CN219642822U

CN219642822U - Heat dissipation device for power device and electronic equipment comprising power device

Info

Publication number: CN219642822U
Application number: CN202320436597.9U
Authority: CN
Inventors: 杨海龙; 叶忠
Original assignee: Inventchip Technology Co Ltd
Current assignee: Zhejiang Zhanxin Electronic Technology Co ltd
Priority date: 2023-03-09
Filing date: 2023-03-09
Publication date: 2023-09-05
Anticipated expiration: 2033-03-09

Abstract

A heat dissipating device for a power device and an electronic apparatus including the power device are provided, the heat dissipating device is used for being connected to one or more power devices arranged on a circuit board, the heat dissipating device comprises a heat dissipating fin, one or more pressing pieces, a front cover plate and a plurality of gaskets, the one or more pressing pieces are connected to the front cover plate, the heat dissipating fin and the gaskets are used for being connected to the circuit board, the gaskets comprise a limiting part, the limiting part comprises a limiting surface parallel to the front cover plate, the front cover plate can be clamped between the limiting surface and the heat dissipating fin, and the one or more pressing pieces can contact the one or more power devices and enable the power devices to be abutted to the heat dissipating fin.

Description

Heat dissipation device for power device and electronic equipment comprising power device

Technical Field

The present utility model relates to the field of semiconductor power devices, and more particularly, to a heat dissipation device for a power device and an electronic device including the power device.

Background

Semiconductor power devices are important electrical components for the development of modern power electronics technology, and are core devices for power conversion in the electrical industry. When the semiconductor power device works, certain heat can be generated due to the action of voltage and current. And long-time high-temperature operation can reduce the service life and the operation reliability of the semiconductor power device. Therefore, the semiconductor power device is often provided with the heat dissipation device to help the semiconductor power device to dissipate heat, control the temperature of the power device and reduce the failure rate of the power device.

The heat dissipation device of the semiconductor power device is often required to be in close contact with the power device, so that heat of the power device can be well transferred to the heat dissipation device. In the prior art, the most common connection mode is to connect a plurality of power devices to the heat dissipation device through bolts. In some application scenarios (for example, some test application scenarios) that require multiple power device disassembly and assembly, multiple screw tightening may result in sliding teeth, sliding wires, etc. The connection mode is time-consuming and labor-consuming, has low efficiency, and can also cause the problems that the bolts and the bolt holes are blocked on the heat dissipating device or the circuit board and are difficult to pull out due to sliding wires, sliding teeth and the like.

Patent CN217426728U discloses a heat dissipation structure of a power semiconductor device, which includes a heat sink and a circuit board. The radiator is positioned above the circuit board, and a plurality of radiating fins are welded on the peripheral surface of the radiator. The radiator is internally provided with a water storage cavity and a heat dissipation cavity, and the heat dissipation cavity is positioned right above the water storage cavity. The upper end of the heat dissipation cavity is fixedly provided with a heat dissipation coil pipe, the middle part of the heat dissipation cavity is fixedly provided with a heat dissipation fan, and the bottom surface of the heat dissipation cavity is provided with a miniature water pump through a screw. Threaded blind holes are formed in the left side and the right side of the upper surface of the circuit board. Through setting up the radiator on semiconductor device, the radiator can absorb the heat that semiconductor device during operation produced, and the heat after the absorption passes through heat radiation fins again and gives off, and the coolant liquid in the radiator can carry out the water-cooling to the radiator and cool down.

The heat radiation structure of the power semiconductor device disclosed by the patent of the utility model is connected with the circuit board and the power semiconductor device by using the screw, the installation process of the connection mode is complicated, and the screw and the threaded hole have the risk of slipping wires, so that the heat radiation structure is difficult to take off from the circuit board. Meanwhile, heat conduction silicone grease is smeared between the power semiconductor device and the heat dissipation structure, the performance of the silicone grease is reduced after the silicone grease is used for a long time, and the silicone grease is difficult to clean.

Disclosure of Invention

The present utility model has been made in view of the above state of the art. The utility model aims to provide a heat dissipation device for a power device and electronic equipment comprising the power device, wherein the heat dissipation device is connected with the power device simply, conveniently and easily, is easy to assemble and disassemble, can be suitable for scenes such as test application, in which the power device needs to be frequently disassembled, and can be used for better cooling and heat dissipation of the power device.

The utility model also provides electronic equipment comprising the power device, which comprises the heat dissipation device.

Embodiments of the present utility model provide a heat sink for a power device, for connecting to one or more power devices disposed on a circuit board,

the heat dissipating device comprises a heat dissipating fin, one or more compressing sheets, a front cover plate and a plurality of gaskets,

the one or more compression tabs are connected to the front cover plate, the heat dissipating fins and the pads are for connection to the circuit board,

the gasket comprises a limiting part, the limiting part comprises a limiting surface parallel to the front cover plate, the front cover plate can be clamped between the limiting surface and the radiating fins,

the one or more hold down tabs are capable of contacting the one or more power devices and abutting the power devices against the heat sink fins.

In at least one possible embodiment, the heat dissipating device further comprises a heat dissipating fan connected to the heat dissipating fin.

In at least one possible embodiment, the heat dissipating device further comprises a thermally conductive and insulating sheet,

the heat conducting insulating sheet is arranged on the surface of the radiating fin adjacent to the power device,

the power device is abutted to the heat radiating fin only via the heat conductive insulating sheet.

In at least one possible embodiment, the end of the compression plate, which is close to the power device, is further formed with an arc.

In at least one possible embodiment, the heat dissipating device further comprises a buckle, both ends of the buckle form bending parts,

the buckle can be used for connecting the radiating fins with the front cover plate.

In at least one possible embodiment, the spacer further includes a support portion sandwiched between the heat radiating fin and the circuit board.

In at least one possible embodiment, the stop portion of the spacer further comprises a ramp,

the inclined plane is connected with the limiting surface.

In at least one possible embodiment, the heat sink further comprises a back cover plate,

the back cover plate is connected to the heat radiating fins, and the back cover plate is sandwiched between the heat radiating fan and the heat radiating fins.

The embodiment of the utility model also provides electronic equipment comprising a power device, which comprises:

a circuit board;

one or more of the power devices disposed on the circuit board; and

the heat dissipation device for the power device is disclosed.

In at least one possible embodiment, one or more of the power devices stand perpendicular to the circuit board,

the heat dissipation fins and the pads are connected to the circuit board in a direction perpendicular to the circuit board,

the one or more pressing pieces press the one or more power devices to the heat radiating fins in a direction parallel to the circuit board.

Drawings

Fig. 1 is a schematic structural view of an electronic device according to an embodiment of the present utility model.

Fig. 2 is a schematic structural view of a heat dissipating device according to another embodiment of the present utility model.

Fig. 3 is a front view of a heat dissipating device according to an embodiment of the present utility model.

Fig. 4 is a schematic structural view of a gasket of a heat sink according to an embodiment of the present utility model.

Fig. 5 is a schematic structural view of a pressing sheet of a heat dissipating device according to an embodiment of the present utility model.

Description of the reference numerals

10. Circuit board

20. Power device

30. Heat dissipation device

31. Radiating fin

32. Compression sheet

321. Arc-shaped part

322. Deformation part

33. Heat radiation fan

34. Front cover plate

35. Gasket

351. Limiting part

3511. Limiting surface

3512. Inclined plane

352. Support part

36. Buckle

361. Bending part

37. Insulating heat conducting fin

38. Rear cover plate

Detailed Description

Exemplary embodiments of the present utility model are described below with reference to the accompanying drawings. It should be understood that these specific illustrations are for the purpose of illustrating how one skilled in the art may practice the utility model, and are not intended to be exhaustive of all of the possible ways of practicing the utility model, nor to limit the scope of the utility model.

Embodiments of the present utility model provide a heat sink (hereinafter sometimes simply referred to as a "heat sink") for a power device, as shown in fig. 1, one or more power devices 20 (illustratively, 4 power devices in total) may be provided on a circuit board 10 (printed circuit board, or PCB). The heat sink 30 may be disposed on the circuit board 10 and connected to the power device 20. The heat sink 30 may include heat radiating fins 31, pressing pieces 32, a heat radiating fan 33, a front cover 34, a gasket 35, a buckle 36, and an insulating heat conducting fin 37.

Here, the power device 20 may be a semiconductor power device, for example.

Specifically, as shown in fig. 1 and 3, a front cover 34 may be disposed on a surface of the heat dissipation fin 31 close to the power device 20. The bottom of the front cover 34 (the portion near the circuit board) may be recessed to leave room for the power device 20 and the hold-down tab 32. One or more compression tabs 32 may be attached to the front cover plate 34, it being understood that the compression tabs 32 may be bolted to the front cover plate 34, but the manner of attachment is not limited thereto. As shown in fig. 1, 3, and 5, the pressing piece 32 may extend from the front cover 34 toward the circuit board 10, and press the power device 20 in a direction parallel to the board surface of the circuit board 10 so that the power device 20 abuts against the heat dissipation fins 31. An end of the pressing piece 32 near the circuit board 10 may form an arc portion 321, and the arc portion 321 may contact the power device 20. It will be appreciated that the arcs 321 may facilitate the ingress of the power device 20 between the heat sink fins 31 and the hold-down tabs 32. The number of the pressing pieces 32 may be the same as the number of the power devices 20, or one longer pressing piece 32 may be used to simultaneously press a plurality of the power devices 20. Preferably, the connection position of the pressing piece 32 and the front cover 34 may be set at the contact surface of the front cover 34 and the heat dissipation fin 31. It will be appreciated that the front cover plate 34 and/or the heat sink fins 31 may be recessed to partially receive the hold-down plate 32.

Preferably, the hold-down plate 32 may be a metal material. It will be appreciated that after the power device 20 is clamped by the pressing plate 32 and the heat dissipation fins 31, the pressing plate 32 will generate a certain elastic deformation, so as to generate a certain pressing force to press the power device 20.

Preferably, as shown in fig. 5, the compressing piece may further include an arc-shaped deformation portion 322, and when the power device 20 is located between the heat dissipation fin 31 and the compressing piece 32, the deformation portion 322 may elastically deform, so that the arc-shaped portion 321 is compressed to the power device 20.

It is understood that the specific structural form of the heat dissipation fins 31 is not limited, and for example, the fin extending direction of the heat dissipation fins 31 may be parallel to the circuit board 10 or perpendicular to the circuit board 10.

Further, as shown in fig. 1 and 3, two pads 35 may be disposed on the circuit board 10, and the two pads 35 may be disposed on two sides (along a direction parallel to the front cover 34) of one or more power devices 20, respectively. As shown in fig. 4, the spacer 35 may include a stopper 351 and a support 352, the stopper 351 being formed at one end of the spacer 35 near the front cover 34. The side of the support portion 352 remote from the circuit board 10 may be connected to the heat dissipation fins 31 to form a support for the heat dissipation fins 31. For example, the heat radiating fins 31 and the support portion 352 may be connected by glue, bolts, or the like. The support 352 may have a plurality of bolt holes for connection of the spacer 35 to the circuit board 10 and/or the heat dissipating fins 31.

As shown in fig. 4, the stopper 351 may include a stopper surface 3511 and an inclined surface 3512, and the stopper surface 3511 may be formed at a bottom (a portion near the circuit board 10) of the stopper 351. The stop surface 3511 may be perpendicular to the circuit board 10 and parallel to the surface of the adjacent heat dissipating fin 31. The distance between the stop surface 3511 and the heat radiating fins 31 may be equal to or slightly greater than the thickness of the front cover plate 34. The front cover 34 may be disposed between the heat dissipation fins 31 and the limiting surface 3511, where the limiting surface 3511 and the heat dissipation fins 31 can form a limit perpendicular to the front cover 34 and parallel to the direction of the circuit board 10. The inclined surface 3512 is connected with the limiting surface 3511, and the front cover plate 34 can slide between the limiting surface 3511 and the radiating fins 31 along the inclined surface 3512, so that the front cover plate 34 can be mounted conveniently.

It is understood that the spacer 35 may not be provided with the support portion 352 and only the limit portion 351 may be left, and the circuit board 10 may be directly connected to the heat dissipation fin 31.

Preferably, an insulating heat conductive sheet 37 may be disposed between the heat dissipation fin 31 and the power device 20, and the insulating heat conductive sheet 37 may be connected to the heat dissipation fin 31. It will be appreciated that in the prior art, a ceramic spacer and a heat conductive paste (e.g., a heat conductive silicone grease) may be disposed between the heat dissipation fin 31 and the power device 20 to perform both heat conduction and insulation functions, wherein the heat conductive paste is typically applied between the ceramic spacer and the power device. The heat conducting performance of the heat conducting glue such as silicone grease can be reduced after long-time use, and meanwhile, the heat conducting glue smeared on the power device can also increase the difficulty of maintaining and replacing the power device and the heat dissipating device thereof.

It is understood that if the insulating and heat conducting sheet 37 is provided between the heat dissipating fin 31 and the power device 20 in the present utility model, only the insulating and heat conducting sheet 37 is solid, and there is no paste material such as heat conducting silicone grease. That is, the heat dissipation fin 31 may be in direct heat conductive contact with the power device 20, or the heat dissipation fin 31 may be in heat conductive contact with the power device 20 only via the insulating heat conduction sheet 37.

Preferably, the side of the heat dissipation fin 31 away from the power device 20 may be further provided with a back cover plate 38, and the back cover plate 38 may have through holes for the air flow 33 of the heat dissipation fan 33 to pass therethrough, and bolt holes passing through bolts. The heat radiation fan 33 may be connected to the back cover plate 38 and the heat radiation fins 31 by bolts.

It is understood that the heat sink 30 may be directly connected to the heat radiating fins 31 without providing the back cover plate 38. The number and positions of the heat dissipation fans 33 are not limited, and may be changed according to specific circuit board arrangement conditions. Illustratively, two heat dissipating fans 33 are provided in the figure, the heat dissipating fans 33 may be connected to the back cover 38, and the heat dissipating airflow generated by the heat dissipating fans 33 may be directed toward the power device 20.

As shown in fig. 1, 2 and 3, two bending portions 361 may be formed at two ends of the buckle 36, and a distance between the two bending portions 361 may be equal to or slightly smaller than thicknesses (in a direction perpendicular to a contact surface of the heat dissipation fin 31 and the front cover plate 34) of the heat dissipation fin 31, the front cover plate 34 and the rear cover plate 38 (only including the heat dissipation fin 31 and the front cover plate 34 if the rear cover plate is not provided). For example, the buckle 36 may be disposed on the top surface (the surface far away from the circuit board 10) of the heat dissipating device, and the two bending portions 361 are respectively buckled to the front cover 34 and the rear cover 38, and the mating pads 35 connect the front cover 34 with the heat dissipating fins 35. It will be appreciated that the specific configuration and placement of the clip 36 may vary depending on the specific arrangement of the heat sink, for example, two clips may be provided at each end of the fin. The catch 36 may also be replaced by a bolt or the like.

The following briefly describes the mounting process of the heat sink for the power device in this embodiment.

The pads 35 are first attached to the circuit board 10 (the circuit board 10 has been attached to one or more power devices 20) and the heat sink fins 31 are attached to the support portions 352 of the pads. The front cover plate 34 is placed between the stopper face 3511 of the spacer 35 and the heat dissipation fins 31, and the pressing plate 32 connected to the front cover plate 34 abuts against the power device 20 to tightly attach the power device 20 to the heat dissipation fins 31 (or the insulating heat conduction fins 37 to which the heat dissipation fins 31 are connected). The heat radiation fan 33 and the back cover 38 are connected to the heat radiation fins 31 by bolts. Finally, the front cover plate 34, the radiating fins 31 and the rear cover plate 38 are connected by the buckles 36.

In the case of frequent disassembly of the power device 20, such as in a test application, the heat dissipating device can be removed and replaced by removing the front cover 34 after removing the fastener 36 after the initial installation according to the above method. After the power device 20 is replaced, the front cover plate 34 is placed between the limiting surface 3511 of the gasket 35 and the radiating fins 31 again, and then the front cover plate 344, the radiating fins 31 and the rear cover plate 38 are connected by using the buckle, so that the connection between the radiating device and the new power device 20 can be completed.

Embodiments of the present utility model also provide an electronic device including a power device, which may include a circuit board 10, one or more power devices 20 disposed on the circuit board 10, and the aforementioned heat dissipation apparatus for the power devices. The one or more power devices 20 stand on the circuit board 10 perpendicular to the circuit board 10, the heat dissipation fins 31 and the pads 35 are connected to the circuit board 10 in a direction perpendicular to the circuit board 10, and the one or more pressing pieces 32 press the one or more power devices 20 to the heat dissipation fins 31 in a direction parallel to the circuit board 10.

It will be appreciated that the power device 20 used in the electronic apparatus is connected to the circuit board 10 in a manner perpendicular to the circuit board 10. In the case where frequent replacement of the power device is required, the power device 20 of this arrangement is easier to replace than a power device arranged parallel to the circuit board.

It can be appreciated that the heat dissipation device for a power device and the electronic device including the power device according to the embodiments of the present utility model may be applied to a scenario requiring frequent replacement of the power device, such as a test application, but the application scope is not limited thereto.

Some advantageous effects of the above-described embodiments of the present utility model are briefly described below.

(1) The heat dissipation device for the power device can simplify the assembly and disassembly processes of the power device and the heat dissipation device. The heat dissipation device is clamped on the power device by using the compression sheet and the buckle, and a traditional bolt connection mode is replaced, so that the power device and the heat dissipation device are more efficiently and conveniently assembled and disassembled. In the scene that needs frequently to change power device such as power device's test application, compare traditional bolted connection mode, use this heat abstractor can promote the power device and the connection efficiency of heat abstractor when changing power device by a wide margin. Meanwhile, the problems of screw thread slipping, thread slipping and the like can be avoided, so that the power device is difficult to take out.

(2) The heat dissipation device for the power device provided by the embodiment of the utility model uses the structure that the insulating heat conduction sheet replaces the traditional silicone grease and ceramic gasket, and avoids performance degradation caused by long use time of heat conduction glue such as silicone grease. Meanwhile, the problem that the heat conduction silicone grease is adhered to the power device and the heat dissipation device and is difficult to clean can be avoided.

It is to be understood that in the present utility model, when the number of parts or members is not particularly limited, the number may be one or more, and the number herein refers to two or more. For the case where the number of parts or members is shown in the drawings and/or described in the specification as a specific number such as two, three, four, etc., the specific number is generally illustrative and not restrictive, it can be understood that a plurality, i.e., two or more, but this does not mean that the present utility model excludes one.

It should be understood that the above-described embodiments are merely exemplary and are not intended to limit the present utility model. Those skilled in the art can make various modifications and changes to the above-described embodiments without departing from the scope of the present utility model.

Claims

1. A heat sink for power devices for connection to one or more power devices disposed on a circuit board,

it is characterized in that the heat dissipating device comprises a heat dissipating fin, one or more compressing sheets, a front cover plate and a plurality of gaskets,

2. The heat sink for a power device of claim 1, further comprising a heat dissipating fan connected to the heat dissipating fin.

3. The heat sink for a power device according to claim 1, further comprising a heat conductive insulating sheet,

4. The heat dissipating device for a power device of claim 1, wherein an end of the pressing piece that is close to the power device is further formed with an arc.

5. The heat sink for a power device according to claim 1, further comprising a buckle, both ends of the buckle forming a bending portion,

6. The heat dissipating apparatus for a power device of claim 1, wherein the spacer further comprises a support portion sandwiched between the heat dissipating fin and the circuit board.

7. The heat sink for a power device of claim 1, wherein the spacing portion of the spacer further comprises a chamfer,

the inclined plane is connected with the limiting surface.

8. The heat sink for a power device of claim 2, further comprising a back cover plate,

9. An electronic device including a power device, comprising:

a circuit board;

one or more of the power devices disposed on the circuit board; and

a heat dissipating device for a power device according to any one of claims 1 to 8.

10. An electronic device comprising a power device according to claim 9, wherein,

one or more of the power devices are vertically arranged on the circuit board perpendicular to the circuit board,