CN203482574U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

Info

Publication number
CN203482574U
CN203482574U CN201320615359.0U CN201320615359U CN203482574U CN 203482574 U CN203482574 U CN 203482574U CN 201320615359 U CN201320615359 U CN 201320615359U CN 203482574 U CN203482574 U CN 203482574U
Authority
CN
China
Prior art keywords
heat abstractor
heat
components
cabinet
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320615359.0U
Other languages
Chinese (zh)
Inventor
冯建宇
魏宇存
刘雪梅
任正某
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaanxi Provincial Electric Power Group (limited) Co
Original Assignee
Shaanxi Provincial Electric Power Group (limited) Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaanxi Provincial Electric Power Group (limited) Co filed Critical Shaanxi Provincial Electric Power Group (limited) Co
Priority to CN201320615359.0U priority Critical patent/CN203482574U/en
Application granted granted Critical
Publication of CN203482574U publication Critical patent/CN203482574U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model provides a heat dissipation device, which is used for an intelligent assembly. A contact area of the heat dissipation device is contacted with an electronic element of the intelligent assembly. A fixing area of the heat dissipation device is fixedly connected with a casing of the intelligent assembly. The heat energy of the electronic element can be transmitted to the surface of the casing. The heat energy of the electronic element can be directly transmitted to the casing, and the casing can be used as the heat dissipation part of the heat dissipation device, and the heat energy generated by the electronic element can be dissipated in the atmosphere, and therefore the temperature of the electronic element can be effectively reduced, and the problem of the prior art can be solved.

Description

Heat abstractor
Technical field
The utility model relates to heat dissipation technology field, more particularly, relates to a kind of heat abstractor.
Background technology
In intelligent assembly running, the electronic devices and components of intelligent assembly produce more heat, if not in time electronic devices and components are dispelled the heat, easily occur the situation that intelligent assembly crashes.Because the cabinet connection wire road of intelligent assembly is complicated, therefore, in the cabinet of intelligent assembly, do not allow for electronic devices and components radiator fan is set, so the heat that electronic devices and components produce can only be diffused in by the mode of convection current in the air in cabinet, by case radiation, radiating effect is not obvious indirectly.Therefore, how making the electronic devices and components of intelligent assembly better dispel the heat, is those skilled in the art's problem demanding prompt solutions.
Utility model content
In view of this, the utility model provides a kind of heat abstractor, and so that the heat of electronic devices and components is conducted to cabinet, the thermal component by cabinet as heat abstractor, realizes the heat radiation to electronic devices and components.
A kind of heat abstractor, be applied to intelligent assembly, the contact zone of described heat abstractor contacts with the electronic devices and components of described intelligent assembly, and the fixed area of described heat abstractor and the cabinet of described intelligent assembly are fixed, the heat of described electronic devices and components is conducted to described cabinet surface.
Preferably, also comprise the thermal conductive zone that connects described contact zone and described fixed area.
Preferably, described contact zone is provided with fixing perforation.
Preferably, described fixed area is provided with fixing perforation.
Preferably, described fixed area and described cabinet are bolted.
Preferably, the material of described heat abstractor is red copper or almag.
From above-mentioned technical scheme, can find out, the utility model provides a kind of heat abstractor, be applied to intelligent assembly, the contact zone of heat abstractor contacts with the electronic devices and components of intelligent assembly, the fixed area of heat abstractor and the cabinet of intelligent assembly are fixed, so that the heat of electronic devices and components is conducted to cabinet surface.Therefore, the heat that electronic devices and components produce can be directly conducted to cabinet, the thermal component by cabinet as heat abstractor, and the heat diffusion that electronic devices and components are produced is in atmosphere, thereby effectively reduce the temperature of electronic devices and components, solved a difficult problem of the prior art.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the shaft side figure of the disclosed a kind of heat abstractor of the utility model embodiment;
Fig. 2 is the structural representation of the disclosed a kind of heat abstractor of the utility model embodiment;
Fig. 3 is the left view of Fig. 2;
Fig. 4 is the upward view of Fig. 2.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Referring to Fig. 1, the utility model embodiment discloses a kind of shaft side figure of heat abstractor, described heat abstractor is applied to intelligent assembly, the contact zone 1 of described heat abstractor contacts with the electronic devices and components of described intelligent assembly, the fixed area 2 of described heat abstractor is fixed with the cabinet of described intelligent assembly, the heat of described electronic devices and components is conducted to described cabinet surface.
Wherein, intelligent assembly is a kind ofly some intelligent electronic device set, to consist of; bear the basic functions such as measurement, control and monitoring of host equipment (high pressure primary equipment), when meeting relevant criterion requirement, can also bear the device of the functions such as relevant metering, protection.Intelligent assembly can comprise the partial devices such as measurement, control, status monitoring, metering protection or all install.
It should be noted is that, the contact zone 1 of described heat abstractor and fixed area 2 can be identical Heat Conduction Material, can be also different Heat Conduction Materials.
Can find out, the heat abstractor that the utility model provides is for being connected electronic devices and components with cabinet, the heat that electronic devices and components are produced can be directly conducted to cabinet, thermal component by cabinet as heat abstractor, the heat diffusion that electronic devices and components are produced is in atmosphere, the heat producing with respect to prior art electronic devices and components can only be diffused in by the mode of convection current in the air in cabinet, indirectly by case radiation, the utility model directly passes through case radiation, thereby effectively reduce the temperature of electronic devices and components, solved a difficult problem of the prior art.
Preferably, electronic devices and components can be CPU(CentralProcessingUnit, central processing unit).
For further optimizing the present embodiment, above-mentioned heat abstractor can also comprise: thermal conductive zone 3;
Thermal conductive zone 3 is for connecting contact zone 1 and fixed area 2.
Preferably, for making the heating region that the contact zone 1 of heat abstractor can overlay electronic components and parts, the heat producing fully to obtain electronic devices and components, what make that heat abstractor can be stable is fixed on cabinet simultaneously, the contact zone 1 of heat abstractor and fixed area 2 can be all laminated structure, because thermal conductive zone 3 is for connecting contact zone 1 and fixed area 2, so thermal conductive zone 3 can be also laminated structure.
Because electronic devices and components are positioned at cabinet inside, heat abstractor needs to contact with electronic devices and components, cabinet simultaneously, therefore, referring to Fig. 1, contact zone 1, thermal conductive zone 3 and fixed area 2 can be designed to following annexation:
Parallel to each other and the connection that keeps predeterminable range in contact zone 1 and thermal conductive zone 3, thermal conductive zone 3 and fixed area 2 are vertically connected to one another.
Referring to Fig. 2, the structural representation of the disclosed a kind of heat abstractor of the utility model embodiment, contact zone 1 can be provided with fixing perforation 01.
It will be understood by those skilled in the art that, electronic devices and components are arranged on the mainboard in cabinet, for making the contact zone 1 and electronic devices and components close contact of heat abstractor, the heat producing fully to obtain electronic devices and components, can closely be fixed on electronic devices and components between contact zone 1 and the mainboard of cabinet by the bolt through fixing perforation 01.
Wherein, the left view of the disclosed Fig. 2 of the utility model embodiment specifically can be referring to Fig. 3.
Referring to Fig. 4, the upward view of the disclosed a kind of Fig. 2 of the utility model embodiment, the fixed area 3 of heat abstractor can be provided with a plurality of fixedly perforation 02, and heat abstractor can be by fixing through bolt and the cabinet of fixing perforation 02.
Be understandable that, for the heat of electronic devices and components generation being conducted to the surface of cabinet, to reach the object of quick heat radiating, the fixed area of heat abstractor 3 can be fixed on to the backboard place of cabinet.
It should be noted is that, in above-mentioned each embodiment, the material of the contact zone 1 of heat abstractor, fixed area 2 and thermal conductive zone 3 can be identical, can be all red copper or almag; The material of contact zone 1, fixed area 2 and thermal conductive zone 3 also can be different; for example: the material of contact zone 1 and thermal conductive zone 3 is red copper; the material of fixed area 2 is almag; the material the utility model in heat abstractor San Ge district does not limit at this; as long as the material in San Ge district has heat conduction function, all belong to protection range of the present utility model.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is the difference with other embodiment, between each embodiment identical similar part mutually referring to.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (6)

1. a heat abstractor, be applied to intelligent assembly, it is characterized in that, the contact zone of described heat abstractor contacts with the electronic devices and components of described intelligent assembly, the fixed area of described heat abstractor and the cabinet of described intelligent assembly are fixed, the heat of described electronic devices and components is conducted to described cabinet surface.
2. heat abstractor according to claim 1, is characterized in that, also comprises the thermal conductive zone that connects described contact zone and described fixed area.
3. heat abstractor according to claim 1, is characterized in that, described contact zone is provided with fixing perforation.
4. heat abstractor according to claim 1, is characterized in that, described fixed area is provided with fixing perforation.
5. heat abstractor according to claim 1, is characterized in that, described fixed area and described cabinet are bolted.
6. according to the heat abstractor described in claim 1 to 5 any one, it is characterized in that, the material of described heat abstractor is red copper or almag.
CN201320615359.0U 2013-09-29 2013-09-29 Heat dissipation device Expired - Fee Related CN203482574U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320615359.0U CN203482574U (en) 2013-09-29 2013-09-29 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320615359.0U CN203482574U (en) 2013-09-29 2013-09-29 Heat dissipation device

Publications (1)

Publication Number Publication Date
CN203482574U true CN203482574U (en) 2014-03-12

Family

ID=50230813

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320615359.0U Expired - Fee Related CN203482574U (en) 2013-09-29 2013-09-29 Heat dissipation device

Country Status (1)

Country Link
CN (1) CN203482574U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104283316A (en) * 2014-10-20 2015-01-14 国家电网公司 Method for improving environment adaptive capacity of intelligent assembly
CN106358361A (en) * 2016-08-31 2017-01-25 安徽赛福电子有限公司 Efficient heat dissipation device for electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104283316A (en) * 2014-10-20 2015-01-14 国家电网公司 Method for improving environment adaptive capacity of intelligent assembly
CN104283316B (en) * 2014-10-20 2016-09-21 国家电网公司 A kind of method improving intelligent assembly adaptive capacity to environment
CN106358361A (en) * 2016-08-31 2017-01-25 安徽赛福电子有限公司 Efficient heat dissipation device for electronic component

Similar Documents

Publication Publication Date Title
CN203301847U (en) Heat radiation circuit board for unmanned plane
CN201585231U (en) Electronic device with heat insulation structure
CN204539700U (en) Radiator, electric-controlled box and air conditioner
CN201601889U (en) Circuit board combination
CN203482574U (en) Heat dissipation device
CN203840687U (en) Heat radiator, circuit board heat radiation structure, and electronic device
CN202018017U (en) Heat-dissipation circuit board for installation of light emitting diode (LED) lamp
CN201726633U (en) Hollow laminar type cooling plate unit structure
CN204180460U (en) A kind of fin
CN104619146A (en) Heat radiating device and electronic equipment
CN204442828U (en) A kind of PCB of high efficiency and heat radiation
CN205864941U (en) A kind of heat-radiating device of electric component
CN102819300A (en) Radiator and electronic device structure
CN204616259U (en) A kind of bus surge protector heat dissipating housing
CN204425783U (en) The pcb board of automobile instrument power circuit
CN203378199U (en) Heat dissipation plate
CN203369024U (en) Multiple-heat-radiation-assembly structure
CN203859967U (en) Heat-radiating fin
CN203120370U (en) Heat dissipation structure of model airplane motor controller
CN203743079U (en) Fan module
CN203775516U (en) PCB with implantable heat dissipation copper block
CN203025635U (en) Display card radiating device
CN208159112U (en) A kind of heat-dissipation electrical cabinet
CN205620905U (en) Consolidate GPU server
CN204408827U (en) The compact radiator structure of motor control unit of electric automobile

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140312

Termination date: 20180929

CF01 Termination of patent right due to non-payment of annual fee