CN220068105U - Electronic element heat radiation module and driving power supply module - Google Patents

Abstract

The utility model discloses an electronic element heat radiation module and a driving power supply module, and belongs to the technical field of electronic equipment heat radiation. The electronic component heat radiation module is used for assembling an electronic component on a heat radiation fin, the heat radiation fin comprises a bottom plate and two vertical plates, the bottom plate is connected with the two vertical plates to form a semi-enclosed structure, and the electronic component heat radiation module comprises: a connection plate formed on the inner side of any one of the risers; and the clamping component is matched with the connecting plate, so that the electronic element can be tightly attached to the connecting plate, and a heat dissipation channel is formed between the electronic element and the vertical plate in the vertical direction. The module comprises the connecting plate and the clamping component, the connecting plate extends in the transverse direction of the vertical plate, the distance between the electronic element and the vertical plate of the radiating fin is reduced, the electronic element is in a vertical state and can be tightly attached to the connecting plate, no gap exists between the electronic element and the connecting plate, the heat transfer efficiency is high, and a good radiating effect is achieved.

Description

Electronic element heat radiation module and driving power supply module

Technical Field

The utility model belongs to the technical field of electronic equipment heat dissipation, and particularly relates to an electronic element heat dissipation module and a driving power supply module, wherein an electronic element is a MOS heat source, a bridge stack, a diode, a triode or an IGBT.

Background

In the current rectifier driving power supply module in the electronic industry, a large amount of heat is generated by an internal power device, therefore, a corresponding heat dissipation structure is required to be arranged for heat dissipation, and besides, individual high-power electronic components (semiconductor power devices such as MOS heat sources, bridge stacks, triodes, IGBTs or diodes) are required to be individually designed with heat dissipation fins and fixed on the electronic components, so that the operation is complex in the manufacturing process, and the production and the processing are inconvenient.

Based on the above, the existing high-power electronic component is fixedly assembled by adopting a PCB, and then the PCB is covered with a radiating fin and directly connected with the radiating fin, so that a radiating channel is formed. For example, chinese patent document CN201920750709.1 discloses a circuit board for heat dissipation of a power device, which comprises a PCB board, a radiator and a power device, wherein the PCB board and the power device are both mounted on the radiator and the PCB board and the power device are located on the same side of the radiator, a pin is provided on the power device, an electrical contact is provided on the PCB board, the PCB board and the power device are connected with the electrical contact through the pin to form an electrical connection, the radiator is mounted and placed horizontally with the PCB board and the power device, and the whole module is miniaturized due to the thickness of the whole circuit board.

As further disclosed in chinese patent document CN202022818788.0, a layout structure of a PCB of a power module for a treadmill includes a PCB extending transversely and an electrical component set disposed on an upper surface of the PCB, the electrical component set including a transformer, a first transistor, and a second transistor; the transformer is arranged on the upper surface of the PCB in the middle, and a first heat dissipation support aluminum plate and a second heat dissipation support aluminum plate which are vertically arranged are respectively arranged on the left side and the right side of the upper surface of the PCB; the transformer is positioned in an area between the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate, and heat dissipation gaps are reserved among the transformer, the first heat dissipation support aluminum plate and the second heat dissipation support aluminum plate; the first transistor and the second transistor are respectively arranged on the inner side surfaces of the first heat dissipation supporting aluminum plate and the second heat dissipation supporting aluminum plate, and the first transistor, the second transistor and the transformer are arranged at intervals. The structure of this patent is favorable to the heat dissipation of transformer, reduces the influence of heat to the electrical component on the PCB board, increases the life of PCB board, but adopts the screw to lock electronic component on first heat dissipation support aluminum plate, second heat dissipation support aluminum plate, is unfavorable for improving production efficiency.

In the in-service use, in order to play insulating effect, generally need be provided with Mylar film or other interlayer between PCB board and radiating bottom plate and keep apart to play insulating effect, high-power electronic component can't direct contact with the bottom plate of fin, heat transfer efficiency is low, need by screw fixation fin and PCB board when production simultaneously, has increased production personnel's operation requirement, has reduced production efficiency.

In order to solve the above-mentioned problems, for example, chinese patent document CN202122466086.5 discloses an integrated device and power motherboard for fixing a plurality of MOS tubes distributed along a line, wherein the device is used for fixing a plurality of MOS tubes distributed along a same direction, and includes a mounting plate and an integrated fixing member, the mounting plate is parallel to a plane extending in the same direction with the plurality of MOS tubes and keeps a predetermined distance from the plane, a limit structure is disposed on a side surface of the mounting plate near the MOS tubes, the integrated fixing member includes a connecting member and a plurality of fastening structures disposed on the same side of the connecting member, wherein the connecting member is matched with the limit structure, and the plurality of fastening structures are respectively matched with the plurality of MOS tubes, so that after the integrated fixing member is fixed to the limit structure through the connecting member, the plurality of fastening structures can fasten the plurality of MOS tubes respectively. The device can improve the work efficiency of fixed a plurality of MOS pipes to a certain extent greatly, but this card solid structure can not be with electronic component and the effective laminating of heat dissipation, probably exists the gap between the two, causes heat transfer efficiency lower, influences high-power electronic component's life.

Disclosure of Invention

1. Problems to be solved

The utility model aims to provide the electronic element heat radiation module and the driving power supply module, which are beneficial to the heat radiation of the electronic element, thereby reducing the influence of heat on other electric elements on the PCB and prolonging the service life of the PCB.

2. Technical proposal

In order to solve the problems, the technical scheme adopted by the utility model is as follows:

the utility model relates to an electronic element heat radiation module, which is used for assembling an electronic element on a heat radiation fin, wherein the heat radiation fin comprises a bottom plate and two vertical plates, and the bottom plate is connected with the two vertical plates to form a semi-enclosed structure, and the electronic element heat radiation module comprises:

a connection plate formed on the inner side of any one of the risers;

and the clamping component is matched with the connecting plate, so that the electronic element can be tightly attached to the connecting plate, and a heat dissipation channel is formed between the electronic element and the vertical plate in the vertical direction.

In one possible implementation manner of the utility model, the connecting plate comprises a base and a backup plate, wherein the base is fixedly connected with the vertical plate, two sides of the backup plate are respectively provided with a joint surface and a clamping surface, and the perpendicularity of the joint surface is required to be 90+/-0.1 degrees; the clamping surface is provided with a convex edge near the inner side, and the contour line of the convex edge is formed by connecting an inclined surface and an arc surface; the engagement member has an elastic head formed with a flange that mates with the rib.

In one possible embodiment of the present utility model, the bonding surface is uniformly formed with bonding grooves for accommodating electronic components, wherein the width of the bonding grooves is greater than the width of the electronic components.

In one possible embodiment of the utility model, the height of the back plate is matched to the height of the electronic component.

In one possible implementation manner of the present utility model, the lowest position of the arc surface is located on the same horizontal plane as the vertical center line of the backup plate.

In one possible implementation mode of the utility model, a U-shaped ruler block is arranged in the fitting groove; the ruler and compass block is made of aluminum materials.

In one possible implementation manner of the utility model, the clamping component and the connecting plate are of a split structure, and the clamping component is made of stainless steel; the material quality of the connecting plate is consistent with that of the radiating sheet.

Another object of the present utility model is to provide a driving power module, comprising:

a PCB board;

a plurality of electronic elements arranged on the PCB;

and the electronic element heat dissipation module.

In one possible embodiment of the present utility model, a rear slot is formed at the inner lower side of the riser, and the PCB is fixed to the heat sink by the slot.

In one possible embodiment of the present utility model, an insulating material is disposed between the PCB board and the chassis.

In one possible embodiment of the present utility model, the PCB is fixed to the base plate by screws.

3. Advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

the electronic element heat radiation module comprises the connecting plate and the clamping part, wherein the connecting plate extends in the transverse direction of the vertical plate, so that the distance between the electronic element and the vertical plate of the radiating fin is reduced, the electronic element is in a vertical state and can be tightly attached to the connecting plate, no gap exists between the electronic element and the connecting plate, the heat transfer efficiency is high, the heat radiation of the electronic element is facilitated, the influence of heat on other electrical elements on the PCB is reduced, and the service life of the PCB is prolonged; meanwhile, the pin is not pulled during installation, so that the cracking of a pin welding spot is not easy to occur, and the quality of the PCB is ensured.

Drawings

FIG. 1 is a schematic diagram of a heat dissipation structure of an electronic device according to the prior art;

FIG. 2 is a schematic diagram of a heat dissipation module for electronic devices according to the present utility model;

FIG. 3 is a schematic perspective view of a heat dissipation module for electronic devices according to another embodiment of the utility model;

FIG. 4 is a front view of a heat dissipating module for electronic components according to the present utility model;

fig. 5 is an enlarged view of a portion a of fig. 4;

FIG. 6 is a schematic perspective view of a driving power module according to the present utility model;

FIG. 7 is a schematic view of another perspective view of the driving power module according to the present utility model;

fig. 8 is a front view of the driving power module of the present utility model.

10. A heat dissipation module; 11. a heat sink; 111. a bottom plate; 112. a riser; 113. a slot; 12. a connecting plate; 121. a base; 122. a backup plate; 123. a bonding surface; 124. a clamping surface; 125. a rib; 126. an inclined surface; 127. an arc surface; 128. a bonding groove; 129. ruler blocks; 13. an engaging member; 131. a flange;

20. an electronic component;

30. and a PCB board.

Detailed Description

Exemplary embodiments of the present utility model are described in detail below. While these exemplary embodiments are described in sufficient detail to enable those skilled in the art to practice the utility model, it is to be understood that other embodiments may be realized and that various changes to the utility model may be made without departing from the spirit and scope of the utility model. The following more detailed description of the embodiments of the utility model is not intended to limit the scope of the utility model, as claimed, but is merely illustrative and not limiting of the utility model's features and characteristics in order to set forth the best mode of carrying out the utility model and to sufficiently enable those skilled in the art to practice the utility model. Accordingly, the scope of the utility model is limited only by the attached claims.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. The following detailed description and example embodiments of the utility model are described.

As shown in fig. 1, in the prior art, the electronic component 20 is fixed on the lower end surface (i.e. the bottom surface) of the PCB 30, then the electronic component 20 is attached to the bottom plate 111, and an insulating material must be disposed in the middle to realize isolation, so as to prevent the problems of short circuit of the PCB, etc., however, if the electronic component 20 is vertically disposed, when the pins of the electronic component 20 are soldered on the PCB 30 according to the design requirement, the pins cannot be completely close to the edge of the PCB, so that the electronic component 20 is attached to the surface of the heat sink 11 in an inclined manner, on one hand, there is a gap between the electronic component 20 and the heat sink 11, which cannot be in close contact, resulting in poor heat dissipation effect; on the other hand, in the process of attaching and mounting, the pins of the electronic component 20 may be pulled by external force, so that the soldering points of the pins are cracked, and quality problems are caused.

In view of the above problems, as shown in fig. 2 to 8, the inventor of the present utility model devised an electronic component heat dissipation module 10 of the present utility model, where the electronic component 20 includes, but is not limited to, a MOS heat source, a bridge stack, a diode, a triode, or an IGBT for assembling the electronic component 20 on the heat sink 11, the heat sink 11 includes a bottom plate 111 and two vertical plates 112, the heat sink 11 is preferably made of aluminum, and in some embodiments, the heat sink 11 may be replaced by other materials with higher thermal conductivity coefficients, such as copper alloy, silver alloy, etc., and the bottom plate 111 of the present utility model is connected with the two vertical plates 112 to form a semi-surrounding structure; a plurality of heat radiating fins (not shown) are formed on the outer side surfaces of the bottom plate 111 and the vertical plate 112 to enhance the heat radiation effect.

As can be seen from the accompanying drawings, the electronic component heat dissipation module 10 of the present embodiment includes: a connection plate 12 formed on the inner side of any one of the risers 112, or a connection plate 12 formed on the inner side of both risers 112 according to the use requirement; the fastening member 13, which is engaged with the connection plate 12, allows the electronic component 20 to be closely attached to the connection plate 12, and forms a heat dissipation path (heat transfer and dissipation direction) with the riser 112 in the vertical direction.

The connecting plate 12 extends in the transverse direction of the vertical plate 112, so that the distance between the electronic element 20 and the vertical plate 112 of the radiating fin 11 is reduced, and the electronic element 20 is in a vertical state and can be tightly attached to the connecting plate 12, so that no gap exists between the electronic element 20 and the connecting plate, the heat transfer efficiency is high, and a better radiating effect is achieved; meanwhile, the pin is not pulled during installation, so that the cracking of the welding spot of the pin is not easy to occur, and the quality of the PCB 30 is ensured.

In addition, the insulating material is not added between the PCB 30 and the bottom plate 111, so that the PCB 30 is suspended (supported by the insulating gasket), and the heat dissipation effect is enhanced.

It should be noted that, the fastening member 13 and the connecting plate 12 may be in a split structure, the fastening member 13 is made of stainless steel, spring steel, or the like, and the optimal width of the fastening member 13 is matched with the width of the electronic component 20; the material of the connecting plate 12 is the same as that of the heat sink 11. As shown in fig. 2 to 5, the specific connecting plate 12 includes a base 121 and a backup plate 122, in the actual production and processing process, the connecting plate 12 may be integrally formed with the heat sink 11, or may be fixed by subsequent welding, etc., the base 121 and the riser 112 are fixedly connected, two sides of the backup plate 122 respectively form a bonding surface 123 and a clamping surface 124, and a great number of experiments are performed to obtain that the perpendicularity requirement of the bonding surface 123 is 90±0.1°, so as to ensure bonding tightness, and in addition, the surface of the bonding surface 123 may be coated with a heat conducting adhesive with a high heat conductivity coefficient (25 to 50 w/(m·k)).

However, during use, since expansion (aluminum alloy with an expansion coefficient of 23.8×0.000001/°c) is generated when the bonding surface 123 is heated (that is, when the temperature of the aluminum alloy with a length of 42.2mm increases by 100 ℃, the length becomes 42.2+ (100×23.8×0.000001) = 42.20238 mm), a large gap appears between the bonding surface 123 and the electronic component 20, and the effect of heat transfer decreases, the inventors devised that a rib 125 is formed on the inner side of the engaging surface 124, the contour line of the rib 125 is formed by connecting the inclined surface 126 and the circular arc surface 127, and the engaging member 13 has an elastic head, and the elasticity can be understood as an ability to recover the original shape, so that the clamping force is formed on the electronic component 30 by using the engaging member 13. The flange 131 is formed on the head and matched with the convex rib 125, so that the head of the buckle part 13 is clamped between the connecting plate 12 and the vertical plate 112, the convex rib 125 is used for limiting, the shake of the buckle part 13 is avoided, even if slight expansion occurs, the electronic element 20 can be tightly attached to the attaching surface 123 under the action of clamping force, the heat transfer efficiency is improved, and the best heat dissipation effect is achieved.

For the specific setting position of the connecting plate, the inventor finds that the setting position is positioned at the middle lower part of the vertical plate 112 through a plurality of experiments and path analysis of final heat transfer emission, and the preferred position is between 1/3 and 3/7 of the height of the vertical plate 112, and in the range, the heat of the electronic component is transferred from the connecting plate to the vertical plate of the radiating fin and then is transferred to the upper end of the vertical plate and the connected bottom plate; in addition, through technical analysis, it is known that air convection exists in the whole heat dissipation module, for example, air is blown into the space between the PCB 30 and the bottom plate 111 by using a fan of the driving power module, after the inlet air passes through the turbulence effect of the connecting plate arranged at the position, stable rotational flow can be formed, the Reynolds number is effectively improved, and the air boundary layer on the surface of the electronic element can be effectively broken, so that the heat exchange effect is enhanced, and the heat exchange efficiency is improved.

The manufacturing method of the electronic element heat radiation module 10 of the utility model comprises the steps of firstly manufacturing the heat radiation fins 11, forming the connecting plate 12 by adopting a linear cutting or other modes achieving the same effect, then pressing the shape outlines of the bottom plate 111 and the vertical plate 112 by a bending die, and controlling the verticality to be 90+/-0.1 DEG in the pressing process; the electronic component 20 is attached to the connection board 12 and is engaged and fixed by the engaging member 13.

Further, in order to improve the bonding tightness of the electronic component 20, the bonding surface 123 is uniformly formed with bonding grooves 128 for accommodating the electronic component 20, wherein the width of the bonding grooves 128 is greater than that of the electronic component 20, and the surface of the bonding grooves 128 can be coated with a thermal conductive adhesive with a high thermal conductivity coefficient (25-50 w/(m·k)), and the thermal conductive adhesive has a good thermal conductive effect.

As shown in fig. 4, the verticality of the present embodiment is 90.05 ° because of the requirement of the machining precision, especially 90±0.1°, and the height of the backup plate 122 is optimally designed to match the height of the electronic component 20.

In addition, in order to improve the uniformity and stability of the stress of the electronic component 20 during the engagement process, the force application point of the fastening member 13 is preferably located at the center of the electronic component 20, so that the lowest position (the lowest point of the circular arc) of the circular arc surface 127 is located on the same horizontal plane as the vertical center line (horizontal center line) of the backup plate 122.

For some more specific electronic components 20, a U-shaped ruler block 129 may be disposed in the fitting groove 128; the ruler block 129 is made of aluminum materials, and the ruler block 129 can be used for finely adjusting the position of the electronic element 20 transversely, so that the contact reliability is ensured.

The present utility model also provides a driving power module, comprising: a PCB 30; a plurality of electronic components 20 disposed on the PCB 30; and the above-mentioned electronic component heat dissipation module 10. In order to facilitate the installation of the PCB 30, a rear slot is formed at the inner lower side of the riser 112, and the PCB 30 is fixed to the heat sink 11 by the slot.

In fig. 8, an insulating material is disposed between the PCB 30 and the bottom plate 111, and the insulating material may be a mylar sheet, a rubber gasket, or the like, and then the PCB 30 is fixed to the bottom plate 111 by a screw, or may be fixed by other alternative manners, such as a clamping connection, or the like.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (10)

1. An electronic component heat dissipation module for assemble electronic component (20) on fin (11), fin (11) include bottom plate (111) and two riser (112), bottom plate (111) are connected with two riser (112) and are constituteed half surrounding structure, its characterized in that includes:

a connection plate (12) formed inside any one of the risers (112);

and the clamping component (13) is matched with the connecting plate (12) so that the electronic component (20) can be tightly attached to the connecting plate (12) and form a heat dissipation channel with the vertical plate (112) in the vertical direction.

2. The electronic component heat dissipation module according to claim 1, wherein the connection board (12) includes a base (121) and a backup board (122), the base (121) is fixedly connected with the riser (112), and an attaching surface (123) and a clamping surface (124) are respectively formed on two sides of the backup board (122), and the verticality of the attaching surface (123) is required to be 90±0.1 °; a convex rib (125) is formed on the inner side of the clamping surface (124), and the contour line of the convex rib (125) is formed by connecting an inclined surface (126) and an arc surface (127); the engagement member (13) has an elastic head portion formed with a flange (131) to be engaged with the rib (125).

3. The electronic component heat dissipating module according to claim 2, wherein the bonding surface (123) has bonding grooves (128) for accommodating the electronic components (20) formed thereon uniformly, and wherein the bonding grooves (128) have a width larger than that of the electronic components (20).

4. A module according to claim 3, wherein the height of the back plate (122) matches the height of the electronic component (20).

5. The electronic component heat dissipation module according to claim 2, wherein a lowest position of the circular arc surface (127) is located on the same horizontal plane as a vertical center line of the backup plate (122).

6. A module according to claim 3, wherein a U-shaped ruler block (129) is disposed in the fitting groove (128).

7. The electronic component heat dissipating module of claim 6, wherein the ruler block (129) is made of aluminum material.

8. The electronic component heat dissipation module according to claim 1, wherein the engaging member (13) and the connecting plate (12) are of a split structure, and the engaging member (13) is made of stainless steel; the material of the connecting plate (12) is consistent with that of the radiating fin (11).

9. A drive power module, comprising:

a PCB board (30);

a plurality of electronic components (20) arranged on the PCB (30);

and an electronic component heat dissipation module (10) according to any one of claims 1-8.

10. The driving power module according to claim 9, wherein a rear slot (113) is formed at an inner lower side of the riser (112), and the PCB board (30) is fixed with the heat sink (11) by the slot.