CN219758714U - TEC temperature control device - Google Patents
TEC temperature control device Download PDFInfo
- Publication number
- CN219758714U CN219758714U CN202321332607.0U CN202321332607U CN219758714U CN 219758714 U CN219758714 U CN 219758714U CN 202321332607 U CN202321332607 U CN 202321332607U CN 219758714 U CN219758714 U CN 219758714U
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- China
- Prior art keywords
- heat
- water
- temperature control
- cotton layer
- lower plate
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920000742 Cotton Polymers 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 12
- 238000005253 cladding Methods 0.000 claims description 8
- 238000004321 preservation Methods 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 10
- 238000009833 condensation Methods 0.000 abstract description 8
- 230000005494 condensation Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model aims to provide a TEC temperature control device which has a simple and compact structure and good heat dissipation effect and can effectively reduce condensation phenomenon. The heat-conducting copper block is provided with a heat-insulating cotton layer at the upper end, a water flowing cavity is formed in the cold plate, a water inlet pipe and a water outlet pipe which are communicated with the water flowing cavity are arranged at the lower end of the cold plate, a contact boss is arranged at the upper end of the heat-conducting copper block, and a yielding window matched with the contact boss is formed in the heat-insulating cotton layer. The utility model relates to the technical field of temperature control devices.
Description
Technical Field
The utility model relates to the technical field of temperature control devices, in particular to a TEC temperature control device.
Background
The chip often needs to be subjected to performance test after production, but in order to test to be more close to real application, different environment temperatures need to be simulated during the test, so that the performance of the chip is better judged. Generally, when performing an environmental temperature simulation, it is necessary to attach the chip to the temperature control mechanism, so that the chip is tested at the temperature regulated by the temperature control mechanism.
The existing temperature control is generally a water circulation type temperature control mechanism, namely a structure of a conduction block and a circulation water pipe is adopted, the temperature of the conduction block rises or falls through hot water or cold water flowing in the circulation water pipe, and then the temperature is transmitted to a chip by the conduction block, but the structure has lower refrigerating and heating efficiency and is unfavorable for high-precision testing.
The utility model patent with the publication number of CN216873449U discloses a TEC temperature control assembly, which comprises a substrate, a heat conducting plate, a TEC, a radiator, a power supply and a controller, wherein when the TEC temperature control assembly is used, the back surface of the substrate is fixed on a PCB (printed circuit board) through a mounting hole, the heat conducting plate is contacted with a temperature control target, the TEC is electrified to generate temperature difference, namely, one side is refrigerated and the other side is heated, and a refrigerating end is used for heating and cooling the target through the heat conducting plate. The temperature control can be realized in the above-mentioned patent, but when using, TEC circular telegram refrigeration, refrigeration terminal surface temperature suddenly becomes and easily produces the condensation phenomenon of condensing water, exists the risk of infiltration after contacting the chip when the test, exists certain hidden danger, and it adopts the auxiliary heat radiation structure of radiator + fan simultaneously, and overall structure is bloated, is not applicable to the environment that installation space requires highly, exists the limitation.
Disclosure of Invention
The technical problem to be solved by the utility model is to overcome the defects of the prior art, and provide the TEC temperature control device which has a simple and compact structure and good heat dissipation effect and can effectively reduce condensation phenomenon.
The technical scheme adopted by the utility model is as follows: the heat-conducting copper block is provided with a heat-insulating cotton layer at the upper end, a water flowing cavity is formed in the cold plate, a water inlet pipe and a water outlet pipe which are communicated with the water flowing cavity are arranged at the lower end of the cold plate, a contact boss is arranged at the upper end of the heat-conducting copper block, and a yielding window matched with the contact boss is formed in the heat-insulating cotton layer.
Further, a mounting hole is formed in one side of the contact boss, and an NTC thermistor is embedded in the mounting hole.
Further, the whole box-shaped that is of heat preservation cotton layer, cladding setting are in on the heat conduction copper billet, the four sides of contact boss are the inclined plane, the window of stepping down is located on the protruding cladding lug that sets up in heat preservation cotton layer middle part, the inside of cladding lug be equipped with the cooperation inclined plane of inclined plane looks adaptation.
Further, the cold plate comprises a lower plate body and an upper cover, the upper cover is fixed on the lower plate body by screws, the water flowing cavity is positioned in the lower plate body, a sealing ring groove is formed in the lower plate body, a sealing ring is arranged in the sealing ring groove, and the water flowing cavity is positioned in the sealing ring groove.
Further, the lower end of the upper cover is provided with a plurality of heat conducting fins in a arrayed mode, and the heat conducting fins are located in the water flowing cavity.
Further, the lower end of the upper cover is provided with a buckling groove matched with the lower plate body, and the upper cover is buckled at the upper end of the lower plate body through the buckling groove.
Further, a water stop plate is arranged in the middle of the water flowing cavity, and the water inlet pipe and the water outlet pipe are positioned on two sides of the water stop plate.
The beneficial effects of the utility model are as follows: when the heat-insulating cotton layer is used for testing, the temperature of a product (namely a chip) to be tested is transmitted through the heat-conducting copper block, the cold and hot temperatures can be conducted out through the cold plate through the water inlet pipe and the water outlet pipe under the control of the TEC, the purposes of external heat transfer and heat dissipation are achieved, and the phenomenon of condensation caused by abrupt change of the temperature of the product is reduced when the heat-insulating cotton layer is used for testing. The utility model has simple and compact integral structure and small occupied space, improves the heat dissipation effect through the cooperation of the water flowing cavity, the water inlet pipe and the water outlet pipe, further improves the cooling rate, and can effectively reduce the condensation phenomenon.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is an exploded view of the present utility model;
FIG. 3 is a cross-sectional view of the present utility model;
FIG. 4 is an enlarged view of portion A of FIG. 3;
fig. 5 is a top view of the lower plate of the present utility model.
Detailed Description
As shown in fig. 1 to 5, in this embodiment, the heat-conducting copper block 1, the TEC2 and the cold plate 3 are sequentially arranged from top to bottom, the heat-conducting copper block 1, the TEC2 and the cold plate 3 can be installed and fixed by adopting screw connection, the upper end of the heat-conducting copper block 1 is provided with a heat-insulating cotton layer 4, and the heat-insulating cotton layer 4 is fixed by glue adhesion or screw connection; the heat-conducting copper block 1 is used for being in contact with a chip to realize temperature control, the TEC2 is electrified to realize temperature regulation, the cold plate 3 is used for radiating the TEC2 so as to improve the refrigerating effect, and the heat-insulating cotton layer 4 is used for coating the heat-conducting copper block 1, so that the heat-conducting copper block 1 cannot be condensed due to temperature dip; a water flowing cavity 5 is formed in the cold plate 3, a water inlet pipe 6 and a water outlet pipe 7 which are communicated with the water flowing cavity 5 are arranged at the lower end of the cold plate 3, and the water inlet pipe 6 and the water outlet pipe 7 are externally connected with a circulating water source, so that a circulating water system is formed by matching the water inlet pipe 6 and the water outlet pipe 7 with the water flowing cavity 5, and heat transfer can be realized through uninterrupted flow; the upper end integrated into one piece of heat conduction copper billet 1 is provided with contact boss 8, contact boss 8 and chip product adaptation just are used for the contact to realize ambient temperature simulation, set up on the heat preservation cotton layer 4 with window 9 of stepping down of contact boss 8 looks adaptation, consequently can make contact boss 8 expose can with the chip contact, can furthest reduce the condition that the condensation of water dews when realizing temperature control and appear.
In this embodiment, a mounting hole is formed on one side of the contact boss 8, and an NTC thermistor 10 is embedded in the mounting hole. The NTC thermistor 10 is embedded in the mounting hole so that the temperature of the contact boss 8 can be monitored for better temperature control, and the NTC thermistor 10 is located inside the contact boss 8 so that the accuracy of detecting the temperature thereof is high.
In this embodiment, the thermal insulation cotton layer 4 is in a box shape, and is coated on the heat-conducting copper block 1, so as to coat the upper end surface and four side surfaces of the heat-conducting copper block 1, thereby effectively reducing the condensation of frost; the four sides of the contact boss 8 are inclined planes, the abdication window 9 is positioned on a cladding lug 11 protruding from the middle of the heat insulation cotton layer 4, a matching inclined plane matched with the inclined plane is arranged in the cladding lug 11, and the heat insulation cotton layer 4 can be installed and then better effect can be achieved by matching the inclined plane with the matching inclined plane, and the bonding degree of the heat conduction copper block 1.
In this embodiment, the cold plate 3 includes a lower plate body 31 and an upper cover 32, the upper cover 32 is fixed on the lower plate body 31 by screws, the water flow chamber 5 is located in the lower plate body 31, a seal ring groove 30 is formed in the lower plate body 31, a seal ring 33 is disposed in the seal ring groove 30, and the water flow chamber 5 is located in the seal ring groove 30. The cold plate 3 is formed by a split structure, so that the processing is facilitated, and the installation is also facilitated; the sealing between the lower plate 31 and the upper cover 32 is realized by the sealing ring 33, so that the sealing effect can be greatly enhanced, and the water leakage and seepage of the water flowing cavity 5 are avoided.
In this embodiment, a plurality of heat conducting fins 34 are arranged at the lower end of the upper cover 32, and the heat conducting fins 34 are located in the water flow chamber 5. The heat conducting fin 34 is used for contacting with water, so that the heat dissipation effect is improved, the heat dissipation rate of the cold plate 3 can be increased, and the requirement of rapid cooling is ensured.
In this embodiment, the lower end of the upper cover 32 is provided with a fastening slot 35 adapted to the lower plate 31, and the upper cover 32 is fastened to the upper end of the lower plate 31 through the fastening slot 35. The size of the buckling groove 35 is matched with the size of the lower plate 31, so that the buckling groove can be buckled on the lower plate 31, the upper cover 32 is matched with the lower plate 31 more tightly, and a better sealing effect is achieved.
In this embodiment, a water-stop plate 12 is disposed in the middle of the water flow chamber 5, and the water inlet pipe 6 and the water outlet pipe 7 are disposed on two sides of the water-stop plate 12. The water-stop plate 12 divides the inner space of the water flow cavity 5 into two parts, when the water outlet pipe 7 is used for discharging water and the water inlet pipe 6 is used for feeding water, namely, when the water circulation system works, water flows along the water-stop plate 12 to form circulation, so that the water flow in the whole water flow cavity 5 can flow, and the heat dissipation effect is ensured.
To enhance the effect, the utility model adopts two TECs.
The utility model has the advantages that:
1. the dual TEC serial connection structure is novel in design, and the requirements of small volume and high power are met;
2. the material of the heat-insulating cotton is utilized to effectively solve the problem that condensation does not occur due to large temperature difference of the product in a vacuum environment;
3. and a precise temperature control negative feedback system is adopted by combining TEC and NTC.
While the embodiments of this utility model have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this utility model, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.
Claims (7)
1. The utility model provides a TEC temperature control device, it includes heat conduction copper block (1), TEC (2) and cold plate (3) that from top to bottom set gradually, its characterized in that: the upper end of heat conduction copper billet (1) is provided with heat preservation cotton layer (4), flowing water chamber (5) have been seted up in cold plate (3), the lower extreme of cold plate (3) be provided with all with flowing water pipe (6) and outlet pipe (7) that flowing water chamber (5) are linked together, the upper end of heat conduction copper billet (1) is provided with contact boss (8), set up on heat preservation cotton layer (4) with window (9) of stepping down of contact boss (8) looks adaptation.
2. The TEC temperature control apparatus according to claim 1, wherein: one side of the contact boss (8) is provided with a mounting hole, and an NTC thermistor (10) is embedded in the mounting hole.
3. The TEC temperature control apparatus according to claim 1, wherein: the heat-insulating cotton layer (4) is box-shaped as a whole, the cladding is arranged on the heat-conducting copper block (1), four sides of the contact boss (8) are inclined planes, the abdication window (9) is arranged on a cladding lug (11) arranged in the middle of the heat-insulating cotton layer (4) in a protruding mode, and the inside of the cladding lug (11) is provided with a matching inclined plane matched with the inclined plane.
4. The TEC temperature control apparatus according to claim 1, wherein: the cold plate (3) comprises a lower plate body (31) and an upper cover (32), wherein the upper cover (32) is fixed on the lower plate body (31) by screws, the water flowing cavity (5) is positioned in the lower plate body (31), a sealing ring groove (30) is formed in the lower plate body (31), a sealing ring (33) is arranged in the sealing ring groove (30), and the water flowing cavity (5) is positioned in the sealing ring groove (30).
5. The TEC temperature control apparatus according to claim 4, wherein: the lower end of the upper cover (32) is provided with a plurality of heat conducting fins (34) in a arrayed mode, and the heat conducting fins (34) are located in the water flowing cavity (5).
6. The TEC temperature control apparatus according to claim 4, wherein: the lower end of the upper cover (32) is provided with a buckling groove (35) matched with the lower plate body (31), and the upper cover (32) is buckled at the upper end of the lower plate body (31) through the buckling groove (35).
7. The TEC temperature control apparatus according to claim 1, wherein: the middle part of the water flowing cavity (5) is provided with a water stop plate (12), and the water inlet pipe (6) and the water outlet pipe (7) are positioned at two sides of the water stop plate (12).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321332607.0U CN219758714U (en) | 2023-05-30 | 2023-05-30 | TEC temperature control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321332607.0U CN219758714U (en) | 2023-05-30 | 2023-05-30 | TEC temperature control device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219758714U true CN219758714U (en) | 2023-09-26 |
Family
ID=88090209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321332607.0U Active CN219758714U (en) | 2023-05-30 | 2023-05-30 | TEC temperature control device |
Country Status (1)
Country | Link |
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CN (1) | CN219758714U (en) |
-
2023
- 2023-05-30 CN CN202321332607.0U patent/CN219758714U/en active Active
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