CN202076924U - Radiating system for power module - Google Patents
Radiating system for power module Download PDFInfo
- Publication number
- CN202076924U CN202076924U CN201120217263XU CN201120217263U CN202076924U CN 202076924 U CN202076924 U CN 202076924U CN 201120217263X U CN201120217263X U CN 201120217263XU CN 201120217263 U CN201120217263 U CN 201120217263U CN 202076924 U CN202076924 U CN 202076924U
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- CN
- China
- Prior art keywords
- power module
- radiator
- pcb board
- boss
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiating system for a power module, which mainly comprises a radiator connected with the power module, and a heat conducting silicon grease layer is arranged between the power module and the radiator. The radiating system for the power module has the advantages of 1 simplicity in installation and operation, 2 simple structure, 3 simplicity in processing technology and low cost, 4 capability of discarding a heat conducting pad, and 5 short heat transfer path, low heat resistance, fine radiation and low cost due to the fact that heat conducting silicon grease is used for heat transfer between the power module and the radiator.
Description
Technical field
The utility model relates to a kind of cooling system at power module.
Background technology
Transmit heat by heat conductive pad between power module and the radiator at present, but there are two problems in this mode: the one, the power module height tolerance is bigger, needs very thick heat conductive pad.
Could offset tolerance, thermal resistance just becomes big like this, causes radiating effect bad; But the cost of thick heat conductive pad is higher.Radiator be used for conducting, the general designation of a series of devices of release heat.Radiator mainly has heating radiator, computer radiator at present, wherein adopts radiator and can be divided into some kinds according to material and mode of operation again, and computer radiator can be divided into some kinds according to purposes and installation method.The heating radiator of Xiao Shouing is divided into copper pipe aluminium wing convector radiator, steel radiator, Aluminium Radiator, copper radiator, stainless steel heat radiator, composite copper aluminium radiator etc. basically on material in the market, also has original cast-iron radiator.
The utility model content
It is a kind of at power module that the purpose of this utility model is to provide, and processing technology is simple, and cost is low, and cooling system simple to operation.
The purpose of this utility model is achieved through the following technical solutions: a kind of cooling system at power module, mainly constitute by the radiator that is connected with power module, and also be provided with the heat-conducting silicone grease layer between described power module and the radiator.
Described power module is connected with pcb board away from radiator one end.
Described pcb board also is connected with radiator.
Described radiator is provided with boss near the one side of pcb board, and described boss is provided with the boss screwed hole away from radiator one end, and described pcb board is connected with the boss screwed hole by the screw assemblies that runs through pcb board.
The height of described boss is greater than the height of power module.
Described power module is connected by screw with radiator.
Described screw is a sunk screw.
Conduct heat by heat-conducting silicone grease between power module and the radiator, heat-transfer path is short, and thermal resistance is low, and thermal diffusivity is good, and cost is low.
Described power module is connected with pcb board away from radiator one end.Power module and pcb board welding are fixing.
Described pcb board also is connected with radiator.Can reinforce pcb board, power module directly is connected with radiator, simultaneously also more or less provide heat radiation for pcb board.
Described radiator is provided with boss near the one side of pcb board, described boss is provided with the boss screwed hole away from radiator one end, and described pcb board is provided with the PCB screwed hole that is complementary with the boss screwed hole, is provided with screw assemblies in described boss screwed hole and the PCB screwed hole.Pcb board is connected with the boss screwed hole by the screw assemblies that runs through pcb board.The height of described boss is greater than the height of power module.
Because the heat-conducting silicone grease layer is set between radiator and power module, making needs very thick heat conductive pad to ban originally, therefore, can make the height of power module, can make pcb board set up at radiator on the basis of boss and directly be connected with radiator less than the boss height.Can reduce the total height of entire heat dissipation system with this.Make littleizationr of cooling system.
Described power module and radiator are provided with the screwed hole that matches each other, and are provided with screw in the described screwed hole.
Described screw is a sunk screw.
Operating procedure of the present utility model is as follows.
1, at first coats the heat-conducting silicone grease layer to power module.
2, with power module by screw on radiator.
3, then pcb board is fixed on the radiator in the lump.
4, again that power module and pcb board welding is fixing at last.
In sum, the beneficial effects of the utility model are: 1, fitting operation is simple; 2, simple in structure, 3, processing technology is simple, cost is low; 4, can ban thick heat conductive pad; 5, conduct heat by heat-conducting silicone grease between power module and the radiator, heat-transfer path is short, and thermal resistance is low, and thermal diffusivity is good, and cost is low.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Mark and corresponding parts title in the accompanying drawing: 1, pcb board; 2, power module; 3, sunk screw; 4, radiator; 5, heat-conducting silicone grease layer; 6, screw assemblies; 7 boss.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited only to this.
Embodiment one
As shown in Figure 1, a kind of cooling system at power module mainly is made of the radiator 4 that is connected with power module 2, also is provided with heat-conducting silicone grease layer 5 between described power module 2 and the radiator 4.
Pcb board 1 also is connected with radiator 4.
Radiator 4 is provided with boss 7 near the one side of pcb board 1, and described boss 7 is provided with the boss screwed hole away from radiator 4 one ends, and pcb board 1 is connected with the boss screwed hole by the screw assemblies 6 that runs through pcb board 1.The height of boss 7 is greater than the height of power module 2.
Just can better realize the utility model as mentioned above.
Claims (7)
1. the cooling system at power module is characterized in that, mainly is made of the radiator (4) that is connected with power module (2), also is provided with heat-conducting silicone grease layer (5) between described power module (2) and the radiator (4).
2. according to the described a kind of cooling system of claim 1, it is characterized in that described power module (2) is connected with pcb board (1) away from radiator (4) one ends at power module.
3. according to the described a kind of cooling system of claim 2, it is characterized in that described pcb board (1) also is connected with radiator (4) at power module.
4. according to claim 2 or 3 described a kind of cooling systems at power module, it is characterized in that, described radiator (4) is provided with boss (7) near the one side of pcb board (1), described boss (7) is provided with the boss screwed hole away from radiator (4) one ends, and described pcb board (1) is connected with the boss screwed hole by the screw assemblies (6) that runs through pcb board (1).
5. according to the described a kind of cooling system of claim 4, it is characterized in that the height of described boss (7) is greater than the height of power module (2) at power module.
6. according to the described a kind of cooling system of claim 1, it is characterized in that described power module (2) is connected by screw with radiator (4) at power module.
7. according to the described a kind of cooling system of claim 6, it is characterized in that described screw is sunk screw (3) at power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120217263XU CN202076924U (en) | 2011-06-24 | 2011-06-24 | Radiating system for power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120217263XU CN202076924U (en) | 2011-06-24 | 2011-06-24 | Radiating system for power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202076924U true CN202076924U (en) | 2011-12-14 |
Family
ID=45115001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120217263XU Expired - Fee Related CN202076924U (en) | 2011-06-24 | 2011-06-24 | Radiating system for power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202076924U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11864323B2 (en) | 2020-07-15 | 2024-01-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | Driver board assemblies and methods of forming a driver board assembly |
-
2011
- 2011-06-24 CN CN201120217263XU patent/CN202076924U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11864323B2 (en) | 2020-07-15 | 2024-01-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | Driver board assemblies and methods of forming a driver board assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: CHENGDU NTS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: NTS TECHNOLOGY (CHENGDU) CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 610000, Sichuan Chengdu hi tech Zone Tianfu road hi tech incubator park information security base 3 and 4 floor Patentee after: Chengdu NTS Technology Co., Ltd. Address before: 610000 Sichuan Chengdu hi tech Development Zone Tianfu road hi tech incubator park information security base 3 and 4 Building Patentee before: NTS Technology (Chengdu) Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20130624 |