the inserting block 321 in the inserting hole is controlled to control the height position of the heat sink 31, and the heat sink 31 can be quickly positioned and tightly attached to the MOS transistor 2.

Since the heat sink 31 and the surface of the MOS transistor 2 cannot be tightly attached to each other in a complete sense, the heat dissipation effect is affected to a certain extent. In the present embodiment, a heat conductive silicone grease is filled between the heat sink 31 and the MOS tube 2. Since the thermal grease has excellent thermal conductivity, the original heat dissipation effect is not affected after the thermal grease is used between the MOS tube 2 and the heat sink 31. Moreover, the heat-conducting silicone grease is a flexible substance, has certain elasticity, and can be tightly attached to the MOS tube 2 and the radiating fin 31, so that the heat of the MOS tube 2 can be more comprehensively released, and a better radiating effect is achieved.

The metal heat sink 3 includes two insertion pieces 32 respectively installed at both ends of the heat sink 31, and the mos transistor 2 is located between the two insertion pieces 32. The two inserting pieces 32 are connected with the PCB 1, so that the connection is firmer; on the other hand also makes both ends homoenergetic about fin 31 continuously receive the power of hugging closely to MOS pipe 2 up end (promptly mainly producing the hot side), and the laminating effect is better for the radiating effect is good.

Besides the positive heat generation of the heat generation, the MOS tube 2 has certain heat on the left and right sides. The insertion pieces 32 at the left end and the right end of the radiating fin 31 are respectively attached to the left end face and the right end face of the MOS tube 2, so that the radiating of the two side faces of the MOS tube 2 is facilitated, and a better radiating effect is achieved. Similarly, in order to make the insertion pieces 32 tightly fit with the MOS tube 2 and achieve a better heat dissipation effect, a heat-conducting silicone grease tightly fitting with the two insertion pieces 32 and the MOS tube 2 is provided between the two insertion pieces 32 and the MOS tube 2.

In the present embodiment, the thickness of the heat conductive silicone grease is 1mm. When the thickness of the heat-conducting silicone grease is in the interval, the heat dissipation effect is good.

Embodiment 2 differs from embodiment 1 in that, as shown in fig. 3, the metal heat sink 3 includes a connection piece 33, and the connection piece 33 is connected to the upper end surface of the heat sink 31. The left end and the right end of the MOS tube 2 are respectively provided with an insertion sheet 32, and the insertion sheet 32 is sequentially provided with a plurality of positioning holes 323 in the height direction. The fasteners 331 at the two ends of the connecting piece 33 are detachably fastened to one of the positioning holes 323 of one of the inserting pieces 32. On one hand, the connecting sheet 33 can be buckled in the positioning holes 323 at different height positions by detachable buckling, so that the height position of the radiating fin 31 can be changed according to actual needs, and the MOS tube 2 can be better attached; and on the other hand, when the radiating fins 31 or other structures are damaged and need to be replaced, the replacement is convenient. Simple fastening, dismounting and mounting are convenient.

According to the size and the model of the MOS transistor 2, or other problems, a gap may exist between the heat sink 31 and the MOS transistor 2. To solve the above problem, in the present embodiment, the heat sink 31 is connected to the connection piece 33 by the spring 34. After the heat sink 31 is connected to the connecting sheet 33 through the spring 34, the heat sink 31 can be more closely attached to the MOS transistor 2 under the downward elastic force provided by the spring 34, so that the gap between the heat sink 31 and the MOS transistor 2 is further filled, and the heat dissipation effect is ensured.

The insertion sheet 32 and the MOS tube 2 are provided with heat-conducting silicone grease which is tightly attached to the insertion sheet 32 and the MOS tube 2, and the heat-conducting silicone grease can be tightly attached to the insertion sheet 32 through the elastic characteristics of the heat-conducting silicone grease, so that the heat at the left side end and the right side end of the MOS tube 2 can be dissipated through the insertion sheet 32, and the heat dissipation effect is enhanced. And heat-conducting silicone grease is also arranged between the MOS tube 2 and the radiating fin 31 to enhance the radiating effect.

The above description is only an exemplary embodiment of the present disclosure, and the scope of the present disclosure should not be limited thereby. It is intended that all equivalent variations and modifications made in accordance with the teachings of the present disclosure be covered thereby. Embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A photovoltaic module quick shutoff device with a good heat dissipation effect comprises a PCB (printed circuit board) (1), wherein an MOS (metal oxide semiconductor) tube (2) is mounted on the PCB (1), and the photovoltaic module quick shutoff device is characterized by further comprising a metal heat dissipation part (3); the metal heat dissipation piece (3) comprises a heat dissipation piece (31) attached to the upper end face of the MOS tube (2) and an insertion piece (32) used for being connected with the PCB (1); the insertion sheet (32) comprises an insertion block (321) and an abutting block (322); PCB board (1) contain with the jack of inserted block (321) grafting, butt joint piece (322) with PCB board (1) butt, inserted block (321) through welded fastening in the jack.

2. The photovoltaic module quick turn-off device with good heat dissipation effect according to claim 1, comprising a heat-conducting silicone grease which is arranged between the heat sink (31) and the MOS tube (2) and is tightly attached to the heat sink and the MOS tube.

3. The photovoltaic module quick shutoff device with good heat dissipation effect as claimed in claim 1, wherein the left end and the right end of the heat dissipation fin (31) are respectively connected with one of the insertion pieces (32), and the MOS tube (2) is located between the two insertion pieces (32).

4. The photovoltaic module quick shutoff device with good heat dissipation effect as recited in claim 3, wherein the two insertion pieces (32) are respectively attached to the left end face and the right end face of the MOS tube (2).

5. The photovoltaic module quick shutoff device with good heat dissipation effect as claimed in claim 3, wherein heat-conducting silicone grease tightly attached to the insertion pieces (32) and the MOS tubes (2) is arranged between the insertion pieces and the MOS tubes.

6. The photovoltaic module quick shutoff device with good heat dissipation effect as claimed in claim 2, wherein the thickness of the heat-conducting silicone grease is 0.5mm to 1.5mm.

7. The photovoltaic module quick turn-off device with good heat dissipation effect as claimed in claim 1, wherein the metal heat dissipation member (3) comprises a connecting sheet (33) connected to the upper end of the heat dissipation sheet (31); the left end and the right end of the MOS tube (2) are respectively provided with the insertion sheet (32), and the insertion sheet (32) is sequentially provided with a plurality of positioning holes (323) in the height direction; both ends of the connecting sheet (33) comprise buckle joints (331) and are detachably buckled with the positioning holes (323) of the two inserting sheets (32) through the buckle joints (331).

8. The photovoltaic module quick turn-off device with good heat dissipation effect as claimed in claim 7, wherein the connecting sheet (33) is connected with the heat dissipation sheet (31) through a spring (34).

9. The photovoltaic module quick shutoff device with good heat dissipation effect as claimed in claim 7, wherein a heat-conducting silicone grease attached to the insertion piece (32) and the MOS tube (2) is arranged between the insertion piece and the MOS tube; and heat-conducting silicone grease which is attached to the radiating fins (31) and the MOS tubes (2) is arranged between the radiating fins (31) and the MOS tubes.