CN209949719U - Inverter complete machine cooling system - Google Patents
Inverter complete machine cooling system Download PDFInfo
- Publication number
- CN209949719U CN209949719U CN201822027341.4U CN201822027341U CN209949719U CN 209949719 U CN209949719 U CN 209949719U CN 201822027341 U CN201822027341 U CN 201822027341U CN 209949719 U CN209949719 U CN 209949719U
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- China
- Prior art keywords
- heat
- heat dissipation
- inverter
- conducting plate
- casing
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- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
Abstract
The utility model relates to an inverter complete machine cooling system, establish heat-conducting plate between the curb plate of casing both sides, install radiator fan on the curb plate of casing both sides, fix inverter assembly and the main heat abstractor at the heat-conducting plate upper surface including casing, level, the upper surface of heat-conducting plate is equipped with temperature sensor and controller, and its lower surface is equipped with the semiconductor refrigeration piece, and the semiconductor refrigeration piece is equipped with vice heat abstractor on the surface. The utility model discloses utilize the semiconductor refrigeration piece directly to dispel the heat the cooling to heat-conducting plate and dc-to-ac converter subassembly, have high heat dissipation efficiency.
Description
Technical Field
The utility model relates to an inverter technical field, concretely relates to dc-to-ac converter complete machine cooling system.
Background
The inverter converts direct current electric energy (batteries and storage batteries) into alternating current (generally 220V,50Hz sine wave). The inverter consists of an inverter bridge, control logic and a filter circuit, and is widely applied to air conditioners, home theaters, lighting equipment and other equipment.
The requirement of the inverter on the temperature of the working environment is relatively high, and the working performance and efficiency of the inverter are directly influenced by the quality of the heat dissipation capacity of the inverter. The inverter generally has two heat dissipation modes, one is a natural cooling heat dissipation mode, and the other is a forced air cooling heat dissipation mode. The forced air cooling heat dissipation mode is that a heat dissipation fan is added in the inverter body, and the heat dissipation fan is used for carrying out air cooling type temperature reduction on each component in the inverter body. However, in some working environments with higher temperature, the requirement of cooling the inverter cannot be met only by cooling the inverter by the cooling fan. Once the inverter is derated in advance due to overhigh temperature, serious loss is caused to the power generation amount of the inverter.
In order to solve the above problem, the chinese utility model patent with the publication number CN206100754U discloses a complete machine heat dissipation system for a high-power inverter. The complete machine heat dissipation system of the inverter comprises a shell, a heat conduction plate arranged between side plates on two sides of the shell, a main heat dissipation device and an auxiliary heat dissipation device. The main heat sink includes a heat sink mounted on the upper surface of the heat conducting plate and a heat dissipating fan mounted on the upper surface of the chassis base plate. The main heat dissipation device can perform air cooling heat dissipation and cooling on each component of the inverter, and when the working temperature of each component of the inverter is higher and the main heat dissipation device cannot meet the heat dissipation and cooling requirements, the auxiliary heat dissipation device can automatically intervene to further dissipate and cool each component of the inverter. The main heat dissipation device is matched with the auxiliary heat dissipation device, so that the heat dissipation system has high heat dissipation efficiency, and the consumption and waste of energy are reduced.
However, in the complete machine heat dissipation system of the inverter, the auxiliary heat dissipation device is arranged on the upper surface of the bottom plate of the casing, the auxiliary heat dissipation device cannot directly dissipate heat and cool the heat conduction plate, and the heat dissipation efficiency still has a space for further improvement and improvement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an use above-mentioned high-power dc-to-ac converter complete machine cooling system as the basis, provide an inverter complete machine cooling system who has higher radiating efficiency.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
the complete machine heat radiation system of the inverter comprises a shell, a heat conduction plate horizontally arranged between side plates at two sides of the shell, heat radiation fans arranged on the side plates at two sides of the shell, an inverter assembly fixed on the upper surface of the heat conduction plate and a main heat radiation device, wherein a temperature sensor and a controller are arranged on the upper surface of the heat conduction plate, a semiconductor refrigeration sheet is arranged on the lower surface of the heat conduction plate, and an auxiliary heat radiation device is arranged on the surface of the semiconductor refrigeration sheet.
Preferably, the number of the heat radiation fans is not less than four groups, and the heat radiation fans are uniformly distributed at the upper end and the lower end of the side plates at the two sides of the machine shell.
Preferably, the primary heat sink and the secondary heat sink are aluminum extruded fins.
Preferably, the controller is electrically connected with the temperature sensor and the semiconductor chilling plate respectively.
Due to the adoption of the technical scheme, compare with prior art, the utility model discloses following beneficial effect has:
the heat conducting plate divides the inverter casing into an upper part and a lower part, the inverter assembly is arranged on the upper surface of the heat conducting plate, and when the inverter is in a normal working state and the temperature of each assembly of the inverter is not high, the heat radiating fan and the main heat radiating device can be used for radiating and cooling the inverter assembly.
And when the temperature sensor detects that the temperature of the inverter assembly exceeds a preset threshold value, the controller transmits a proper current value to the semiconductor refrigerating piece to enable the semiconductor refrigerating piece to work. Because the semiconductor refrigeration piece is directly arranged on the lower surface of the heat conducting plate, the cold end of the semiconductor refrigeration piece can quickly absorb the heat of the heat conducting plate and the inverter assembly and then the heat is dissipated and discharged through the auxiliary heat dissipation device and the heat dissipation fan.
The heat dissipation system has extremely high heat dissipation efficiency, can improve the efficiency of electric energy conversion of the inverter, and reduces the consumption and waste of energy.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiment of the present invention, all other embodiments that a person skilled in the art can obtain without creative work all belong to the protection scope of the present invention.
As shown in fig. 1, the complete inverter heat dissipation system includes a casing 1, a heat conduction plate 2 horizontally disposed between two side plates of the casing 1, a heat dissipation fan 3 installed on the two side plates of the casing 1, an inverter assembly 4 fixed on the upper surface of the heat conduction plate 2, and a primary heat dissipation device 5, wherein a temperature sensor 6 and a controller 7 are disposed on the upper surface of the heat conduction plate 2, a semiconductor refrigeration sheet 8 is disposed on the lower surface of the heat conduction plate, and a secondary heat dissipation device 9 is disposed on the surface of the semiconductor refrigeration sheet 8.
The primary heat sink 5 and the secondary heat sink 9 are aluminum extruded fins, and the horizontal plane of the gap between the two fins is perpendicular to the working surface of the heat dissipation fan 3. When the heat dissipation fan 3 is started, the air flow will flow through the gap channel formed by the heat dissipation fins of the primary heat dissipation device 5 and the secondary heat dissipation device 9, and the heat will be blown away.
The temperature sensor 6 and the controller 7 are installed on the upper surface of the heat conducting plate 2, and when the temperature sensor 6 detects that the temperature of the heat conducting plate 2 exceeds a preset threshold value, an electric signal is sent to the controller 7. The controller 2 calculates according to the electric signal transmitted by the temperature sensor 6, and then outputs a proper current value to the semiconductor chilling plate 8. The cold end of the semiconductor refrigeration piece 8 is connected with the heat conducting plate 2, and the heat of the heat conducting plate 2 can be rapidly absorbed during working and then dissipated at the cold end.
The hot end of the semiconductor refrigeration sheet 8 is connected with the auxiliary heat dissipation device 9, and the heat absorbed by the cold end of the semiconductor refrigeration sheet from the heat conduction plate 2 is transferred to the auxiliary heat dissipation device 9. The controller 2 controls the action of the cooling fan 3 while starting the semiconductor cooling plate 8, and then the heat emitted by the secondary cooling device 9 can be blown away and exhausted.
In order to achieve a better heat dissipation effect, the number of the heat dissipation fans 3 is not less than four, and the heat dissipation fans are uniformly distributed at the upper end and the lower end of the side plates at the two sides of the machine shell 1. The cooling fan 3, the semiconductor chilling plate 8 and the temperature sensor 6 are electrically connected with the controller 2. The controller 2 may be a PLC controller or an embedded one-chip control chip.
As an improved scheme, the lower surface of the heat conducting plate 2 can be provided with a semiconductor refrigeration sheet array formed by combining a plurality of semiconductor refrigeration sheets 8. In the semiconductor refrigerating sheet array, the cold ends of all the semiconductor refrigerating sheets are attached to the lower surface of the heat conducting plate 2, and the hot ends of the semiconductor refrigerating sheets are connected with the radiating fins in a unified mode. Between two adjacent semiconductor refrigerating sheets, heat insulating materials such as vacuum plates and glass fibers can be arranged to isolate reverse transfer of heat at the hot end of the semiconductor refrigerating sheets and improve the heat dissipation efficiency.
A layer of heat-conducting silicone grease is coated between the main heat-radiating device 5 and the heat-conducting plate 2, between the semiconductor refrigerating sheet 8 and the heat-conducting plate 2 and between the semiconductor refrigerating sheet 8 and the auxiliary heat-radiating device 9 to enhance the contact between the main heat-radiating device 5 and the heat-conducting plate 2 and improve the heat-conducting and heat-radiating performance to the maximum extent.
The above all be the utility model discloses a preferred embodiment, the utility model discloses a protection scope does not confine above-mentioned embodiment to, the all belong to the utility model discloses other technical scheme under the thinking all belong to the utility model discloses a protection scope.
Claims (4)
1. Inverter complete machine cooling system, including casing, level establish the heat-conducting plate between the casing both sides curb plate, install the radiator fan on casing both sides curb plate, fix inverter subassembly and the main heat abstractor on the heat-conducting plate upper surface, its characterized in that: the upper surface of the heat conducting plate is provided with a temperature sensor and a controller, the lower surface of the heat conducting plate is provided with a semiconductor refrigerating piece, and the surface of the semiconductor refrigerating piece is provided with an auxiliary heat dissipation device.
2. The inverter-integrated heat dissipation system according to claim 1, wherein: the number of the heat radiation fans is not less than four, and the heat radiation fans are uniformly distributed at the upper end and the lower end of the side plates at the two sides of the machine shell.
3. The inverter-integrated heat dissipation system according to claim 2, wherein: the main heat dissipation device and the auxiliary heat dissipation device are aluminum extruded heat dissipation fins.
4. The inverter-integrated heat dissipation system according to claim 3, wherein: the controller is respectively electrically connected with the temperature sensor, the cooling fan and the semiconductor refrigerating sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822027341.4U CN209949719U (en) | 2018-12-04 | 2018-12-04 | Inverter complete machine cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822027341.4U CN209949719U (en) | 2018-12-04 | 2018-12-04 | Inverter complete machine cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209949719U true CN209949719U (en) | 2020-01-14 |
Family
ID=69118595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822027341.4U Active CN209949719U (en) | 2018-12-04 | 2018-12-04 | Inverter complete machine cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209949719U (en) |
-
2018
- 2018-12-04 CN CN201822027341.4U patent/CN209949719U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: Room 703, Building 1, Wanyang Chuangzhi Park, No. 82, Wuxing Section, Xiaotang Industrial Avenue, Shishan Town, Nanhai District, Foshan, Guangdong 528200 Patentee after: FOSHAN LASAIERDA TECHNOLOGY Co.,Ltd. Address before: No. 402, floor 4, block C, No. 1, middle section of Fuluo Road, Luocun, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528200 Patentee before: FOSHAN LASAIERDA TECHNOLOGY Co.,Ltd. |