CN201955726U - Heat-radiation structure for heat radiator - Google Patents
Heat-radiation structure for heat radiator Download PDFInfo
- Publication number
- CN201955726U CN201955726U CN2011200619545U CN201120061954U CN201955726U CN 201955726 U CN201955726 U CN 201955726U CN 2011200619545 U CN2011200619545 U CN 2011200619545U CN 201120061954 U CN201120061954 U CN 201120061954U CN 201955726 U CN201955726 U CN 201955726U
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- CN
- China
- Prior art keywords
- heat
- radiating fin
- radiation
- copper
- copper billet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a heat-radiation structure for a heat radiator, which comprises a copper block and heat-radiation fins, wherein the copper block is used for absorbing heat of a heat-radiation body and is in direct contact, the heat-radiation pins absorb heat on the copper block and comprise a main heat-radiation fin and sub heat-radiation fins, the main heat-radiation fin is in direct and tight contact with the copper block, and a heat transfer copper pipe for conducting the heat of the copper block to the sub heat-radiation fins is arranged on the copper block. Through the additional arrangement of the heat transfer copper pipe and a plurality of heat-radiation fins, the heat-radiation area is greatly increased, and the heat-radiation efficiency is improved on the premise without increasing the space.
Description
Technical field
The utility model relates to a kind of improvement technology of heat spreader structures.
Background technology
Heating radiator is the important thermal components of electric component such as computer, most of heating radiator dispels the heat by heat conduction, radiating fin that heat dispersion is good, owing to be subjected to by the influence in size of thermal component own and space, the radiating fin size is limited, area of dissipation is difficult to accomplish very big, and radiating efficiency is received influence.
The utility model content
In view of this, the technical problems to be solved in the utility model provides the high heating radiator of a kind of radiating efficiency.
In order to solve the problems of the technologies described above, the utility model is realized in the following way:
A kind of radiator heat-dissipation structure, comprise the radiating fin that is used to absorb heater heat and the copper billet that directly contacts and absorbs heat on the copper billet, described radiating fin comprises a direct main radiating fin and a secondary radiating fin that closely contacts with copper billet, and copper billet is provided with the heat transmission copper pipe that the copper billet heat is conducted to secondary radiating fin.
As the improvement to such scheme, described secondary radiating fin is 1 or 2 or 3 or 4, vertically is installed on main radiating fin edge, and heat transmission copper pipe is interspersed in the copper billet and extends on the secondary radiating fin and closely contacts with secondary radiating fin.
In order further to improve heat conduction, radiating efficiency, on main radiating fin, offer the conduit that passes through for heat transmission copper pipe, heat transmission copper pipe closely is affixed in the conduit.
The utility model has improved radiating efficiency by setting up heat transmission copper pipe and a plurality of radiating fin has greatly increased area of dissipation under the prerequisite that does not increase the space.
Description of drawings
Fig. 1 is the utility model embodiment one-piece construction synoptic diagram;
Fig. 2 is a present embodiment decomposing state structural representation.
Embodiment
Defective at prior art exists describes in further detail of the present utility model for the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing:
Shown in accompanying drawing 1,2, the heating radiator that present embodiment discloses can be applicable to the heat radiation of electronic unit inner heat bodies such as computer, guarantees the working temperature that it is stable.
The radiator heat-dissipation structure that this programme adopts comprises copper billet 1, by a main radiating fin 21 and two radiating fin and heat transmission copper pipes 3 that secondary radiating fin 22 is formed.Wherein copper billet 1 and heater directly contact and absorb the heater heat, and radiating fin 21 and copper billet 1 directly contact to be used to absorb the heat of copper billet 1 and to spread to the external world and lower the temperature.Heat transmission copper pipe 3 one ends are interspersed in the copper billet 1, can absorb the heat of conduction copper billet 1, and heat transmission copper pipe 3 other ends extend and closely to contact with secondary radiating fin 22, the part heat of copper billet 1 is conducted on the secondary radiating fin 22 spread.
Be provided with two secondary radiating fins 22 in the present embodiment, be installed on the both sides of main radiating fin 21 respectively, be provided with conduit 211 in main radiating fin 21, heat transmission copper pipe 3 closely is affixed in the conduit 211, and extends on the secondary radiating fin 22 by conduit 211.
Above embodiment only is the preferable implementation of the utility model; can not limit protection domain of the present utility model with this; under the present utility model design prerequisite that do not come off; still may there be the distortion that belongs within the utility model protection domain; quantity such as secondary radiating fin can be 1 or 3 or 4, and so similar conspicuous variation all belongs to protection domain of the present utility model.
Claims (3)
1. radiator heat-dissipation structure, comprise the radiating fin that is used to absorb heater heat and the copper billet that directly contacts (1) and absorbs heat on the copper billet, it is characterized in that: described radiating fin comprises a direct main radiating fin (21) and a secondary radiating fin (22) that closely contacts with copper billet, and copper billet is provided with the heat transmission copper pipe (3) that the copper billet heat is conducted to secondary radiating fin.
2. radiator heat-dissipation structure according to claim 1, it is characterized in that: described secondary radiating fin is 1 or 2 or 3 or 4, vertically be installed on main radiating fin edge, heat transmission copper pipe is interspersed in the copper billet and extends on the secondary radiating fin and closely contacts with secondary radiating fin.
3. radiator heat-dissipation structure according to claim 2 is characterized in that: offer the conduit (211) that passes through for heat transmission copper pipe on main radiating fin, heat transmission copper pipe closely is affixed in the conduit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200619545U CN201955726U (en) | 2011-03-11 | 2011-03-11 | Heat-radiation structure for heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200619545U CN201955726U (en) | 2011-03-11 | 2011-03-11 | Heat-radiation structure for heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201955726U true CN201955726U (en) | 2011-08-31 |
Family
ID=44499832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200619545U Expired - Fee Related CN201955726U (en) | 2011-03-11 | 2011-03-11 | Heat-radiation structure for heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201955726U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313582A (en) * | 2013-06-25 | 2013-09-18 | 江苏博普电子科技有限责任公司 | Cooling system for radio-frequency microwave power devices |
-
2011
- 2011-03-11 CN CN2011200619545U patent/CN201955726U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313582A (en) * | 2013-06-25 | 2013-09-18 | 江苏博普电子科技有限责任公司 | Cooling system for radio-frequency microwave power devices |
| CN103313582B (en) * | 2013-06-25 | 2016-08-17 | 江苏博普电子科技有限责任公司 | Frequency microwave power device cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20180311 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |