CN203607389U - Reinforced chip conduction radiator - Google Patents
Reinforced chip conduction radiator Download PDFInfo
- Publication number
- CN203607389U CN203607389U CN201320793094.3U CN201320793094U CN203607389U CN 203607389 U CN203607389 U CN 203607389U CN 201320793094 U CN201320793094 U CN 201320793094U CN 203607389 U CN203607389 U CN 203607389U
- Authority
- CN
- China
- Prior art keywords
- chip
- heat
- radiator
- heating panel
- radiating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 17
- 230000002787 reinforcement Effects 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 6
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 1
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a reinforced chip conduction radiator, comprising a radiating plate which is directly contacted with a chip, wherein the radiating plate sleeves between limiting blocks arranged on the radiator, and the radiating plate and the radiator are provided with a flexible heat conducting material therebetween. According to the utility model, the radiating plate is designed to be directly contacted with the chip, heat is quickly conducted to a copper piece directly, the copper piece transmits the heat to the radiator, and the heat is radiated out finally, thereby improving the radiating performance of the chip, overcoming defects of radiating in the prior art, and ensuring the chip to operate normally. The limiting blocks are designed on the radiator, and the radiating plate does not move when the radiator is used in environmental conditions such as vibrations and the like, thereby increasing the reliability in operation.
Description
Technical field
The utility model belongs to chip cooling technical field, relates to a kind of reinforcement type chip heat loss through conduction device.
Background technology
In the time that the heat power consumption of electronic equipment chips is too high, all need to above chip, design radiator, with guarantee chip can be under the temperature conditions of regulation the work of normal reliable.The advantages such as it is aluminium alloy that at present fairly simple reliable fansink designs adopts material, and it is little that aluminium alloy has density as radiator material, and heat conductivility is good, cost performance excellence, can meet instructions for use for common heat power consumption aluminium alloy heat radiator.This design cost is low, simple in structure easy to operate.Generally there are two kinds of following designs:
The first is between radiator and chip, to use soft Heat Conduction Material to fill gap between the two, and this is modal radiator structure, and concrete structure is shown in Fig. 1.This radiator structure is simple and easy to realize.But in the time that chip caloric value is excessive; the soft Heat Conduction Material contacting with chip is because thermal resistance is excessive; being difficult to derives the heat of chip internal fast; can make chip internal accumulation of heat; cause chip internal excess Temperature to occur that chip temperature protection cannot normally work, when serious, even can burn chip.
The second is on soft Heat Conduction Material, to increase a heating panel identical with die size (aluminium sheet) again, between heating panel and radiator, is heat conducting film, is soft Heat Conduction Material (heat-conducting silicone grease etc.) between heating panel and chip, and concrete structure is shown in Fig. 2.This frame mode can be alleviated the first frame mode and bring accumulation of heat problem, but because the heat conductivility of aluminum alloy materials is not best, still has certain restriction for heat-transfer rate.And in this radiating mode, while use under vibration condition, aluminium block there will be displacement, when serious, can depart from heat radiation chip, cause chip because cannot normally working without cooling measure.
Utility model content
The technical problem that the utility model solves is to provide a kind of reinforcement type chip heat loss through conduction device, can make chip quick heat radiating, and guarantee the stability of radiator work by spacing design.
The utility model is to be achieved through the following technical solutions:
A kind of reinforcement type chip heat loss through conduction device, comprises the heating panel directly contacting with chip, and heating panel is set between the guide vane end stop arranging on radiator, is also provided with soft Heat Conduction Material between heating panel and radiator.
Described heating panel is heat radiation copper coin, and the vacant gap between chip and heating panel is also filled with gap Heat Conduction Material.
The heat that described chip distributes is directly conducted to heating panel, and heating panel is passed to radiator by heat again, by radiator, heat is shed.
Described chip is assemblied in printed board.
Compared with prior art, the utlity model has following useful technique effect:
The reinforcement type chip heat loss through conduction device that the utility model provides, is designed to heating panel directly to contact between chip, fills gap Heat Conduction Material between the two, and heating panel contacts and fill in centre soft Heat Conduction Material with radiator.In the time of chip operation, heat directly conducts to copper sheet fast, and copper sheet is passed to radiator by heat again, finally heat is shed, and has improved the heat dispersion of chip, has overcome the defect that in prior art, heat radiation exists, and assurance chip is normally worked.And the utility model carries out the design of guide vane end stop on radiator, can, for heating panel provides the extra protection of adhering to, under the environmental conditions such as vibration, use like this, there will not be heating panel displacement, increase the reliability of work.
Accompanying drawing explanation
Fig. 1 is one of existing chip heat transfer structure schematic diagram;
Fig. 2 is two of existing chip heat transfer structure schematic diagram;
Fig. 3 is structural representation of the present utility model.
Wherein: 1 is printed board, and 2 is chip, and 3 is soft Heat Conduction Material, and 4 is heating panel, and 5 is heat-conducting block, and 6 is guide vane end stop.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail, described in be to explanation of the present utility model rather than restriction.
Referring to Fig. 3, a kind of reinforcement type chip heat loss through conduction device, comprises the heating panel 5 directly contacting with chip 2, and heating panel 5 is set between the guide vane end stop 6 arranging on radiator 4, is also provided with soft Heat Conduction Material 3 between heating panel 5 and radiator 4.Described chip 2 is assemblied in printed board 1.
Described heating panel 5 is heat radiation copper coin, and the vacant gap between chip 2 and heating panel 5 is also filled with gap Heat Conduction Material.The heat conduction aluminum of aluminium alloy is 177W/(m ℃), and the thermal conductivity of fine copper is 401W/(m ℃), by contrast, use the heat conduction speed ratio aluminium alloy plate hight of heat radiation copper coin.
In the time of chip operation, the heat that chip 2 distributes is directly conducted to heating panel 5, and heating panel 5 is passed to heat radiator 4 again, by radiator 4, heat is shed, and has improved the heat dispersion of chip.
The reinforcement type chip heat loss through conduction device that the utility model provides, is designed to heating panel directly to contact between chip, fills gap Heat Conduction Material between the two, and heating panel contacts and fill in centre soft Heat Conduction Material with radiator.In the time of chip operation, heat directly conducts to copper sheet fast, and copper sheet is passed to radiator by heat again, finally heat is shed, and assurance chip is normally worked.And the utility model carries out the design of guide vane end stop on radiator, can, for heating panel provides the extra protection of adhering to, under the environmental conditions such as vibration, use like this, there will not be heating panel displacement, increase the reliability of work.
Claims (4)
1. a reinforcement type chip heat loss through conduction device, it is characterized in that, comprise the heating panel (5) directly contacting with chip (2), heating panel (5) is set between the upper guide vane end stop (6) arranging of radiator (4), between heating panel (5) and radiator (4), is also provided with soft Heat Conduction Material (3).
2. reinforcement type chip heat loss through conduction device as claimed in claim 1, is characterized in that, described heating panel (5) is heat radiation copper coin, and the vacant gap between chip (2) and heating panel (5) is also filled with gap Heat Conduction Material.
3. reinforcement type chip heat loss through conduction device as claimed in claim 1, it is characterized in that, the heat that described chip (2) distributes is directly conducted to heating panel (5), and heating panel (5) is passed to heat radiator (4) again, by radiator (4), heat is shed.
4. reinforcement type chip heat loss through conduction device as claimed in claim 1, is characterized in that, described chip (2) is assemblied in printed board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320793094.3U CN203607389U (en) | 2013-12-04 | 2013-12-04 | Reinforced chip conduction radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320793094.3U CN203607389U (en) | 2013-12-04 | 2013-12-04 | Reinforced chip conduction radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203607389U true CN203607389U (en) | 2014-05-21 |
Family
ID=50720053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320793094.3U Expired - Lifetime CN203607389U (en) | 2013-12-04 | 2013-12-04 | Reinforced chip conduction radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203607389U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182440A (en) * | 2017-06-20 | 2017-09-22 | 河北汇朝机械配件有限公司 | Modified corn picker |
| CN107567239A (en) * | 2017-07-24 | 2018-01-09 | 广东美的暖通设备有限公司 | Radiating subassembly and refrigeration plant |
| CN110557931A (en) * | 2019-08-30 | 2019-12-10 | 华为技术有限公司 | Vehicle-mounted device and vehicle |
| CN110867425A (en) * | 2019-11-21 | 2020-03-06 | 杭州迪普科技股份有限公司 | Chip radiator and electronic equipment with chip |
-
2013
- 2013-12-04 CN CN201320793094.3U patent/CN203607389U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182440A (en) * | 2017-06-20 | 2017-09-22 | 河北汇朝机械配件有限公司 | Modified corn picker |
| CN107567239A (en) * | 2017-07-24 | 2018-01-09 | 广东美的暖通设备有限公司 | Radiating subassembly and refrigeration plant |
| CN107567239B (en) * | 2017-07-24 | 2020-03-27 | 广东美的暖通设备有限公司 | Heat dissipation assembly and refrigeration equipment |
| CN110557931A (en) * | 2019-08-30 | 2019-12-10 | 华为技术有限公司 | Vehicle-mounted device and vehicle |
| CN110557931B (en) * | 2019-08-30 | 2020-12-08 | 华为技术有限公司 | Vehicle-mounted device and vehicle |
| US11839065B2 (en) | 2019-08-30 | 2023-12-05 | Huawei Technologies Co., Ltd. | Temperature equalizing vehicle-mountable device |
| CN110867425A (en) * | 2019-11-21 | 2020-03-06 | 杭州迪普科技股份有限公司 | Chip radiator and electronic equipment with chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140521 |
|
| CX01 | Expiry of patent term |